Decapsulation lead frame jig and decapsulation test equipment
By using test boards and non-conductive glue to fix the conductive pins in the unpackaged lead frame fixture, the problem of easy movement or missing conductive pins is solved, and the improvement of the pin stability and testing efficiency after packaging is achieved.
Patent Information
- Application Number
- CN202421010642.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-10
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2034-05-10
AI Technical Summary
In the prior art, when depacking the QFN package, the conductive pins are prone to move or missing, causing the leads to be disengaged and broken, affecting the results of the depacket analysis.
Designed a depacket lead frame fixture, including test board and insulation, with a central pad and test pins on the test board, the insulation is filled between the pad and pin, and the pin is fixed with non-conductive glue. , prevent it from shifting and scattering.
Effectively prevent the conductive pins from scattering and shifting after depackaging, improve the reliability and accuracy of packaging testing, facilitate electrical performance testing and analysis, easy operation and high testing efficiency.
Smart Images
Figure CN222233606U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of depackaging of a lead frame, in particular to a depackaging lead frame jig and depackaging testing equipment. Background Art
[0002] QFN (Quad Flat No-leads Package) is a square flat no-lead package, which is square or rectangular. There is a base island at the bottom center of the packaged product. The base island uses a large exposed pad for heat conduction. There are multiple conductive pins for electrical connection on the periphery and intervals of the base island. Since the conductive pins are fixed with a resin plastic package, when the existing conventional manual chemical decapping technology is used for product decapsulation analysis, it is very easy to cause the conductive pins to move or be missing, resulting in the detachment and breakage of the internal leads of the product, thereby affecting the decapsulation analysis results. Utility Model Content
[0003] The utility model aims to provide a decapsulation lead frame jig and a decapsulation test device, which can prevent the conductive pins from falling off and shifting after decapsulation.
[0004] The embodiment of the utility model is achieved as follows:
[0005] In a first aspect, the utility model provides a lead frame decapsulation jig, comprising:
[0006] A test board, wherein the test board is provided with a central pad and a plurality of test pins arranged at the periphery of the central pad; the test board is used to be connected to a lead frame to be tested;
[0007] An insulating member is disposed between the central pad and the test pin.
[0008] In an optional implementation, the insulating member is made of non-conductive glue.
[0009] In an optional implementation, the test pins are symmetrically arranged about the center pad.
[0010] In an optional embodiment, the test board has four first corners, each of the first corners is provided with a first pin, and the first pins are symmetrically distributed about a diagonal line of the test board.
[0011] In an optional embodiment, the first pin includes a positioning portion and a testing portion that are connected to each other, and an area of the testing portion is larger than an area of the positioning portion.
[0012] In an optional embodiment, the testing portion is away from an edge of the testing board relative to the positioning portion.
[0013] In an optional embodiment, the cross-section of the test board is polygonal, and the test pin is provided on each side; among the several test pins on each side, the test pins at both ends are shorter, and the test pins in the middle are longer.
[0014] In an optional embodiment, the central pad has four second corners, and each of the second corners is provided with a connecting rib extending in a direction away from the central pad.
[0015] In an optional embodiment, a cutting path is provided on the test board, and the test pins are connected to the cutting path. When the cutting path is removed, the plurality of test pins are independent of each other.
[0016] In a second aspect, the utility model provides a decapsulation test device, comprising a tester and a decapsulation lead frame jig as described in any one of the aforementioned embodiments.
[0017] The beneficial effects of the embodiments of the utility model include:
[0018] The decapsulation lead frame jig provided by the embodiment of the utility model can be used as a decapsulation auxiliary jig for the lead frame, effectively preventing the conductive pins of the decapsulated lead frame from being scattered and shifted, and can facilitate the electrical performance testing and analysis of the decapsulated lead frame, with convenient operation and high testing efficiency.
[0019] The decapsulation test equipment provided by the embodiment of the utility model includes a tester and the above-mentioned decapsulation lead frame fixture, which can prevent the conductive pins of the decapsulated lead frame from scattering and shifting. It can also facilitate the electrical performance testing and analysis of the decapsulated lead frame, which is easy to operate and has high testing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0021] Figure 1 A schematic diagram of the structure of a lead frame decapsulation jig provided by an embodiment of the utility model;
[0022] Figure 2 for Figure 1 A schematic diagram of the local enlarged structure at M in the middle;
[0023] Figure 3 A schematic diagram of the structure of the depackaging lead frame jig after edge cutting provided by an embodiment of the utility model.
[0024] Icon: 110 - test board; 101 - first corner; 111 - cutting path; 120 - insulating member; 130 - center pad; 140 - test pin; 141 - first pin; 1411 - positioning part; 1413 - test part; 143 - second pin; 150 - connecting rib. DETAILED DESCRIPTION
[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.
[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0027] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0028] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0029] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0030] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0031] Please refer to Figures 1 to 3 The present embodiment provides a decapsulation lead frame fixture, which includes a test board 110 and an insulating member 120. The test board 110 is provided with a central pad 130 and a plurality of test pins 140 disposed on the periphery of the central pad 130. The test board 110 is used to connect to the lead frame to be tested. The insulating member 120 is disposed between the central pad 130 and the test pins 140. The decapsulation lead frame fixture facilitates the decapsulation test of the lead frame and prevents the conductive pins of the lead frame from shifting or scattering after decapsulation. The test is convenient and the fixation is reliable.
