Device for detecting electrical impedance of cell layer

Abstract

The utility model discloses a device for detecting electrical impedance of a cell layer. The device for detecting the electrical impedance of the cell layer comprises a base, a chip to be detected, a top plate and an external plug, the base is provided with a lower circuit board; the chip to be detected consists of an upper glass electrode, a lower glass electrode and a cell chip body positioned between the upper glass electrode and the lower glass electrode; the top plate is provided with an upper circuit board; according to the utility model, the glass electrode for measuring the electrical impedance of the cell layer is stably and reliably connected to an external measuring circuit through a unique measuring loop design and a circuit connection mode, so that the device has stable measuring signals and strong anti-interference capability.

Description

TECHNICAL FIELD

[0001] The utility model discloses a device for detecting cell layer electrical impedance belongs to cell biology detection instrument field. BACKGROUND

[0002] The cell layer cultured in vitro has an indispensable position in the field of disease research and drug development. The common method for detecting the integrity and function of the cell layer, such as marking imaging on the cell layer or introducing biomolecules to detect the permeability of the cell layer, is an invasive detection method, and the introduced substances will have a certain impact on the cell layer. The electrical impedance detection is a non-invasive detection method, which can detect the electrical resistance and reactance of the cell layer by applying voltage or current to both sides of the cell layer, and analyze the integrity and function of the cell layer. It is a non-marking and non-invasive detection method, and has important significance in the field of cell biology research.

[0003] At present, there are mainly two kinds of devices for detecting cell layer electrical impedance. The first kind is to manually place two electrodes on both sides of the open cell layer, but the position of the electrode cannot be fixed, and the detection result has a large operation error. The second kind is to fix two electrodes on the upper and lower sides of the cell layer, generally using glass as the electrode substrate, spraying gold, silver or platinum on the glass to form an electrode pattern, and the upper and lower electrodes are in contact with the cell culture medium to form a detection circuit. Because the orientations of the upper and lower electrodes are opposite and they are in different planes, and the glass has the characteristics of being easy to break, it is difficult to stably connect the upper and lower electrodes to the detection circuit, which often causes problems such as poor contact and signal loss during measurement.

[0004] In order to solve the above-mentioned technical problems of difficult connection of glass electrodes and easy contact failure of circuit, the utility model aims to provide a device for detecting cell layer electrical impedance. CONTENT OF THE UTILITY MODEL

[0005] In order to achieve the above object, the utility model provides a device for detecting cell layer electric impedance, the device for detecting cell layer electric impedance includes: base, chip to be measured, top plate and external plug, the base is provided with lower circuit board and first electrode, the chip to be measured is composed of upper glass electrode, lower glass electrode and cell chip body between upper glass electrode and lower glass electrode, wherein, the cell chip body is provided with upper culture cavity and lower culture cavity and cell layer cavity between upper culture cavity and lower culture cavity, the top plate is provided with upper circuit board, second electrode and fourth electrode, the upper glass electrode is connected with first electrode and is connected to external plug through fourth electrode, the lower glass electrode is connected with second electrode and is connected to external plug, when the device for detecting cell layer electric impedance works, upper culture cavity and lower culture cavity are communicated with upper glass electrode and lower glass electrode respectively, and form detection loop through external plug, fourth electrode, first electrode, upper glass electrode, upper culture cavity, cell layer, lower culture cavity, lower glass electrode, second electrode and external plug, and send detection signal into external signal processing equipment through external plug.

[0006] In an alternative embodiment, the first electrode, the second electrode and the fourth electrode are respectively arranged as a first spring needle array, a second spring needle array and a fourth spring needle array.

[0007] In another alternative embodiment, the upper glass electrode is provided with an upper electrode pattern and is connected with the first spring needle array, the first spring needle array is connected to a metal contact point through a lower circuit board lead provided by the lower circuit board and is connected with the fourth spring needle array, the lower glass electrode is provided with a lower electrode pattern and is connected with the second spring needle array, and the second spring needle array and the fourth spring needle array are respectively connected with the external connector through an upper circuit board lead provided by the upper circuit board. In the detection loop of the utility model, the connection with the upper glass electrode is equivalent to the connection with the upper electrode pattern, and the connection with the lower glass electrode is equivalent to the connection with the lower electrode pattern.

