Welding strip bending and welding strip, upper die synchronous grasping method and synchronous grasping mechanism

Abstract

The method for bending solder strips and synchronously grabbing solder strips and upper dies proposed in the present invention realizes synchronously picking up one or two or n groups of solder strips and one or two or n upper dies, and synchronously releasing one or two or n groups of solder strips and one or two or n upper dies onto a solder strip support plate, while implementing a method for preparing solder strips by bending one or two or n groups of solder strips, thereby realizing synchronous arrangement of solder strips on multiple battery cells and arrangement and synchronous preparation of solder strips of multiple specifications, improving the efficiency of strip laying and strip making of automated equipment, and thereby improving the productivity of the equipment.

Description

Technical Field

[0001] The invention relates to the technical field of preparation, grabbing and handling of interconnection welding strips on solar cell sheets, and in particular to a welding strip bending method and a synchronous grabbing mechanism for the welding strip and an upper die synchronously. Background Art

[0002] Since the development of solar cells, dense-grid modules, especially 9-grid, 10-grid and 12-grid modules, have been well utilized and developed. However, in order to improve the efficiency, module manufacturers have not stopped researching. Therefore, the whole cell is split into 2, 3, 4, 5 or even 6 small cells. It is found that their efficiency is higher than that of the whole cell module under the same unit area. Therefore, each module manufacturer hopes to produce this kind of high-efficiency small-piece module.

[0003] However, due to the reduced size of this type of dense-grid small-piece component, the slicing of battery cells, the preparation, transportation, and positioning of solder strips without affecting production efficiency are all new technical challenges. Therefore, component manufacturers are in urgent need of automated equipment to solve these technical problems. Summary of the invention

[0004] It is necessary to propose a method for bending the solder strip and synchronously grabbing the solder strip and the upper die.

[0005] It is also necessary to propose a welding strip bending and welding strip and upper die synchronous grasping mechanism.

[0006] A method for bending a solder strip and synchronously grabbing the solder strip and an upper mold, wherein the solder strip bending, solder strip picking and placing, and upper mold picking and placing are arranged under an overall structure, so as to synchronously pick up the solder strip and the upper mold, synchronously release the solder strip and the upper mold onto a solder strip support plate, and perform a solder strip bending action to prepare the required solder strip, comprising the following steps:

[0007] Grab the prepared solder ribbon using a solder ribbon pick and place assembly;

[0008] At the same time, the upper die is picked up by the upper die pick-and-place assembly;

[0009] After the welding strip and the upper mold are placed on the welding strip support plate, the welding strip pre-bending section is bent by using the welding strip bending assembly to realize the preparation of the required welding strip while transporting the welding strip and the upper mold.

[0010] A mechanism for bending a solder strip and synchronously grabbing the solder strip and an upper mold, comprising a driving assembly and a solder strip pick-up and place assembly, a solder strip bending assembly and a solder strip support plate installed on the driving assembly. A connecting assembly is arranged below the driving assembly, and the connecting assembly is connected between the driving assembly and the solder strip pick-up and place assembly and / or the solder strip bending assembly. The solder strip pick-up and place assembly is used to pick up or put down the two ends of the solder strip. The solder strip bending assembly is arranged in the middle of the solder strip support plate and is used to bend the solder strip. The solder strip support plate is arranged below the solder strip pick-up and place assembly and the solder strip bending assembly and is used to support and lift the solder strip.

