Multi-layer circuit board pressing device

Abstract

The utility model belongs to the technical field of press-fit devices, and particularly relates to a multilayer circuit board press-fit device which comprises a bottom plate, four vertically upward guide columns are fixedly arranged on the upper side wall of the bottom plate, the upper ends of the guide columns are jointly and fixedly connected with a horizontal fixing plate, a hydraulic cylinder is fixedly arranged in the middle of the lower side wall of the fixing plate, and the hydraulic cylinder is fixedly connected with the guide columns. The driving end of the hydraulic cylinder is vertically downward, and the driving end of the hydraulic cylinder is fixedly connected with a horizontal pressing die. The utility model has the advantages that when the pressing die returns, the limiting rod II slides to the vertical surface from the inclined surfaces on the limiting frame I and the limiting frame II, the spring I pulls the guide rod to move inwards, so that the push plate slides inwards along the lower side wall of the pressing die 5, and when the circuit board is adhered to the pressing die, the push plate pushes the circuit board, so that the circuit board is separated from the pressing die; the circuit board does not need to be manually removed by an operator, and the working efficiency of the pressing device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of pressing devices, in particular to a multi-layer circuit board pressing device. Background Art

[0002] In the production and processing of multi-layer circuit boards, multiple circuit boards and multiple insulating layers need to be stacked and fixed on a laminating machine, and then pressed to obtain a multi-layer circuit board. Before pressing, the stacked circuit boards need to be subjected to corresponding heat treatment.

[0003] In order to facilitate the placement of multi-layer circuit boards into the pressing mechanism, the pressing die is generally set lower. During the pressing process, there is a certain possibility that the circuit board will stick to the pressing die or the table. When the circuit board sticks to the table, since the table is low, the staff can directly see the circuit board, which makes it convenient to remove the circuit board directly from the table. When the circuit board sticks to the pressing die, the pressing die will block the operator's line of sight, making it inconvenient to operate the circuit board.

[0004] In order to solve the above problems, we proposed a multi-layer circuit board pressing device. Summary of the invention

[0005] The utility model aims to solve the problems in the background technology and proposes a multi-layer circuit board pressing device.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a multi-layer circuit board pressing device, comprising a bottom plate, the upper side wall of the bottom plate is fixedly provided with four vertically upward guide pillars, the upper ends of the guide pillars are commonly fixedly connected with a horizontal fixed plate, a hydraulic cylinder is fixedly provided in the middle of the lower side wall of the fixed plate, the driving end of the hydraulic cylinder is vertically downward, the driving end of the hydraulic cylinder is fixedly connected with a horizontal pressing die, the four corners of the pressing die are respectively slidably sleeved on the outer wall of the guide pillar, a notch is opened in the middle of the left side of the bottom plate, and a horizontal left-facing fixed left-facing notch is fixed on the left side wall of the pressing die A connecting plate is arranged, the upper side wall of the connecting plate is fixedly connected with a sleeve, the front and rear side walls of the sleeve are provided with a sliding groove, the inner side of the sleeve is slidingly provided with a guide rod, the outer wall of the guide rod is symmetrically provided with a limit rod 1 located in the slide groove, the outer end of the guide rod is fixedly connected with a push plate located at the connecting plate and the lower side of the die, a spring 1 is fixedly connected between the inner end of the guide rod and the inner wall of the sleeve, the outer side wall of the push plate is symmetrically provided with a limit rod 2, the upper side wall of the bottom plate is fixedly connected with a limit frame 1 and a limit frame 2, and the limit frame 1 and the limit frame 2 are symmetrically arranged on both sides of the notch.

[0007] In the above-mentioned multi-layer circuit board pressing device, the upper side wall of the bottom plate is provided with a positioning strip located at the lower side of the pressing mold.

[0008] In the above-mentioned multi-layer circuit board pressing device, four springs 2 are fixedly connected between the pressing die and the fixed plate, and the springs 2 are respectively sleeved on corresponding guide pillars.

[0009] In the above-mentioned multi-layer circuit board pressing device, a plurality of supporting legs are fixedly connected to the lower side wall of the bottom plate, and positioning plates are fixedly provided at the ends of the supporting legs, and positioning holes are provided on the positioning plates.

