High-frequency transparent film antenna

Abstract

The utility model discloses a high-frequency transparent film antenna, which adopts a laminated structure and sequentially comprises a first conducting layer, a first transparent medium layer, a first transparent bonding layer, a second transparent medium layer, a second transparent bonding layer, a third transparent medium layer and a second conducting layer, wherein the first transparent dielectric layer is a carrier of the first conductive layer, the first transparent bonding layer and the second transparent bonding layer are respectively used for bonding two adjacent layers, and the second transparent dielectric layer is used for increasing the thickness of the antenna; the third transparent dielectric layer is a carrier of the second conductive layer, the second conductive layer adopts a gridding structure, and the third transparent dielectric layer and the second conductive layer form a grounding plate of the antenna together. Through the laminated structure design, on the premise that the radiation performance of the antenna is not affected, the visible light permeability is greatly improved, the antenna is high in attractiveness, capable of being better fused with the environment, high in installation flexibility and capable of well meeting the use requirements for the high-frequency transparent antenna in multiple scenes.

Description

Technical Field

[0001] The utility model relates to the technical field of film antennas, and more specifically, particularly to a high-frequency transparent film antenna. Background Art

[0002] General high-frequency antennas (greater than 10GHz) usually use PCB microstrip printed antennas. The mature PCB processing technology can effectively control the production cost, but it cannot be transparent and cannot meet the application scenarios with high aesthetic requirements. Transparent film antennas have the advantages of high transparency and easy conformality without losing the antenna radiation performance, so they are widely used in such scenarios.

[0003] For high-frequency microstrip antennas, the thickness of the intermediate dielectric layer directly affects the antenna's operating bandwidth, feed network design, and antenna efficiency. The dielectric layer thickness is usually required to be above 0.25 mm. However, the thickness of the dielectric used to make transparent film antennas is usually much less than 0.25 mm. Direct application will cause problems such as small antenna operating bandwidth and low radiation efficiency.

[0004] Therefore, it is of great significance to design and improve the structure of the thin film antenna so that it can meet the use requirements of high-frequency transparent antenna without affecting the radiation performance. Utility Model Content

[0005] The utility model provides a high-frequency transparent film antenna to solve the problems raised in the above background technology. To achieve the above purpose, the utility model provides the following technical solutions: a high-frequency transparent film antenna, which adopts a laminated structure, which is sequentially a first conductive layer, a first transparent medium layer, a first transparent adhesive layer, a second transparent medium layer, a second transparent adhesive layer, a third transparent medium layer and a second conductive layer; the first conductive layer is formed on the surface of the first transparent medium layer, and the second conductive layer is formed on the surface of the third transparent medium layer.

[0006] Preferably, the first conductive layer is formed on the first transparent medium layer by an additive process or an etching subtractive process; and the second conductive layer is formed on the third transparent medium layer by a semi-additive process, an additive process or an etching subtractive process.

[0007] Preferably, the first conductive layer is made of metal material or non-metallic conductive material.

[0008] Preferably, the material of the first transparent medium layer includes but is not limited to PET, COP and CPI, and the thickness thereof includes but is not limited to 50um, 100um and 125um.

[0009] Preferably, the first transparent adhesive layer and the second transparent adhesive layer are made of the same material, namely, OCA, PVB or other transparent optical adhesive; and the thickness of the first transparent adhesive layer and the second transparent adhesive layer are both less than or equal to 10 um.

[0010] Preferably, the first transparent medium layer, the first transparent adhesive layer, the second transparent medium layer, the second transparent adhesive layer and the third transparent medium layer are combined by pressing.

[0011] Preferably, the second transparent medium layer is a transparent medium with low dielectric loss, and its thickness includes but is not limited to 50um, 100um and 125um.

[0012] Preferably, the material and thickness of the third transparent medium layer are the same as those of the first transparent medium layer.

[0013] Preferably, the second conductive layer is a grid-shaped patterned structure and is used for grounding.

[0014] Preferably, the surface of the high-frequency transparent film antenna is covered with a protective layer.