[0011] In the method of the present invention, it is possible to achieve synchronous grabbing and placement of the welding strip and the upper mold, and simultaneously bend the welding strip during its transportation. The three actions do not interfere with or affect each other and are completed synchronously. This is not achievable in the prior art, in which the grabbing of the welding strip and the grabbing and placement of the upper mold are performed by two mechanisms respectively, and have a sequence, and cannot be achieved synchronously. In addition, for the welding strip, a separate preparation mechanism is required to prepare the welding strip in advance, and then a separate bending mechanism is used to be bent, which is also a separate mechanism and a separate process, and cannot be completed synchronously. The intention of the present invention is to propose a method with a high degree of integration, coordinated actions, and synchronous realization of multiple functions, which not only simplifies the integrated equipment, but also saves the time required for a single process, and has outstanding contributions in terms of equipment intelligence and product mass production. The present invention can also realize the method of preparing solder strips by synchronously picking up one, two or n groups of solder strips and one, two or n upper dies, and synchronously releasing one, two or n groups of solder strips and one, two or n upper dies onto a solder strip support plate, while implementing a bending action on one, two or n groups of solder strips, thereby realizing the synchronous arrangement of solder strips on multiple battery cells and the arrangement and synchronous preparation of solder strips of multiple specifications.

[0012] With regard to the prior art, if individual devices or processes that realize separate functions are superimposed, it is impossible to obtain the design concept of the present invention, because the coordination relationship and connection relationship between the various devices or processes cannot be realized.

[0013] The present invention arranges the front clamp, the rear clamp, the upper mold pick-and-place assembly and the solder strip bending assembly to the same drive handling hand structure and the same drive with multiple handling hands, thereby realizing the synchronous clamping and releasing of each solder strip corresponding to each main grid line on the same solar cell, and the synchronous picking and releasing of the upper mold, and performing bending preparation on each solder strip after releasing the solder strip and the upper mold. At the same time, it also realizes the synchronous clamping and releasing of each solder strip corresponding to each main grid line on multiple solar cells, and the synchronous picking and releasing of the upper mold, and performing bending preparation on each solder strip after releasing the solder strip and the upper mold, thereby improving the efficiency of the automated equipment in laying and making the tape, thereby improving the equipment productivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the axial structure of a welding strip bending and welding strip and upper die synchronous grasping mechanism.

[0015] Figure 2 The present invention is a schematic diagram of the axial structure of a driving assembly of a welding strip bending and welding strip and upper die synchronous grasping mechanism.

[0016] Figure 3 In order to omit the driving assembly of the gripping mechanism, an axonometric structural diagram of the positional relationship between the solder strip bending, upper mold pick-and-place assembly, and solder strip clamping and releasing assembly is shown.

[0017] Figure 4 for Figure 2 Schematic diagram of the axial structure of the middle and upper mold pick and place assembly.

[0018] Figure 5 for Figure 2 Schematic diagram of the main structure of the center front clamp.

[0019] Figure 6 for Figure 4 Schematic diagram of the main structure of the medium V-shaped plate.

[0020] Figure 7 for Figure 5 Cross-sectional view in the direction shown in .

[0021] Figure 8 for Figure 2 Schematic diagram of the axial structure of the middle welding strip bending assembly.

[0022] Fig. 9 for Figure 2 A schematic diagram of the axial structure of the welding strip support plate shown in FIG.

[0023] Fig.10 The figure is a schematic diagram of the axial structure of how the solder ribbon bending assembly cooperates with the solder ribbon support plate to bend the solder ribbon.

[0024] Fig.11 for Fig.10 Schematic diagram of placing the sub-sliced ​​battery cells 200.

[0025] Fig.12 for Figure 2 Schematic diagram of the axial structure of the front center clamp and the rear clamp cooperating to clamp and release the solder strip onto the solder strip support plate.

[0026] Fig.13 For the general Figure 2 Schematic diagram of the main structure of the grabbing mechanism after the structure is replicated.

[0027] Fig.14 For the general Fig.12 When the grabbing mechanism is placed in the equipment space, the position adjustment in the three directions of X, Y and Z is realized.

[0028] Fig.15 Schematic diagram of the welding strip after bending. Schematic diagram of the main structure of the welding strip after bending.

