Plating solution treatment system

Abstract

The utility model discloses a plating solution treatment system which comprises at least two plating solution treatment units which are sequentially arranged, each plating solution treatment unit comprises a plating solution treatment tank and a filter, and a solution inlet and a solution outlet of the filter in each plating solution treatment unit are respectively connected to the plating solution treatment tank through a pipeline unit. In every two adjacent plating solution treatment units, the solution outlet of the previous plating solution treatment unit is connected to the solution inlet of the next plating solution treatment unit through one pipeline unit, and each pipeline unit is provided with a pipeline switch so that the circulation direction of the plating solution can be controlled by controlling the on-off state of each pipeline switch. According to the utility model, the pipeline switch on each pipeline unit is controlled, so that the plating solution in the plating solution treatment tank of the current plating solution treatment unit can be circularly filtered by the filter in each plating solution treatment unit, the plating solution circulation among different plating solution treatment units can be met, and the multi-stage filtration of the plating solution is realized.

Description

Technical Field

[0001] The utility model relates to the field of electroplating solution processing, in particular to a plating solution processing system. Background Art

[0002] With the development of my country's economy and society, the energy demand is tight and the energy security situation is becoming increasingly urgent. The adjustment of my country's energy structure with renewable energy such as solar energy and wind energy has been accelerated, and the sustainable development of energy has been promoted. Among them, the application of solar energy is relatively widespread, and silicon wafer cutting systems in the solar energy field are also widely used. In the existing silicon wafer cutting field, diamond wire is generally used to cut silicon rods. When producing diamond wire, the diamond wire needs to be electroplated. After the plating solution has been used for a period of time, there will be some impurities and foreign matter in the plating solution. When there are more impurities and foreign matter, it may cause wire breakage. In order to ensure the quality of the diamond wire, the purity of the plating solution must be ensured. If the plating solution is frequently replaced, it will not only cause a waste of resources, but also metal nickel and other substances in the plating solution will pollute the environment. Utility Model Content

[0003] The utility model aims to provide a plating solution processing system so as to solve the problems of resource waste and environmental pollution caused by replacing the plating solution due to the presence of a large number of impurities in the plating solution in the prior art.

[0004] One aspect of the utility model provides a plating liquid treatment system, comprising at least two plating liquid treatment units arranged in sequence, each plating liquid treatment unit comprising a plating liquid treatment tank and a filter, the liquid inlet and the liquid outlet of the filter in each plating liquid treatment unit are respectively connected to the plating liquid treatment tank through a pipeline unit, the liquid outlet of the previous plating liquid treatment unit in two adjacent plating liquid treatment units is connected to the liquid inlet of the next plating liquid treatment unit through a pipeline unit, and each pipeline unit is provided with a pipeline switch to control the flow direction of the plating liquid by controlling the switching state of each pipeline switch.

[0005] Furthermore, the liquid inlet of the plating liquid treatment unit is the liquid inlet of the plating liquid treatment tank, and the liquid outlet is the liquid outlet of the filter. The liquid outlets of the two filters in two adjacent plating liquid treatment units are connected by a pipeline to form a pipeline unit connecting the two adjacent plating liquid treatment units.

[0006] Furthermore, the liquid inlet of the plating liquid treatment unit is the liquid inlet of the filter, and the liquid outlet is the liquid outlet of the filter. The liquid outlet of the previous filter in two adjacent plating liquid treatment units is connected to the liquid inlet of the next filter through a pipeline to form a pipeline unit connecting the two adjacent plating liquid treatment units.

[0007] Furthermore, the liquid inlet of the plating liquid treatment unit is the liquid inlet of the filter, and the liquid outlet is the liquid outlet of the plating liquid treatment tank. The liquid outlet of the previous plating liquid treatment tank in two adjacent plating liquid treatment units is connected to the liquid inlet of the next filter through a pipeline to form a pipeline unit connecting the two adjacent plating liquid treatment units.

[0008] Furthermore, the plating solution treatment tanks are arranged side by side, and the filter and the pipeline unit are arranged at the back of the plating solution treatment tank.

[0009] Furthermore, the plating solution treatment unit also includes an exhaust hood, which is arranged above the plating solution treatment tank and is used to absorb vapor volatilized in the plating solution treatment tank.

[0010] Furthermore, the plating solution treatment system also includes a spray tower, and the exhaust hood is connected to the spray tower.

[0011] Furthermore, the plating solution treatment units include three, and the plating solution treatment units are, in order from the front to the back according to the flow direction of the plating solution, a stirring and filtering unit, an electrolysis unit and a static unit.

[0012] Furthermore, a stirring device is provided in the plating solution treatment tank of the stirring and filtering unit, and the stirring device is used to stir the plating solution in the plating solution treatment tank.

[0013] Furthermore, an electrolysis device is provided in the plating solution treatment tank of the electrolysis unit, and the electrolysis device is used to electrolyze the plating solution in the plating solution treatment tank.

[0014] Furthermore, at least one plating solution treatment tank is provided with a heating device for heating the plating solution in the plating solution treatment tank.

[0015] Furthermore, a liquid level detection device is provided in the plating solution treatment tank for detecting the liquid level of the plating solution in the plating solution treatment tank.

[0016] The plating solution processing system of the utility model has the following advantages:

[0017] 1. By controlling the pipeline switches on each pipeline unit, not only can the filter in each plating solution treatment unit circulate and filter the plating solution in the plating solution treatment tank of the current plating solution treatment unit, but also the plating solution between different plating solution treatment units can be circulated, thus realizing multi-stage filtration of the plating solution;

[0018] 2. Plating solution treatment tanks are arranged side by side, and the piping unit and the filter are arranged at the back of the plating solution treatment tanks, making the overall structure of the plating solution treatment system compact and saving floor space.

[0019] 3. By respectively arranging a stirring device and an electrolysis device for each plating solution treatment tank, the plating solution is treated by combining physical purification, chemical purification and static purification of the plating solution, thereby improving the filtering and purification effect of the plating solution.

[0020] 4. By installing a heating device in the plating solution treatment tank, the efficiency of plating solution filtration and purification is further improved.

[0021] 5. An exhaust hood is installed above each plating solution treatment tank and connected to the spray tower to collect the volatilized gas during the plating solution treatment process to prevent the volatilized gas from polluting the environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a three-dimensional schematic diagram of the front and side of the plating solution processing system according to an embodiment of the utility model.

[0023] Figure 2 It is a three-dimensional schematic diagram of the back side of the plating solution processing system according to an embodiment of the present utility model.

[0024] Figure 3 It is a schematic diagram of the internal structure of the plating liquid treatment tank of the plating liquid treatment system of an embodiment of the utility model. DETAILED DESCRIPTION

[0025] In order to better understand the purpose, structure and function of the utility model, the plating solution processing system of the utility model is further described in detail below in conjunction with the accompanying drawings.

[0026] like Figure 1-Figure 3 As shown, the plating liquid treatment system provided by the utility model includes three plating liquid treatment units (such as the stirring and filtering unit 01, the electrolysis unit 02 and the static unit 03 shown in the accompanying drawings) arranged in sequence, wherein each plating liquid treatment unit includes a plating liquid treatment tank 1 and a filter 2, the filter 2 is used for filtering the plating liquid, the plating liquid treatment tanks 1 are arranged side by side, the filter 2 and the connecting pipes connecting each plating liquid treatment tank 1 and the filter 2 are arranged at the back of the plating liquid treatment tank 1, so that the entire plating liquid treatment system has a compact structure and can save the floor space of the plating liquid treatment system.

[0027] It should be noted that the accompanying drawings schematically show a specific embodiment of the utility model, and the plating liquid treatment unit in the plating liquid treatment system of the utility model can also be set to two or more to form a multi-stage filtration and purification of the plating liquid.

[0028] Further, in the embodiment of the utility model, the liquid inlet and the liquid outlet of the filter 2 in each plating liquid treatment unit are respectively connected to the plating liquid treatment tank 1 through a pipeline unit, that is, the filter 2 in each plating liquid treatment unit can circulate and filter the plating liquid in the plating liquid treatment tank 1 corresponding to it. It can be understood that the pipeline unit connecting the filter 2 and the plating liquid treatment tank 1 extends inside the plating liquid treatment tank 1 to the bottom of the plating liquid treatment tank 1, so as to perform an extraction operation on the plating liquid at the bottom of the plating liquid treatment tank 1.