[0032] The insulating member 120 is made of non-conductive glue. The non-conductive glue is filled between the central pad 130 and the test pin 140, making the structure more flat and reliable. Furthermore, the non-conductive glue is also filled between each test pin 140, connecting multiple test pins 140 as a whole, avoiding the test pins 140 from being scattered or shifted after the subsequent trimming process, thereby improving the test accuracy of the lead frame to be tested.
[0033] The non-conductive adhesive is acid-resistant and high-temperature-resistant. For example, at a temperature of 250°C, the non-conductive adhesive can be guaranteed not to melt for at least 3 minutes. In addition, the non-conductive adhesive can prevent solder from flowing on the surface of the non-conductive adhesive, thereby avoiding the risk of short circuit of multiple test pins 140. The non-conductive adhesive can use existing glue, such as glue with model PSR-4000EY / CA-40ER.
[0034] Optionally, the test pins 140 are symmetrically arranged about the center pad 130. The center pad 130 can be used to achieve grounding of the decapsulated product. The test pins 140 are used to connect to the conductive pins of the lead frame to be tested. For example, when it is necessary to perform an electrical performance test and analysis on the lead frame to be tested, the conductive pins of the lead frame to be tested can be welded to the test pins 140 of the test board 110. The number of test pins 140 can be greater than or equal to the number of conductive pins, and it is ensured that each conductive pin is welded to a test pin 140.
[0035] In order to meet the test requirements of lead frames of more sizes, the center pad 130 in this embodiment can be made as small as possible to provide more design and layout space for the distribution of the test pins 140. The test pins 140 can be made relatively longer, so that more lead frame package products with the same spacing of the outer ring conductive pins but different appearance sizes can be adapted to a certain extent, and the adaptability is stronger. There is no need to design a corresponding decapsulation lead frame fixture for each lead frame to be tested, which saves costs and improves production efficiency.
[0036] Optionally, the test board 110 is made of a metal plate. For example, the test board 110 is made of a copper plate. The test board 110 is rectangular or square. The test board 110 has four first corners 101. Each first corner 101 is provided with a first pin 141. It can be understood that the test pin 140 at the first corner 101 is defined as the first pin 141, and the remaining test pins 140 are defined as the second pin 143.
[0037] In this embodiment, each first corner 101 is provided with six first pins 141. Alternatively, in some embodiments, each first corner 101 may also be provided with two, four, or eight, etc. Optionally, the number of first pins 141 provided at each first corner 101 is an even number. The first pins 141 at the first corner 101 are symmetrically distributed about the diagonal line of the test board 110.
[0038] Optionally, the first pin 141 includes a connected positioning portion 1411 and a testing portion 1413, and the area of the testing portion 1413 is larger than the area of the positioning portion 1411. In this embodiment, the width D of the testing portion 1413 is larger than the width of the positioning portion 1411, and the width of the testing portion 1413 is larger than the width of the second pin 143. This is conducive to increasing the electrical connection contact area, thereby improving the electrical connection reliability of the first pin 141 and the convenience of the electrical connection operation.
[0039] The testing portion 1413 is away from the edge of the testing board 110 relative to the positioning portion 1411. The cross section of the second pin 143 does not change from the edge of the testing board 110 toward the center of the testing board 110, and the cross section of the second pin 143 is smaller than the cross section of the testing portion 1413 of the first pin 141.
[0040] The cross section of the test board 110 is polygonal, and each side is provided with a test pin 140. Among the test pins 140 on each side, the test pins 140 at both ends are shorter, and the test pins 140 in the middle are longer. Among them, the length of the second pin 143 is greater than the length of the first pin 141.
[0041] In this embodiment, the test pins 140 are symmetrically distributed about the diagonal line of the test board 110. In this way, more test pins 140 can be formed, saving space and improving the utilization rate of the test board 110. In addition, the lengths of the test pins 140 are not completely the same, so that more lead frame package products to be tested with the same spacing of the outer ring conductive pins but different appearance sizes can be adapted.
[0042] Optionally, the central pad 130 has four second corners, and each second corner is provided with a connecting rib 150 extending in a direction away from the central pad 130. The connecting rib 150 is extended along the diagonal line of the test board 110. Optionally, a non-conductive glue is provided between the test pin 140 and the connecting rib 150.
[0043] Optionally, a cutting path 111 is provided on the test board 110. The cutting path 111 is located around the edge of the test board 110. The test pins 140 are connected to the cutting path 111. When the cutting path 111 is removed, that is, after trimming, the multiple test pins 140 are independent of each other. Figure 3 As shown. Independence here means that there is no electrical connection between the test pins 140, and there will be no short circuit. It is convenient to test and analyze the electrical performance of the lead frame to be tested. It can be understood that since the test pins 140 are connected by non-conductive glue, the integrity of the multiple test pins 140 can be maintained, and the multiple test pins 140 can be well fixed to prevent scattering or displacement.