[0029] Figure 16-20 The schematic diagrams of several different embodiments are formed by utilizing the design concept of the present invention. Of course, various embodiments are reasonable evolutions of the present invention and belong to the concept of the present invention. Fig.16 It is a structural schematic diagram in which only the solder ribbon pick-up and place assembly 20 and the solder ribbon support plate 40 are arranged on the driving assembly 10. Fig.17 It is a structural schematic diagram that only the solder ribbon picking and placing assembly 20 , the solder ribbon bending assembly 30 , and the solder ribbon supporting plate 40 are arranged on the driving assembly 10 . Fig.18 It is a structural schematic diagram that only the solder ribbon pick-up and place assembly 20 , the solder ribbon support plate 40 , and the upper mold pick-up and place assembly 50 are arranged on the driving assembly 10 . Fig.19 A solution is to set a group of synchronous grasping mechanisms below the driving assembly 10, that is, the grasping mechanism includes a solder strip picking and placing assembly 20, a solder strip bending assembly 30, a solder strip support plate 40, and an upper mold picking and placing assembly 50. Fig. 20 In order to simultaneously arrange several groups of the grabbing mechanisms below the driving assembly 10, at least three groups of welding strips can be grabbed synchronously, three groups of upper molds can be picked up and placed synchronously, and the three groups of welding strips can be bent during the transportation of the welding strips and the upper molds.

[0030] In the figure: drive assembly 10, main drive motor 11, motor mounting seat 12, screw rod 13, guide rail 14, slider 15, welding strip pick-up and place assembly 20, front clamp 21, clamp connecting plate 211, clamp drive 212, back plate 213, opening and closing plate 214, inverted "V" shaped opening 2141, clamp 215, clamp seat 216, closing limit table 2161, pressure plate 217, spring 218, pin 219, rear clamp 22, welding strip bending assembly 30, bending connecting plate 31, bending drive 32, transition connecting plate 33, bending plate 34, Groove 341, solder ribbon support plate 40, front support bar 41, elongated groove 411, rear support bar 42, groove 43 for bending the solder ribbon, side table 44, adsorption part 45, upper mold pick-up and place assembly 50, guide rail seat 51, upper mold connecting plate 52, upper mold drive 53, suction palm 54, electromagnetic suction cup 55, buffer sleeve 56, connection assembly 60, main connection plate 61, guide rod 62, solder ribbon 100, front half 101, rear half 102, small-piece battery cell 200, Z-axis adjustment mechanism 300, X-axis adjustment mechanism 400, Y-axis adjustment mechanism 500. DETAILED DESCRIPTION

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] See also Figure 16-20 A method for bending a solder strip and synchronously grabbing a solder strip and an upper mold is provided, wherein the solder strip bending, solder strip picking and placing, and upper mold picking and placing are arranged under an overall structure, so as to synchronously pick up the solder strip and the upper mold, synchronously release the solder strip and the upper mold onto a solder strip support plate 40, and perform a solder strip bending action to prepare a desired solder strip 100, comprising the following steps:

[0033] Grab the prepared solder strip using the solder strip pick and place assembly 20;

[0034] At the same time, the upper mold is picked up by the upper mold pick-and-place assembly 50;

[0035] After the solder strip and the upper mold are placed on the solder strip support plate 40, the solder strip pre-bending section is bent using the solder strip bending assembly 30, so as to prepare the required solder strip 100 while transporting the solder strip and the upper mold.

[0036] Further, the solder strips described in the synchronously grasping solder strips and the upper mold can be 1 group, 2 groups or n groups, and the upper mold can be 1, 2 or n; and the solder strips synchronously bent by the solder strip bending assembly 30 can be 1 group, 2 groups or n groups;

[0037] Furthermore, the specifications of the welding strips in the group 1, group 2 or group n may be welding strips of the same specifications, or welding strips of different specifications;

[0038] Further, the ribbon pick-and-place assembly 20 is any suction action and release action with an adsorption function, or any clamping action and release action with a clamping function;

[0039] Further, the upper mold pick-and-place assembly 20 is any suction action and release action with adsorption function.

