Hearing aid circuit and hearing aid

Abstract

The embodiment of the utility model relates to the technical field of hearing aids, and discloses a hearing aid circuit and a hearing aid, the hearing aid circuit comprises an artificial intelligence chip, a Bluetooth chip and a hearing aid chip; the artificial intelligence chip is used for being connected with the audio input unit to receive an audio signal; a first communication pin group of the artificial intelligence chip is connected with a second communication pin group of the Bluetooth chip and is used for sending an audio identification signal to the Bluetooth chip; a third communication pin group of the Bluetooth chip is connected with a fourth communication pin group of the hearing aid chip and is used for sending a control instruction to the hearing aid chip, and the control instruction is generated by the Bluetooth chip according to the audio identification signal; the hearing-aid chip is used for receiving the control instruction to set hearing-aid parameters, and modulating the audio signal according to the hearing-aid parameters to synthesize a hearing-aid audio signal; and the hearing-aid chip is also used for being connected with the audio output unit to output a hearing-aid audio signal. According to the embodiment of the invention, the power consumption of the hearing aid circuit for intelligent scene recognition is reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of hearing aids, and more particularly to a hearing aid circuit and a hearing aid. Background Art

[0002] With the continuous advancement of technology, modern hearing aids have the function of intelligent scene recognition. This function automatically adjusts the hearing aid parameters (such as noise suppression, reverberation suppression, wind noise suppression, feedback suppression and directionality processing, etc.) according to the sound environment of the wearer, so that the hearing aid can modulate the audio signal collected by the microphone according to the hearing aid parameters, so that the hearing aid can better adapt to various scenes and provide the wearer with a more intelligent and comfortable hearing aid effect.

[0003] There are two main hearing aid circuit designs that implement intelligent scene recognition functions: one is to use a Bluetooth SOC (System on Chip) chip to integrate hearing aid and intelligent scene recognition functions; the other is to combine the Bluetooth SOC chip with the hearing aid DSP (Digital Signal Processing) chip, the Bluetooth SOC chip performs intelligent scene recognition and generates hearing aid instructions, and the DSP chip is responsible for the actual hearing aid function. However, both circuit designs use the Bluetooth SOC chip as the intelligent scene recognition chip, and the Bluetooth SOC IC (Integrated Circuit) consumes a lot of battery energy when performing intelligent calculations (running the intelligent scene recognition function), which greatly reduces the battery life of the hearing aid.

[0004] Therefore, how to reduce the power consumption of hearing aid circuits for intelligent scene recognition has become a technical problem that needs to be solved urgently. Utility Model Content

[0005] In view of the above problems, the embodiments of the present application provide a hearing aid circuit and a hearing aid, which are used to solve the problem of high power consumption of the hearing aid circuit for intelligent scene recognition in the prior art.

[0006] According to one aspect of an embodiment of the present application, a hearing aid circuit is provided, which includes an artificial intelligence chip, a Bluetooth chip and a hearing aid chip; wherein the artificial intelligence chip is used to connect to an audio input unit to receive an audio signal sent by the audio input unit; the first communication pin group of the artificial intelligence chip is connected to the second communication pin group of the Bluetooth chip, and is used to send an audio recognition signal to the Bluetooth chip, and the audio recognition signal is generated by the artificial intelligence chip according to the ambient noise in the audio signal; the third communication pin group of the Bluetooth chip is connected to the fourth communication pin group of the hearing aid chip, and is used to send a control instruction to the hearing aid chip, and the control instruction is generated by the Bluetooth chip according to the audio recognition signal; the hearing aid chip is used to connect to the audio input unit to receive the audio signal sent by the audio input unit; the hearing aid chip is used to receive the control instruction to set the hearing aid parameters, and modulate the audio signal according to the hearing aid parameters to synthesize the hearing aid audio signal; the hearing aid chip is also used to connect to the audio output unit to output the hearing aid audio signal.

[0007] In an optional manner, the hearing aid circuit also includes a class D trigger; wherein the artificial intelligence chip is also used to generate a scene switching signal, which is a high-level signal generated when the artificial intelligence chip detects a change in ambient noise in the audio signal; the clock pin of the class D trigger is connected to the scene switching signal output pin of the artificial intelligence chip to receive the scene switching signal sent by the artificial intelligence chip; the output pin of the class D trigger is connected to the wake-up pin of the Bluetooth chip, and is used to continuously output a wake-up signal to the Bluetooth chip after receiving the scene switching signal to wake up the Bluetooth chip until the clock pin of the class D trigger receives a high-level signal again, wherein the wake-up signal is a high-level signal; the Bluetooth chip is also used to generate a reset signal after wake-up, and send the reset signal to the first communication pin group of the artificial intelligence chip through the second communication pin group; the artificial intelligence chip is also used to send a high-level signal to the clock pin of the class D trigger through the scene switching signal output pin after receiving the reset signal.