[0010] In the above-mentioned multi-layer circuit board pressing device, the left side walls of the first limiting frame and the second limiting frame both include a vertical surface and an inclined surface, and the second limiting rod is slidably arranged on the left side walls of the first limiting frame and the second limiting frame.

[0011] In the above-mentioned multi-layer circuit board pressing device, the push plate is in sliding contact with the lower side wall of the pressing mold.

[0012] Compared with the existing technology, the advantages of this multi-layer circuit board pressing device are:

[0013] When the die of the utility model returns, the limit rod 2 slides from the limit frame 1 and the inclined surface on the limit frame 2 to the vertical surface, and the spring 1 pulls the guide rod to move inward, so that the push plate slides inward along the lower side wall of the die 5. When the circuit board sticks to the die, the push plate will push the circuit board to separate the circuit board from the die. There is no need for the operator to manually remove the circuit board, thereby improving the working efficiency of the pressing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a structural schematic diagram of a multi-layer circuit board pressing device proposed by the utility model;

[0015] Figure 2 for Figure 1 A magnified view of part A;

[0016] Figure 3 This is a front view of a multi-layer circuit board pressing device proposed by the utility model.

[0017] In the figure: 1 bottom plate, 2 guide column, 3 fixed plate, 4 hydraulic cylinder, 5 die, 6 notch, 7 connecting plate, 8 sleeve, 9 slide groove, 10 guide rod, 11 push plate, 12 spring 1, 13 limit rod 2, 14 limit frame 1, 15 limit frame 2, 16 positioning strip, 17 spring 2, 18 support leg, 19 positioning plate. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0019] Reference Figure 1-Figure 3 A multi-layer circuit board pressing device comprises a bottom plate 1, four vertically upward guide pillars 2 are fixedly arranged on the upper side wall of the bottom plate 1, the outer wall of the guide pillars 2 is smoothly arranged, the upper ends of the guide pillars 2 are fixedly connected with a horizontal fixing plate 3, a hydraulic cylinder 4 is fixedly arranged in the middle of the lower side wall of the fixing plate 3, the driving end of the hydraulic cylinder 4 is vertically downward, the driving end of the hydraulic cylinder 4 is fixedly connected with a horizontal pressing die 5, the four corners of the pressing die 5 are respectively slidably sleeved on the outer wall of the guide pillar 2, a notch 6 is opened in the middle of the left side of the bottom plate 1, and a horizontal pressing die 5 is fixed on the left side wall of the pressing die 5 A connecting plate 7 is arranged on the left, and the upper side wall of the connecting plate 7 is fixedly connected with a sleeve 8, and the front and rear side walls of the sleeve 8 are provided with a slide groove 9. A guide rod 10 is slidably arranged inside the sleeve 8, and a limit rod 1 located in the slide groove 9 is symmetrically arranged on the outer wall of the guide rod 10. The limit rod 1 prevents the guide rod 10 from detaching from the sleeve 8 when sliding. The outer end of the guide rod 10 is fixedly connected with a push plate 11 located on the lower side of the connecting plate 7 and the die 5, and the push plate 11 is in sliding contact with the lower side wall of the die 5. A spring 12 is fixedly connected between the inner end of the guide rod 10 and the inner wall of the sleeve 8.

[0020] The outer side wall of the push plate 11 is symmetrically provided with a limiting rod 13, the upper side wall of the bottom plate 1 is fixedly connected to a limiting frame 14 and a limiting frame 15, the limiting frame 14 and the limiting frame 15 are symmetrically arranged on both sides of the notch 6, the left side walls of the limiting frame 14 and the limiting frame 15 both include a vertical surface and an inclined surface, the inclined surface is arranged to be lower on the left and higher on the right, and the limiting rod 13 is slidably arranged on the left side walls of the limiting frame 14 and the limiting frame 15.

[0021] When the die 5 moves downward, the limit rod 2 13 slides downward along the vertical surfaces of the limit frame 1 14 and the limit frame 2 15, and the guide rod 10 remains stationary relative to the sleeve 8. As the die 5 descends, the limit rod 2 13 contacts the inclined surface, and under the guiding action of the inclined surface, the limit rod 2 13 drives the guide rod 10 to slide outward, the spring 12 is stretched, and the die 5 presses the multi-layer circuit board downward. During the return stroke, the die 5 moves upward, and the spring 12 pulls the guide rod 10, so that the guide rod 10 drives the push plate 11 to move right, and the push plate 11 slides on the lower side wall of the die 5. If the circuit board sticks to the die 5, the push plate 11 will push the circuit board to separate the circuit board from the die 5 and fall onto the bottom plate 1, until the limit rod 2 13 slides to the vertical surfaces of the limit frame 1 14 and the limit frame 2 15, the push plate 11 stops sliding relative to the die 5, and there is no need for the operator to manually separate the circuit board, thereby improving the pressing efficiency of the pressing device.