[0008] Optionally, the upper electrode pattern includes a first upper electrode pattern and a second upper electrode pattern which are not communicated with each other, and the lower electrode pattern includes a first lower electrode pattern and a second lower electrode pattern which are not communicated with each other.

[0009] In an alternative embodiment, the base is in the shape of a cuboid, an open cross-shaped groove is arranged at the top of the cuboid, one lower circuit board is arranged at each of the two wings of the cross-shaped groove in the transverse direction, and each lower circuit board is provided with a first spring needle array, and the two first spring needle arrays are respectively located at the two wings of the cross-shaped groove in the transverse direction.

[0010] The to-be-tested chip is a cross-shaped structure of the upper glass electrode, the cell chip body and the lower glass electrode stacked in sequence from top to bottom, and is placed in the cross-shaped groove of the base, wherein the lower glass electrode is processed to be placed along the longitudinal direction of the cross-shaped groove, the upper glass electrode is processed to be placed along the transverse direction of the cross-shaped groove, two upper electrode patterns arranged on the upper glass electrode are located on two wings of the cross-shaped groove and are respectively connected with two first spring needle arrays located directly below, and one lower electrode pattern is arranged at the end of the longitudinal direction of the lower glass electrode.

[0011] The top plate is a hollow plate communicated with the top of the base, one second spring needle array is arranged at each end of the longitudinal direction of the top plate and is connected with the lower electrode pattern located directly below, and one fourth spring needle array is arranged at each wing of the transverse direction of the top plate and is connected with the first spring needle array located side by side.

[0012] Optionally, the detection circuit provided by the utility model is: an external plug, a fourth electrode, a first electrode, a first upper electrode pattern, an upper culture chamber, a cell layer, a lower culture chamber, a first lower electrode pattern, a second electrode, and an external plug; or

[0013] an external plug, a fourth electrode, a first electrode, a second upper electrode pattern, an upper culture chamber, a cell layer, a lower culture chamber, a second lower electrode pattern, a second electrode, and an external plug; or

[0014] an external plug, a fourth electrode, a first electrode, a second upper electrode pattern, an upper culture chamber, a cell layer, a lower culture chamber, a first lower electrode pattern, a second electrode, and an external plug; or

[0015] an external plug, a fourth electrode, a first electrode, a first upper electrode pattern, an upper culture chamber, a cell layer, a lower culture chamber, a second lower electrode pattern, a second electrode, and an external plug.

[0016] The above detection circuit is four independent detection circuits arranged in parallel, and the above upper glass electrode is divided into a first upper electrode pattern and a second upper electrode pattern, and the lower glass electrode is divided into a first lower electrode pattern and a second lower electrode pattern, and in actual application, one of the detection circuits can be selected according to the implementation requirement, or the detection can be performed by switching the plurality of detection circuits.

[0017] In another optional embodiment, a third spring needle array without circuit connection is arranged on the inner side of the fourth spring needle array in the upper circuit board, for balancing the force of the fourth spring needle array on the upper glass electrode and preventing the upper glass electrode from being broken.

[0018] Two lower circuit boards are installed on the base by means of adhesion, the lower circuit board is connected with the first spring needle array by means of welding, one side of the lower electrode pattern is connected with one side of the cell chip body by means of adhesion or plasma bonding, the other side of the upper electrode pattern is connected with the other side of the cell chip body by means of adhesion or plasma bonding, the upper circuit board is connected with the second spring needle array, the third spring needle array and the fourth spring needle array by means of welding, and the upper circuit board is connected with the external connector by means of welding.