[0029] Furthermore, the liquid outlet of the previous plating liquid treatment unit in two adjacent plating liquid treatment units is connected to the liquid inlet of the next plating liquid treatment unit through a pipeline unit, that is, a pipeline unit is also arranged between each plating liquid treatment unit for transferring the plating liquid between the previous and next two plating liquid treatment units.

[0030] It should be noted that the liquid inlet of the plating liquid treatment unit can be the liquid inlet of the filter 2, or the liquid inlet of the plating liquid treatment tank 1. The liquid outlet of the plating liquid treatment unit can be the liquid outlet of the filter 2, or the liquid outlet of the plating liquid treatment tank 1. Since the filter 2 and the plating liquid treatment tank 1 are already connected through the pipeline unit, it can be understood that the liquid inlet of the filter 2 in a plating liquid treatment unit is the liquid outlet of the plating liquid treatment tank 1, and the liquid inlet of the plating liquid treatment tank 1 is the liquid outlet of the filter 2. In addition, the liquid inlet and liquid outlet of the plating liquid treatment tank 1 cannot be used as the liquid inlet and liquid outlet of the plating liquid treatment unit at the same time, because there is no power for the plating liquid to circulate at this time. For each liquid inlet and liquid outlet according to the attached Figure 2 The flow direction of the plating solution marked by the arrow can be distinguished.

[0031] Furthermore, for the convenience of description, the plating liquid treatment unit is divided into a primary plating liquid treatment unit (i.e., the stirring and filtering unit 01 described in the subsequent embodiments), a secondary plating liquid treatment unit (i.e., the electrolysis unit 02 described in the subsequent embodiments) and a tertiary plating liquid treatment unit (i.e., the standing unit 03 described in the subsequent embodiments) according to the flow direction of the plating liquid. The plating liquid treatment unit from which the plating liquid flows out is regarded as the previous-stage plating liquid treatment unit, and the plating liquid treatment unit into which the plating liquid flows is regarded as the next-stage plating liquid treatment unit. The filter 2 and the plating liquid treatment tank 1 in the plating liquid treatment unit are described according to the same rules.

[0032] Furthermore, each pipeline unit is provided with a pipeline switch, and the flow direction of the plating solution can be controlled by controlling the switching state of each pipeline switch. That is, by controlling the on and off of the pipeline switch, the plating solution in the plating solution treatment unit can be controlled to circulate and filter the plating solution therein, and the plating solution can also be controlled to be transported between the various plating solution treatment units.

[0033] The following is combined with Figure 2 A piping system of a specific embodiment of the utility model is introduced in detail. The direction of the arrow in the figure is the flow direction of the plating liquid. In this specific embodiment, the liquid inlet of the plating liquid treatment unit is the liquid inlet of the plating liquid treatment tank 1, and the liquid outlet is the liquid outlet of the filter 2. Therefore, the liquid outlets of the two filters 2 in two adjacent plating liquid treatment units are connected by a pipeline, forming a piping unit connecting the two adjacent plating liquid treatment units.

[0034] Furthermore, the first-level plating liquid treatment unit connects the liquid outlet of the plating liquid treatment tank 1 and the liquid inlet of the filter 2 through the first pipeline unit 31, connects the liquid inlet of the plating liquid treatment tank 1 and the liquid outlet of the filter 2 through the second pipeline unit 32, and connects the first-level plating liquid treatment unit and the second-level plating liquid treatment unit through the third pipeline unit 33; the second-level plating liquid treatment unit connects the liquid outlet of the plating liquid treatment tank 1 and the liquid inlet of the filter 2 through the fourth pipeline unit 34, connects the liquid inlet of the plating liquid treatment tank 1 and the liquid outlet of the filter 2 through the fifth pipeline unit 35, and connects the second-level plating liquid treatment unit and the tertiary plating liquid treatment unit through the sixth pipeline unit 35; the tertiary plating liquid treatment unit connects the liquid outlet of the plating liquid treatment tank 1 and the liquid inlet of the filter 2 through the seventh pipeline unit 37, and connects the liquid inlet of the plating liquid treatment tank 1 and the liquid outlet of the filter 2 through the eighth pipeline unit 38. As can be seen from the figure, a pipeline switch is also provided on each corresponding pipeline unit, and two pipeline units connected to the same liquid outlet or liquid inlet are connected through a tee. For example, the second pipeline unit 32 and the third pipeline unit 33 are connected through a tee and then connected to the liquid outlet of the first-stage filter. Therefore, part of the pipeline of the liquid outlet of the first-stage filter is shared by the second pipeline unit 32 and the third pipeline unit 33.