[0008] In an optional manner, the third communication pin group is connected to the fourth communication pin group via an SPI bus.

[0009] In an optional manner, the Bluetooth chip is also used to wirelessly connect to an external device to receive audio data sent by the external device, convert the audio data into a Bluetooth audio signal, and send the Bluetooth audio signal to the hearing aid chip via the SPI bus; the hearing aid chip is also used to modulate the Bluetooth audio signal according to hearing aid parameters to synthesize a hearing aid audio signal.

[0010] In an optional manner, the Bluetooth chip is also used to wirelessly connect to an external device to receive audio data sent by the external device and convert the audio data into a Bluetooth audio signal; the Bluetooth chip is also used to connect to an audio output unit to output a Bluetooth audio signal.

[0011] In an optional manner, the audio output unit includes a switch unit and an earpiece, the output end of the switch unit is connected to the earpiece, the first input end of the switch unit is connected to the hearing aid chip, and the second input end of the switch unit is connected to the Bluetooth chip. The switch unit is used to connect the earpiece to the hearing aid chip, and is also used to connect the earpiece to the Bluetooth chip and disconnect the earpiece from the hearing aid chip when receiving a Bluetooth audio signal.

[0012] In an optional manner, the Bluetooth chip is also used to connect to the audio input unit to receive the audio signal sent by the audio input unit; the Bluetooth chip is also used to convert the audio signal into call audio data and send the call audio data to an external device.

[0013] In an optional manner, the third communication pin group is connected to the fourth communication pin group via an I2C bus.

[0014] In an optional manner, the first communication pin group is connected to the second communication pin group via an I2C bus.

[0015] According to another aspect of the embodiments of the present application, a hearing aid is provided. The hearing aid includes the hearing aid circuit in any of the above embodiments.

[0016] The embodiment of the present application uses a Bluetooth chip as a control chip for an artificial intelligence chip and a hearing aid chip, so that the artificial intelligence chip can replace the Bluetooth chip for intelligent computing (running the intelligent scene recognition function), thereby significantly reducing the power consumption of the hearing aid circuit.

[0017] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0019] Figure 1 A circuit structure diagram of a hearing aid circuit provided in an embodiment of the present application is shown;

[0020] Figure 2 A schematic diagram showing the pin layout of the artificial intelligence chip provided in the embodiment of the present application and its connection relationship with the Bluetooth chip, the audio input unit and the D-type trigger;

[0021] Figure 3 A schematic diagram showing the pin layout of the Bluetooth chip provided in an embodiment of the present application and its connection relationship with an artificial intelligence chip, a hearing aid chip, an audio input unit, an audio output unit, and a D-type trigger;

[0022] Figure 4 A schematic diagram showing the pin layout of the hearing aid chip provided in an embodiment of the present application and its connection relationship with a Bluetooth chip, an audio input unit, and an audio output unit;

[0023] Figure 5 A circuit structure diagram of another hearing aid circuit provided in an embodiment of the present application is shown;

[0024] Figure 6 A schematic diagram showing level values ​​of various signals related to waking up a Bluetooth chip provided in an embodiment of the present application is shown;

[0025] Figure 7 A circuit structure schematic diagram of another hearing aid circuit provided in an embodiment of the present application is shown.

[0026] The reference numerals in the specific implementation manner are as follows:

[0027] 100. Hearing aid circuit;

[0028] 110. artificial intelligence chip; 111. first communication pin group; 112. scene switching signal output pin;

[0029] 120, Bluetooth chip; 121, second communication pin group; 122, third communication pin group; 123, wake-up pin;

[0030] 130. Hearing aid chip; 131. Fourth communication pin group;

[0031] 140. Audio input unit;

[0032] 150, audio output unit; 151, switch unit; 151a, output end of the switch unit; 151b, first input end of the switch unit; 151c, second input end of the switch unit; 152, receiver;

[0033] 160. D-type flip-flop; 161. clock pin; 162. output pin. DETAILED DESCRIPTION

[0034] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0036] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0037] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0038] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0039] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0040] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0041] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0042] The intelligent scene recognition function of the hearing aid will automatically adjust the hearing aid parameters of the hearing aid according to the sound environment the wearer is in, so that the hearing aid can better adapt to various scenes and provide the wearer with a smarter and more comfortable hearing aid effect. The intelligent scene recognition function is usually implemented by the hearing aid circuit in the hearing aid.

[0043] At present, hearing aid circuits usually use Bluetooth SOC chips to achieve intelligent scene recognition functions. However, Bluetooth SOC ICs consume a lot of battery energy when performing intelligent calculations, which greatly reduces the battery life of hearing aids.