[0044] The embodiment of the utility model further provides a decapsulation test device, comprising a tester and a decapsulation lead frame fixture as in any one of the above-mentioned embodiments. The tester includes but is not limited to a multimeter and the like.
[0045] The decapsulation lead frame jig provided in the embodiment of the utility model has the following usage method:
[0046] First, the lead frame to be tested is welded to the test board 110 , wherein the central base island of the lead frame to be tested is welded to the central pad 130 , and the conductive pins of the lead frame to be tested are welded to the test pins 140 .
[0047] The lead frame to be tested is clamped by a fixture and chemically opened. Optionally, a mixture of concentrated sulfuric acid and fuming nitric acid is used to corrode and dissolve the plastic package of the lead frame to be tested.
[0048] After dissolving the plastic package, the unsealed lead frame can be inspected, observed, and abnormal points can be checked. If further electrical performance test and analysis is required, the test board 110 can be trimmed and cut along the cutting path 111. The test pins 140 are cut and separated into single pieces. After trimming, the multiple test pins 140 are separated from each other and have no electrical connection. Due to the presence of non-conductive glue, the multiple test pins 140 are still bonded together and will not scatter or shift. The electrical performance test of the test pins 140 or the conductive pins of the lead frame can be performed using a multimeter, etc., so that the electrical performance test and analysis of the unpacked product can be performed.
[0049] It should be noted that, since the conductive pins of the lead frame to be tested and the test pins 140 are welded together, the test terminal of the multimeter can be connected to either the test pins 140 or the conductive pins.
[0050] Since the test portion 1413 of the first pin 141 on the test board 110 is relatively large, it is convenient to connect with the test line. Here, the size of the test portion 1413 mainly refers to the surface area of the test portion 1413 facing the lead frame to be tested. This relatively large size can increase the contact area, whether it is welded with a conductive pin, connected with a multimeter test terminal or connected with a test line, the electrical connection is reliable, and the test operation is more convenient.
[0051] It can be understood that one test end of the multimeter is connected to the first pin 141, and the other test end is connected to the conductive pins one by one, so that each conductive pin can be detected whether it is abnormal. Alternatively, one test end of the multimeter is connected to the first pin 141, and the other test end can repeatedly detect and analyze different abnormal points to improve the test efficiency and test reliability.
[0052] In summary, the decapsulation lead frame jig and decapsulation test equipment provided by the embodiments of the present invention have the following beneficial effects:
[0053] The decapsulation lead frame jig provided by the embodiment of the utility model can be used as an auxiliary jig for decapsulation of the lead frame, and the non-conductive glue can fix the test pins 140, effectively preventing the conductive pins of the lead frame after decapsulation from scattering and shifting. At the same time, the non-conductive glue can prevent the solder paste from flowing on its surface, preventing the electrical short circuit between the test pins 140, and can facilitate the electrical performance testing and analysis of the lead frame after decapsulation, which is easy to operate and has high testing efficiency.
[0054] The decapsulation test equipment provided by the embodiment of the utility model includes a tester and the above-mentioned decapsulation lead frame fixture, which can prevent the conductive pins of the decapsulated lead frame from scattering and shifting. It can also facilitate the electrical performance testing and analysis of the decapsulated lead frame, which is easy to operate and has high testing efficiency.
[0055] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
Claims
1. A lead frame decapsulation jig, characterized in that: include: A test board, wherein the test board is provided with a central pad and a plurality of test pins arranged at the periphery of the central pad; the test board is used to be connected to a lead frame to be tested; An insulating member is disposed between the central pad and the test pin.
2. The lead frame decapsulation jig according to claim 1, characterized in that: The insulating member is made of non-conductive glue.
3. The lead frame decapsulation jig according to claim 1, characterized in that: The test pins are symmetrically arranged about the central pad.
4. The lead frame decapsulation jig according to claim 1, characterized in that: The test board has four first corners, each of which is provided with a first pin, and the first pins are symmetrically distributed about a diagonal line of the test board.
5. The lead frame decapsulation jig according to claim 4, characterized in that: The first pin includes a positioning portion and a testing portion connected to each other, and an area of the testing portion is larger than an area of the positioning portion.
6. The lead frame decapsulation jig according to claim 5, characterized in that: The testing portion is away from the edge of the testing board relative to the positioning portion.
7. The lead frame decapsulation jig according to claim 1, characterized in that: The cross section of the test board is polygonal, and the test pins are arranged on each side; among the several test pins on each side, the test pins at the two ends are shorter, and the test pins in the middle are longer.
8. The lead frame decapsulation jig according to claim 1, characterized in that: The central pad has four second corners, and each of the second corners is provided with a connecting rib extending in a direction away from the central pad.
9. The lead frame decapsulation jig according to claim 1, characterized in that: The test board is provided with a cutting path, and the test pins are connected to the cutting path. When the cutting path is removed, the plurality of test pins are independent of each other.
10. A decapsulation test device, characterized in that: The invention comprises a tester and a decapsulation lead frame jig as claimed in any one of claims 1 to 9.