[0015] Compared with the prior art, the utility model has the following beneficial effects: the utility model provides a high-frequency transparent microstrip film antenna, the laminated structure is arranged as a first conductive layer, a first transparent medium layer, a first transparent adhesive layer, a second transparent medium layer, a second transparent adhesive layer, a third transparent medium layer and a second conductive layer, wherein the first transparent medium layer is a carrier of the first conductive layer, the first transparent adhesive layer and the second transparent adhesive layer are respectively used to bond two adjacent layers, and the second transparent medium layer is used to increase the thickness of the antenna; the third transparent medium layer is a carrier of the second conductive layer, and the second conductive layer adopts a grid structure, and the two together form the ground plane of the antenna. Through the above-mentioned laminated structure design, the antenna can greatly improve the transmittance of visible light without affecting the radiation performance, the antenna has high aesthetics, can be better integrated with the environment, has strong installation flexibility, and can well meet the use requirements of high-frequency transparent antennas in multiple scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of a high-frequency transparent film antenna according to an embodiment of the utility model;

[0017] exist Figure 1 In the figure, the corresponding relationship between the names of the components and the numbers of the drawings is as follows:

[0018] 1--first conductive layer, 2--first transparent medium layer, 3--first transparent adhesive layer, 4--second transparent medium layer, 5--second transparent adhesive layer, 6--third transparent medium layer, 7--second conductive layer. DETAILED DESCRIPTION

[0019] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0020] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] Please refer to Figure 1 The utility model provides a high-frequency transparent film antenna, which adopts a laminated structure, which includes a first conductive layer 1, a first transparent medium layer 2, a first transparent adhesive layer 3, a second transparent medium layer 4, a second transparent adhesive layer 5, a third transparent medium layer 6 and a second conductive layer 7 in sequence; the first conductive layer 1 is formed on the surface of the first transparent medium layer 2, and the second conductive layer 7 is formed on the surface of the third transparent medium layer 6.

[0023] In the embodiment of the utility model, the high-frequency transparent film antenna adopts a laminated structure, wherein the first conductive layer 1 is located on the surface layer, and the second conductive layer 7 is located on the bottom layer. Among them, electrode sheets are arranged at the end points of the first conductive layer 1 to connect with the antenna signal transmission device, and the entire first conductive layer 1 can be designed with a specific line pattern to reduce optical interference phenomena such as rainbow patterns and moiré patterns. The second conductive layer 7 located at the bottom layer serves as the grounding terminal of the antenna by forming a grid shape. The first transparent medium layer 2 and the second transparent medium layer 4 serve as carriers of the two conductive layers respectively, and between the two carriers are the second transparent medium layer 4 and the second transparent adhesive layer and the second transparent adhesive layer that play an adhesion role. The second transparent medium layer 4 is mainly to increase the thickness of the medium layer so that the antenna meets the requirements of working loan and efficiency.

[0024] Preferably, the first conductive layer 1 is formed on the first transparent medium layer 2 by an additive method or an etching subtractive process; the second conductive layer 7 is formed on the third transparent medium layer 6 by a semi-additive method, an additive method or an etching subtractive process. In this embodiment, the first conductive layer 1 can be made by an additive method or an etching subtractive process. The second conductive layer 7 is made of the same material as the first conductive layer 1, and can be formed on the third transparent medium layer 6 by a semi-additive method, an additive method or an etching subtractive process.

[0025] Preferably, the first conductive layer 1 is made of metal material or non-metallic conductive material.

[0026] Preferably, the material of the first transparent medium layer 2 includes but is not limited to PET, COP and CPI, and its thickness includes but is not limited to 50um, 100um and 125um. The first transparent medium layer 2 is a carrier of the first conductive layer 1, and the first transparent medium layer 2 is a transparent substrate including but not limited to PET, COP, CPI, etc., and its thickness usually includes but is not limited to 50um, 100um, 125um and other sizes.

[0027] Preferably, the first transparent adhesive layer 3 and the second transparent adhesive layer 5 are made of the same material, which is OCA, PVB or other transparent optical adhesive; the thickness of the first transparent adhesive layer 3 and the second transparent adhesive layer 5 is less than or equal to 10um. The first transparent adhesive layer 3 and the second transparent adhesive layer can be made of transparent optical adhesive, OCA, PVB, etc., and the thickness must be less than or equal to 10um to minimize the impact on electromagnetic signals.

[0028] Preferably, the first transparent medium layer 2 , the first transparent adhesive layer 3 , the second transparent medium layer 4 , the second transparent adhesive layer 5 and the third transparent medium layer 6 are combined by pressing.

