Temperature control chip test pressure head convenient for ion dissipation dust removal

Abstract

The utility model belongs to the technical field of chip test fixture structure design, and particularly relates to a temperature control chip test pressure head convenient for ion dissipation dust removal, which comprises a pressure head, five air holes, five electrode needles and a temperature control module, the pressure head is used for contacting a chip, the bottom end of the pressure head is provided with the five air holes, the upper ends of the air holes are provided with the five electrode needles, and the electrode needles are mounted on the inner wall of the upper end of the pressure head. In addition, a temperature control module is installed on the inner wall, the temperature control module can capture the temperature change in the pressing head and feed back the actual temperature condition to the system, and the system can heat or cool the interior of the pressing block according to the set testable temperature interval. The temperature inside the pressure head is kept in an originally set testable temperature range, a good test temperature environment is provided for chip test, test data are more accurate, and meanwhile, the pressure head design not only can remove dust at the upper surface end of a chip, but also plays an anti-static role when the pressure head is in contact with the chip.

Description

Technical Field

[0001] The utility model relates to the technical field of chip test fixture structure design, in particular to a temperature-controlled chip test pressure head which is convenient for ion dissipation and dust removal. Background Art

[0002] At present, the existing high and low temperature chip test pressure heads are basically physical pressure heads. The chip is placed in a high temperature or low temperature cavity. When the traditional chip test physical pressure head contacts the chip for testing, the temperature of the chip surface is actually quite different from the set testable temperature, and the final test data will be inaccurate. Secondly, before the pressure head contacts the chip, if there is dust on the surface of the chip, after the pressure head is pressed, there will be a relatively obvious imprint on the chip surface, which is an abnormal product quality. In addition, in the above-mentioned high and low temperature test cavity, the chip may be at risk of being broken down by static electricity during testing;

[0003] To this end, a temperature-controlled chip test pressure head is provided to facilitate ion dissipation and dust removal, realizing the dust removal and anti-static functions required during chip testing, thereby improving product quality yield. Its built-in temperature control module design provides a reliable guarantee for the accuracy of the test results. Utility Model Content

[0004] The utility model aims to provide a temperature-controlled chip test pressure head which is convenient for ion dissipation and dust removal, and solves the problems raised in the background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a temperature-controlled chip test pressure head that is convenient for ion dissipation and dust removal, including a pressure head, an air hole, an electrode needle, and a temperature control module. A chip is arranged on the lower side of the pressure head, and the chip is installed on the top of the test module. The pressure head is a pressure block that applies pressure to the upper surface of the chip. An air hole is opened at the bottom of the pressure head, and the air hole is directly connected to the upper end of the pressure head. A total of five electrode needles are arranged at the upper end outlet of the air hole, and the electrode needles are fixed to the two side walls of the inner cavity at the upper end of the pressure head. A temperature control module is fixedly installed in the middle of one side of the inner cavity at the upper end of the pressure head.

[0006] By adopting the above technical solution, when the upper end of the pressure head is filled with high-temperature or low-temperature gas, the gas will enter the lower end of the pressure head through the electrode needle, and the gas reaching the lower end of the pressure head will also reach the upper surface of the chip, thereby achieving the effect of removing dust and impurities on the upper surface of the chip.

[0007] As a preferred embodiment of the present invention, the temperature control module is specifically a temperature sensor for detecting the internal temperature of the pressure head.

[0008] By adopting the above technical solution, when high-temperature or low-temperature gas is filled into the upper end of the pressure head, the temperature control module will quickly capture the temperature change of the pressure head and will feed back the temperature information of the pressure head to the system. When the internal and external temperatures of the pressure head are inconsistent with the temperature set in the test, the system will fill the high-temperature or low-temperature gas into the pressure head so that the temperature of the pressure head reaches the temperature set in the test. This temperature change will also be monitored in real time by the temperature control module, and the action of filling the high-temperature or low-temperature gas into the pressure head is also operated in real time to ensure that the temperature of the pressure head is consistent with the test set temperature, thereby achieving the effect of constant temperature of the pressure head.

[0009] As a preferred embodiment of the present invention, the number of the air holes is five, and the five air holes are evenly distributed through the bottom of the pressure head.

