Aging test board and aging test device

Abstract

The utility model provides an aging test board and an aging test device, and the aging test board comprises a bottom plate which is coupled with a processing assembly; the first circuit board is coupled with the processing assembly, a second circuit board is coupled on the first circuit board, a groove is formed in the second circuit board in a penetrating manner, and the first circuit board is clamped in the groove; wherein the base plate is provided with a first interface to realize signal transmission and power supply, and the second circuit board is used for connecting a memory bank to realize the test of the processing assembly on the memory bank. Through the mode, the test function and the interface are highly integrated, and the test efficiency of products such as the memory bank is improved, so that the test cost of the memory bank is reduced.

Description

Technical Field

[0001] The present application is applied to the technical field of electronic circuits, and in particular relates to an aging test board and an aging test device. Background Art

[0002] Currently, conventional system-level aging tests for memory products are mostly performed using motherboards with an X86 architecture (processor). Since memory manufacturers do not manufacture motherboards, it is difficult to achieve fully automated loading and unloading for system-level aging tests. Therefore, current aging tests for memory products are basically performed manually for plugging and unplugging, resulting in low aging test efficiency.

[0003] And because the demographic dividend in recent years no longer exists, for processing and manufacturing companies, as labor costs continue to rise, the cost of aging testing of memory products has also risen, which is not conducive to reducing testing costs and realizing large-scale batch production operations. Utility Model Content

[0004] The present application provides an aging test board to solve the problem that it is difficult to achieve fully automated testing for aging testing.

[0005] In order to solve the above technical problems, the present application provides an aging test board, including: a base plate, a processing component is coupled to the base plate; a first circuit board, the first circuit board is coupled to the processing component, a second circuit board is coupled to the first circuit board, a groove is penetrated through the second circuit board, and the first circuit board is clamped in the groove; wherein a first interface is provided on the base plate to realize signal transmission and power supply, and the second circuit board is used to connect a memory stick to realize the testing of the memory stick by the processing component.

[0006] Among them, a support member and a first supporting plate are arranged on the base plate, one end of the support member is connected to the base plate, and the other end is connected to the first supporting plate. The second circuit board is arranged on the end surface of the first supporting plate away from the base plate, and the height of the first supporting plate is not lower than the height of the processing component.

[0007] A through slot matched with the groove is formed on the first supporting plate, a fixing piece is detachably connected in the through slot, and the fixing piece can be inserted in the through slot to position the first circuit board.

[0008] A jig is arranged on the end surface of the second circuit board away from the support member, and a plurality of positioning through holes connected to the groove are opened on the jig. The first circuit board is located inside the positioning through holes to fix the first circuit board.

[0009] A first insulating sheet is arranged on the end surface of the first carrier plate away from the bottom plate and is clamped by the first carrier plate and the second circuit board. A second insulating sheet is arranged on the end surface of the second circuit board away from the support member and is clamped by the fixture and the second circuit board.

[0010] Wherein, a second bearing plate is arranged on an end surface of one side of the bottom plate away from the supporting member, and a hanging ear is arranged at the end of the second bearing plate.

[0011] Wherein, a second interface is arranged on the first circuit board, and the memory stick is inserted into the second interface.

[0012] The aging test board at least includes two first circuit boards and a second circuit board, and the first circuit boards correspond to the second circuit boards one by one.

[0013] To solve the above problems, the present application also provides an aging test device, including: an aging test board; the aging test board is arranged in the communication equipment, and the aging test board is any of the aging test boards mentioned above.

[0014] The aging test device further includes a mechanical arm, which is arranged corresponding to the aging test board and is used for inserting the memory stick into the aging test board.

[0015] The aging test device further comprises a transmission mechanism, and the aging test board is driven to move by the transmission mechanism.

[0016] The beneficial effects of the present application are as follows: different from the prior art, the present application supplies power to the processing component through the base plate, and integrates the first circuit board and the second circuit board on the base plate, effectively realizing automatic switching of communication and power supply signals, facilitating subsequent testing of other memory sticks, and through the modular design of the aging test board, the test standards of the aging test board are unified, the test functions and interfaces are highly integrated, the test efficiency of products such as memory sticks is improved, and the test cost of the memory sticks is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is the aging test board exposure photo of this application Figure 1 A schematic structural diagram of an embodiment;

[0018] Figure 2 This is a schematic diagram of the structure of an embodiment of an aging test board of the present application;

[0019] Figure 3 It is a structural schematic diagram of another embodiment of the aging test board of the present application. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0021] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0022] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0023] See also Figure 1 , Figure 1 This application provides an aging test board explosion Figure 1 A structural block diagram of an embodiment.

