Memory device including memory blocks performing sub-block operations
By employing a chip stacking structure and cell array structure with sub-block operation in the memory device, the problem of increased chip size in 3D NAND flash memory has been solved, thereby improving the performance and reliability of the memory device.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SAMSUNG ELECTRONICS CO LTD
- Filing Date
- 2025-10-30
- Publication Date
- 2026-06-05
AI Technical Summary
As memory cell size decreases, the integration density of 3D NAND flash memory increases, leading to larger chip size, and the need for spare memory blocks affects reliability and availability.
By implementing sub-block operations on a single memory block in a memory device, including chip stack structures and cell array structures, multiple sub-blocks are used for erase, program, verify, and read operations, thereby reducing chip size and improving performance.
This enables a reduction in the chip size of memory devices while improving their performance and reliability, supporting the reliability, availability, and serviceability of memory controllers.
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Abstract
Citation Information
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