[0010] As a preferred embodiment of the present utility model, the outer ends of the needle tips of the five electrode needles correspond to the top openings of the five air holes respectively.

[0011] By adopting the above technical solution, when the gas passes through the electrode needle from the upper end to the lower end, the gas at this time already carries anti-static ion wind. When the ion wind blows to the upper surface of the chip, it achieves the anti-static effect of preventing the chip from being broken down by static electricity during testing.

[0012] As a preferred implementation mode of the present invention, a positioning groove adapted to the chip is provided on the top of the test module, and the chip is placed in the positioning groove.

[0013] By adopting the above technical solution, the chip is positioned using the positioning groove, so that the chip can be accurately positioned in the test module, thereby ensuring accurate pressure from the pressure head and further ensuring accurate testing.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0015] The five-air hole design of the pressure head of the utility model can remove dust and impurities on the surface of the chip to prevent abnormal imprinting of the chip. Secondly, the discharge of the electrode needle at the upper end of the pressure head can make the gas blown to the surface end of the chip achieve an anti-static effect, thereby preventing the chip from being broken down by static electricity during testing. In addition, the built-in temperature control module design at the upper end of the pressure head can ensure that the temperature inside and outside the pressure block is consistent with the set test temperature, thereby achieving the effect of constant temperature of the pressure head. When the chip is contacted and crimped with the pressure head, it can ensure that the temperature of the upper surface of the chip is consistent with the set test temperature, providing a reliable guarantee for the accuracy of the test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0017] Figure 1 This is a schematic diagram of the overall structure of a temperature-controlled chip test pressure head that is convenient for ion dissipation and dust removal in the utility model;

[0018] Figure 2 This is a schematic diagram of the pressure head structure of a temperature-controlled chip test pressure head that is convenient for ion dissipation and dust removal in the utility model;

[0019] Figure 3 The utility model is a schematic diagram of a top view of a temperature-controlled chip test pressure head that is convenient for ion dissipation and dust removal.

[0020] In the figure:

[0021] 1. Temperature control module; 2. Electrode needle; 3. Air hole; 4. Pressure head; 5. Chip; 6. Test module. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0023] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0024] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "set" should be understood in a broad sense, for example, they can be fixedly connected or set, or detachably connected or set, or integrally connected or set. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. The models of electrical appliances provided in the present utility model are only for reference, and different models of electrical appliances with the same functions can be replaced according to actual usage.

[0025] See also Figure 1-3The utility model provides a technical solution: a temperature-controlled chip test pressure head for ion dissipation and dust removal, including a pressure head 4, an air hole 3, an electrode needle 2, and a temperature control module 1. A chip 5 is arranged on the lower side of the pressure head 4, and the chip 5 is installed on the top of the test module 6. A positioning groove adapted to the chip 5 is opened on the top of the test module 6. The pressure head 4 in which the chip 5 is placed is a pressure block for applying pressure to the upper surface end of the chip 5. An air hole 3 is opened at the bottom of the pressure head 4, and the air hole 3 is directly connected to the upper end of the pressure head 4. The number of the air holes 3 is five, and the five air holes 3 are evenly distributed at the bottom of the pressure head 4 in a through-type manner. A total of five electrode needles 2 are arranged at the outlet of the upper end of the air hole 3, and the electrode needles 2 are fixed to the two side walls of the inner cavity at the upper end of the pressure head 4. The outer ends of the needles of the five electrode needles 2 correspond to the top openings of the five air holes 3 respectively. A temperature control module 1 is fixedly installed in the middle of one side of the inner cavity at the upper end of the pressure head 4. The temperature control module 1 is specifically a temperature sensor for detecting the internal temperature of the pressure head 4.

[0026] When testing the chip 5, the pressure head 4 is lowered to pressurize the chip 5, so that the chip 5 can be stably tested in the test module 6. During the test, when the upper end of the pressure head 4 is filled with high-temperature or low-temperature gas, the gas will pass through the electrode needle 2 and enter the lower end of the pressure head 4. The gas reaching the lower end of the pressure head 4 will also reach the upper surface of the chip 5, thereby achieving the effect of removing dust and impurities on the upper surface of the chip 5.