[0024] This application provides an aging test board, such as Figure 1 As shown, an aging test board of this embodiment includes a base plate 10 and a first circuit board 30, and a processing component 20 is coupled to the base plate 10. The first circuit board 30 is coupled to the processing component 20, and a second circuit board 40 is coupled to the first circuit board 30. A groove 401 is provided through the second circuit board 40, and the first circuit board 30 is clamped inside the groove 401. Among them, a first interface 101 is provided on the base plate 10 to realize signal transmission and power supply, and the second circuit board 40 is used to connect a memory stick (not shown) to realize the processing component 20 to test the memory stick. Among them, the base plate 10 supplies power to the processing component 20, so that the processing component 20 can subsequently test the memory stick. The processing component 20 is provided with a 90° power adapter (not shown), so that when the processing component 20 is connected to the base plate 10, it will not interfere with other devices installed on the base plate 10. The processing component 20 can be specifically provided with a 24Pin 90° power adapter. The processing component 20 can be an MSI Z590M motherboard, and this application does not make specific restrictions here. In order to facilitate the aging test board to perform aging tests on the memory stick, the first interface 101 on the base plate 10 can be set at one end or the other end of the base plate 10. The aging test board can be connected to external devices on the left or right side, and the first interface 101 can also be set at both ends of the base plate 10. This application does not make specific restrictions here.

[0025] In an optional embodiment, the processing component 20 is coupled to the bottom plate 10, and the first circuit board 30 is coupled to the processing component 20. By opening a groove 401 on the second circuit board 40, the first circuit board 30 is clamped inside the groove 401 of the second circuit board 40, and the first circuit board 30 is coupled to the second circuit board 40. Among them, the first circuit board 30 can be coupled to the processing component 20 perpendicular to the processing component 20, the first circuit board 30 is clamped inside the groove 401 of the second circuit board 40, and the second circuit board 40 is vertically arranged with the first circuit board 30, so as to prevent the first circuit board 30 and the first circuit board 30 from interfering with the installation of other devices. Other connection methods that are convenient for installing other devices can also be used, which are not specifically limited in this application. The first circuit board 30 is coupled with the second circuit board 40, so as to assist the processing component 20 in testing the memory stick, wherein the first circuit board 30 can be set as a LS761A vertical board, and the second circuit board 40 can be set as a LS761A horizontal board, or can be set as other circuit boards, which are not specifically limited in this application.

[0026] Furthermore, after the base plate 10 is connected to the external device through the first interface 101, the base plate 10 supplies power to the processing component 20, and then the memory stick is inserted on the first circuit board 30, and the first circuit board 30 is coupled with the memory stick, that is, through the integrated aging test board, the communication and power supply signals are effectively automatically switched on and off, so as to facilitate the plugging and unplugging of the memory stick and test the subsequent memory sticks, and the program of the memory stick is automatically loaded, tested, and the result is fed back and output through the test board, so as to complete the aging test of the memory stick. That is, in this application, the memory stick aging test board is unified through the standard, the first circuit board 30, the second circuit board 40 and the processing component 20 are arranged on the base plate 10, the aging test board is modularly designed, the test function and interface are highly integrated, the test efficiency of products such as memory sticks is improved, and the test cost of memory sticks is reduced.

[0027] In the above embodiment, the processing component 20 is powered by the base plate 10, and the first circuit board 30 and the second circuit board 40 are integrated on the base plate 10, which effectively realizes the automatic switching of communication and power signals, and facilitates the subsequent testing of other memory sticks. In addition, through the modular design of the aging test board, the test standards of the aging test board are unified, the test functions and interfaces are highly integrated, and the test efficiency of products such as memory sticks is improved, thereby reducing the test cost of the memory sticks.

[0028] In an optional embodiment, if Figure 2As shown, a support member 50 and a first carrier plate 501 are provided on the bottom plate 10, one end of the support member 50 is connected to the bottom plate 10, and the other end is connected to the first carrier plate 501, and the second circuit board 40 is provided on the end surface of the first carrier plate 501 away from the bottom plate 10, and the height of the first carrier plate 501 is not lower than the height of the processing assembly 20. The support member 50 can be four support columns provided from the end surface of the bottom plate 10, or can be provided in other shapes that are convenient for supporting the first carrier plate 501, that is, the second circuit board 40 can be supported by the support member 50 and the first carrier plate 501, wherein the support member 50 and the first carrier plate 501 can be designed as an integrated whole, and the support member 50 can also be installed on the second carrier plate 90, which is not specifically limited in this application. Among them, the processing assembly 20 is at least partially located at the lower end of the first carrier plate 501, so that interference between the processing assembly 20 and the installation of the first circuit board 30 and the second circuit board 40 is effectively prevented.

