High-wear-resistance diamond wire saw bead string

Abstract

The utility model provides a high-wear-resistance diamond wire saw bead string. The high-wear-resistance diamond wire saw bead string comprises a bead string base body and an abrasive particle layer. The abrasive particle layer is arranged on the outer surface of the bead string base body in a sleeving mode and fixedly connected with the bead string base body. The grinding wheel is characterized in that the abrasive particle layer comprises a matrix, high-entropy alloy particles and diamond particles, and the high-entropy alloy particles and the diamond particles are distributed in a dispersed mode and embedded into the matrix; by the adoption of the technical scheme, the high-entropy alloy particles are embedded into the matrix in a dispersed distribution mode, it is guaranteed that the high-entropy alloy particles are enough to support each diamond particle, the abrasion speed of local eccentric abrasion caused by uneven local stress of the bead string is reduced, the abrasion resistance and stability of the bead string are improved, and therefore the service life of the bead string is prolonged, and the service life of the bead string is prolonged. And the service life of the rope saw is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of diamond tools, in particular to a highly wear-resistant diamond wire saw bead. Background Art

[0002] Traditional wire saws are made by threading a certain number of beads proportionally onto a multi-strand steel wire rope. The beads generally consist of a bead base and an abrasive layer fixed on the outer surface of the bead base. Adjacent beads are separated by an isolation sleeve that serves as a support and fixation. During the sawing process, the grinding is mainly done by the beads. Therefore, the quality of the beads directly determines the working efficiency and cost of the wire saw machine.

[0003] See also Figure 1 As shown, currently commonly used beads are diamond beads. See application publication number CN113334583A for a diamond wire saw, which discloses that the beads include a base and a matrix. Both the base and the matrix are in a simple shape, and the matrix is ​​fixed to the middle of the outer wall of the base. The matrix contains diamond particles. In this technical solution, the matrix contains only diamond particles. During the cutting process, the beads experience uneven force in certain areas, causing rapid wear of the diamond particles and the matrix in that area, resulting in local eccentric wear. This makes it difficult to maintain stable cutting performance under complex working conditions, causing the wire saw to fail as a whole. Furthermore, problems such as poor diamond particle removal and insufficient chip removal space arise, resulting in low cutting efficiency and a short wire saw lifespan. Utility Model Content

[0004] To this end, it is necessary to provide a highly wear-resistant diamond wire saw bead to solve the problem that during the cutting process, the diamond particles and the matrix of the beads are rapidly worn due to uneven local force, resulting in local eccentric wear, making it difficult to maintain stable cutting performance under complex working conditions.

[0005] To achieve the above-mentioned objectives, the utility model provides a highly wear-resistant diamond wire saw bead, comprising a bead base and an abrasive layer; the abrasive layer is sleeved on the outer surface of the bead base and fixedly connected to the bead base; the abrasive layer comprises a matrix, high entropy alloy particles and diamond particles, and the high entropy alloy particles and diamond particles are dispersed and embedded in the matrix.

[0006] Furthermore, a plurality of high entropy alloy particles are distributed around each diamond particle.

[0007] Furthermore, the high entropy alloy particles include Cr, W, Ni, Mo, Si, B, Mn, C and Fe.

[0008] Furthermore, the high-entropy alloy particles are prepared by uniformly mixing 10% by weight of 2000-mesh W powder and 300-mesh powder with weight proportions of 3% Cr, 3% Ni, 3% Mo, 0.5% Si, 2.5% B, 0.7% Mn, 0.3% C and 75% Fe, and then preparing the mixture by melting and atomization.

[0009] Furthermore, the mesh size of the diamond particles is smaller than that of the high entropy alloy particles.

[0010] Furthermore, the diamond particles are 30-60 mesh, and the high entropy alloy particles are 40-80 mesh.

[0011] Furthermore, the carcass is formed from carcass powder, and the carcass powder includes 2-4% SiC.

[0012] Furthermore, the SiC is 1000-2000 mesh.

[0013] Different from the existing technology, the above technical solution mainly adds high-entropy alloy particles and embeds them into the matrix in a dispersed distribution manner, ensuring that the high-entropy alloy particles are sufficient to support each diamond particle, slowing down the wear rate of local eccentric wear caused by local uneven force, improving the wear resistance and stability of the beads, thereby extending the service life of the beads and then extending the service life of the wire saw. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A schematic diagram of the diamond bead structure of a diamond wire saw described in the background art;

[0015] Figure 2 Schematic diagram of a highly wear-resistant diamond wire saw bead structure according to an embodiment;

[0016] Figure 3 for Figure 2 Cross-sectional view at AA in the middle;

[0017] Figure 4 for Figure 3 Enlarged schematic diagram of point B in the middle.

[0018] Description of reference numerals:

[0019] 10. Beaded base;

[0020] 20. Abrasive layer;

[0021] 201, matrix; 202, diamond particles; 203, high entropy alloy particles;

[0022] H, the height of diamond particles exposed on the surface of the matrix;

[0023] h. The exposed height of high entropy alloy particles on the matrix surface. DETAILED DESCRIPTION

[0024] In order to explain the technical content, structural features, achieved objectives and effects of the technical solution in detail, the following is a detailed description in conjunction with specific embodiments and accompanying drawings.