[0035] Further, when the first pipeline switch (the pipeline switch on the first pipeline unit 31, the following description can be analogized, so it is not repeated) and the second pipeline switch are turned on, and the third pipeline switch is turned off, the primary filter 2 in the primary plating solution treatment unit is started, and the primary filter 2 circulates and filters the plating solution in the primary plating solution treatment tank 1. When the first pipeline switch, the third pipeline switch and the fifth pipeline switch are turned on, and the second pipeline switch and the sixth pipeline switch are turned off, the primary filter 2 in the primary plating solution treatment unit is started, and the primary filter 2 transfers the plating solution in the primary plating solution treatment tank 1 to the secondary plating solution treatment tank 1.

[0036] Further, when the third pipeline opening and the sixth pipeline switch are closed, the fourth pipeline switch and the fifth pipeline switch are opened, and the secondary filter 2 in the secondary plating liquid treatment unit is started at the same time, the secondary filter 2 circulates and filters the plating liquid in the secondary plating liquid treatment tank 1. The operation of the subsequent pipeline switches is similar to the above, and will not be repeated here.

[0037] Furthermore, in another embodiment of the utility model (not shown in the drawings), the liquid inlet of the plating liquid treatment unit is the liquid inlet of the filter 2, and the liquid outlet is the liquid outlet of the filter 2. The liquid outlet of the first filter 2 in two adjacent plating liquid treatment units is connected to the liquid inlet of the second filter 2 through a pipeline to form a pipeline unit connecting the two adjacent plating liquid treatment units. At this time, the operation of each plating liquid treatment unit during the plating liquid circulation filtration is the same. When transferring between each plating liquid treatment unit, it is necessary to open the filters 2 in the two plating liquid treatment units at the same time to extract the plating liquid flowing out of the liquid outlet of the first filter 2 to the liquid inlet of the second filter 2, and flow into the liquid inlet of the second plating liquid treatment tank 1 through the liquid outlet of the second filter 2.

[0038] Furthermore, in another embodiment of the utility model (not shown in the drawings), the liquid inlet of the plating liquid treatment unit is the liquid inlet of the filter 2, and the liquid outlet is the liquid outlet of the plating liquid treatment tank 1. The liquid outlet of the previous plating liquid treatment tank 1 in two adjacent plating liquid treatment units is connected to the liquid inlet of the next filter 2 through a pipeline to form a pipeline unit connecting the two adjacent plating liquid treatment units. At this time, the operation of each plating liquid treatment unit during the plating liquid circulation filtration is the same. When transferring between each plating liquid treatment unit, it is necessary to open the filter 2 in the next plating liquid treatment unit to extract the plating liquid in the previous plating liquid treatment tank 1 to the liquid inlet of the next filter 2, and flow into the liquid inlet of the next plating liquid treatment tank 1 through the liquid outlet of the next filter 2.

[0039] Furthermore, in a specific embodiment of the utility model, three plating solution processing units are provided, and the plating solution processing units are, from front to back, a stirring and filtering unit 01, an electrolysis unit 02, and a standing unit 03 according to the flow direction of the plating solution. After the plating solution is fully filtered by the stirring and filtering unit 01 and most of the impurities are removed, it is transferred to the electrolysis unit 02 for electrolysis, and after the electrolysis unit 02 is fully electrolyzed, it is transferred to the standing unit 03, and after the standing unit 03 is fully standing, the plating solution can be put back online for use.