[0040] See also Figure 1The embodiment of the present invention provides a welding strip bending and welding strip and upper mold synchronous grasping mechanism, including a driving component 10 and a welding strip picking and placing component 20, a welding strip bending component 30 and a welding strip support plate 40 installed on the driving component 10, a connecting component 60 is arranged below the driving component 10, and the connecting component 60 is connected between the driving component 10 and the welding strip picking and placing component 20 and / or the welding strip bending component 30, including the connecting component 60 and the welding strip picking and placing component 20, the welding strip bending component 30, and the upper mold picking and placing component 50 The scheme of connecting them separately, or two or one of them is to suspend the solder ribbon picking and placing assembly 20 and the solder ribbon bending assembly 30 below the driving assembly 10, and be synchronously driven back and forth by the driving assembly 10. The solder ribbon picking and placing assembly 20 is used to pick up or put down the two ends of the solder ribbon, and the solder ribbon bending assembly 30 is arranged in the middle of the solder ribbon support plate 40, and is used to bend the solder ribbon to form a front half or a rear half. The solder ribbon support plate 40 is arranged below the solder ribbon picking and placing assembly 20 and the solder ribbon bending assembly 30, and is used to support and lift the solder ribbon.

[0041] Furthermore, the connecting assembly 60 includes a main connecting plate 61 and a guide rod 62 that crosses the main connecting plate 61. The main connecting plate 61 is connected to the driving assembly 10. The guide rod 62 is passed through the top of the solder strip picking and placing assembly 20 and the solder strip bending assembly 30 to connect them to the driving assembly 10.

[0042] Furthermore, the gripping mechanism also includes an upper mold pick-up and place assembly 50, which is arranged in parallel with the solder ribbon pick-up and place assembly 20 and the solder ribbon bending assembly 30 below the driving assembly 10, and the connecting assembly 60 is connected between the driving assembly 10 and the solder ribbon pick-up and place assembly 20 and / or the solder ribbon bending assembly 30, and the upper mold pick-up and place assembly 50. The upper mold pick-up and place assembly 50 is used to pick up or release the upper mold.

[0043] Further, the solder strip pick-and-place assembly 20 includes a front clamp 21 and a rear clamp 22, which are relatively arranged at the two ends above the solder strip support plate 40, and the front clamp 21 includes a clamp connecting plate 211, a clamp drive 212, a back plate 213, an opening and closing plate 214, a plurality of clamps 215, and a plurality of limit members. The upper end of the clamp connecting plate 211 is connected to the connecting assembly 60, the clamp drive 212 is fixed on the clamp connecting plate 211, and the transmission output end of the clamp drive 212 is connected to the opening and closing plate 214 to drive the opening and closing plate 214. Moving up and down, the upper end of the back plate 213 is connected to the clamp connecting plate 211, and a plurality of clamps 215 and limit members are arranged at the lower end. The clamps 215 are set up vertically, and the limit members are arranged on both sides of the clamps 215 opposite to the back plate 213 to limit the clamps 215 on the side of the back plate 213. An inverted "V"-shaped opening 2141 for inserting the upper end of the clamp 215 is arranged on the side wall of the opening and closing plate 214. The inverted "V"-shaped opening 2141 of the opening and closing plate 214 is located above the clamp 215 and is used to control the closing and opening of the clamp 215.

[0044] Furthermore, the limiting member includes a clamp seat 216, a pressure plate 217, a spring 218, and a pin 219. The clamp seat 216 is arranged on the side wall of the back plate 213. The pin 219 passes through the pressure plate 217, the back plate 213 and the clamp therebetween. The pressure plate 217 covers the side wall of the clamp seat 216. The spring 218 is engaged between the two clamping nozzles at the upper part of the clamp so that the two clamping nozzles are in a normally open state. The two clamping nozzles at the lower part of the clamp are used to clamp or release the welding strip.