[0029] In an optional embodiment, if Figure 1 As shown, a through slot 502 matching the groove 401 is provided on the first carrier plate 501, and a fixing member 60 is detachably connected in the through slot 502, and the fixing member 60 can be inserted in the through slot 502 to position the first circuit board 30. In order to integrate the first circuit board 30 and the second circuit board 40 on the base plate 10, a through slot 502 matching the groove 401 on the second circuit board 40 is provided on the first carrier plate 501, so that the first circuit board 30 can pass through the groove 401 of the second circuit board 40 and the through slot 502 of the first carrier plate 501 to couple with the processing component 20, thereby improving the layout capability of installing the first circuit board 30, the processing component 20 and the second circuit board 40 on the base plate 10. By detachably connecting the fixing member 60 in the through slot 502, that is, after the first circuit board 30 is inserted into the processing component 20, the fixing member 60 can be inserted into the through slot 502. At this time, the fixing member 60 has a certain squeezing force on the first circuit board 30, and can make the first circuit board 30 abut against the side wall of the through slot 502, thereby facilitating the positioning of the first circuit board 30.

[0030] In an optional embodiment, a jig 70 is provided on the end surface of the second circuit board 40 away from the support member 50, and a plurality of positioning through holes 701 connected to the groove 401 are provided on the jig 70, and the first circuit board 30 is located inside the positioning through holes 701 to fix the first circuit board 30. Among them, the jig 70 has a certain height, so that the first circuit board 30 is at least partially located inside the jig 70. By providing a plurality of positioning through holes 701 connected to the groove 401 on the jig 70, a plurality of first circuit boards 30 can be inserted into the processing component 20 through the plurality of positioning through holes 701 on the jig 70, and the positioning through holes 701 can further position and fix the first circuit board 30. In an optional embodiment, the positioning through holes 701 can be set to four. In other embodiments, the number of positioning through holes 701 can also be set as needed, for example, three, five, six, etc., which is not specifically limited in this application.

[0031] In an optional embodiment, a first insulating sheet 801 is provided on the end surface of the first carrier plate 501 away from the bottom plate 10, and is clamped by the first carrier plate 501 and the second circuit board 40, and a second insulating sheet 802 is provided on the end surface of the second circuit board 40 away from the support member 50, and the second insulating sheet 802 is clamped by the fixture 70 and the second circuit board 40. Among them, the shapes of the first insulating sheet 801 and the second insulating sheet 802 are adapted to the through slot 502 on the first carrier plate 501, so as to facilitate the first circuit board 30 to pass through the first carrier plate 501. Therefore, the first insulating sheet 801 is provided between the first carrier plate 501 and the second circuit board 40, and is clamped and fixed by the first carrier plate 501 and the second circuit board 40, so as to prevent the second circuit board 40 from being connected to the first carrier plate 501. The second insulating sheet 802 is provided between the second circuit board 40 and the fixture 70, and is clamped and fixed by the second circuit board 40 and the fixture 70, so as to prevent the second circuit board 40 from being connected to the fixture 70. That is, by providing the first insulating sheet 801 and the second insulating sheet 802 , it is possible to effectively prevent the aging test board from having a short circuit and the like, thereby preventing the components from being damaged.

[0032] In an optional embodiment, a second carrier plate 90 is provided on the end surface of one side of the bottom plate 10 away from the support member 50, and a hanging ear 901 is provided at the end of the second carrier plate 90. That is, the bottom plate 10 is arranged on the second carrier plate 90, and the second carrier plate 90 can well provide a certain structural strength for the bottom plate 10. When the aging test board is used to test the memory bar, since the memory bar needs to be plugged in and out on the aging test board, the second carrier plate 90 can effectively prevent the bottom plate 10 from being broken or damaged, thereby ensuring the accuracy of the aging test board when testing the memory bar. Further, a hanging ear 901 is provided on the second carrier plate 90, wherein the hanging ear 901 is provided on the end surface at a position relative to the bottom plate 10, that is, when the aging test board is used to test the memory bar, the aging test board can be pulled by the hanging ear 901 through an external component, and the aging test board can be pulled to a specified position. Among them, the second carrier plate 90 has an insulating effect, thereby preventing the aging test board from being connected to an external device when testing the memory bar, thereby damaging the memory bar or causing inaccurate test results of the memory bar. In some embodiments, a plurality of heat dissipation holes (not shown) are provided on the second carrier board 90 to dissipate heat for the aging test board when the aging test board tests the memory stick, thereby preventing the aging test board from being damaged due to overheating.