[0044] Based on this, the inventors of this application discovered that AI (Artificial Artificial Intelligence (AI) chips (hereinafter referred to as "AI chips") are designed to perform intelligent computing. The power consumption of AI chips for intelligent computing is much less than that of Bluetooth SOC chips for intelligent computing. Therefore, the AI ​​chip can be used to realize the intelligent scene recognition function of the hearing aid circuit to avoid the Bluetooth SOC chip consuming a large amount of battery energy for intelligent computing. Specifically, the AI ​​chip can be combined with the DSP chip to design a hearing aid circuit to integrate the intelligent scene recognition function of the AI ​​chip and the hearing aid function of the DSP chip. With the development of the actual design process, the inventors found in this process that although such AI chips already have intelligent scene recognition functions, the AI ​​chip can generate a switching signal after detecting the sound scene switching (for example, from a noisy environment to a quiet environment), but the AI ​​chip cannot convert the switching signal into a control instruction to enable the DSP chip to adjust the hearing aid parameters, that is, such AI chips cannot be directly applied to the hearing aid circuit. Therefore, on the basis of the AI ​​chip and the DSP chip, the inventors added a Bluetooth SOC chip as a control chip for the AI ​​chip and the DSP chip, so that the AI ​​chip replaces the Bluetooth SOC chip for intelligent computing, thereby greatly reducing the power consumption of the hearing aid circuit that realizes the intelligent scene recognition function.

[0045] Please refer to Figure 1 , Figure 1 FIG. 1 shows a circuit structure diagram of a hearing aid circuit provided in an embodiment of the present application. Figure 1As shown, the hearing aid circuit 100 includes an artificial intelligence chip 110, a Bluetooth chip 120 and a hearing aid chip 130; wherein the artificial intelligence chip 110 is used to connect to the audio input unit 140 to receive the audio signal sent by the audio input unit 140; the first communication pin group 111 of the artificial intelligence chip 110 is connected to the second communication pin group 121 of the Bluetooth chip 120, and is used to send an audio recognition signal to the Bluetooth chip 120, and the audio recognition signal is generated by the artificial intelligence chip 110 according to the environmental noise in the audio signal; the third communication pin group 112 of the Bluetooth chip 120 is connected to the second communication pin group 121 of the Bluetooth chip 120, and is used to send an audio recognition signal to the Bluetooth chip 120. The communication pin group 122 is connected to the fourth communication pin group 131 of the hearing aid chip 130, and is used to send control instructions to the hearing aid chip 130, and the control instructions are generated by the Bluetooth chip 120 according to the audio recognition signal; the hearing aid chip 130 is used to connect with the audio input unit 140 to receive the audio signal sent by the audio input unit 140; the hearing aid chip 130 is used to receive control instructions to set hearing aid parameters, and modulate the audio signal according to the hearing aid parameters to synthesize a hearing aid audio signal; the hearing aid chip 130 is also used to connect with the audio output unit 150 to output a hearing aid audio signal.

[0046] Among them, the audio input unit 140 is configured with a sound collection system, such as a microphone. After the audio input unit 140 collects the audio signal of the external ear environment, the audio input unit 140 sends the collected audio signal to the artificial intelligence chip 110; after receiving the audio signal, the artificial intelligence chip 110 runs the intelligent scene recognition function to recognize the audio signal collected by the audio input unit 140, and the artificial intelligence chip 110 generates an audio recognition signal according to the scene recognition result obtained by judging the environmental noise in the audio signal, and the artificial intelligence chip 110 sends the generated audio recognition signal to the Bluetooth chip 120; after receiving the audio recognition signal, the Bluetooth chip 120 determines whether the environment in which the wearer is located has changed according to the current audio recognition signal and the previous audio recognition signal, and if changed, the wearer's environment is changed. The Bluetooth chip 120 runs a hearing aid parameter generation program to generate hearing aid parameters of the wearer's environment according to the audio recognition signal received this time, and generates control instructions according to the hearing aid parameters at this time, so that after receiving the control instructions, the hearing aid chip 130 configures the hearing aid parameters to the hearing aid parameters generated by the Bluetooth chip 120 according to the audio recognition signal; after receiving the audio signal collected by the audio input unit 140, the hearing aid chip 130 modulates the audio signal into a hearing aid audio signal according to the reset hearing aid parameters to reduce environmental noise interference, and the hearing aid chip 130 sends the hearing aid audio signal to the audio output unit 150, which is equipped with a speaker. The audio output unit 150 outputs the hearing aid audio signal to the wearer, so that the wearer can better listen to the target sound.