[0045] Furthermore, a closing limit platform 2161 is provided in the middle position of the lower middle part of the clamp seat 216, which is used to limit the position of the clamp when it is closed. When the clamp mouth is closed, the inner side of the clamp leans against the closing limit platform 2161, and the closing position of the clamp is limited by the closing limit platform 2161, so that the closing position of the clamp is accurate, so as to accurately clamp and release the welding strip. Preferably, the closing limit platform 2161 can be a protrusion of the clamp seat 216.

[0046] The structure of the rear clamp 22 is the same as that of the front clamp 21 , and the rear clamp 22 is symmetrically arranged with the front clamp 21 at two ends of the upper mold pick-and-place assembly 50 .

[0047] Further, the welding strip bending assembly 30 includes a bending connecting plate 31, a bending drive 32, a transition connecting plate 33, and a bending plate 34. The upper end of the bending connecting plate 31 is connected to the connecting assembly 60. The bending drive 32 is fixed on the bending connecting plate 31. The transmission output end of the bending drive 32 is connected to the transition connecting plate 33. The bending plate 34 is arranged on the transition connecting plate 33. The lower surface of the bending plate 34 is provided with corresponding grooves 341 according to the number and position of the welding strips provided in the welding strip support plate 40, which are used to limit and bend the welding strips. After the front clamp 21 and the rear clamp 22 release the welding strips to each main grid line of the solar cell, the bending plate 34 and the groove 341 limit the welding strips and bend the welding strips in the pre-bending section, so that the welding strips placed on the end of the rear support bar 42 of the welding strip support plate 40 fall into the groove and bend the welding strips in the pre-bending section of the welding strips, so that the welding strips at the end of the rear support bar 42 are slightly lower than the welding strips at the end of the front support bar 41.

[0048] The bent solder strip 100 includes a front half 101 and a rear half 102. The rear half is slightly tilted downward. After the small-piece solar cell 200 is placed on the solder strip support plate 40, the front half 101 is kept placed in the slender groove of the front support bar 41, and the rear half 102 is located on the main grid line of the small-piece solar cell 200.

[0049] Furthermore, the welding strip support plate 40 includes a plurality of front support bars 41 and a plurality of rear support bars 42 connected as one body, and an elongated groove 411 for accommodating the welding strip is arranged on the surface of the front support bar 41 and the surface of the rear support bar 42, and a groove 43 for bending the welding strip is arranged at the connecting portion of the front support bar 41 and the rear support bar 42, and the groove 43 for bending the welding strip is used to accommodate the welding strip bending assembly 30 so that the welding strip bending assembly 30 can perform the welding strip bending action, and the groove 43 for bending the welding strip is perpendicular to the plurality of elongated grooves 411 on the front support bar 41, and the projection of the elongated groove in the horizontal plane is located between two adjacent front support bars 41, and the elongated groove runs through the surface of the front support bar 41.

[0050] Furthermore, side tables 44 for overlapping the upper mold are provided on both sides of the welding strip support plate 40 .

[0051] Furthermore, an adsorption portion 45 is provided at the connection portion between the front support bar 41 and the rear support bar 42 , and a negative pressure adsorption hole is provided inside the adsorption portion 45 to be connected to an external negative pressure system.

[0052] Furthermore, the upper mold pick-and-place assembly 50 includes a guide rail seat 51, an upper mold connecting plate 52, an upper mold drive 53, and an upper mold adsorption structure. The upper end of the guide rail seat 51 is connected to the connecting assembly 60, and the guide rail seat 51 is slidably connected to the upper mold connecting plate 52 (for example, vertical guide rails and sliders are respectively provided on the guide rail seat 51 and the upper mold connecting plate 52, and the two are slidably connected to achieve sliding cooperation between the guide rail seat 51 and the upper mold connecting plate 52). The upper mold drive 53 is provided on the guide rail seat 51, and the transmission output end of the upper mold drive 53 is connected to the upper mold connecting plate 52 to drive the upper mold connecting plate 52 to move up and down. The upper mold adsorption structure is provided at both ends of the upper mold connecting plate 52, and the upper mold adsorption structure is provided above the side table 44 of the welding strip support plate 40.

