Diamond fretsaw electroplating treatment device

Abstract

The utility model provides an electroplating treatment device for a diamond wire saw. The electroplating treatment device comprises a rack, a liquid storage tank, a circulating assembly, an electroplating bath, an electroplating power supply and a master control device, the electroplating bath is arranged on the rack, and the liquid storage tank is arranged on the rack below the electroplating bath and is communicated with the electroplating bath through the circulating assembly; the master control device is arranged on the rack above the electroplating bath and electrically connected with all the components, a sand table used for loading electroplating sand is arranged in the electroplating bath, a wire binding support is placed in the sand table, a rotating assembly is correspondingly arranged above the sand table, a metal vertical strip is arranged at the rotating end of the rotating assembly, and the metal vertical strip is arranged on the electroplating bath. The metal vertical strip is lapped on the electroplating sand, and an anode and a cathode of the electroplating power supply are respectively connected with the sand table and the rotating assembly; by finely controlling electroplating parameters and optimizing the electrode structure design, the uniformity and compactness of an electroplated layer are ensured, so that the cutting performance of the diamond fretsaw is improved, and the service life of the diamond fretsaw is prolonged.

Description

Technical Field

[0001] The utility model relates to the field of diamond wire saw preparation, in particular to a diamond wire saw electroplating processing device. Background Art

[0002] At present, diamond wire is the abbreviation of diamond cutting wire, also known as diamond cutting wire or diamond wire. It is mainly used in the cutting of hard and brittle materials such as photovoltaic silicon wafers, sapphire, magnetic materials, and crystal materials. With the continuous development of the photovoltaic industry and the reduction in the price of diamond wire, the field of photovoltaic crystal silicon wafer cutting has become the largest application field of diamond wire. The quality of the diamond wire used is the core factor affecting the cutting process. In the production of diamond wire, in order to combine the diamond grit and the baseline intact, after the baseline is sandblasted, the baseline with diamond grit attached needs to be electroplated. At present, the electroplating operation of diamond wire is to pass the diamond wire through the plating liquid of the plating tank. The electroplating time is mostly controlled manually, resulting in unstable electroplating quality, and bubbles are easily generated on the baseline during electroplating, affecting the electroplating effect.

[0003] The prior art CN2023116466053 discloses a diamond wire electroplating device capable of uniform electroplating, including an electroplating mechanism and a picking mechanism, wherein the electroplating mechanism includes a workbench, a receiving block is fixedly mounted on the upper surface of the workbench, a rectangular groove is provided on the surface of the receiving block, the bottom of the receiving block is fixedly connected to the upper surface of the cylinder, the output shaft of the cylinder is fixedly connected to one end of the hydraulic rod, the other end of the hydraulic rod is fixedly connected to the bottom of the moving block, and the outer surface of the moving block is slidably connected to the inner wall of the rectangular groove. Although the invention can stir the electroplating solution through the stirring blade to reduce the generation of bubbles, the following problems still exist:

[0004] 1. The electroplating time of existing diamond electroplating processing devices is mostly controlled manually, which greatly affects the work efficiency, and the electroplating time cannot be accurately controlled, resulting in unstable electroplating quality.

[0005] 2. The diamond wire base of the invention is suspended on a hook, and the fixing method of the diamond wire is not stable enough, which causes the diamond wire to shake or shift during the electroplating process, affecting the continuity and uniformity of the electroplating layer.

[0006] 3. During electroplating, the existing baselines are all hung on a clamping device such as a hook, and then extended into the electroplating solution for electroplating, which can easily lead to uneven current density distribution during the electroplating process, causing the thickness of the electroplating layer on the surface of the diamond wire to be uneven, affecting the cutting performance of the final product. Utility Model Content

[0007] In view of this, the purpose of the utility model is to provide a diamond wire saw electroplating processing device, which effectively solves the problems existing in traditional diamond electroplating processing by finely controlling electroplating parameters and optimizing electrode structure design, ensures the uniformity and density of the electroplating layer, and thus improves the cutting performance and service life of the diamond wire saw.