[0027] The temperature control module 1 of the utility model is set up. When the high-temperature or low-temperature gas is filled into the upper end of the pressure head 4, the temperature control module 1 will quickly capture the temperature change of the pressure head 4 and will feed back the temperature information of the pressure head 4 to the system. When the internal and external temperatures of the pressure head 4 are inconsistent with the test set temperature, the system will fill the high-temperature or low-temperature gas into the pressure head 4 along the air hole 3, so that the temperature of the pressure head 4 reaches the test set temperature. This temperature change will also be monitored in real time by the temperature control module 1, and the action of filling the high-temperature or low-temperature gas into the pressure head 4 is also operated in real time to ensure that the temperature of the pressure head 4 is consistent with the test set temperature, thereby achieving the effect of constant temperature of the pressure head 4.

[0028] At the same time, when the gas passes through the electrode needle 2 from the upper end to the lower end, the gas at this time has carried anti-static ion wind. When the ion wind blows to the upper surface of the chip 5, it achieves the anti-static effect of preventing the chip 5 from being broken down by static electricity during testing;

[0029] This technical solution is applicable to a variety of scenarios, such as system-level chip testing, probe card temperature testing, electronic component temperature aging testing, etc. It solves the problems of abnormal imprinting caused by dust adhering to the chip surface during chip testing, static electricity breakdown of the chip during testing, and inconsistency between the actual chip test temperature and the test set temperature. The five air holes designed at the lower end of the press head in the above-mentioned embodiment can effectively remove dust, avoid quality problems such as abnormal imprinting, and improve product yield. In addition, the built-in temperature control module design at the upper end of the press head can abandon the traditional cavity temperature testing environment. This design can make the internal and external temperatures of the press head consistent with the test set temperature, that is, the test temperature required by the chip is consistent with the test set temperature, providing a reliable guarantee for the accuracy of the chip test results.

[0030] In addition, the components included in the temperature-controlled chip test pressure head that is convenient for ion dissipation and dust removal in the utility model are all universal standard parts or components known to technical personnel in this field. The structure and principle thereof can be known to technical personnel in this field through technical manuals or through conventional experimental methods. In the idle part of this device, all the above-mentioned electrical components, which refer to power elements, electrical components, and adapted monitoring computers and power supplies are connected through wires. The specific connection means should refer to the following working principle. The electrical connection is completed in the working order below. The detailed connection means are well-known technologies in this field. The following mainly introduces the working principles and processes, and no explanation is given on the electrical control.

[0031] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0032] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A temperature-controlled chip test pressure head for facilitating ion dissipation and dust removal, comprising a pressure head (4), an air hole (3), an electrode needle (2), and a temperature control module (1), characterized in that: A chip (5) is arranged at the lower side of the pressure head (4), and the chip (5) is mounted on the top of the test module (6). The pressure head (4) is a pressure block for applying pressure to the upper surface of the chip (5). An air hole (3) is provided at the bottom of the pressure head (4), and the air hole (3) is directly connected to the upper end of the pressure head (4). A total of five electrode needles (2) are arranged at the outlet of the upper end of the air hole (3). The electrode needles (2) are fixed to the two side walls of the inner cavity at the upper end of the pressure head (4). A temperature control module (1) is fixedly installed in the middle of one side of the inner cavity at the upper end of the pressure head (4).

2. A temperature-controlled chip test pressure head for ion dissipation and dust removal according to claim 1, characterized in that: The temperature control module (1) is specifically a temperature sensor for detecting the internal temperature of the pressure head (4).

3. A temperature-controlled chip test pressure head for ion dissipation and dust removal according to claim 1, characterized in that: The number of the air holes (3) is five, and the five air holes (3) are evenly distributed through the bottom of the pressure head (4).

4. A temperature-controlled chip test pressure head for ion dissipation and dust removal according to claim 1 or 3, characterized in that: The outer ends of the needles of the five electrode needles (2) correspond to the top openings of the five air holes (3) respectively.

5. A temperature-controlled chip test pressure head for ion dissipation and dust removal according to claim 1, characterized in that: A positioning groove adapted to the chip (5) is provided on the top of the test module (6), and the chip (5) is placed in the positioning groove.

Images