[0047] For example, when the target sound is a human voice, the wearer can hear a clearer human voice by wearing a hearing aid. The artificial intelligence chip 110 recognizes that the scene of the wearer at home (a relatively quiet environment) is a quiet scene, and generates an audio recognition signal corresponding to the quiet scene. The scene of the wearer in the vegetable market (a relatively noisy environment) is a noisy scene, and generates an audio recognition signal corresponding to the noisy scene. When the wearer goes from home to the vegetable market, the audio recognition signal received by the Bluetooth chip 120 changes from the audio recognition signal corresponding to the quiet scene to the audio recognition signal corresponding to the noisy scene. The Bluetooth chip 120 determines that the audio recognition signals received before and after are inconsistent and confirms that the wearer's environment has changed. The Bluetooth chip 120 generates a control instruction corresponding to the hearing aid parameters adapted to the noisy scene according to the audio recognition signal corresponding to the noisy scene, and sends it to the hearing aid chip 130. The hearing aid chip 130 adjusts the hearing aid parameters adapted to the quiet scene to the hearing aid parameters adapted to the noisy scene, so that the wearer can hear a clearer human voice even in the noisy vegetable market.

[0048] The Bluetooth chip 120 determines whether the wearer's environment has changed based on the current audio recognition signal and the previous audio recognition signal. If not, the hearing aid chip 130 continues to modulate the audio signal into a hearing-aid audio signal based on the original hearing-aid parameters in the hearing aid chip 130, and sends the hearing-aid audio signal to the audio output unit 150.

[0049] Specifically, Figure 2 The figure shows the pin layout of the artificial intelligence chip provided in the embodiment of the present application and the schematic diagram of the connection relationship with the Bluetooth chip, the audio input unit and the D-type trigger. Figure 3 The figure shows the pin layout of the Bluetooth chip provided in the embodiment of the present application and the connection relationship between the Bluetooth chip, the artificial intelligence chip, the hearing aid chip, the audio input unit, the audio output unit and the D-type trigger. Figure 4 The pin layout of the hearing aid chip provided in the embodiment of the present application and the schematic diagram of the connection relationship with the Bluetooth chip, the audio input unit and the audio output unit are shown. Figure 2 , Figure 3 and Figure 4 , the artificial intelligence chip 110 receives the audio signal through the audio input pin (such as Figure 2 The VIP_LNA pin shown in FIG. 1 is connected to the audio output pin on the audio input unit 140 to receive the audio signal sent by the audio input unit 140; the first communication pin group 111 of the artificial intelligence chip 110 (such as Figure 2 The SCL pin and SDA pin shown in FIG. 1 are connected to the second communication pin group 121 of the Bluetooth chip 120 (such as Figure 3ADC5 / USB_DP / PB3 pin and ADC6 / USB_DM / PB4 pin) are connected to send an audio recognition signal to the Bluetooth chip 120; the third communication pin group 122 of the Bluetooth chip 120 (such as Figure 3 The PE4 / SDPG pin, PE7 / SDAT3 / ADC9 pin, PE6 / SDCLK3 / ADC8 pin and PE5 / SDCMD / ADC7 pin shown in FIG. 1 are connected to the fourth communication pin group 131 of the hearing aid chip 130 (such as Figure 4 The B_MI pin, B_MO pin, B_SCK pin and B_CSN pin shown in the figure are connected to send control instructions to the hearing aid chip 130; Figure 4 As shown, the hearing aid chip 130 can be connected to the audio output pin on the audio input unit 140 through the AMIC_0 pin or the AMIC_1 pin to receive the audio signal sent by the audio input unit 140; Figure 4 As shown, the hearing aid chip 130 can be connected to the audio output unit 150 through the PA_OUTN pin and the PA_OUTP pin to output the hearing aid audio signal.

[0050] The power consumption of the artificial intelligence chip 100 for intelligent computing is much lower than that of the Bluetooth chip 200 for intelligent computing. The embodiment of the present application uses the Bluetooth chip 200 as the control chip of the artificial intelligence chip 100 and the hearing aid chip 300, so that the artificial intelligence chip 100 can replace the Bluetooth chip 200 for intelligent computing (running the intelligent scene recognition function), thereby greatly reducing the power consumption of the hearing aid circuit 100.

[0051] In an optional manner, the third communication pin group 122 is connected to the fourth communication pin group 131 via an I2C bus, that is, the communication protocol between the third communication pin group 122 and the fourth communication pin group 131 is the I2C communication protocol.

[0052] In an optional manner, the first communication pin group 111 is connected to the second communication pin group 121 via an I2C bus, that is, the first communication pin group 111 (such as Figure 2 The SCL pin and SDA pin shown in FIG. Figure 3 The communication protocol between the ADC5 / USB_DP / PB3 pin and the ADC6 / USB_DM / PB4 pin) is the I2C communication protocol.