[0053] Furthermore, the upper mold adsorption structure includes a suction palm 54, an electromagnetic suction cup 55, and a buffer sleeve 56. Suction palms 54 are arranged at both ends of the upper mold connecting plate 52, the electromagnetic suction cup 55 is installed on the suction palm 54, and the buffer sleeve 56 is installed on the electromagnetic suction cup 55, so as to drive the electromagnetic suction cup 55 to adsorb or release the upper mold through the upper mold drive 53.

[0054] Furthermore, the driving assembly 10 includes a main driving motor 11, a motor mounting seat 12, a screw rod 13, a guide rail 14 and a slider 15. The driving motor is mounted on one end of the motor mounting seat 12. The screw rod 13 and the guide rail 14 are arranged parallel to the motor mounting seat 12. The transmission belt of the driving motor is connected to the screw rod 13 to drive the screw rod to rotate. The slider 15 cooperates with the guide rail 14. The slider 15 is fixedly connected to the nut of the screw rod 13. The upper end of the connecting assembly 60 is connected to the slider 15.

[0055] Furthermore, driving mechanisms in the three directions of X, Y, and Z are provided above the grasping mechanism to adjust the position of the welding strip when it is pressed and bent and the welding strip and the upper mold are grasped synchronously. For example, the existing lead screw slider 15 in the three directions of X, Y, and Z can be used to achieve this. For example, the Z-direction adjustment mechanism 200, the X-direction adjustment mechanism 300, and the Y-direction adjustment mechanism 400 are shown in the figure.

[0056] The present invention also provides a method for bending a welding strip and synchronously grabbing the welding strip and an upper mold, comprising the following steps:

[0057] Grab the prepared solder strip using the front clamp 21 and the rear clamp 22 of the solder strip pick-and-place assembly 20;

[0058] At the same time, the upper mold is picked up by the upper mold pick-and-place assembly 50;

[0059] After the solder strip and the upper mold are placed on the solder strip support plate 40, the pre-bent section of the solder strip is bent using the solder strip bending assembly 30; the structure of the solder strip pick-up and place assembly 20, the upper mold pick-up and place assembly 50, and the solder strip support plate 40 is the above-mentioned structure.

[0060] The modules or units in the device of the embodiment of the present invention may be combined, divided or deleted according to actual needs.

[0061] What is disclosed above is only the preferred embodiment of this patent document, and of course it cannot be used to limit the scope of rights of the present invention. Moreover, the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. A person of ordinary skill in the art can understand that the implementation of all or part of the processes of the above-mentioned embodiments and the equivalent changes made in accordance with the claims of the present invention still fall within the scope covered by the invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present invention. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0062] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A welding strip bending and welding strip and upper die synchronous grabbing mechanism, characterized in that: The invention comprises a driving component and a solder strip pick-up and place component, an upper mold pick-up and place component, a solder strip bending component and a solder strip support plate installed on the driving component. A connecting component is arranged below the driving component. The connecting component is connected between the driving component and the solder strip pick-up and place component and / or the solder strip bending component. The solder strip pick-up and place component is used to pick up or put down the two ends of the solder strip. The upper mold pick-up and place component is arranged in parallel with the solder strip pick-up and place component and the solder strip bending component below the driving component. The connecting component is connected between the driving component and the solder strip pick-up and place component and / or the solder strip bending component and the upper mold pick-up and place component. The pick-and-place assembly is used to pick up or release the upper mold. The solder strip bending assembly is arranged in the middle of the solder strip support plate, and includes a bending connecting plate, a bending drive, a transition connecting plate, and a bending plate. The upper end of the bending connecting plate is connected to the connecting assembly, the bending drive is fixed on the bending connecting plate, and the transmission output end of the bending drive is connected to the transition connecting plate. The bending plate is arranged on the transition connecting plate. The lower surface of the bending plate is provided with corresponding grooves according to the number and position of solder strips in the solder strip support plate, which are used to limit and bend the solder strips. The solder strip support plate is arranged below the solder strip pick-and-place assembly and the solder strip bending assembly, and is used to support and lift the solder strip.