[0019] In an optional embodiment, the lower glass electrode has the same thickness as the lower circuit board, the first spring needle array has the same length as the third spring needle array, the second spring needle array has the same length as the fourth spring needle array, the thickness of the lower electrode pattern, the upper electrode pattern, the circuit board lead and the metal contact site is 100-300 nanometers, the thickness of the cell chip body is equal to 70%-85% of the length of the first spring needle array, the sum of 70%-85% of the length of the first spring needle array, the length of the third spring needle array and the thickness of the upper glass electrode is equal to 70%-85% of the length of the fourth spring needle array.

[0020] In an optional embodiment, the material of the base is alloy, the material of the upper electrode pattern and the lower electrode pattern is gold, and the material of the cell chip body is polydimethylsiloxane.

[0021] In an optional embodiment, the external connector is a USB-C connector.

[0022] Array nuts are arranged at four corners of the top plate, array bolts corresponding to the array nuts are arranged at four corners of the base, and the device for detecting the electrical impedance of the cell layer is assembled and formed by the array nuts and the array bolts. Advantages

[0023] The utility model uses the spring needle array bridging mode to connect the electrode patterns in opposite directions to the same circuit board and external connector, belongs to the complex circuit connection through the structure design, and the more traditional or easy to think scheme such as welding the wire to the electrode in opposite directions, sticking to the electrode with conductive adhesive tape or clamping the electrode with alligator clamp and finally leading out to the external circuit, there is the risk of electrode pattern damage leading to test sample failure or unstable signal, the spring needle array of the utility model can also fix the electrode, the electrode cannot move after the spring needle is pressed, and the stability of the test is more guaranteed, and the fixation of the electrode can resist slight vibration interference.

[0024] The spring needle array has multiple needle contacts, the device connects 4 or 5 contacts to the same electrode pattern, avoids the circuit breakage caused by single contact failure, and improves the durability of the equipment.

[0025] The clamping scheme of the device considers the stress condition of the glass electrode, and a pair of needle arrays is arranged on the upper and lower glasses to balance the stress, and an additional array is arranged on the upper glass electrode to reduce the bending deformation of the upper glass, so that the sample is not invalid due to fracture.

[0026] The utility model provides 4 independent detection loops which are arranged in parallel, in actual application, one of the detection loops can be selected according to the implementation requirement, or a plurality of detection loops can be switched to carry out detection. BRIEF DESCRIPTION OF DRAWINGS

[0027] Figure 1 . The exploded view of the device for detecting the electrical impedance of the cell layer,

[0028] Figure 2 . The assembly schematic view of the circuit board lead connected with the first spring needle array and the metal contact site connected with the fourth spring needle array,

[0029] Figure 3 . The assembly schematic view of the upper glass electrode, the cell chip body and the lower glass electrode,

[0030] Figure 4 . The assembly schematic view of the upper circuit board, the second spring needle array, the fourth spring needle array and the external plug,

[0031] Figure 5 . The overall assembly schematic view of the device for detecting the electrical impedance of the cell layer

[0032] Figure 6 . The cell chip body structure and the detection loop schematic view of the device for detecting the electrical impedance of the cell layer,

[0033] Figure 7 . The actual detection result view of the device for detecting the electrical impedance of the cell layer.

[0034] Digital identification description

[0035] 1 - base;

[0036] 2 - array bolt;

[0037] 3 - lower circuit board;

[0038] 31 - metal contact site;

[0039] 32 - lower circuit board lead;

[0040] 4 - first spring needle array;

[0041] 5 - lower glass electrode;

[0042] 51 - lower electrode pattern;

[0043] 51A - first lower electrode pattern;

[0044] 51B - first lower electrode pattern;

[0045] 6 - cell chip body;

[0046] 61 - cell layer;

[0047] 62 - culture chamber;

[0048] 62A - upper culture chamber;

[0049] 62B - lower culture chamber;

[0050] 62C - electrode connection hole of upper culture chamber;

[0051] 62D - electrode connection hole of lower culture chamber;

[0052] 7 - upper glass electrode;

[0053] 71 - upper electrode pattern;