[0053] Among them, I2C (Inter-IC Circuit) is a serial communication bus used to connect a microcontroller and its peripheral devices to achieve low-speed data communication.

[0054] In a preferred embodiment, the third communication pin group 122 is connected to the fourth communication pin group 131 via the SPI bus, that is, the third communication pin group 122 (such as Figure 3 1 pin, PE7 / SDAT3 / ADC9 2 pin, PE6 / SDCLK3 / ADC8 3 pin and PE5 / SDCMD / ADC7 pin) and the fourth communication pin group 131 of the hearing aid chip 130 (such as Figure 4 The communication protocol between the B_MI pin, B_MO pin, B_SCK pin and B_CSN pin shown is the SPI communication protocol.

[0055] Among them, SPI (Serial Peripheral Interface) is a common synchronous serial communication protocol, which is mainly used for high-speed data communication.

[0056] In addition, after the artificial intelligence chip 110 generates an audio recognition signal based on the scene recognition result obtained by judging the ambient noise in the audio signal, the artificial intelligence chip 110 can also be used to judge whether the wearer's environment has changed based on the current audio recognition signal and the previous audio recognition signal. If the artificial intelligence chip 110 detects that the ambient noise in the audio signal has changed, a scene switching signal is generated. The scene switching signal output pin 112 of the artificial intelligence chip 110 is connected to the Bluetooth chip 120 to send a scene switching signal to the Bluetooth chip 120. After receiving the scene switching signal from the artificial intelligence chip 110, the Bluetooth chip 120 generates hearing aid parameters for the wearer's environment at this time based on the most recently received audio recognition signal, and generates control instructions based on the hearing aid parameters at this time, so that after receiving the control instructions, the hearing aid chip 130 configures the hearing aid parameters to the hearing aid parameters generated by the Bluetooth chip 120 based on the audio recognition signal.

[0057] When the Bluetooth chip 120 is used as a control chip, a low-power Bluetooth chip can be selected. If you want to further reduce the power consumption of the hearing aid circuit, you can set the Bluetooth chip 120 to a sleep state before receiving a scene switching signal, and it does not receive or process the signal. After receiving the scene switching signal, the Bluetooth chip 120 is awakened and starts to receive the audio recognition signal sent by the artificial intelligence chip 110, and generates hearing aid parameters based on the received audio recognition signal, generates control instructions based on the hearing aid parameters, sends the hearing aid parameters to the hearing aid chip 130, and then enters the sleep state again.

[0058] Figure 5 FIG. 4 shows a circuit structure diagram of another hearing aid circuit provided in an embodiment of the present application. Figure 5As shown, the hearing aid circuit 100 also includes a D-type trigger 160; wherein the artificial intelligence chip 110 is also used to generate a scene switching signal, and the scene switching signal is a high-level signal generated by the artificial intelligence chip 110 when detecting a change in the ambient noise in the audio signal; the clock pin 161 of the D-type trigger 160 is connected to the scene switching signal output pin 112 of the artificial intelligence chip 110 to receive the scene switching signal sent by the artificial intelligence chip 110; the output pin 162 of the D-type trigger 160 is connected to the wake-up pin 123 of the Bluetooth chip 120, and is used to receive the scene switching signal when receiving the scene switching signal. After the signal is changed, the wake-up signal is continuously output to the Bluetooth chip 120 to wake up the Bluetooth chip 120 until the clock pin 161 of the D-type trigger 160 receives a high-level signal again, wherein the wake-up signal is a high-level signal; the Bluetooth chip 120 is also used to generate a reset signal after wake-up, and send a reset signal to the first communication pin group 111 of the artificial intelligence chip 110 through the second communication pin group 121; the artificial intelligence chip 110 is also used to send a high-level signal to the clock pin 161 of the D-type trigger 160 through the scene switching signal output pin 112 after receiving the reset signal.

[0059] Figure 6 A schematic diagram showing the level values ​​of various signals related to waking up the Bluetooth chip provided in an embodiment of the present application is shown. Figure 6 When the selected Bluetooth chip 120 is a low-power chip, the Bluetooth chip 120 needs to be awakened before it can start working. Figure 6 P1 in the figure is the wake-up pin 123 of the Bluetooth chip 120 (eg Figure 3 Schematic diagram of the level value of the input signal of the PB1 / WK2 / ADC3 pin, or the PB5 / WK0 / ADC12 pin, or the PB2 / WK3 / ADC4 pin) in FIG. Figure 6 As shown in P1 in FIG. 1 , the condition for the Bluetooth chip 120 to be awakened is that the awakening pin 123 continuously receives a high-level signal of a duration not less than T1 (T1=t2-t0), wherein T1 is usually 1 ms. Figure 6 P2 in the figure is the scene switching signal output pin 112 of the artificial intelligence chip 110 (such as Figure 2 The level value diagram of the output signal of the KWS_INT pin in FIG. Figure 6 As shown in P2 in FIG. 1 , the duration of the high-level signal generated by the artificial intelligence chip 110 when detecting a change in the ambient noise in the audio signal is T2 (T2=t1-t0), where T2 is usually 300ns. Figure 6 It can be seen that T2 is smaller than T1, that is, the artificial intelligence chip 110 cannot send a scene switching signal to the Bluetooth chip 120 to wake up the Bluetooth chip 120.