2. The welding strip bending and welding strip and upper mold synchronous grabbing mechanism according to claim 1, characterized in that: The connecting assembly includes a main connecting plate and a guide rod that crosses the main connecting plate. The main connecting plate is connected to the driving assembly. The guide rod is passed through the top of the solder strip picking and placing assembly and the solder strip bending assembly to connect them to the driving assembly.

3. The welding strip bending and welding strip and upper mold synchronous grasping mechanism according to claim 1, characterized in that: The solder strip picking and placing assembly comprises a front clamp and a rear clamp, the front clamp and the rear clamp are relatively arranged at two ends above the solder strip supporting plate, the front clamp comprises a clamp connecting plate, a clamp drive, a back plate, an opening and closing plate, a plurality of clamps, and a plurality of limit members, the upper end of the clamp connecting plate is connected to the connecting assembly, the clamp drive is fixed on the clamp connecting plate, the transmission output end of the clamp drive is connected to the opening and closing plate to drive the opening and closing plate to move up and down, the upper end of the back plate is connected to the clamp connecting plate, and a plurality of clamps and limit members are arranged at the lower end, the clamp is vertically set up, and the limit members and the back plate are relatively arranged on both sides of the clamp to limit the clamp on the side of the back plate, and an inverted "V"-shaped opening for inserting the upper end of the clamp is arranged on the side wall of the opening and closing plate, and the inverted "V"-shaped opening of the opening and closing plate is located above the clamp for controlling the opening of the clamp.

4. The welding strip bending and welding strip and upper mold synchronous grasping mechanism as claimed in claim 3, characterized in that: The limiting member includes a clamp seat, a pressure plate, a spring, and a pin shaft. The clamp seat is arranged on the side wall of the back plate. The pin shaft passes through the pressure plate, the back plate and the clamp therebetween. The pressure plate covers the side wall of the clamp seat. The spring is engaged between the two clamping nozzles on the upper part of the clamp so that the two clamping nozzles are in a normally closed state. The two clamping nozzles on the lower part of the clamp are used to clamp or release the welding strip.

5. The welding strip bending and welding strip and upper mold synchronous grabbing mechanism according to claim 4, characterized in that: A closing limit platform is arranged at the middle position of the lower middle part of the clamp seat, which is used for limiting the position of the clamp when it is closed.

6. The welding strip bending and welding strip and upper mold synchronous grasping mechanism according to claim 1, characterized in that: The welding strip support plate includes a plurality of front support bars and a plurality of rear support bars connected as one body, and slender grooves for accommodating welding strips are arranged on the surfaces of the front support bars and the surfaces of the rear support bars, and a groove for bending the welding strip is arranged at the connecting part of the front support bar and the rear support bar, and the groove for bending the welding strip is used to accommodate the welding strip bending assembly, and the groove for bending the welding strip is perpendicular to the plurality of slender grooves on the front support bar.

7. The welding strip bending and welding strip and upper mold synchronous grasping mechanism according to claim 6, characterized in that: Side tables for overlapping the upper mold are also arranged on both sides of the welding strip support plate.

8. The welding strip bending and welding strip and upper mold synchronous grasping mechanism according to claim 6, characterized in that: An adsorption portion is arranged at the connection portion of the front support bar and the rear support bar, and a negative pressure adsorption hole is arranged inside the adsorption portion to be connected with an external negative pressure system.

9. The welding strip bending and welding strip and upper mold synchronous grabbing mechanism according to claim 1, characterized in that: The upper mold pick-and-place assembly includes a guide rail seat, an upper mold connecting plate, an upper mold drive, and an upper mold suction and release structure. The upper end of the guide rail seat is connected to the connecting assembly, and the guide rail seat is slidably connected to the upper mold connecting plate. The upper mold drive is arranged on the guide rail seat, and the transmission output end of the upper mold drive is connected to the upper mold connecting plate to drive the upper mold connecting plate to move up and down. The upper mold suction and release structure is arranged at both ends of the upper mold connecting plate, and the upper mold suction and release structure is arranged above the side table of the welding strip support plate.

