Phosphorus gettering process of silicon chip,Method for preparing three-dimensional cell chip,Inorganic adhesive for aluminum paste of silicon solar cells and preparation method thereof,Integrated amorphous silicon double-junction solar cell curtain wall and methods for manufacturing and using the same,Method and system for per-cell interference estimation for interference suppression

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128 results about "Cell chip" patented technology

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Cell chip - Computer Definition. A CPU chip developed by IBM, Sony and Toshiba that is designed for media processing such as in high-definition TV sets. Using an enhanced PowerPC CPU and eight floating point units, the Cell is expected to achieve an effective clock speed close to 5 GHz.

Phosphorus gettering process of silicon chip

InactiveCN101667605AImprove electrical performance parametersIncreased average life expectancyFinal product manufactureSemiconductor devicesEtchingSurface oxidation

The invention relates to a phosphorus gettering process of silicon chips in the manufacture of solar cells, which comprises the following steps: putting sueded silicon chips into a diffusion furnace for pre-deposition, removing a phosphorosilicate glass layer after diffusion, soaking the silicon chips through distributed processing in a hydrofluoric acid solution, and removing oxide layers from the surfaces of the silicon chips; then putting the silicon chips after washing into the diffusion furnace for secondary diffusion processing, taking the silicon chips out from the diffusion furnace after the processing of the secondary diffusion working procedure, cooling the silicon chips to room temperature, and measuring the square resistance of the silicon chips. The invention can effectively decrease heavily doped 'dead layers' and greatly prolong the average minority carrier lifetime of the silicon chips; after the processes including etching, PECVD, silk screen sintering and the like arefinished according to the normal process of a cell chip, the average transformation efficiency of the made cell chip is further improved, and the cell chip has better electrical performance parameters.

Owner:无锡尚品太阳能电力科技有限公司

Method for preparing three-dimensional cell chip

InactiveCN101892285AImprove reliabilityImprove accuracyMicrobiological testing/measurementCell chipMicroarray

The invention discloses a method for preparing a three-dimensional cell chip. The method comprises the following steps of: preparing sol solution for forming a micro-pore array; preparing sol solution mixed with cell culture fluid; preparing a micro-pore array; then preparing cell-containing cell culture fluid; preparing cell-gel suspension; and finally stamping cells into the micro-pore array. Or the method comprises the following steps of: preparing the sol solution for forming the micro-pore array; preparing the micro-pore array; then preparing the cell-containing cell culture fluid; and finally stamping the cells into the micro-pore array. In the cell chip prepared by the invention, the cells grow in a three-dimensional culture mode, so that the cell chip has the advantages of high reliability and high accuracy on research results.

Owner:XI AN JIAOTONG UNIV

Inorganic adhesive for aluminum paste of silicon solar cells and preparation method thereof

ActiveCN101555388ASmall expansion coefficientLess bendingFinal product manufactureInorganic adhesivesAdhesiveSilicon solar cell

The invention provides inorganic adhesive for the aluminum paste of silicon solar cells and a preparation method thereof. The inorganic adhesive comprises the following components by the weight part: 10% to 20% of SiO2, 15% to 30% of B2O3, 5% to 15% of Al2O3, 15% to 35% of Bi2O3, 10% to 18% of ZrO2, 10% to 25% of ZnO and 1% to 8% of MoO with the total amount being 100%. The preparation method comprises the following steps: putting the components forming the inorganic solvent into a mixer to mix the components uniformly; loading the mixed components into a porcelain crucible and placing the porcelain crucible into a baking oven to be dried at the temperature of 120 to 150 DEG C for 3 to 5 hours; then, placing the porcelain crucible into a high-temperature furnace to melt at the temperature of 800 to 1,100 DEG C for melting for 1 to 2 hours; carrying out water-quenching and oven-drying; milling the components with a planetary ball mill until the particle size is lower than 10 mum; and oven-drying the components to obtain the final product of the inorganic adhesive. The glass powder has lower softening temperature and high adhesion when the aluminum paste prepared from the inorganic solvent is used for sintering, so that the aluminum powder layer can be firmly adhered to silicon chips; the expansion coefficient is lower after sintering; the bending degree of cell chips is lower; and the breakage rate is reduced.

128 results about "Cell chip" patented technology

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