[0060] Therefore, a D-type trigger 160 is provided in the hearing aid circuit 100 to wake up the Bluetooth chip 120. Specifically, a clock pin 161 of the D-type trigger 160 is connected to a scene switching signal output pin 112 (such as Figure 2 The output pin 162 of the D-type trigger 160 is connected to the wake-up pin 123 of the Bluetooth chip 120 (such as the KWS_INT pin in the Bluetooth chip 120) to receive the scene switching signal sent by the artificial intelligence chip 110; the output pin 162 of the D-type trigger 160 is connected to the wake-up pin 123 of the Bluetooth chip 120 (such as the KWS_INT pin in the Bluetooth chip 120) to receive the scene switching signal sent by the artificial intelligence chip 110; Figure 3 The PB1 / WK2 / ADC3 pin, or the PB5 / WK0 / ADC12 pin, or the PB2 / WK3 / ADC4 pin) is connected to continuously output a wake-up signal to the Bluetooth chip 120 to wake up the Bluetooth chip 120 after receiving the scene switching signal.

[0061] Please continue reading Figure 6 , Figure 6 P3 in FIG. 1 is a schematic diagram of the level value of the output signal of the output pin 162 of the D-type flip-flop 160, as shown in FIG. Figure 6 As shown in P3 in FIG. 1 , after the artificial intelligence chip 110 detects that the ambient noise in the audio signal changes and generates a high-level signal with a duration of T2 (T2=t1-t0), the artificial intelligence chip 110 sends the scene switching signal to the D-type trigger 160, and the D-type trigger 160 detects the rising edge process in the scene switching signal (such as Figure 6 After the process indicated by the arrow at time t0 in P2 of FIG, the output pin 162 of the D-type trigger continuously outputs a high-level signal to the Bluetooth chip 120 until time t2, when the Bluetooth chip 120 is awakened, and the Bluetooth chip 120 begins to receive the audio recognition signal sent by the first communication pin group 111 of the artificial intelligence chip 110 through the second communication pin group 121, and generates hearing aid parameters according to the received audio recognition signal, generates control instructions according to the hearing aid parameters, and sends the hearing aid parameters to the hearing aid chip 130; the Bluetooth chip 120 needs to enter the sleep state before entering the sleep state again, that is, before Figure 6 At t3 in P1, the Bluetooth chip 120 sends a reset signal to the first communication pin group 111 of the artificial intelligence chip 110 through the second communication pin group 121. After receiving the reset signal, the artificial intelligence chip 110 sends a high level signal to the clock pin 161 of the D-type trigger 160 through the scene switching signal output pin 112, which is Figure 6 The output signal of P2 at time t3-t4 in the D-type trigger detects the rising edge process of the output signal at time t3-t4 sent by the scene switching signal output pin 112 (such as Figure 6After t3, the output pin 162 of the D-type trigger stops outputting a high-level signal, that is, after t3, the output signal of the output pin 162 is empty, the input signal of the wake-up pin 123 is empty, and the Bluetooth chip 120 enters the sleep state again.

[0062] The embodiment of the present application sets a D-type trigger 160 in the hearing aid circuit 100 so that the Bluetooth chip 120 works only when the wearer's environment changes, and is in a sleep state at other times, thereby greatly reducing the power consumption of the hearing aid circuit 100, extending the battery life of the hearing aid equipped with the hearing aid circuit 100, and improving the wearer's user experience.

[0063] In order to further enhance the wearer's experience, in addition to being the main control chip to generate control instructions, the Bluetooth chip 120 can also receive audio data sent by external devices (such as mobile phones and tablets). In an optional manner, the Bluetooth chip 120 is also used to wirelessly connect to an external device to receive audio data sent by the external device, convert the audio data into a Bluetooth audio signal, and send the Bluetooth audio signal to the hearing aid chip 130 via the SPI bus; the hearing aid chip 130 is also used to modulate the Bluetooth audio signal according to the hearing aid parameters to synthesize the hearing aid audio signal.