[0033] In an optional embodiment, a second interface (not shown) is provided on the first circuit board 30, and the memory stick is inserted into the second interface. That is, the second interface is provided on the first circuit board 30, and when the memory stick needs to be tested, the memory stick can be pressed down and inserted into the second interface by an external component, so as to test the memory stick. Furthermore, after the test of the memory stick is completed, the memory stick is pulled out from the second interface by an external component.

[0034] In a specific embodiment, Figure 3 As shown, the aging test board includes at least two first circuit boards 30 and a second circuit board 40, and the first circuit boards 30 and the second circuit boards 40 correspond one to one. In order to improve the efficiency of the memory bar test when testing the memory bar, by setting two first circuit boards 30 and the second circuit boards 40 on the base plate 10, the test efficiency can be effectively improved and the test cost can be reduced. Among them, the aging test board can also be provided with multiple first circuit boards 30 and second circuit boards 40, and the first circuit boards 30 and the second circuit boards 40 correspond one to one, for example, three, four, etc., so as to improve the test efficiency of the memory bar and reduce the test cost under the premise of ensuring the structural strength of the aging test board, and the present application does not make specific limitations here.

[0035] In a specific embodiment, the installation scheme of the aging test board is as follows: first, the base plate 10 is installed on the second carrier plate 90, and the processing component 20 is installed on the base plate 10, and the processing component 20 is coupled to the base plate 10 through the power adapter, and then the support member 50 and the first carrier plate 501 are installed on the base plate 10 close to the processing component 20, so that the processing component 20 is at least partially located at the upper end of the processing component 20, and the second circuit board 40 is installed on the first carrier plate 501, and the first insulating sheet 801 is installed on the first carrier plate 501, and the second circuit board 40 is installed on the first carrier plate 501. 40 and the first carrier plate 501 are clamped, and then the first circuit board 30 is inserted into the processing component 20 through the groove 401 on the second circuit board 40, and the fixing member 60 is inserted into the through groove 502 to position the first circuit board 30, and then the second insulating sheet 802 is installed on the second circuit board 40, and the jig 70 is installed on the second insulating sheet 802, so that the jig 70 and the second circuit board 40 reduce and clamp the second insulating sheet 802, wherein the first circuit board 30 passes through the positioning through hole 701 on the jig 70, thereby positioning and fixing the first circuit board 30.

[0036] In the above manner, the present application can integrate the first circuit board 30 and the second circuit board 40 on the bottom plate 10 by arranging the processing component 20, the first circuit board 30 and the second circuit board 40 on the bottom plate 10, and the first circuit board 30 is clamped in the second circuit board 40, so as to highly integrate the test function and interface, improve the test efficiency of products such as memory sticks, and thus reduce the test cost of memory sticks. By arranging the support member 50 and the first carrier plate 501 on the bottom plate 10, and the height of the first carrier plate 501 is not less than the height of the processing component 20, the first carrier plate 501 can be partially arranged at the upper end of the processing component 20, thereby preventing the processing component 20 from interfering with the installation of the first circuit board 30 and the second circuit board 40. By opening a through slot 502 on the first carrier plate 501 and detachably connecting the fixing member 60 in the through slot 502, the fixing member 60 can be inserted into the through slot 502 after the first circuit board 30 is inserted into the processing component 20, thereby effectively positioning the first circuit board 30. By setting a fixture 70 on the second circuit board 40 and opening a plurality of positioning through holes 701 on the fixture 70, the first circuit board 30 can be further positioned and fixed. By setting a first insulating sheet 801 and a second insulating sheet 802 on both end surfaces of the second circuit board 40, it is possible to effectively prevent the aging test board from short circuiting and damaging the device. By setting a second carrier plate 90 on the end surface of the side of the bottom plate 10 away from the support member 50, it is possible to effectively prevent the bottom plate 10 from being broken or damaged, thereby ensuring the accuracy of the aging test board when testing the memory stick. By setting a second interface on the first circuit board 30, the memory stick can be pressed down and inserted into the second interface through an external component, which is convenient for subsequent testing of the memory stick. By setting at least two one-to-one corresponding first circuit boards 30 and second circuit boards 40 on the bottom plate 10, the test efficiency of the memory stick can be effectively improved and the test cost can be reduced.

[0037] The present application also provides an aging test device, which includes: an aging test board, which is arranged in the aging test device, and the frequency generating circuit is the aging test board of any of the above-mentioned embodiments.

[0038] In an optional embodiment, the aging test device further includes a mechanical arm, which is arranged corresponding to the aging test board and is used to insert the memory stick into the aging test board. Therefore, when testing the memory stick, the test board can load multiple memory sticks at the same time through the loading action of the mechanical arm, and the insertion of the memory stick can be achieved through the pressing action of the mechanical arm on the memory stick. After the memory stick is tested in the aging test device, the memory stick can be removed from the aging test board by the mechanical arm, thereby realizing automatic loading and unloading of the memory stick test and reducing the test cost required for manual testing.

[0039] In an optional embodiment, the aging test device further includes a conveying mechanism, and the aging test board is driven by the conveying mechanism to move. Therefore, after the memory stick is loaded on the aging test board by the mechanical arm, the aging test board loaded and inserted with the memory stick can be conveyed by the conveying mechanism to dock with the external component, and the memory stick can be tested by the upper computer software control. After the memory stick test is completed, the conveying mechanism can convey the aging test board loaded and inserted with the memory stick to the initial position, and remove the memory stick by the mechanical arm, thus realizing the automation of the memory stick test.

[0040] In the above embodiment, multiple memory sticks can be loaded and inserted into the aging test board through the robotic arm, and the aging test board can be transported and docked with external components through the conveying mechanism, thereby completing the test of the memory stick. After the memory stick test is completed, the conveying mechanism transports the aging test board to the initial position, and the memory stick can be removed by the robotic arm, thereby realizing automatic loading and unloading of the memory stick test and reducing the testing cost required for manual testing.

[0041] The above description is only an implementation method of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. An aging test board, characterized in that: The aging test board comprises: a base plate, to which a processing assembly is coupled; A first circuit board, the first circuit board is coupled to the processing component, a second circuit board is coupled to the first circuit board, a groove is provided through the second circuit board, and the first circuit board is clamped inside the groove; The base plate is provided with a first interface to realize signal transmission and power supply, and the second circuit board is used to connect the memory stick to realize the testing of the memory stick by the processing component.

2. The aging test board according to claim 1, characterized in that: A support member and a first carrier plate are provided on the base plate, one end of the support member is connected to the base plate, and the other end is connected to the first carrier plate, the second circuit board is arranged on the end surface of the first carrier plate away from the base plate, and the height of the first carrier plate is not lower than the height of the processing component.

3. The aging test board according to claim 2, characterized in that: The first supporting plate is provided with a through slot matched with the groove, a fixing piece is detachably connected in the through slot, and the fixing piece can be inserted in the through slot to position the first circuit board.

4. The aging test board according to claim 3, characterized in that: A jig is arranged on the end surface of the second circuit board away from the support member, and a plurality of positioning through holes communicating with the groove are opened on the jig, and the first circuit board is located inside the positioning through holes to fix the first circuit board.

5. The aging test board according to claim 4, characterized in that: A first insulating sheet is arranged on the end surface of the first supporting plate away from the base plate and is clamped by the first supporting plate and the second circuit board. A second insulating sheet is arranged on the end surface of the second circuit board away from the support member and is clamped by the fixture and the second circuit board.

6. The aging test board according to claim 2, characterized in that: A second bearing plate is arranged on an end surface of the bottom plate away from the supporting member, and a hanging ear is arranged at the end of the bearing plate.

7. The aging test board according to claim 1, characterized in that: The first circuit board is provided with a second interface, and the memory stick is inserted into the second interface.

8. The aging test board according to claim 1, characterized in that: The aging test board includes at least two first circuit boards and a second circuit board, and the first circuit boards correspond to the second circuit boards one by one.

9. An aging test device, characterized in that: The aging test device comprises: An aging test board, wherein the aging test board is arranged in the aging test device, and the aging test board is the aging test board according to any one of claims 1 to 8.

10. The aging test device according to claim 9, characterized in that: The aging test device further comprises a mechanical arm, which is arranged corresponding to the aging test board and is used for inserting a memory stick into the aging test board.

11. The aging test device according to claim 9, characterized in that: The aging test device further comprises a conveying mechanism, and the aging test board is driven to move by the conveying mechanism.

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