Battery piece carrier

Abstract

The utility model relates to a battery piece carrier. The battery piece carrier comprises a bearing base and a first silicon wafer supporting pad, the bearing base is provided with a battery piece placing area, and the first silicon wafer supporting pad is arranged on the bearing base and surrounds the battery piece placing area. Supporting force is provided for the edge of the battery piece through the first silicon wafer supporting pad, the contact area with the battery piece is reduced, the whole face of the battery piece is prevented from being rubbed in the conveying process, damage to a surface film layer of the battery piece is further reduced, the appearance yield of the battery piece can be improved, and the performance such as the conversion efficiency of the battery piece can be improved. Moreover, the part, close to the battery piece placement area, of the first silicon wafer supporting pad is recessed inwards to form the limiting recessed part, and the limiting recessed part is used for limiting placement of the battery pieces, so that unexpected displacement of the battery pieces in the transmission process can be prevented, the transmission stability of the battery pieces is improved, and the fragmentation rate of the battery pieces is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaics, in particular to a battery cell carrier. Background Art

[0002] In the process of preparing solar cells, it is necessary to use a transmission device to transmit cells between different production equipment or within the production equipment. For example, in the screen printing process of solar cells, a conveyor belt is usually used to transmit cells between the paste printing station and the sintering and curing furnace, and between the sintering and curing furnace and the testing and sorting.

[0003] However, when using a conveyor belt to transport battery cells, the friction between the battery cells and the conveyor belt during the transmission process causes the surface film of the battery cells to be damaged, resulting in scratches, contamination, etc., which not only affects the appearance of the battery cells, but may also have an adverse effect on the battery performance. In addition, due to the difference in tension, the symmetrically arranged conveyor belts may also form different friction forces on the battery cells transported on them, which in turn causes the battery cells to undergo different degrees of asymmetric displacement during the transportation process, making it impossible for the battery cells to be completely transported in the expected direction on the conveyor belt, deviating from their original transmission direction, increasing the risk of collision between the battery and the frame of the conveyor belt, and thus increasing the fragmentation rate of the battery cells. Utility Model Content

[0004] Based on this, it is necessary to provide a battery cell carrier to solve the problem that the traditional transmission method causes damage to the battery cell and fails to transmit completely in the expected direction, resulting in an increased fragmentation rate.

[0005] A battery cell carrier comprises a carrying base and a first silicon wafer support pad, wherein the carrying base has a battery cell placement area, the first silicon wafer support pad is arranged on the carrying base and around the battery cell placement area, and a portion of the first silicon wafer support pad close to the battery cell placement area is concave to form a limiting recess, and the limiting recess is used for limiting the placement of the battery cell.

[0006] In one embodiment, there are multiple first silicon wafer support pads, and the limiting recessed portions of the multiple first silicon wafer support pads are used to cooperate in limiting the placement of the battery cell.

[0007] In one of the embodiments, the cell carrier has at least four first silicon wafer support pads distributed at the four corners of a rectangle.

[0008] In one of the embodiments, the first silicon wafer support pad includes a support member and a limit member, the support member is connected to the supporting base, the limit member is arranged on the support member, and the limit member cooperates with the support member to form a limit recess.

[0009] In one of the embodiments, the cell carrier further includes a second silicon wafer support pad, which is disposed on the supporting base and located in the cell placement area.

[0010] In one embodiment, the first silicon wafer supporting pad is an elastic pad.

[0011] In one embodiment, the second silicon wafer supporting pad is an elastic pad.

[0012] In one embodiment, the first silicon wafer supporting pad is a rubber pad.

[0013] In one embodiment, the second silicon wafer supporting pad is a rubber pad.

[0014] In one of the embodiments, the first silicon wafer support pad is at least one of a polyphenylene ether pad, a polycarbonate pad, an isotactic polystyrene pad, a polymalic acid pad, a polytetrafluoroethylene pad, a polyethylene naphthalate pad, a polyethylene terephthalate pad, a nylon MXD6 pad, a nylon 9T pad, a nylon 6T pad, a nylon 68 pad, a nylon 66 pad and a nylon 6 pad.