[0064] When the third communication pin group 122 is connected to the fourth communication pin group 131 via the SPI bus, the SPI bus can be used to transmit audio data. Figure 1 When the external device transmits the audio data to the Bluetooth chip 120, the Bluetooth chip 120 converts the audio data into a Bluetooth audio signal, and sends the Bluetooth audio signal to the hearing aid chip 130 through the connection between the third communication pin group 122 and the fourth communication pin group 131 of the hearing aid chip 130. The hearing aid chip 130 modulates the Bluetooth audio signal according to the hearing aid parameters to synthesize the hearing aid audio signal.

[0065] The external device may be a mobile device such as a smart phone or a tablet computer, and the wireless connection between the Bluetooth chip 120 and the external device may be a low-power Bluetooth connection, or the Bluetooth chip 120 may send a broadcast to establish a connection with the external device. The audio data transmitted by the external device to the Bluetooth chip 120 may be music audio data played by the external device, or may be call audio data of the other party to the call established with the external device.

[0066] In the embodiment of the present application, the audio data of the external device is converted by the Bluetooth chip 120 and then modulated and output by the hearing aid chip 130, so that the hearing aid audio signal generated according to the audio data is an audio signal output after the hearing aid signal 130 performs hearing compensation to meet the hearing aid habits of the wearer; the Bluetooth audio signal is sent to the hearing aid chip 130 through the SPI bus, so that the structure of the hearing aid circuit does not need to be improved, and the audio data of the external device can be compensated for hearing and played to the wearer, thereby making the structure of the hearing aid circuit 100 simple and the size of the hearing aid equipped with the hearing aid circuit small.

[0067] The hearing aid parameters of the hearing aid chip 130 are hearing aid parameters adapted to the external ear environment. The hearing aid chip 130 may not be able to obtain the hearing aid audio signal with the best hearing compensation effect by modulating the Bluetooth audio signal using the hearing aid parameters adapted to the external ear environment. In order to further improve the wearer's user experience, in an optional manner, the Bluetooth chip 120 is also used to wirelessly connect to an external device to receive audio data sent by the external device and convert the audio data into a Bluetooth audio signal; the Bluetooth chip 120 is also used to connect to the audio output unit 150 to output the Bluetooth audio signal.

[0068] Preferably, the audio data sent by the external device is audio data with good compensation effect pre-modulated by the external device according to the hearing aid parameters. In order to prevent the hearing aid chip 130 from interfering with the audio data modulated by the external device, the Bluetooth chip 120 can be connected to the audio output unit 150 to output the Bluetooth audio signal generated by the Bluetooth chip according to the modulated audio data.

[0069] Figure 7 A circuit structure diagram of another hearing aid circuit provided in an embodiment of the present application is shown. Figure 7 The audio output unit includes a switch unit 151 and an earpiece 152, the output end 151a of the switch unit is connected to the earpiece 152, the first input end 151b of the switch unit is connected to the hearing aid chip 130, and the second input end 151c of the switch unit is connected to the Bluetooth chip 120. The switch unit 151 is used to connect the earpiece 152 and the hearing aid chip 130, and is also used to connect the earpiece 152 and the Bluetooth chip 120 and disconnect the earpiece 152 and the hearing aid chip 130 when receiving a Bluetooth audio signal.

[0070] The first input terminal 151b of the switch unit is connected to the p1 pin (eg Figure 4 The second input terminal 151c of the switch unit is connected to the p2 pin of the Bluetooth chip 120 (such as the PA_OUTN pin and the PA_OUTP pin shown in FIG. Figure 3The switch unit 151 outputs the input of the first input terminal 151b or the second input terminal 151c of the switch unit to the earpiece 152 through the output terminal 151a of the switch unit. The switch unit 151 is provided with a control circuit. When the switch unit 151 does not receive the Bluetooth audio signal output by the Bluetooth chip 120, the switch unit 151 controls the earpiece 152 to be connected to the hearing aid chip 130 to complete the hearing aid of the external environment sound; when the switch unit 151 receives the Bluetooth audio signal output by the Bluetooth chip 120, the switch unit controls the earpiece 152 to be connected to the Bluetooth chip 120, and disconnects the earpiece 152 from the hearing aid chip 130 to give priority to the output of the Bluetooth audio signal.

[0071] In an optional manner, the Bluetooth chip 120 is also used to connect to the audio input unit 140 to receive the audio signal sent by the audio input unit 140; the Bluetooth chip 120 is also used to convert the audio signal into call audio data and send the call audio data to an external device.

[0072] When the wearer is talking to other people through an external device, the external device may not be able to collect the wearer's voice well (for example, the external device is far away from the wearer). Therefore, the audio signal of the external environment outside the ear (including the wearer's voice) can be collected through the audio input unit 140, and then the audio signal can be converted into call audio data through the Bluetooth chip 120, and the call audio data can be sent to the external device to ensure that the call proceeds normally.