[0040] Furthermore, a stirring device is provided in the plating solution treatment tank 1 of the stirring and filtering unit 01, and the stirring device is used to stir the plating solution in the plating solution treatment tank 1. The stirring device specifically includes a stirring drive motor 52 provided on the plating solution treatment tank 1, and a stirring rod 51 extending into the plating solution treatment tank 1, and the stirring drive motor 52 drives the stirring rod 51 to rotate to stir the plating solution in the plating solution treatment tank 1. In order to improve the stirring effect, a stirring paddle can also be installed on the stirring rod 51.

[0041] Furthermore, an electrolysis device (not shown in the drawings) is provided in the plating solution treatment tank 1 of the electrolysis unit 02, and the electrolysis device is used to electrolyze the plating solution in the plating solution treatment tank 1 to further remove impurities in the plating solution.

[0042] Furthermore, in each plating solution treatment unit, at least one plating solution treatment tank 1 is provided with a heating device 6, which can heat the plating solution in the plating solution treatment tank 1 to further improve the efficiency of the plating solution treatment. The heating device is a heating tube extending into the plating solution treatment tank 1, and the heating tube is all made of titanium, which is not easily corroded in an acidic or alkaline environment. If damage occurs, this heating method is more conducive to repair and replacement.

[0043] Furthermore, each plating liquid treatment unit is also provided with a liquid level detection device 7, which is used to detect the liquid level of the plating liquid in each plating liquid treatment tank 1 to avoid dry burning or dry extraction of the plating liquid in the plating liquid treatment tank 1, or to avoid excessive plating liquid overflowing from the plating liquid treatment tank 1.

[0044] Furthermore, an exhaust hood 4 is provided above each plating solution treatment tank 1, and the exhaust hood 4 is used to absorb the volatilized steam in the plating solution treatment tank 1. In particular, when a heating device 6 is provided in the plating solution treatment tank 1, more volatilized steam will be generated. Since the volatilized steam contains harmful substances, the exhaust hood 4 extracts the volatilized air and transmits it to a spray tower (not shown in the drawings), and the harmful steam is treated by the spray tower before being discharged to the outside.

[0045] The specific working process of the plating solution treatment system provided by the embodiment of the utility model is as follows:

[0046] 1. Extract the plating solution into the stirring and filtering unit 01, add activated carbon and other adsorption components into the plating solution treatment tank 1 of the stirring and filtering unit 01, turn on the stirring device and start the filter 2 in the stirring and filtering unit at the same time, so that the plating solution is fully stirred and filtered in the stirring and filtering unit 01;

[0047] 2. After the stirring and filtering operation is completed, the plating solution in the stirring and filtering unit 01 is transferred to the electrolysis unit 02 by adjusting the corresponding pipeline switches and the filter 2;

[0048] 3. Turn on the electrolysis device in the electrolysis unit 02 and start the filter 2 in the electrolysis unit at the same time, so that the plating solution is electrolyzed while filtering;

[0049] 4. After the electrolysis operation is completed, the plating solution in the electrolysis unit 02 is transferred to the static unit 03 by adjusting the corresponding pipeline switches and the filter 2;

[0050] 5. Turn on the filter 2 in the static unit, first perform a period of circulation filtration on the plating solution in the plating solution treatment tank 1 in the static unit 03, and then allow the plating solution to stand in the plating solution treatment tank 1 in the static unit 03 to settle the impurities that have not been filtered out to the bottom of the tank. At the same time, it serves as a storage container waiting for the plating solution to come online.

[0051] It should be noted that when a heating device 6 is provided in the plating liquid treatment unit, the heating device 6 can also be turned on at the same time to improve the efficiency of the plating liquid filtration. The above-mentioned operation process of the plating liquid treatment is an optimal operation process, and a more efficient operation process can also be set in combination with the respective processing requirements of each plating liquid treatment unit of the plating liquid treatment system provided by the utility model.

[0052] The plating solution processing system of the utility model has the following advantages:

[0053] 1. By controlling the pipeline switches on each pipeline unit, not only can the filter 2 in each plating solution treatment unit circulate and filter the plating solution in the plating solution treatment tank 1 of the current plating solution treatment unit, but also the plating solution between different plating solution treatment units can be circulated, thus realizing multi-stage filtration of the plating solution;

[0054] 2. The plating solution treatment tanks 1 are arranged side by side, and the pipeline unit and the filter 2 are arranged at the back of the plating solution treatment tank 1, so that the overall structure of the plating solution treatment system is compact and the floor space is saved.

