2 results about "Spot analysis" patented technology

This application discloses a laser annealing system, comprising: a laser for generating a laser beam and focusing it onto a predetermined area of ​​a wafer to form a spot on the wafer surface; a camera for acquiring an image of the spot; a spot analysis system communicatively connected to the camera for analyzing the image of the spot to obtain temperature information of the spot; and a controller communicatively connected to both the laser and the spot analysis system, configured to adjust the energy of the laser beam based on the temperature information of the spot. This avoids the problem of excessively high actual temperature on the wafer surface due to laser overcompensation, thereby improving the annealing quality.

The present application relates to a laser focusing spot measuring system based on different wavelengths, which comprises a shell and an analysis assembly, the shell is provided with an opening, and the analysis assembly is arranged in the shell and used for spot analysis, the analysis assembly comprises a collimating lens and a wedge prism used for decomposing laser into reflected beams and transmitted beams, a measuring camera used for measuring the reflected beams and a tail light absorber used for absorbing the transmitted beams, the collimating lens is arranged at the opening, and the wedge prism is arranged between the collimating lens and the measuring camera, wherein one of the analysis assemblies is provided with a focusing lens, and the focusing lens is arranged between the wedge prism and the measuring camera. The present application can be applied to high-power laser measuring analysis of different wavelengths, and cost reduction is realized.