[0073] Preferably, a call mode and a hearing aid mode can be set so that the wearer can switch the hearing aid mode to the call mode so that the Bluetooth chip 120 converts the audio signal sent by the audio input unit 140 into call audio data, and sends the call audio data to an external device, thereby improving the wearer's experience of using the hearing aid equipped with the hearing aid circuit 100.

[0074] In addition, the present application also provides a hearing aid, which includes the hearing aid circuit 100 in any of the above embodiments.

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A hearing aid circuit, characterized in that: Including artificial intelligence chips, Bluetooth chips and hearing aid chips; among them, The artificial intelligence chip is used to connect to the audio input unit to receive the audio signal sent by the audio input unit; the first communication pin group of the artificial intelligence chip is connected to the second communication pin group of the Bluetooth chip to send an audio recognition signal to the Bluetooth chip, and the audio recognition signal is generated by the artificial intelligence chip according to the environmental noise in the audio signal; The third communication pin group of the Bluetooth chip is connected to the fourth communication pin group of the hearing aid chip, and is used to send a control instruction to the hearing aid chip, where the control instruction is generated by the Bluetooth chip according to the audio recognition signal; The hearing aid chip is used to connect to the audio input unit to receive the audio signal sent by the audio input unit; the hearing aid chip is used to receive the control instruction to set the hearing aid parameters, and modulate the audio signal according to the hearing aid parameters to synthesize the hearing aid audio signal; the hearing aid chip is also used to connect to the audio output unit to output the hearing aid audio signal.

2. The hearing aid circuit according to claim 1, characterized in that: The hearing aid circuit also includes a D-type trigger; wherein, The artificial intelligence chip is also used to generate a scene switching signal, where the scene switching signal is a high-level signal generated by the artificial intelligence chip when it detects a change in the ambient noise in the audio signal; The clock pin of the D-type trigger is connected to the scene switching signal output pin of the artificial intelligence chip to receive the scene switching signal sent by the artificial intelligence chip; The output pin of the D-type trigger is connected to the wake-up pin of the Bluetooth chip, and is used to continuously output a wake-up signal to the Bluetooth chip to wake up the Bluetooth chip after receiving the scene switching signal, until the clock pin of the D-type trigger receives a high-level signal again, wherein the wake-up signal is a high-level signal; The Bluetooth chip is also used to generate a reset signal after waking up, and send the reset signal to the first communication pin group of the artificial intelligence chip through the second communication pin group; The artificial intelligence chip is also used to send a high level signal to the clock pin of the D-type trigger through the scene switching signal output pin after receiving the reset signal.

3. The hearing aid circuit according to claim 1, characterized in that: The third communication pin group is connected to the fourth communication pin group via an SPI bus.

4. The hearing aid circuit according to claim 3, characterized in that: The Bluetooth chip is also used to wirelessly connect to an external device to receive audio data sent by the external device, convert the audio data into a Bluetooth audio signal, and send the Bluetooth audio signal to the hearing aid chip through the SPI bus; The hearing aid chip is further used to modulate the Bluetooth audio signal according to the hearing aid parameter to synthesize a hearing aid audio signal.

5. The hearing aid circuit according to claim 1, characterized in that: The Bluetooth chip is also used to wirelessly connect to an external device to receive audio data sent by the external device and convert the audio data into a Bluetooth audio signal; The Bluetooth chip is also used to connect to the audio output unit to output the Bluetooth audio signal.

6. The hearing aid circuit according to claim 5, characterized in that: The audio output unit includes a switch unit and an earpiece, the output end of the switch unit is connected to the earpiece, the first input end of the switch unit is connected to the hearing aid chip, and the second input end of the switch unit is connected to the Bluetooth chip. The switch unit is used to connect the earpiece and the hearing aid chip, and is also used to connect the earpiece and the Bluetooth chip and disconnect the earpiece and the hearing aid chip when receiving the Bluetooth audio signal.

7. The hearing aid circuit according to claim 6, characterized in that: The Bluetooth chip is also used to connect with the audio input unit to receive the audio signal sent by the audio input unit; the Bluetooth chip is also used to convert the audio signal into call audio data and send the call audio data to the external device.

8. The hearing aid circuit according to claim 1 or 5, characterized in that: The third communication pin group is connected to the fourth communication pin group via an I2C bus.

9. The hearing aid circuit according to claim 1, characterized in that: The first communication pin group is connected to the second communication pin group via an I2C bus.

10. A hearing aid, characterized in that: The hearing aid comprises: a hearing aid circuit as claimed in any one of claims 1 to 9.

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