[0015] In one of the embodiments, the second silicon wafer support pad is at least one of a polyphenylene ether pad, a polycarbonate pad, an isotactic polystyrene pad, a polymalic acid pad, a polytetrafluoroethylene pad, a polyethylene naphthalate pad, a polyethylene terephthalate pad, a nylon MXD6 pad, a nylon 9T pad, a nylon 6T pad, a nylon 68 pad, a nylon 66 pad and a nylon 6 pad.

[0016] In one of the embodiments, an anti-slip structure is provided on a side of the supporting base away from the first silicon wafer supporting pad.

[0017] In one embodiment, the anti-slip structure includes anti-slip grooves.

[0018] Compared with the traditional solution, the above-mentioned battery cell carrier has the following beneficial effects:

[0019] In the above-mentioned cell carrier, the first silicon wafer support pad is arranged on the supporting base and around the cell placement area. The first silicon wafer support pad provides support force to the edge of the cell, which reduces the contact area with the cell, avoids the friction of the entire surface of the cell during the transmission process, and thus reduces the damage to the film layer on the surface of the cell, which can improve the appearance yield rate of the cell, and can improve the conversion efficiency and other performance of the cell. In addition, the part of the first silicon wafer support pad close to the cell placement area is concave to form a limiting recessed part, which is used for limiting the placement of the cell, and can prevent the cell from unexpected displacement during the transmission process, thereby improving the stability of the cell transmission and reducing the fragmentation rate of the cell. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] FIG1 is a schematic structural diagram of a battery cell carrier according to an embodiment;

[0021] FIG. 2 is a cross-sectional view of the battery cell carrier shown in FIG. 1 along the AA′ direction.

[0022] Description of reference numerals:

[0023] 100, battery cell carrier; 110, carrying base; 112, battery cell placement area; 120, first silicon wafer support pad; 121, limiting recess; 122, support member; 123, limiting member; 1232, first stop bar; 1234, second stop bar; 130, second silicon wafer support pad. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0027] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0029] The utility model provides a battery cell carrier, which can be used for loading battery cells, can reduce the friction damage to the battery cells during the transmission process, and prevent the battery cells from unexpected displacement during the transmission process.

[0030] Please refer to FIG. 1 and FIG. 2 , a cell carrier 100 according to an embodiment includes a supporting base 110 and a first silicon wafer support pad 120. The supporting base 110 is disposed on a conveying mechanism. The supporting base 110 has a cell placement area 112, and the first silicon wafer support pad 120 is disposed on the supporting base 110 and around the cell placement area 112. The portion of the first silicon wafer support pad 120 close to the cell placement area 112 is concave to form a limiting recess 121, and the limiting recess 121 is used for limiting the placement of the cell.

[0031] When the battery cells are transferred between different production equipment or in the process of being transferred in production equipment, the battery cells are loaded on the above-mentioned battery cell carrier 100, and the battery cell carrier 100 is transported by a conveying mechanism such as a conveyor belt, thereby changing the traditional production method of placing the battery cells directly on the conveyor belt.

[0032] In the above-mentioned cell carrier 100, the first silicon wafer support pad 120 is arranged on the supporting base 110 and around the cell placement area 112. The first silicon wafer support pad 120 provides support force to the edge of the cell, thereby reducing the contact area with the cell, avoiding friction on the entire surface of the cell during the transmission process, thereby reducing the damage to the film layer on the surface of the cell, thereby improving the appearance yield rate of the cell and improving the conversion efficiency of the cell. In addition, the part of the first silicon wafer support pad 120 located in the cell placement area 112 is concave to form a limiting recess 121, which is used for limiting the placement of the cell, and can prevent the cell from unexpected displacement during the transmission process, thereby improving the stability of the cell during transmission and reducing the fragmentation rate of the cell.

[0033] As shown in Figures 1 and 2, the first silicon wafer support pad 120 includes a support member 122 and a stopper 123. The support member 122 is connected to the supporting base 110 and is used to support the battery cell. The stopper 123 is arranged on the support member 122. The stopper 123 cooperates with the support member 122 to form a stopper recess 121. The stopper 123 includes a first stopper 1232 and a second stopper 1234 respectively connected to the support member 122. The first stopper 1232 and the second stopper 1234 are arranged at an angle, and the angle is, for example, 90°.

[0034] Only one first silicon wafer support pad 120 may be provided on the cell carrier 100, as long as the first silicon wafer support pad 120 is provided around the cell placement area 112. It is understandable that the cell carrier 100 may also be provided with a plurality of first silicon wafer support pads 120, for example, more than 4. In one example, the number of first silicon wafer support pads 120 is 4 to 10. When there are multiple first silicon wafer support pads 120, the limiting recessed portions 121 of the multiple first silicon wafer support pads 120 are used to cooperate with the limiting placement of the cell.

[0035] When there are multiple first silicon wafer support pads 120, the multiple first silicon wafer support pads 120 are not directly connected, but are spaced at a certain distance, and the multiple first silicon wafer support pads 120 can be used to place the battery cell. The first silicon wafer support pads 120 are spaced apart, so that the contact area of ​​the battery cell can be reduced, which is more conducive to reducing the friction damage to the battery cell during the transmission process.

[0036] Furthermore, in one example, the cell carrier 100 has at least four first silicon wafer support pads 120 distributed at the four corners of a rectangle. In this way, the distribution uniformity of the cell support force can be improved, making the placement of the cell more stable.

[0037] In other examples, the specific distribution of the first silicon wafer support pads 120 may also be set according to the shape of the battery cell.

[0038] In one example, the cell carrier 100 further includes a second silicon wafer support pad 130. The second silicon wafer support pad 130 is disposed on the carrier base 110 and is located in the cell placement area 112. By adding the second silicon wafer support pad 130 in the cell placement area 112, the uniformity of the distribution of the cell support force can be improved, making the placement of the cell more stable. The second silicon wafer support pad 130 is preferably disposed at the center of the cell placement area 112.

[0039] It can be understood that the second silicon wafer support pad 130 has the same height as the support member 122 in the first silicon wafer support pad 120 , or the second silicon wafer support pad 130 may also be slightly higher than the support member 122 in the first silicon wafer support pad 120 .

[0040] In the specific example shown in the figure, the cell carrier 100 has four first silicon wafer support pads 120 and one second silicon wafer support pad 130. The four first silicon wafer support pads 120 are distributed at the four corners of a rectangle, and the one second silicon wafer support pad 130 is located at the center of the rectangle.

[0041] It can be understood that in other examples, the number of the second silicon wafer support pads 130 is not limited to only one, and there can be multiple, such as 2 to 10, and the specific number can be set according to factors such as the size of the battery cell.

[0042] In order to better realize elastic support and buffer protection of the battery cell, both the first silicon wafer support pad 120 and the second silicon wafer support pad 130 can be elastic pads.

[0043] In one example, the first silicon wafer support pad 120 is a rubber pad. In one example, the second silicon wafer support pad 130 is a rubber pad.

[0044] For the cell carrier 100 used in the screen printing process of heterojunction cells, since the sintering temperature of the grid line paste is generally less than 250°C, the glass transition temperature of the first silicon wafer support pad 120 and the second silicon wafer support pad 130 is preferably above 220°C. For example, the first silicon wafer support pad 120 and the second silicon wafer support pad 130 can be but not limited to polyphenylene ether pads, polycarbonate pads, isotactic polystyrene pads, polymalic acid pads, polytetrafluoroethylene pads, polyethylene naphthalate pads, polyethylene terephthalate pads, nylon MXD6 pads, nylon 9T pads, nylon 6T pads, nylon 68 pads, nylon 66 pads and nylon 6 pads. The Young's modulus of the above elastic material is less than 1GPa. The materials of the first silicon wafer support pad 120 and the second silicon wafer support pad 130 can be the same or different.

[0045] The material of the supporting base 110 can be the same as that of the first silicon wafer supporting pad 120 and the second silicon wafer supporting pad 130, such as the elastic material mentioned above; or it can be different from that of the first silicon wafer supporting pad 120 and the second silicon wafer supporting pad 130, for example, a non-elastic material with a melting point higher than 300°C and a Young's modulus higher than 10 GPa can be selected. The non-elastic material can be, but is not limited to, stainless steel, aluminum alloy, glass, etc.

[0046] In one example, an anti-slip structure (not shown in the figure) is provided on one side of the carrier base 110 away from the first silicon wafer support pad 120. Optionally, the anti-slip structure may be, but is not limited to, anti-slip grooves. Anti-slip structures such as anti-slip grooves prevent the carrier base 110 from sliding during transportation by increasing the friction between the carrier base 110 and the conveying mechanism.

