Tower type aluminum profile heat dissipation assembly

Abstract

The utility model relates to the technical field of radiators, in particular to a tower type aluminum profile radiating assembly which comprises an aluminum profile base material, a plurality of groups of radiating fins are formed on the surface of the aluminum profile base material, side fins are formed at the two ends of the aluminum profile base material, and the side fins are arranged on the surface of the aluminum profile base material. The bottom ends of the side fins are matched with the aluminum profile base material to form a heat conduction paste preset area used for placing heat conduction pastes in advance, heat conduction paste fixing cavities are formed in the two ends of the heat conduction paste preset area to limit the heat conduction pastes placed in advance, and the heat conduction pastes are attached to the surface of a cooled electronic component along with the aluminum profile base material under the limitation of the heat conduction paste fixing cavities. The heat conduction paste is fixed in the heat conduction paste preset area through the heat conduction paste fixing cavity, the heat conduction paste is synchronously arranged along with the aluminum profile base material, and the heat conduction paste and the aluminum profile base material make full contact.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to a tower-type aluminum profile heat dissipation component. Background Art

[0002] Aluminum profile heat sink is a heat dissipation device that utilizes the excellent thermal conductivity of aluminum profiles. It has the advantages of light weight and good heat dissipation performance.

[0003] When the heat dissipation aluminum profile is normally set up, it will be used in conjunction with a thermal paste. The thermal paste can better transfer the heat generated by electronic components to the heat dissipation aluminum profile and improve the heat transfer efficiency. However, there is no fixed relationship between the heat dissipation aluminum profile and the thermal paste currently used. The thermal paste is set up first, and then the heat dissipation aluminum profile is installed. Insufficient contact is likely to occur between the two. For this reason, we propose a tower aluminum profile heat dissipation component to solve the above problem. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a tower aluminum profile heat dissipation assembly to solve the problem that there is no fixed relationship between the heat dissipation aluminum profile and the thermal conductive paste, and insufficient contact between the thermal conductive paste and the heat dissipation aluminum profile.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a tower-type aluminum profile heat dissipation component, comprising an aluminum profile substrate, a plurality of heat dissipation fins are formed on the surface of the aluminum profile substrate, side fins are formed at both ends of the aluminum profile substrate, the bottom ends of the side fins cooperate with the aluminum profile substrate to form a thermal conductive paste pre-placement area for pre-placing the thermal conductive paste, and both ends of the thermal conductive paste pre-placement area are formed with a thermal conductive paste fixing cavity to limit the pre-placed thermal conductive paste;

[0006] The thermal conductive paste is attached to the surface of the electronic component to be cooled along with the aluminum profile substrate under the limitation of the thermal conductive paste fixing cavity.

[0007] Preferably, a plurality of groups of heat sink fins are formed on the surface of the aluminum profile substrate at equal intervals, with the middle heat sink fin as the center, and the heights of the heat sink fins on both sides decrease one by one.

[0008] Preferably, the top ends of the side fins are lower than the height of the adjacent heat dissipation fins, and the bottom ends of the side fins extend in opposite directions.

[0009] Preferably, the surfaces of the two groups of side fins are both provided with a plurality of groups of airflow guiding grooves, and the plurality of groups of airflow guiding grooves are arranged at equal intervals on the outer surfaces of the side fins.

[0010] Preferably, the bottom of the aluminum profile substrate is formed with an arc-shaped portion downwardly, and the arc-shaped portion extends downwardly into the preset area of ​​the thermal conductive paste.

[0011] Preferably, the thermal conductive paste fixing cavity is communicated with the thermal conductive paste preset area, and an end opening of the thermal conductive paste fixing cavity is contracted inwardly relative to the other end.

[0012] Preferably, a protrusion is formed inside the thermal conductive paste fixing cavity, and the protrusion is triangular in design.

[0013] Compared with the prior art, the utility model can achieve the following beneficial effects:

[0014] 1. In the present invention, side fins are formed at both ends of the aluminum profile substrate, and the bottom ends of the side fins cooperate with the aluminum profile substrate to form a thermal conductive paste pre-setting area, which is used for pre-setting the thermal conductive paste. Both ends of the thermal conductive paste pre-setting area are formed with thermal conductive paste fixing cavities, and the thermal conductive paste is fixed in the thermal conductive paste pre-setting area through the thermal conductive paste fixing cavity. The thermal conductive paste is synchronously set with the aluminum profile substrate, and the two are in full contact;

[0015] 2. A protrusion is formed inside the thermal paste fixing cavity, which divides the interior of the thermal paste fixing cavity into two parts, an upper part and an lower part. After the end of the thermal paste enters the interior of the thermal paste fixing cavity, it will deflect downward or upward under the guidance of the thermal paste fixing cavity, so that the thermal paste forms redundancy inside the thermal paste fixing cavity by deflection. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0017] Figure 2 It is a three-dimensional bottom-up structural schematic diagram of the utility model;

[0018] Figure 3 This is a front view structural schematic diagram of the utility model;

[0019] Figure 4 For the utility model Figure 1 Enlarged structural diagram at A in the middle.

[0020] Among them: 1. Aluminum profile substrate; 2. Heat dissipation fins; 3. Side fins; 4. Air flow guide grooves; 5. Thermal paste pre-placement area; 6. Thermal paste fixing cavity. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, purpose and efficacy of the utility model easy to understand, the utility model is further described below in conjunction with specific embodiments, but the following embodiments are only preferred embodiments of the utility model, not all. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the utility model. The experimental methods in the following embodiments are all conventional methods unless otherwise specified, and the materials, reagents, etc. used in the following embodiments are all commercially available unless otherwise specified.