[0054] 71A - first upper electrode pattern;

[0055] 71B - first upper electrode pattern;

[0056] 8 - upper circuit board;

[0057] 81 - upper circuit board lead;

[0058] 9 - array nut;

[0059] 10 - second spring needle array;

[0060] 11 - third spring needle array;

[0061] 12 - fourth spring needle array;

[0062] 13 - external connector (USB-C connector). DETAILED DESCRIPTION

[0063] The advantages and features of the present application will become more apparent with the following description of specific embodiments. These embodiments are merely exemplary and do not limit the scope of protection defined by the claims of the present application.

[0064] Structural embodiments

[0065] Attached Figures 1-6 A specific embodiment of the present application is shown:

[0066] As Figure 1As shown, the device for detecting cell layer resistance impedance of the present embodiment is divided into three parts: the base 1 composed of the lower circuit board 3 and the first spring needle array 4 at the bottom, the chip to be tested composed of the cell chip body 6, the lower glass electrode 5, the lower electrode pattern 51, the upper glass electrode 7 and the upper electrode pattern 71 at the middle, and the upper circuit board 8 (top plate) composed of the second spring needle array 10, the third spring needle array 11 and the fourth spring needle array 12 at the upper part. The external plug 13 is connected to the upper circuit board 8. Array nuts 9 are arranged at the four corners of the top plate, and array bolts 2 corresponding to the array nuts are arranged at the four corners of the base 1. The device for detecting cell layer resistance impedance is assembled by the array nuts 9 and the array bolts 2.

[0067] The base 1 is in the shape of a rectangular cuboid, and an open cross-shaped groove is arranged in the middle. Two lower circuit boards 3 are arranged at the two wings (two ends perpendicular to the longitudinal direction) of the cross-shaped groove, respectively. The first spring needle array 4 is arranged on each lower circuit board 3. The lower circuit board 3 and the first spring needle array 4 are connected by welding.

[0068] As shown in Figure 2 The number of the first spring needle array 4 is 5, which is connected to the metal contact site 31 through the lower circuit board lead 32. The two lower circuit boards 3 are installed on the base 1 by adhesion.

[0069] As shown in Figure 3 The chip to be tested is composed of the upper glass electrode 7, the lower glass electrode 5 and the cell chip body 6 between the upper glass electrode 7 and the lower glass electrode 5. The surface of the lower glass electrode 5 is sprayed with the lower electrode pattern 51, and the surface of the upper glass electrode 7 is sprayed with the upper electrode pattern 71. The side of the lower glass electrode 5 with the electrode pattern is connected to one side of the cell chip body 6 by adhesion or plasma bonding, and the side of the upper glass electrode 7 with the electrode pattern is connected to the other side of the cell chip body 6 by adhesion or plasma bonding.

[0070] As shown in Figure 4 The top plate is provided with the upper circuit board 8, on which two second spring needle arrays 10, two third spring needle arrays 11 and two fourth spring needle arrays 12 are arranged. The upper circuit board 8 is connected to the second spring needle array 10, the third spring needle array 11 and the fourth spring needle array 12 by welding. The second spring needle array 10 and the fourth spring needle array 12 are connected to the plug 13 through the upper circuit board lead 81.

[0071] As shown in Figure 1 and Figure 5As shown, after assembly, the lower electrode pattern 51 of the lower glass electrode 5 contacts the second spring pin array 10, is connected to the upper circuit board 8 through the second spring pin array 10, and is then connected to the plug 13 through the upper circuit board lead 81.

[0072] The upper electrode pattern 71 of the upper glass electrode 7 is connected to the lower circuit board 3 via the first spring pin array 4, and then connected to the metal contact point 31 via the lower circuit board lead 32. The metal contact point 31 connects the upper electrode pattern 71 of the upper glass electrode 7 to the upper circuit board 8 via the fourth spring pin 12, and is connected to the plug 13 via the upper circuit board lead 81.