[0008] The technical solution adopted by the utility model to solve its technical problems is:

[0009] Provided is a diamond wire saw electroplating treatment device, comprising: a frame, a liquid storage tank, a circulation component, an electroplating tank, an electroplating power supply and a master control device; the electroplating tank is arranged on the frame, the liquid storage tank is arranged on the frame below the electroplating tank, and is connected to the electroplating tank through the circulation component;

[0010] The master control device is arranged on a frame above the electroplating tank and is electrically connected to each component. A sand tray for loading electroplating sand is provided in the electroplating tank. A wire binding bracket is placed in the sand tray. A rotating assembly is correspondingly provided above the sand tray. A metal vertical bar is provided at the rotating end of the rotating assembly. The metal vertical bar is laid on the electroplating sand. The anode and cathode of the electroplating power supply are respectively connected to the sand tray and the rotating assembly.

[0011] It should be noted that the operation of each component is controlled by a master control device (such as a PLC controller), and direct current is provided to the sand table (anode) and the rotating component (cathode) through the electroplating power supply, so that the metal ions in the electroplating solution migrate to the diamond wire under the action of the electric field to form a uniform electroplating layer; and the metal vertical bar not only acts as an electrode for conduction, but also can stir the electroplating solution and electroplating sand, so that the electroplating covers the diamond wire more evenly, thereby improving the quality of the electroplating layer and the service life of the diamond wire saw, and the metal vertical bar can continuously collide with the baseline through rotation, causing the baseline to vibrate slightly, thereby effectively dispersing bubbles attached to the surface of the baseline without affecting the electroplating effect, further improving product quality.

[0012] Preferably, the master control device includes a temperature control device, a timing device, and a speed regulating device. The temperature control device is connected to the liquid storage tank and can control the temperature of the electroplating liquid in the liquid storage tank. The timing device is electrically connected to the electroplating power supply and can control the on and off of the electroplating power supply. The speed regulating device is electrically connected to the rotating component and can control the rotation speed of the rotating component.

[0013] It should be noted that by electrically connecting the timing device to the electroplating power supply, the start and end time of the electroplating operation can be accurately controlled, solving the problem of inaccurate manual control of the electroplating time in traditional electroplating operations. The temperature control device can accurately adjust and control the temperature of the plating solution to ensure that the electroplating reaction is carried out under optimal conditions and improve the uniformity and density of the electroplating layer. The speed regulating device can control the rotation speed of the rotating component, thereby controlling the collision frequency of the metal vertical bar and the baseline in the electroplating solution to prevent excessive speed from affecting the deposition rate and uniformity of the electroplating layer, thereby ensuring that the electroplating layer is more uniform and dense, improving the cutting performance of the diamond wire saw, and at the same time having a higher degree of automation, improving work efficiency and ensuring the repeatability of the electroplating operation.

[0014] Preferably, a heating rod is provided in the liquid storage tank, and the temperature control device is electrically connected to the control end of the heating rod.

[0015] It should be noted that the temperature of the plating solution is controlled by the linkage between the heating rod and the temperature control device, so as to automatically maintain the constant temperature of the plating solution, optimize the electroplating reaction conditions, further ensure the quality of the electroplating layer, and improve the electroplating efficiency.

[0016] Preferably, the sand table is mounted on the titanium mesh column of the anode, and support feet are evenly distributed around the titanium mesh column at the lower end thereof.

[0017] It should be noted that the supporting feet can ensure the stability of the sandbox, reduce the vibration of the sandbox during the electroplating process, make the electroplating sand more evenly distributed, and ensure the continuity and uniformity of the electroplating layer.

[0018] Preferably, the rotating assembly includes a fixed frame, a driving motor, a rotating shaft and a vertical bar bracket, the driving motor is arranged on the fixed frame and is transmission-connected to the rotating shaft, the vertical bar bracket is arranged at the lower end of the rotating shaft, and the upper end of the rotating shaft is connected to the cathode of the power supply through a conductive slip ring.

[0019] It should be noted that the rotating shaft is connected to the cathode of the electroplating power supply through a conductive slip ring, so that the metal vertical bar can always work with power when rotating.