[0047] A cell transport device includes a conveying mechanism and a cell carrier 100 of any of the above examples, wherein the cell carrier 100 is arranged on the conveying mechanism and transported by the conveying mechanism. The conveying mechanism may be, but is not limited to, a conveyor belt. The cell carrier 100 is used to be arranged on the conveyor belt.

[0048] The above-mentioned cell transmission device transmits the cell carrier 100 through the conveying mechanism, and the cell is loaded on the above-mentioned cell carrier 100, which changes the traditional production method of directly placing the cell on the conveyor belt. The first silicon wafer support pad 120 in the cell carrier 100 is arranged on the supporting base 110 and around the cell placement area 112. The first silicon wafer support pad 120 provides support force to the edge of the cell, reducing the contact area between the cell carrier 100 and the cell, avoiding the friction of the entire surface of the cell during the transmission process, thereby greatly reducing the damage area of ​​the film layer on the surface of the cell, so as to improve the appearance yield rate of the cell and improve the conversion efficiency of the cell. In addition, the part of the first silicon wafer support pad 120 close to the cell placement area 112 is concave to form a limiting recess 121, which is used for limiting the placement of the cell, and can prevent the cell from unexpected displacement during the transmission process, thereby improving the stability of the cell transmission and reducing the fragmentation rate of the cell.

[0049] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A battery cell carrier (100), characterized in that: The invention comprises a supporting base (110) and a first silicon wafer support pad (120), wherein the supporting base (110) has a cell placement area (112), the first silicon wafer support pad (120) is arranged on the supporting base (110) and around the cell placement area (112), and a portion of the first silicon wafer support pad (120) close to the cell placement area (112) is inwardly concave to form a limiting recessed portion (121), and the limiting recessed portion (121) is used for limiting the placement of the cell.

2. The battery cell carrier (100) according to claim 1, characterized in that: There are a plurality of first silicon wafer support pads (120), and the limiting recessed portions (121) of the plurality of first silicon wafer support pads (120) are used to cooperate with the limiting position to place the battery cell.

3. The battery cell carrier (100) according to claim 1, characterized in that: The cell carrier (100) has at least four of the first silicon wafer support pads (120) distributed at the four corners of a rectangle.

4. The battery cell carrier (100) according to claim 1, characterized in that: The first silicon wafer support pad (120) comprises a support member (122) and a limit member (123), the support member (122) being connected to the bearing base (110), the limit member (123) being arranged on the support member (122), and the limit member (123) cooperates with the support member (122) to form the limit recess (121).

5. The battery cell carrier (100) according to any one of claims 1 to 4, characterized in that: The cell carrier (100) further comprises a second silicon wafer support pad (130), wherein the second silicon wafer support pad (130) is arranged on the supporting base (110) and is located in the cell placement area (112).

6. The battery cell carrier (100) according to claim 5, characterized in that: The first silicon wafer support pad (120) is an elastic pad; and / or The second silicon wafer supporting pad (130) is an elastic pad.

7. The battery cell carrier (100) according to claim 6, characterized in that: The first silicon wafer supporting pad (120) is a rubber pad; and / or The second silicon wafer supporting pad (130) is a rubber pad.

8. The battery cell carrier (100) according to claim 7, characterized in that: The first silicon wafer support pad (120) is at least one of a polyphenylene ether pad, a polycarbonate pad, an isotactic polystyrene pad, a polymalic acid pad, a polytetrafluoroethylene pad, a polyethylene naphthalate pad, a polyethylene terephthalate pad, a nylon MXD6 pad, a nylon 9T pad, a nylon 6T pad, a nylon 68 pad, a nylon 66 pad, and a nylon 6 pad; and / or The second silicon wafer support pad (130) is at least one of a polyphenylene ether pad, a polycarbonate pad, an isotactic polystyrene pad, a polymalic acid pad, a polytetrafluoroethylene pad, a polyethylene naphthalate pad, a polyethylene terephthalate pad, a nylon MXD6 pad, a nylon 9T pad, a nylon 6T pad, a nylon 68 pad, a nylon 66 pad, and a nylon 6 pad.

9. The battery cell carrier (100) according to any one of claims 1 to 4 and 6 to 8, characterized in that: An anti-slip structure is provided on a side of the bearing base (110) away from the first silicon wafer supporting pad (120).

10. The battery cell carrier (100) according to claim 9, characterized in that: The anti-slip structure includes anti-slip grooves.

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