[0055] 3. By respectively arranging a stirring device and an electrolysis device in each plating solution treatment tank 1, the plating solution is treated by combining physical purification, chemical purification and static purification of the plating solution, thereby improving the filtering and purification effect of the plating solution.

[0056] 4. By providing a heating device in the plating solution treatment tank 1, the efficiency of plating solution filtration and purification is further improved.

[0057] 5. An exhaust hood is arranged above each plating solution treatment tank 1 and connected to the exhaust hood with a spray tower, so as to collect the volatilized gas during the plating solution treatment process and prevent the volatilized gas from polluting the environment.

[0058] The utility model is further described above with the help of specific embodiments, but it should be understood that the specific description here should not be understood as limiting the essence and scope of the utility model. Various modifications made to the above embodiments by ordinary technicians in this field after reading this specification are all within the scope of protection of the utility model. The various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the various possible combinations of the embodiments of the utility model will not be described separately.

[0059] If the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

Claims

1. A plating solution processing system, characterized in that: The invention comprises at least two plating liquid treatment units arranged in sequence, each of which comprises a plating liquid treatment tank and a filter, the liquid inlet and the liquid outlet of the filter in each plating liquid treatment unit are respectively connected to the plating liquid treatment tank through a pipeline unit, the liquid outlet of the previous plating liquid treatment unit in two adjacent plating liquid treatment units is connected to the liquid inlet of the next plating liquid treatment unit through a pipeline unit, and each pipeline unit is provided with a pipeline switch to control the flow direction of the plating liquid by controlling the switch state of each pipeline switch.

2. The system according to claim 1, characterized in that The liquid inlet of the plating liquid treatment unit is the liquid inlet of the plating liquid treatment tank, and the liquid outlet is the liquid outlet of the filter. The liquid outlets of the two filters in two adjacent plating liquid treatment units are connected by a pipeline to form a pipeline unit connecting the two adjacent plating liquid treatment units.

3. The system according to claim 1, characterized in that The liquid inlet of the plating liquid treatment unit is the liquid inlet of the filter, and the liquid outlet is the liquid outlet of the filter. The liquid outlet of the first-stage filter in two adjacent plating liquid treatment units is connected to the liquid inlet of the second-stage filter through a pipeline to form a pipeline unit connecting the two adjacent plating liquid treatment units.

4. The system according to claim 1, characterized in that The liquid inlet of the plating liquid treatment unit is the liquid inlet of the filter, and the liquid outlet is the liquid outlet of the plating liquid treatment tank. The liquid outlet of the previous plating liquid treatment tank in two adjacent plating liquid treatment units is connected to the liquid inlet of the next filter through a pipeline to form a pipeline unit connecting the two adjacent plating liquid treatment units.

5. The system according to any one of claims 1 to 4, characterized in that: The plating solution processing tanks are arranged side by side, and the filter and the pipeline unit are arranged at the back of the plating solution processing tank.

6. The system according to claim 1, characterized in that The plating solution treatment unit also includes an exhaust hood, which is arranged above the plating solution treatment tank and is used to absorb the volatilized steam in the plating solution treatment tank.

7. The system according to claim 1, characterized in that The plating solution treatment units include three, and each plating solution treatment unit is a stirring and filtering unit, an electrolysis unit and a static unit from front to back according to the flow direction of the plating solution.

8. The system according to claim 7, characterized in that A stirring device is arranged in the plating solution treatment tank of the stirring and filtering unit, and the stirring device is used to stir the plating solution in the plating solution treatment tank.

9. The system according to claim 7, characterized in that An electrolysis device is arranged in the plating solution treatment tank of the electrolysis unit, and the electrolysis device is used to electrolyze the plating solution in the plating solution treatment tank.

10. The system according to any one of claims 7 to 9, characterized in that: At least one plating solution treatment tank is provided with a heating device for heating the plating solution in the plating solution treatment tank.

11. The system according to any one of claims 7 to 9, characterized in that: A liquid level detection device is arranged in the plating liquid treatment tank, which is used to detect the liquid level of the plating liquid in the plating liquid treatment tank.

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