[0022] The upper side wall of the base plate 1 is provided with a positioning strip 16 located at the lower side of the die 5. The positioning strip 16 is arranged at a right angle and corresponds to a corner of the die 5. The height of the positioning strip 16 is slightly lower than the thickness of the circuit board after lamination. The positioning strip 16 is conducive to the rapid positioning of the circuit board before lamination. Four springs 17 are fixedly connected between the die 5 and the fixed plate 3. The springs 17 are respectively mounted on the corresponding guide pillars 2. When the die 5 returns, the springs 17 provide pulling force to the die 5 to reduce the load of the hydraulic cylinder 4.

[0023] The lower side wall of the base plate 1 is fixedly connected with a plurality of support legs 18, and the ends of the support legs 18 are fixedly provided with positioning plates 19, each of which has a positioning hole. The positioning plates 19 are fastened to the ground by bolts to fix the support legs 18 and improve the stability of the base plate 1.

[0024] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multi-layer circuit board pressing device, comprising a base plate (1), characterized in that: Four guide pillars (2) extending vertically upward are fixedly arranged on the upper side wall of the base plate (1), and the upper ends of the guide pillars (2) are fixedly connected to a horizontal fixing plate (3). A hydraulic cylinder (4) is fixedly arranged in the middle of the lower side wall of the fixing plate (3), and the driving end of the hydraulic cylinder (4) is vertically downward. The driving end of the hydraulic cylinder (4) is fixedly connected to a horizontal pressing die (5), and the four corners of the pressing die (5) are respectively slidably sleeved on the outer wall of the guide pillar (2). A notch (6) is opened in the middle of the left side of the base plate (1), and a connecting plate (7) arranged horizontally to the left is fixedly arranged on the left side wall of the pressing die (5). The upper side wall of the connecting plate (7) is fixedly connected to a sleeve (8), and the front of the sleeve (8) is The rear side walls are provided with a slide groove (9), a guide rod (10) is slidably arranged inside the sleeve (8), and a limit rod 1 located in the slide groove (9) is symmetrically arranged on the outer wall of the guide rod (10), and the outer end of the guide rod (10) is fixedly connected to a push plate (11) located at the lower side of the connecting plate (7) and the die (5), and a spring 1 (12) is fixedly connected between the inner end of the guide rod (10) and the inner wall of the sleeve (8), and a limit rod 2 (13) is symmetrically arranged on the outer side wall of the push plate (11), and the upper side wall of the bottom plate (1) is fixedly connected to a limit frame 1 (14) and a limit frame 2 (15), and the limit frame 1 (14) and the limit frame 2 (15) are symmetrically arranged on both sides of the notch (6).

2. A multi-layer circuit board pressing device according to claim 1, characterized in that: The upper side wall of the bottom plate (1) is provided with a positioning strip (16) located at the lower side of the pressing mold (5).

3. A multi-layer circuit board pressing device according to claim 1, characterized in that: Four springs (17) are fixedly connected between the pressing die (5) and the fixed plate (3), and the springs (17) are respectively sleeved on corresponding guide pillars (2).

4. A multi-layer circuit board pressing device according to claim 1, characterized in that: A plurality of support legs (18) are fixedly connected to the lower side wall of the bottom plate (1), and positioning plates (19) are fixedly provided at the ends of the support legs (18), and positioning holes are provided on the positioning plates (19).

5. A multi-layer circuit board pressing device according to claim 1, characterized in that: The left side walls of the first limiting frame (14) and the second limiting frame (15) both include a vertical surface and an inclined surface, and the second limiting rod (13) is slidably arranged on the left side walls of the first limiting frame (14) and the second limiting frame (15).

6. A multi-layer circuit board pressing device according to claim 1, characterized in that: The push plate (11) is in sliding contact with the lower side wall of the die (5).

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