[0022] Example:

[0023] See also Figure 1 - Figure 4 A tower-type aluminum profile heat dissipation component includes an aluminum profile substrate 1, and a plurality of groups of heat dissipation fins 2 are formed on the surface of the aluminum profile substrate 1. The plurality of heat dissipation fins 2 are formed on the surface of the aluminum profile substrate 1 at equal intervals. The middle heat dissipation fin 2 is used as the center, and the heights of the heat dissipation fins 2 on both sides are gradually reduced. Through the design of gradually reducing the heights, a better upward airflow is formed in the process of heat dissipation. Side fins 3 are formed at both ends of the aluminum profile substrate 1. The top of the side fin 3 is lower than the height of the adjacent heat dissipation fin 2. The bottom ends of the side fins 3 extend oppositely. The bottom ends of the side fins 3 cooperate with the aluminum profile substrate 1 to form a thermal conductive paste pre-setting area 5. The thermal conductive paste pre-setting area 5 is used for pre-setting the thermal conductive paste. Both ends of the thermal conductive paste pre-setting area 5 are formed with a thermal conductive paste fixing cavity 6.

[0024] The surfaces of the two groups of side fins 3 are both provided with a plurality of groups of airflow guiding grooves 4. The plurality of airflow guiding grooves 4 are evenly spaced on the outer surfaces of the side fins 3. The airflow guiding grooves 4 form an axial guide space on the side of the side fins 3. When the lateral airflow blows toward the side fins 3, the airflow can be combed to form a stable airflow column.

[0025] The bottom of the aluminum profile substrate 1 is formed with an arc-shaped portion downward, and the arc-shaped portion extends downward into the thermal conductive paste pre-placement area 5. When the thermal conductive paste is set in the thermal conductive paste pre-placement area 5, the arc-shaped portion of the aluminum profile substrate 1 can increase the contact surface between the aluminum profile substrate 1 and the thermal conductive paste. When the aluminum profile substrate 1 is set, the aluminum profile substrate 1 can squeeze the thermal conductive paste through the arc-shaped portion, thereby more fully contacting the thermal conductive paste and avoiding contact gaps.

[0026] The thermal conductive paste fixing cavity 6 is connected to the thermal conductive paste preset area 5, and the end opening of the thermal conductive paste fixing cavity 6 is contracted inwardly relative to the other end. After the thermal conductive paste is set inside the thermal conductive paste preset area 5, the excess part of the thermal conductive paste is inserted into the thermal conductive paste fixing cavity 6. The contraction design of the opening of the thermal conductive paste fixing cavity 6 can limit the end of the thermal conductive paste, so that the thermal conductive paste can contact the electronic components by being pre-installed in the thermal conductive paste preset area 5, thereby ensuring that the aluminum profile substrate 1 is in full contact with the thermal conductive paste when contacting the electronic components.

[0027] A protrusion is formed inside the thermal paste fixing cavity 6, and the protrusion is designed to be triangular. The protrusion divides the interior of the thermal paste fixing cavity 6 into two parts, an upper part and an lower part. After the end of the thermal paste enters the thermal paste fixing cavity 6, the end of the thermal paste will deflect downward or upward under the guidance of the thermal paste fixing cavity 6, so that the thermal paste forms a redundant amount inside the thermal paste fixing cavity 6 by deflection, which allows the thermal paste to shrink when it becomes dry after long-term use, thereby ensuring the thermal conductivity of the thermal paste during long-term use.

[0028] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A tower-type aluminum profile heat dissipation assembly, characterized in that: The invention comprises an aluminum profile substrate (1), wherein a plurality of groups of heat dissipation fins (2) are formed on the surface of the aluminum profile substrate (1), side fins (3) are formed at both ends of the aluminum profile substrate (1), the bottom ends of the side fins (3) cooperate with the aluminum profile substrate (1) to form a thermal conductive paste pre-placement area (5) for pre-placing the thermal conductive paste, and thermal conductive paste fixing cavities (6) are formed at both ends of the thermal conductive paste pre-placement area (5) to limit the pre-placed thermal conductive paste; The thermal conductive paste is attached to the surface of the electronic component to be cooled along with the aluminum profile substrate (1) under the restriction of the thermal conductive paste fixing cavity.

2. The tower-shaped aluminum profile heat dissipation assembly according to claim 1, characterized in that: A plurality of groups of heat dissipation fins (2) are formed at equal intervals on the surface of the aluminum profile substrate (1), with the middle heat dissipation fin (2) as the center, and the heights of the heat dissipation fins (2) on both sides are gradually reduced.

3. The tower-shaped aluminum profile heat dissipation assembly according to claim 1, characterized in that: The top ends of the side fins (3) are lower than the height of the adjacent heat dissipation fins (2), and the bottom ends of the side fins (3) extend in opposite directions.

4. The tower-shaped aluminum profile heat dissipation assembly according to claim 3, characterized in that: The surfaces of the two groups of side fins (3) are both provided with a plurality of groups of airflow guiding grooves (4), and the plurality of groups of airflow guiding grooves (4) are arranged at equal intervals on the outer surfaces of the side fins (3).

5. The tower-shaped aluminum profile heat dissipation assembly according to claim 4, characterized in that: The bottom of the aluminum profile substrate (1) is formed with an arc-shaped portion downward, and the arc-shaped portion extends downward into the thermal conductive paste preset area (5).

6. The tower-shaped aluminum profile heat dissipation assembly according to claim 5, characterized in that: The thermal conductive paste fixing cavity (6) is in communication with the thermal conductive paste pre-placed area (5), and an end opening of the thermal conductive paste fixing cavity (6) is contracted inwardly relative to the other end.

7. The tower-shaped aluminum profile heat dissipation assembly according to claim 6, characterized in that: A protrusion is formed inside the thermal conductive paste fixing cavity (6), and the protrusion is designed to be triangular.

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