[0020] Preferably, the circulation component includes a circulation pump, an overflow pipe, an outlet pipe and an inlet pipe, the overflow pipe, the outlet pipe and the inlet pipe are arranged on the bottom plate of the electroplating tank, the overflow pipe and the outlet pipe are connected to the liquid storage tank through a three-way joint, and a switch valve is provided on the outlet pipe, one end of the circulation pump is connected to the liquid storage tank, and the other end is connected to the inlet pipe on the electroplating tank through a connecting pipe, and a one-way valve is provided on the connecting pipe.

[0021] It should be noted that the overflow pipe can allow excess plating liquid to flow back into the liquid storage tank from the overflow pipe when there is too much plating liquid in the plating tank, while other plating liquid can flow into the liquid storage tank through the outlet pipe by opening the switch valve on the outlet pipe. The circulation pump can draw the plating liquid in the liquid storage tank and transport it to the plating tank to replenish the plating liquid in the plating tank. The one-way valve arranged between the inlet pipe and the circulation pump can effectively prevent the plating liquid from flowing back and maintain the stability of the circulation system.

[0022] Preferably, the liquid storage box comprises a box body, a sliding groove and a cover plate, the sliding groove is arranged at the upper end of the box body, the cover plate is covered on the box body through the sliding groove, and the cover plate can be moved forward and backward through the sliding groove.

[0023] It should be noted that the liquid storage tank is designed as a movable cover, which can be easily opened and closed through a sliding groove, which facilitates the replacement and maintenance operations of the electroplating liquid, improves operational convenience, and reduces maintenance costs.

[0024] Preferably, a transparent liquid level tube is provided on the side of the box body, and the lower end of the liquid level tube is connected to the interior of the box body.

[0025] It should be noted that the transparent liquid level tube can intuitively display the liquid level, monitor the electroplating liquid level in real time, and replenish or adjust it in time to ensure the continuous electroplating operation and prevent interruption due to lack of liquid.

[0026] Preferably, a machine tool hose lamp is provided on the frame above the electroplating tank.

[0027] It should be noted that the machine tool hose light can provide lighting for the operation area, improve the lighting conditions of the work area, improve operation safety, reduce operation errors and improve work efficiency.

[0028] Beneficial effects of the utility model:

[0029] The utility model provides a diamond wire saw electroplating processing device, which realizes fine control of the electroplating process through an integrated master control device (such as a PLC controller), including accurate setting of the electroplating time, automatic adjustment of the temperature, and control of the speed of the rotating component, which significantly improves the automation level of the electroplating operation, reduces the uncertainty caused by human factors, and ensures the uniformity and density of the electroplating layer;

[0030] The rotating assembly and metal vertical bar design not only participate in the electroplating process as an electrode, but also effectively stir the electroplating solution and electroplating sand during rotation, so that metal ions are more evenly deposited on the diamond wire under the action of the electric field, avoiding bubble adhesion and improving the continuity and uniformity of the electroplating layer. At the same time, the slight collision baseline design of the metal vertical bar helps to disperse bubbles, further ensuring the quality of electroplating.

[0031] The built-in temperature control device and circulation components can dynamically adjust the temperature of the plating solution and keep it clean and recyclable. The automated temperature control system ensures that the electroplating reaction is carried out at the most suitable temperature. The circulation pump and related pipeline design ensure the freshness and stability of the plating solution. The sliding cover design of the liquid storage tank, the transparent liquid level tube and the overall modular structure greatly simplify the replacement and daily maintenance process of the plating solution, reducing the difficulty of operation and maintenance costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a schematic diagram of the overall structure of a diamond wire saw electroplating processing device according to Example 1 of the utility model.

[0033] Figure 2 This is a schematic diagram of the structure of the master control device of Example 1 of the utility model.

[0034] Figure 3 This is a schematic diagram of the structure of the electroplating tank of Example 1 of the utility model.

[0035] Figure 4 This is a schematic diagram of the internal structure of the electroplating tank in Example 1 of the utility model.

[0036] Figure 5 This is a schematic diagram of the structure of the rotating assembly of Example 1 of the utility model.

[0037] Figure 6 This is a schematic diagram of the installation structure of the circulation component of Example 1 of the utility model.

[0038] Figure 7 This is a schematic structural diagram of the liquid storage tank of Example 1 of the utility model.

[0039] Figure 8 This is a schematic diagram of the wire binding bracket structure of Example 1 of the utility model.

[0040] In the figure: 1. frame; 2. liquid storage tank; 21. box body; 22. sliding groove; 23. cover plate; 3. circulation component; 31. circulation pump; 32. overflow pipe; 33. outlet pipe; 34. switch valve; 35. inlet pipe; 36. one-way valve; 4. electroplating tank; 5. master control device; 51. temperature control device; 52. timing device; 53. speed regulating device; 6. electroplating power supply; 61. anode; 62. cathode; 7. sand table; 71. support foot; 8. rotating component; 81. fixed frame; 82. drive motor; 83. rotating shaft; 84. vertical bar bracket; 9. metal vertical bar; 10. wire binding bracket; 11. heating rod; 12. liquid level tube; 13. machine tool hose light.

[0041] It should be noted that these drawings and text descriptions are not intended to limit the conceptual scope of the present invention in any way, but rather illustrate the concept of the present invention for those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0043] Example 1

[0044] like Figure 1-Figure 8 As shown, a diamond wire saw electroplating treatment device comprises: a frame 1, a liquid storage tank 2, a circulation component 3, an electroplating tank 4, an electroplating power supply 6 and a master control device 5; the electroplating tank 4 is arranged on the frame 1, the liquid storage tank 2 is arranged on the frame 1 below the electroplating tank 4, and is connected to the electroplating tank 4 through the circulation component 3;

[0045] The master control device 5 is arranged on the frame 1 above the electroplating tank 4 and is electrically connected to each component. A sand tray 7 for loading electroplating sand is provided in the electroplating tank 4. A wire binding bracket 10 is placed in the sand tray 7. A rotating component 8 is correspondingly provided above the sand tray 7. A metal vertical bar 9 is provided at the rotating end of the rotating component 8. The metal vertical bar 9 is erected on the electroplating sand. The anode 61 and the cathode 62 of the electroplating power supply 6 are respectively connected to the sand tray 7 and the rotating component 8.

[0046] The master control device 5 includes a temperature control device 51, a timing device 52, and a speed regulating device 53. The temperature control device 51 is connected to the liquid storage tank 2 and can control the temperature of the electroplating liquid in the liquid storage tank 2. The timing device 52 is electrically connected to the electroplating power supply 6 and can control the on and off of the electroplating power supply 6. The speed regulating device 53 is electrically connected to the rotating component 8 and can control the rotation speed of the rotating component 8.

[0047] A heating rod 11 is disposed in the liquid storage tank 2 , and the temperature control device 51 is electrically connected to a control end of the heating rod 11 .

[0048] The sand table 7 is mounted on the titanium mesh column of the anode 61, and support legs 71 are evenly distributed around the titanium mesh column at the lower end thereof.

[0049] The rotating assembly 8 includes a fixed frame 81, a driving motor 82, a rotating shaft 83 and a vertical bar bracket 84. The driving motor 82 is arranged on the fixed frame 81 and is transmission-connected to the rotating shaft 83. The vertical bar bracket 84 is arranged at the lower end of the rotating shaft 83. The upper end of the rotating shaft 83 is connected to the power supply cathode 62 through a conductive slip ring.

[0050] The circulation component 3 includes a circulation pump 31, an overflow pipe 32, an outlet pipe 33 and an inlet pipe 35. The overflow pipe 32, the outlet pipe 33 and the inlet pipe 35 are arranged on the bottom plate of the electroplating tank 4. The overflow pipe 32 and the outlet pipe 33 are connected to the liquid storage tank 2 through a three-way joint, and a switch valve 34 is provided on the outlet pipe 33. One end of the circulation pump 31 is connected to the liquid storage tank 2, and the other end is connected to the inlet pipe 35 on the electroplating tank 4 through a connecting pipe, and a one-way valve 36 is provided on the connecting pipe.

[0051] The liquid storage box 2 includes a box body 21, a sliding groove 22 and a cover plate 23. The sliding groove 22 is arranged at the upper end of the box body 21. The cover plate 23 is covered on the box body 21 through the sliding groove 22, and the cover plate 23 can be moved forward and backward through the sliding groove 22.