[0025] References to "embodiments" herein mean that the specific features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the word "embodiment" in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or relevance to other embodiments. In principle, in this application, as long as there are no technical contradictions or conflicts, the various technical features mentioned in the embodiments can be combined in any manner to form a corresponding implementable technical solution.

[0026] Unless otherwise defined, the technical terms used herein have the same meanings as those generally understood by those skilled in the art to which this application belongs; the use of relevant terms herein is only for describing specific embodiments and is not intended to limit this application.

[0027] In the description of this application, the term "and / or" is used to describe a logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and both A and B exist. In addition, the character " / " in this document generally indicates that the objects before and after are in a logical "or" relationship.

[0028] In this application, terms such as "first" and "second" are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual quantity, priority or sequence relationship between these entities or operations.

[0029] Without further limitations, in this application, the words "include", "comprise", "have" or other similar expressions used in the sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those defined elements, but also other elements not explicitly listed, or elements inherent to such process, method or product.

[0030] Consistent with the understanding in the Patent Examination Guidelines, in this application, expressions such as "greater than," "less than," and "exceed" are understood to exclude the number itself; expressions such as "above," "below," and "within" are understood to include the number itself. In addition, in the description of the embodiments of this application, "multiple" means more than two (including two), and similar expressions related to "multiple" are also understood in this manner, such as "multiple groups" and "multiple times," unless otherwise clearly and specifically limited.

[0031] In the description of the embodiments of the present application, the space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present application or facilitating the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, it should not be understood as a limitation on the embodiments of the present application.

[0032] Unless otherwise expressly specified or limited, in the description of the embodiments of the present application, the terms "installed", "connected", "connected", "fixed", "set", etc. used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art of the present application, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0033] See also Figure 2-Figure 4 As shown, the utility model provides a highly wear-resistant diamond wire saw bead, which is used to solve the problem that during the cutting process of the bead, the diamond particles 202 and the matrix 201 in the local area are rapidly worn due to uneven local force, resulting in local eccentric wear, making it difficult to maintain stable cutting performance under complex working conditions, and causing the entire wire saw to fail; it mainly adds high entropy alloy particles 203, embeds them in the matrix 201 in a dispersed distribution, ensures that the high entropy alloy particles 203 are sufficient to support each diamond particle 202, slows down the wear rate of the bead due to local eccentric wear caused by uneven local force, improves the wear resistance and stability of the bead, thereby extending the service life of the bead, and then extending the service life of the wire saw.

[0034] See also Figure 2-Figure 3To further illustrate the present invention, embodiments are provided below. A highly wear-resistant diamond wire saw bead comprises a bead base 10 and an abrasive layer 20; the abrasive layer 20 is sleeved on the outer surface of the bead base 10 and fixedly connected to the bead base 10; the abrasive layer 20 comprises a matrix 201, high-entropy alloy particles 203, and diamond particles 202, wherein the high-entropy alloy particles 203 and diamond particles 202 are dispersed and embedded in the matrix 201.

[0035] The high-entropy alloy particles 203 and diamond particles 202 are dispersed and embedded in the matrix 201, forming an abrasive layer 20. When fixedly connected, the matrix 201 is sleeved and fixedly connected to the outer surface of the bead base 10, so that the abrasive layer 20 is sleeved on the outer surface of the bead base 10. The diamond particles 202 have a grinding function. During operation, the diamond particles 202 are exposed on the matrix surface, causing the diamond particles 202 to grind the product to be cut, thus giving the bead a grinding function. The high-entropy alloy particles 203 are composed of multiple elements and have a highly mixed grain structure, which gives them excellent wear resistance and stability. They can be produced through mechanical alloying, powder metallurgy, melt mixing, thin film deposition, etc. The high-entropy alloy particles 203 can provide sufficient support for the diamond particles 202 when the bead is subjected to uneven local forces, preventing rapid wear of some diamond particles 202 and the matrix 201, which could cause the bead to fail as a whole, thereby extending the bead's service life.

[0036] The high-entropy alloy particles 203 provide sufficient support for the diamond particles 202. They and the diamond particles 202 can be randomly or regularly distributed within the matrix 201. Preferably, a plurality of high-entropy alloy particles 203 are distributed around each diamond particle 202. By precisely controlling the distribution of the high-entropy alloy particles 203, sufficient alloy particle support is ensured around each diamond particle 202. This further reduces the wear rate of the beads, which can be caused by localized eccentric wear due to uneven local force, thereby improving the wear resistance and stability of the beads and extending their service life.

[0037] The high entropy alloy particles 203 are composed of a highly mixed grain structure composed of multiple elements. They can be prepared by mixing multiple elements or multiple element alloys and then melting and atomizing them. The elemental composition of the high entropy alloy particles can include, but is not limited to, any combination of elements such as Fe, Cr, Ti, Mo, Nb, W, Mn, Si, B, