Plasma degumming machine

Abstract

The utility model discloses a plasma degumming machine and relates to the field of degumming machines. The plasma glue removing machine comprises a machine frame body, a lower cavity base is arranged on the machine frame body, an upper cavity base is rotationally connected to the machine frame body, a process gas inlet pipe is arranged on the upper cavity base, a water cooling electrode is arranged in the lower cavity base, and a vacuumizing pipeline and a water cooling pipeline are arranged at the bottom of the water cooling electrode. When the plasma degumming machine is used for degumming, the lower cavity seat and the upper cavity seat are circular cavities and are more suitable for wafer degumming, plasma degumming belongs to dry type degumming, most degumming processes are suitable, degumming is more thorough, efficiency is higher, a circular water-cooled electrode is adopted, discharge uniformity is guaranteed, plasma generation is more uniform, and a better degumming effect is achieved. And the water-cooling connecting assembly is matched, circulating water is connected, heat in the degumming process is taken away, and the degumming effect is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of glue removers, in particular to a plasma glue remover. Background Art

[0002] The degumming machine is mainly used for surface etching and degumming of semiconductor wafers. Removing photoresist is an important process in semiconductor production. The quality of degumming will affect the effect of subsequent processes and the yield of the final product. In the past, semiconductor degumming adopted oxidation degumming and solvent degumming. The common disadvantages are incomplete degumming and slow efficiency. In view of the shortcomings of the prior art, the utility model provides a plasma degumming machine to solve the above problems. Utility Model Content

[0003] 1. Technical issues to be resolved

[0004] In view of the deficiencies in the prior art, the utility model provides a plasma degumming machine. When degumming, the lower cavity seat and the upper cavity seat cavity are circular cavities, which are more suitable for wafer degumming. Moreover, plasma degumming belongs to dry degumming, which is applicable to most degumming processes. The degumming is more thorough and efficient. A circular water-cooled electrode is used to ensure discharge uniformity, and plasma is generated more uniformly to achieve a better degumming effect. The water-cooled connection component is used to connect the circulating water to take away the heat in the degumming process and ensure the degumming effect.

[0005] (II) Technical solution

[0006] To achieve the above objectives, the utility model is implemented through the following technical solutions: a plasma degumming machine, comprising a frame body, the frame body is provided with a lower cavity seat, the frame body is rotatably connected with an upper cavity seat, and the upper cavity seat is provided with a process gas inlet pipe;

[0007] A water-cooling electrode is arranged inside the lower cavity seat, and a vacuum pipeline and a water-cooling pipeline are arranged at the bottom of the water-cooling electrode.

[0008] Preferably, a vacuum pump is fixedly connected to the frame body, and the vacuum pump is fixedly connected to the vacuum extraction pipeline.

[0009] Preferably, a vacuum gauge is fixedly connected to the vacuum pumping pipeline.

[0010] Preferably, an external cable is fixedly connected to the bottom of the water-cooled electrode.

[0011] Preferably, a control panel is provided on the frame body.

[0012] The utility model discloses a plasma glue removal machine, which has the following beneficial effects:

[0013] This plasma degumming machine has circular cavities for the lower and upper chamber seats during degumming, which are more suitable for wafer degumming. Moreover, plasma degumming belongs to dry degumming, which is applicable to most degumming processes. It removes degumming more thoroughly and more efficiently. It uses circular water-cooled electrodes to ensure discharge uniformity and more uniform plasma generation, achieving better degumming effects. It cooperates with water-cooled connection components and connects to circulating water to take away the heat during the degumming process and ensure the degumming effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 It is a disassembly schematic diagram of the lower cavity seat of the utility model.

[0017] In the figure: 1. Rack body; 101. Control panel; 2. Lower cavity seat; 3. Upper cavity seat; 301. Process gas inlet pipe; 4. Water-cooled electrode; 5. Vacuum extraction pipeline; 6. Vacuum gauge; 7. Water cooling pipeline; 8. External cables; 9. Vacuum pump. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution in the embodiments of the utility model is described clearly and completely. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] The embodiment of the present application provides a plasma degumming machine, which solves the problem that the previous semiconductor degumming methods use oxidation degumming and solvent degumming, and the common disadvantages are incomplete degumming and low efficiency.

[0020] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0021] The utility model embodiment discloses a plasma glue removal machine, according to the attached Figure 1-2As shown, it includes a frame body 1, a lower cavity seat 2 is provided on the frame body 1, an upper cavity seat 3 is rotatably connected to the frame body 1, and a process gas inlet pipe 301 is provided on the upper cavity seat 3;

[0022] A water-cooling electrode 4 is provided inside the lower cavity seat 2 , and a vacuum pipeline 5 and a water-cooling pipeline 7 are provided at the bottom of the water-cooling electrode 4 .

[0023] Furthermore, a vacuum pump 9 is fixedly connected to the frame body 1, and the vacuum pump 9 is fixedly connected to the vacuum extraction pipeline 5. The arranged vacuum pump 9 is convenient for being fixedly connected to the vacuum extraction pipeline 5, so as to perform vacuum extraction inside the lower cavity seat 2 and the upper cavity seat 3.

[0024] Furthermore, a vacuum gauge 6 is fixedly connected to the vacuum line 5, and an optimum vacuum degree for generating plasma is achieved through a vacuum pump 9, and the vacuum degree can be conveniently controlled by using the vacuum gauge 6.

[0025] Specifically, the bottom of the water-cooled electrode 4 is fixedly connected with an external cable 8, and the external cable 8 is used to supply power to the water-cooled electrode 4, thereby facilitating the generation of plasma for wafer cleaning.

[0026] It is particularly disclosed that a control panel 101 is provided on the frame body 1, and the control panel 101 is provided to facilitate circuit control of the entire device.

[0027] The plasma degumming machine, when degumming, places the wafer product inside the lower cavity seat 2 and fits it with the water-cooled electrode 4, then rotates the upper cavity seat 3 and contacts and seals it with the lower cavity seat 2, and uses the process gas inlet pipe 301 to fill the working gas into the inner cavity of the lower cavity seat 2 and the upper cavity seat 3 to degumming. During the degumming operation, the vacuum pump 9 and the vacuum pumping pipeline 5 are designed to evacuate the inner cavity of the lower cavity seat 2 and the upper cavity seat 3, and the water-cooled electrode 4 is designed to generate plasma after power is turned on, so as to further perform the degumming operation on the wafer.

[0028] The water cooling pipeline 7 is connected to circulating water to cool the water-cooled electrode 4, take away the heat in the degumming process, and ensure the degumming effect.

[0029] In summary, when removing glue, the lower cavity seat 2 and the upper cavity seat 3 of the plasma degumming machine are circular cavities, which are more suitable for wafer degumming, and plasma degumming belongs to dry degumming, which is applicable to most degumming processes. The degumming is more thorough and efficient. The circular water-cooled electrode 4 is used to ensure the uniformity of discharge and more uniform plasma generation to achieve better degumming effect. The water-cooled connection component is used to connect the circulating water to take away the heat in the degumming process and ensure the degumming effect.

[0030] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A plasma degumming machine, comprising a frame body (1), characterized in that: The frame body (1) is provided with a lower cavity seat (2), the frame body (1) is rotatably connected with an upper cavity seat (3), and the upper cavity seat (3) is provided with a process gas inlet pipe (301); A water-cooling electrode (4) is provided inside the lower cavity seat (2), and a vacuum pipeline (5) and a water-cooling pipeline (7) are provided at the bottom of the water-cooling electrode (4).

2. The plasma glue remover according to claim 1, characterized in that: A vacuum pump (9) is fixedly connected to the frame body (1), and the vacuum pump (9) is fixedly connected to the vacuum extraction pipeline (5).

3. The plasma glue remover according to claim 2, characterized in that: A vacuum gauge (6) is fixedly connected to the vacuum extraction pipeline (5).

4. The plasma glue remover according to claim 1, characterized in that: An external cable (8) is fixedly connected to the bottom of the water-cooled electrode (4).

5. The plasma glue remover according to claim 1, characterized in that: A control panel (101) is provided on the frame body (1).

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