[0052] A transparent liquid level tube 12 is provided on the side of the box body 21 , and the lower end of the liquid level tube 12 is communicated with the interior of the box body 21 .

[0053] A machine tool hose lamp 13 is provided on the frame 1 above the electroplating tank 4 .

[0054] The working principle and use method of a diamond wire saw electroplating treatment device of this embodiment:

[0055] A diamond wire saw electroplating processing device provided in this embodiment fixes the baseline by a wire binding bracket 10, prepares the electroplating solution according to the requirements of the desired electroplating layer, injects it into the liquid storage tank 2, and adjusts it to a suitable temperature through a temperature control device 51. During this process, the heating rod 11 is automatically adjusted according to the instructions of the temperature control device 51 to keep the temperature of the electroplating solution constant. After starting the main control device 5, the timing device 52 starts timing to accurately control the time of the electroplating operation. At the same time, the circulation pump 31 is started to extract the electroplating solution from the liquid storage tank 2 through the inlet pipe 35, and after filtering or treatment, it is sent to the electroplating tank 4. The excess electroplating solution in the electroplating tank 4 can be returned to the liquid storage tank 2 through the overflow pipe 32 to form a circulation system to ensure that the electroplating solution is fresh and has stable composition. The one-way valve 36 can prevent the electroplating solution from backflowing to ensure the normal operation of the circulation system. The anode 61 of the electroplating power supply 6 is connected to the sand table 7, and the cathode 62 is connected to the rotating component 8 through a conductive slip ring. The rotating component The driving motor 82 of 8 drives the rotating shaft 83 to rotate, so that the vertical bar bracket 84 and the metal vertical bar 9 rotate accordingly. When the metal vertical bar 9 rotates in the electroplating solution, on the one hand, it participates in the electroplating reaction as an electrode, guides the metal ions to be deposited on the diamond wire under the action of the electric field, and forms a uniform and dense electroplating layer; on the other hand, due to the stirring effect generated by the rotation, the flow of the electroplating solution is promoted, the bubble generation is reduced, and the quality and uniformity of the electroplating layer are improved. In addition, the metal vertical bar 9 slightly collides with the diamond wire to help disperse the tiny bubbles that have been formed. The speed regulating device 53 controls the speed of the rotating component 8 according to the preset program to adjust the stirring intensity of the electroplating solution and the contact frequency of the metal vertical bar 9 with the diamond wire to ensure the thickness and uniformity of the electroplating layer; during the entire electroplating process, the operator can monitor the temperature of the electroplating solution, the electroplating time and the speed of the rotating component 8 through the display screen of the master control device 5, and adjust various parameters in time according to actual conditions to achieve the best electroplating effect.

[0056] When in use, first check whether all electrical connections are correct and confirm that all components are functioning normally, especially the ratio of the plating solution, the water level of the liquid storage tank 2, the setting of the temperature control device 51, etc., wind the diamond baseline around the wire binding bracket 10, ensure that the wire is flat and not twisted, then place the wire binding bracket 10 on the sand table 7 in the plating tank 4, and ensure that the baseline is immersed in the plating sand, then turn on the master control device 5 to set the plating parameters (temperature, time, speed, etc.), start the circulation pump 31 to start the circulation of the plating solution, and turn on the heating rod 11 to adjust the temperature of the plating solution. When the temperature reaches After reaching the set value, the electroplating power supply 6 is started through the timing device 52 to start electroplating, and the timing device 52 starts timing. At the same time, the rotating component 8 starts to drive the metal vertical bar 9 to start rotating slowly, and the electroplating process is observed through the good lighting provided by the machine tool hose lamp 13. If necessary, the parameters can be fine-tuned through the main control device 5 to ensure the smooth progress of the electroplating process. After the electroplating is completed, the electroplating power supply 6 and various auxiliary equipment are turned off, and the diamond wire is taken out after cooling for subsequent processing, and the equipment is regularly inspected and maintained, including cleaning the electroplating tank 4, replacing the electroplating solution and checking electrical components.

[0057] Finally, it should be noted that the above is only a preferred embodiment of the utility model, which is only used to illustrate the technical solution of the utility model, and is not used to limit the protection scope of the utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model are included in the protection scope of the utility model.