[0073] The third spring pin array 11 is not connected to the upper circuit board 8. It is only used to balance the force exerted by the spring pin array 4 on the upper glass electrode 7 and prevent the upper glass electrode 7 from breaking.

[0074] like Figure 6 As shown, the cell chip body 6 includes a culture chamber 62 and a cell layer 61 located between the upper and lower culture chambers. The culture chamber 62 is divided into an upper culture chamber 62A and a lower culture chamber 62B according to its position relative to the cell layer 61. The upper culture chamber 62A has an upper culture chamber electrode connection hole 62C, and the lower culture chamber 62B has a lower culture chamber electrode connection hole 62D. The upper and lower culture chambers are connected, and the cell chip body 6 is plasma-bonded to the upper and lower glass electrodes. The upper and lower chambers are exposed on the upper and lower electrode patterns, respectively. During impedance measurement, the cell culture medium fills the culture chamber 62 of the cell chip body, and the cell layer 61 is completely immersed in the cell culture medium.

[0075] Finally, the above connection method stably connects the upper electrode pattern 71 and the lower electrode pattern 51 to the plug 13, and the plug 13 is then connected to the electrical impedance analyzer, thus realizing the measurement circuit of electrical impedance analyzer-upper electrode pattern 71-culture chamber 62-cell layer 61-cell culture medium 62-lower electrode pattern 51-electrical impedance analyzer, and stably measuring the electrical impedance of the cell layer.

[0076] In an optional technical solution, the upper electrode pattern 71 is designed to include a first upper electrode pattern 71A and a second upper electrode pattern 71B, which are not connected to each other, and the lower electrode pattern 51 is designed to include a first lower electrode pattern 51A and a second lower electrode pattern 51B, which are not connected to each other. Based on this design, the detection circuit of this utility model has four independently selectable detection circuits:

[0077] External plug 13, fourth electrode 12, first electrode 4, first upper electrode pattern 71A, upper culture chamber 62A, cell layer 61, lower culture chamber 62B, first lower electrode pattern 51A, second electrode 10, external plug 13; or

[0078] the external plug 13, the fourth electrode 12, the first electrode 4, the second upper electrode pattern 71B, the upper culture chamber 62A, the cell layer 61, the lower culture chamber 62B, the second lower electrode pattern 51B, the second electrode 10, the external plug 13; or

[0079] the external plug 13, the fourth electrode 12, the first electrode 4, the second upper electrode pattern 71B, the upper culture chamber 62A, the cell layer 61, the lower culture chamber 62B, the first lower electrode pattern 51A, the second electrode, the external plug 13; or

[0080] the external plug 13, the fourth electrode 12, the first electrode 4, the first upper electrode pattern 71A, the upper culture chamber, the cell layer 61, the lower culture chamber 62B, the second lower electrode pattern 51B, the second electrode 10, the external plug 13.

[0081] Preparation Example

[0082] This embodiment is a specific implementation scheme of the utility model.

[0083] The base 1 has a length, width and height of 95*55*8.5 mm, an inner depth of 7.5 mm, and is made of an alloy material. The lower glass electrode 5 has a length, width and height of 75*25*1 mm and is placed on the groove of the base 1. The upper glass electrode 7 has a length, width and height of 35*18*1 mm. The lower electrode pattern 51 and the upper electrode pattern 71 are made of gold. The cell chip body 6 has a size of 32*18*2.6 mm and is made of polydimethylsiloxane (PDMS).

[0084] The two lower circuit boards 3 have a size of 18*11*1 mm and are installed on the groove of the base 1 by means of gluing and are located on both sides of the lower glass electrode 5. The first spring needle array 4 has a number of 5 and a length of 3.5 mm. The lower circuit board and the first spring needle array are connected by means of welding. One side of the lower electrode pattern 51 and one side of the cell chip body 6 are connected by means of gluing or plasma bonding.