10. The welding strip bending and welding strip and upper mold synchronous grabbing mechanism according to claim 9, characterized in that: The upper mold suction and release structure includes a suction palm, an electromagnetic suction cup, and a buffer sleeve. Suction palms are arranged at both ends of the upper mold connecting plate, the electromagnetic suction cup is installed on the suction palm, and the buffer sleeve is installed on the electromagnetic suction cup, so that the electromagnetic suction cup is driven by the upper mold to adsorb or release the upper mold.

11. The welding strip bending and welding strip and upper mold synchronous grabbing mechanism according to claim 9, characterized in that: The upper mold suction and release structure includes a suction cup seat and a suction cup. Suction cup seats are arranged at both ends of the upper mold connecting plate. The suction cup is installed on the suction cup seat to drive the suction cup to adsorb or release the upper mold through the upper mold drive.

12. The welding strip bending and welding strip and upper mold synchronous grasping mechanism according to claim 1, characterized in that: The driving assembly includes a main driving motor, a motor mounting seat, a lead screw, a guide rail and a slider. The driving motor is mounted on one end of the motor mounting seat. The lead screw and the guide rail are arranged on the motor mounting seat in parallel. The transmission belt of the driving motor is connected to the lead screw to drive the lead screw to rotate. The slider cooperates with the guide rail. The slider is fixedly connected to the nut of the lead screw. The upper end of the connecting assembly is connected to the slider.

13. The welding strip bending and welding strip and upper mold synchronous grasping mechanism according to claim 1, characterized in that: A driving mechanism in three directions of X, Y and Z is also arranged above the grabbing mechanism to adjust the position of the welding strip when it is pressed and bent and the welding strip and the upper mold are grabbed synchronously.

14. A method for bending a solder strip and synchronously grabbing the solder strip and the upper die, implemented by the solder strip bending and synchronously grabbing the solder strip and the upper die according to any one of claims 1 to 13, characterized in that: The solder strip bending, solder strip picking and placing, and upper mold picking and placing are arranged under the overall structure to realize synchronous picking up of the solder strip and the upper mold, synchronously releasing the solder strip and the upper mold onto the solder strip support plate, and performing the solder strip bending action to prepare the required solder strip, including the following steps: Grab the prepared solder ribbon using a solder ribbon pick and place assembly; At the same time, the upper die is picked up by the upper die pick-and-place assembly; After the welding strip and the upper mold are placed on the welding strip support plate, the welding strip pre-bending section is bent by using the welding strip bending assembly to realize the preparation of the required welding strip while transporting the welding strip and the upper mold.

15. The method for bending a solder strip and synchronously grabbing the solder strip and the upper mold as claimed in claim 14, characterized in that: The solder strips described in the synchronously grasping solder strips and the upper mold are 1 group, 2 groups or n groups, and the upper molds are 1, 2 or n groups; and the solder strips synchronously bent by the solder strip bending assembly are 1 group, 2 groups or n groups.

16. The method for bending a solder strip and synchronously grabbing the solder strip and the upper mold as claimed in claim 15, characterized in that: The specifications of the welding strips in the group 1, group 2 or group n are the same specifications or different specifications.

17. The method for bending a solder strip and synchronously grabbing the solder strip and the upper mold as claimed in claim 14, characterized in that: The solder ribbon pick-and-place assembly is any suction action and release action with adsorption function, or any clamping action and release action with clamping function.

18. The method for bending a solder strip and synchronously grabbing the solder strip and the upper mold as claimed in claim 14, characterized in that: The upper mold pick-and-place assembly is any suction action and release action with adsorption function.

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