[0029] Preferably, the second transparent medium layer 4 is a transparent medium with low dielectric loss, and its thickness includes but is not limited to 50um, 100um and 125um. The second transparent medium layer 4 is a transparent medium with low dielectric loss, and is usually made of the same material as the first transparent medium layer 2, or it can be different. Its main function is to increase the thickness of the medium layer. Specifically, the thickness of the second transparent medium layer 4 includes but is not limited to 50um, 100um, 125um and other sizes.

[0030] Preferably, the material and thickness of the third transparent medium layer 6 are the same as those of the first transparent medium layer 2. The third transparent medium layer 6 is a carrier of the second conductive layer 7, and the material includes but is not limited to transparent substrates such as PET, COP, and CPI, and the thickness generally includes but is not limited to 50um, 100um, 125um, and the like.

[0031] Preferably, the second conductive layer 7 is a grid-shaped patterned structure and is used for grounding. The second conductive layer 7 can be formed by gridding the conductive material using a semi-additive method, an additive method or an etching subtractive process to directly form a ground plane of the transparent microstrip film antenna.

[0032] Preferably, the surface of the high-frequency transparent film antenna is covered with a protective layer. By providing the protective layer on the front and back of the high-frequency transparent film antenna, the protective layer can be made of a transparent medium with low dielectric loss to protect the antenna and reduce the erosion of the antenna by the external environment.

[0033] Compared with the prior art, the utility model has the following beneficial effects: the utility model provides a high-frequency transparent microstrip film antenna, the laminated structure is arranged as a first conductive layer, a first transparent medium layer, a first transparent adhesive layer, a second transparent medium layer, a second transparent adhesive layer, a third transparent medium layer and a second conductive layer, wherein the first transparent medium layer is a carrier of the first conductive layer, the first transparent adhesive layer and the second transparent adhesive layer are respectively used to bond two adjacent layers, and the second transparent medium layer is used to increase the thickness of the antenna; the third transparent medium layer is a carrier of the second conductive layer, and the second conductive layer adopts a grid structure, and the two together form the ground plane of the antenna. Through the above-mentioned laminated structure design, the antenna can greatly improve the transmittance of visible light without affecting the radiation performance, the antenna has high aesthetics, can be better integrated with the environment, has strong installation flexibility, and can well meet the use requirements of high-frequency transparent antennas in multiple scenarios.

[0034] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A high-frequency transparent film antenna, characterized in that: The high-frequency transparent film antenna adopts a laminated structure, which comprises, in sequence, a first conductive layer (1), a first transparent dielectric layer (2), a first transparent adhesive layer (3), a second transparent dielectric layer (4), a second transparent adhesive layer (5), a third transparent dielectric layer (6) and a second conductive layer (7); the first conductive layer is formed on the surface of the first transparent dielectric layer, and the second conductive layer is formed on the surface of the third transparent dielectric layer.

2. The high-frequency transparent film antenna according to claim 1, characterized in that: The first conductive layer is formed on the first transparent medium layer by an additive method or an etching subtractive process; the second conductive layer is formed on the third transparent medium layer by a semi-additive method, an additive method or an etching subtractive process.

3. The high-frequency transparent film antenna according to claim 1, characterized in that: The first conductive layer is made of metal material or non-metallic conductive material.

4. The high-frequency transparent film antenna according to claim 1, characterized in that: The material of the first transparent medium layer includes but is not limited to PET, COP and CPI, and the thickness thereof includes but is not limited to 50um, 100um and 125um.

5. The high-frequency transparent film antenna according to claim 1, characterized in that: The first transparent adhesive layer and the second transparent adhesive layer are made of the same material, namely, OCA or PVB; and the thickness of the first transparent adhesive layer and the second transparent adhesive layer are both less than or equal to 10 um.

6. The high-frequency transparent film antenna according to claim 1, characterized in that: The first transparent medium layer, the first transparent adhesive layer, the second transparent medium layer, the second transparent adhesive layer and the third transparent medium layer are combined by pressing.

7. The high-frequency transparent film antenna according to claim 1, characterized in that: The second transparent medium layer is a transparent medium with low dielectric loss, and its thickness includes but is not limited to 50um, 100um and 125um.

8. The high-frequency transparent film antenna according to claim 4, characterized in that: The material and thickness of the third transparent medium layer are the same as those of the first transparent medium layer.

9. The high-frequency transparent film antenna according to claim 1, characterized in that: The second conductive layer is a grid-shaped patterned structure and is used for grounding.

10. The high-frequency transparent film antenna according to any one of claims 1 to 9, characterized in that: The surface of the high-frequency transparent film antenna is covered with a protective layer.

Images