[0085] The upper circuit board 8 has a size of 95*55*2 mm. The third spring needle array 11 (having a number of 5) has a length of 3.5 mm. The second spring needle array 10 (having a number of 16) and the plug 13 are USB-C connectors. The upper circuit board 8, the second spring needle array 10, the third spring needle array 11 and the fourth spring needle array 12 are connected by means of welding. The upper circuit board and the plug 13 are connected by means of welding. One side of the upper electrode pattern 71 and the other side of the cell chip body 6 are connected by means of gluing or plasma bonding.

[0086] The thickness of the lower glass electrode 5 is the same as that of the lower circuit board 3, the length of the first spring needle array 4 is the same as that of the third spring needle array 11, the length of the second spring needle array 10 is the same as that of the fourth spring needle array 12, the thickness of the lower electrode pattern 51 and the upper electrode pattern 71, the thickness of the lower circuit board lead 32 and the upper circuit board lead 81, the metal contact site 31 is 200 nanometers, the thickness of the cell chip body 6 is equal to 70% to 85% of the length of the first spring needle array 4, 70% to 85% of the length of the first spring needle array 4 plus 70% to 85% of the length of the third spring needle array 11 plus the thickness of the upper glass electrode 7 is equal to 70% to 85% of the length of the fourth spring needle array 12, so as to realize the optimal spring needle contact performance.

[0087] Application Example

[0088] Appendix Figure 7 It is a Bode diagram for detecting the electrical impedance of the intestinal cell layer by using the utility model, the device starts to detect from five hours after the cell is spread on the chip, and the stable and undisturbed result diagram of the measured signal is detected to 191 hours.

Claims

1. A device for detecting cell layer electrical impedance, characterized in that, The device for detecting the impedance of the cell layer comprises a base, a chip to be tested, a top plate and an external plug; the base is provided with a lower circuit board and a first electrode; the chip to be tested is provided with an upper glass electrode, a lower glass electrode and a cell chip body between the upper glass electrode and the lower glass electrode, wherein the cell chip body is provided with an upper culture cavity and a lower culture cavity, and a cell layer between the upper culture cavity and the lower culture cavity; the top plate is provided with an upper circuit board, a second electrode and a fourth electrode; the upper glass electrode is connected with the first electrode and connected to the external plug through the fourth electrode; the lower glass electrode is connected with the second electrode and connected to the external plug; when the device for detecting the impedance of the cell layer works, the upper culture cavity and the lower culture cavity are communicated with the upper glass electrode and the lower glass electrode respectively, a detection loop is formed by the external plug, the fourth electrode, the first electrode, the upper glass electrode, the upper culture cavity, the cell layer, the lower culture cavity, the lower glass electrode, the second electrode and the external plug, and a detection signal is sent to an external signal processing device through the external plug.

2. The apparatus for detecting electrical impedance of a cell layer according to claim 1, wherein, The first electrode, the second electrode and the fourth electrode are respectively arranged as a first spring needle array, a second spring needle array and a fourth spring needle array.

3. The apparatus for detecting electrical impedance of a cell layer according to claim 2, wherein, The upper glass electrode is provided with an upper electrode pattern and connected with the first spring needle array in abutment, the first spring needle array is connected to a metal contact point through a lower circuit board lead of the lower circuit board and connected with the fourth spring needle array in abutment; the lower glass electrode is provided with a lower electrode pattern and connected with the second spring needle array in abutment; the second spring needle array and the fourth spring needle array are respectively connected with the external plug through upper circuit board leads of the upper circuit board.

4. The apparatus for detecting electrical impedance of a cell layer according to claim 3, wherein, The upper electrode pattern comprises a first upper electrode pattern and a second upper electrode pattern which are not communicated with each other, and the lower electrode pattern comprises a first lower electrode pattern and a second lower electrode pattern which are not communicated with each other.