[0058] In the description of the present invention, it needs to be understood that the orientations or positional relationships indicated by the terms "upper", "lower", "upper end", "lower end", "upper surface", "lower surface", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0059] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "install", "connect", "connection" and "set" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

Claims

1. A diamond wire saw electroplating treatment device, comprising: A frame (1), a liquid storage tank (2), a circulation component (3), an electroplating tank (4), an electroplating power supply (6) and a master control device (5); the electroplating tank (4) is arranged on the frame (1), the liquid storage tank (2) is arranged on the frame (1) below the electroplating tank (4), and is connected to the electroplating tank (4) through the circulation component (3); characterized in that: The master control device (5) is arranged on a frame (1) above the electroplating tank (4) and is electrically connected to each component. A sand tray (7) for loading electroplating sand is arranged in the electroplating tank (4). A wire binding bracket (10) is placed in the sand tray (7). A rotating assembly (8) is arranged above the sand tray (7). A metal vertical bar (9) is arranged at the rotating end of the rotating assembly (8). The metal vertical bar (9) is mounted on the electroplating sand. The anode (61) and the cathode (62) of the electroplating power supply (6) are respectively connected to the sand tray (7) and the rotating assembly (8).

2. A diamond wire saw electroplating treatment device as claimed in claim 1, characterized in that: The master control device (5) comprises a temperature control device (51), a timing device (52), and a speed regulating device (53). The temperature control device (51) is connected to the liquid storage tank (2) and is capable of controlling the temperature of the electroplating liquid in the liquid storage tank (2). The timing device (52) is electrically connected to the electroplating power supply (6) and is capable of controlling the on and off of the electroplating power supply (6). The speed regulating device (53) is electrically connected to the rotating component (8) and is capable of controlling the rotation speed of the rotating component (8).

3. A diamond wire saw electroplating treatment device as claimed in claim 2, characterized in that: A heating rod (11) is provided in the liquid storage tank (2), and the temperature control device (51) is electrically connected to a control end of the heating rod (11).

4. The diamond wire saw electroplating treatment device according to claim 1, characterized in that: The sand table (7) is sleeved on the titanium mesh column of the anode (61), and support feet (71) are evenly distributed around the titanium mesh column at the lower end.

5. The diamond wire saw electroplating treatment device according to claim 1, characterized in that: The rotating assembly (8) comprises a fixed frame (81), a driving motor (82), a rotating shaft (83) and a vertical bar bracket (84); the driving motor (82) is arranged on the fixed frame (81) and is drivingly connected to the rotating shaft (83); the vertical bar bracket (84) is arranged at the lower end of the rotating shaft (83); and the upper end of the rotating shaft (83) is connected to the cathode (62) of the power supply via a conductive slip ring.

6. The diamond wire saw electroplating treatment device according to claim 1, characterized in that: The circulation component (3) comprises a circulation pump (31), an overflow pipe (32), an outlet pipe (33) and an inlet pipe (35); the overflow pipe (32), the outlet pipe (33) and the inlet pipe (35) are arranged on the bottom plate of the electroplating tank (4); the overflow pipe (32) and the outlet pipe (33) are connected to the liquid storage tank (2) through a three-way joint, and a switch valve (34) is provided on the outlet pipe (33); one end of the circulation pump (31) is connected to the liquid storage tank (2), and the other end is connected to the inlet pipe (35) on the electroplating tank (4) through a connecting pipe, and a one-way valve (36) is provided on the connecting pipe.

7. The diamond wire saw electroplating treatment device according to claim 1, characterized in that: The liquid storage box (2) comprises a box body (21), a sliding groove (22) and a cover plate (23); the sliding groove (22) is arranged at the upper end of the box body (21); the cover plate (23) is covered on the box body (21) through the sliding groove (22), and the cover plate (23) can be moved forward and backward through the sliding groove (22).

8. The diamond wire saw electroplating treatment device according to claim 7, characterized in that: A transparent liquid level tube (12) is provided on the side of the box body (21), and the lower end of the liquid level tube (12) is connected to the interior of the box body (21).

9. The diamond wire saw electroplating treatment device according to claim 1, characterized in that: A machine tool hose lamp (13) is provided on the frame (1) above the electroplating tank (4).

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