5. The apparatus for detecting electrical impedance of a cell layer according to claim 4, wherein, The base is in the shape of a rectangular parallelepiped, an open cross-shaped groove is arranged at the top of the rectangular parallelepiped, and a lower circuit board is arranged at each of the two wings in the transverse direction of the cross-shaped groove, and each lower circuit board is provided with a first spring needle array; The chip to be tested is in the shape of a cross structure with the upper glass electrode, the cell chip body and the lower glass electrode stacked in sequence from top to bottom, and is arranged in the cross-shaped groove of the base, wherein the two upper electrode patterns arranged in the upper glass electrode are located at the two wings of the cross-shaped groove and are connected with the two first spring needle arrays arranged below in abutment, and a lower electrode pattern is arranged at the end of the lower glass electrode in the longitudinal direction; The top plate is arranged as a hollow plate communicated with the top of the base, a second spring needle array is arranged at each of the two ends in the longitudinal direction of the top plate and connected with the lower electrode pattern arranged below in abutment, and a fourth spring needle array is arranged at each of the two wings in the transverse direction of the top plate and connected with the first spring needle array arranged side by side.

6. The apparatus for detecting electrical impedance of a cell layer according to claim 5, wherein, The detection circuit for detecting the resistance of the cell layer comprises an external plug, a fourth electrode, a first electrode, a first upper electrode pattern, an upper culture chamber, a cell layer, a lower culture chamber, a first lower electrode pattern, a second electrode, and an external plug; or The detection circuit for detecting the resistance of the cell layer comprises an external plug, a fourth electrode, a first electrode, a second upper electrode pattern, an upper culture chamber, a cell layer, a lower culture chamber, a second lower electrode pattern, a second electrode, and an external plug; or The detection circuit for detecting the resistance of the cell layer comprises an external plug, a fourth electrode, a first electrode, a second upper electrode pattern, an upper culture chamber, a cell layer, a lower culture chamber, a first lower electrode pattern, a second electrode, and an external plug; or The detection circuit for detecting the resistance of the cell layer comprises an external plug, a fourth electrode, a first electrode, a first upper electrode pattern, an upper culture chamber, a cell layer, a lower culture chamber, a second lower electrode pattern, a second electrode, and an external plug.

7. The apparatus for detecting electrical impedance of a cell layer according to claim 5, wherein A third spring needle array without circuit connection is arranged on the inner side of the fourth spring needle array in the upper circuit board, for balancing the force of the fourth spring needle array on the upper glass electrode and preventing the upper glass electrode from being broken.

8. The apparatus for detecting electrical impedance of a cell layer according to claim 7, wherein, The lower circuit board is glued to the base, the lower circuit board is connected to the first spring needle array by welding, one side of the lower electrode pattern is connected to one side of the cell chip body by gluing or plasma bonding, the other side of the upper electrode pattern is connected to the other side of the cell chip body by gluing or plasma bonding, the upper circuit board is connected to the second spring needle array, the third spring needle array, and the fourth spring needle array by welding, and the upper circuit board is connected to the external plug by welding.

9. The apparatus for detecting electrical impedance of a cell layer according to claim 7, wherein, The thickness of the lower glass electrode and the lower circuit board is the same, the length of the first spring needle array and the third spring needle array is the same, the length of the second spring needle array and the fourth spring needle array is the same, the thickness of the lower electrode pattern, the upper electrode pattern, the circuit board lead, and the metal contact site is 100-300 nanometers, the thickness of the cell chip body is equal to 70%-85% of the first spring needle array, the sum of 70%-85% of the length of the first spring needle array, the length of the third spring needle array, and the thickness of the upper glass electrode is equal to 70%-85% of the length of the fourth spring needle array.

10. The apparatus for detecting electrical impedance of a cell layer according to claim 6, wherein, The base is made of alloy, the upper electrode pattern and the lower electrode pattern are made of gold, and the cell chip body is made of polydimethylsiloxane.

11. The apparatus for detecting electrical impedance of a cell layer according to claim 1, wherein, Array nuts are arranged at the four corners of the top plate, and array bolts corresponding to the array nuts are arranged at the four corners of the base, and the device for detecting the resistance of the cell layer is assembled by the array nuts and the array bolts.

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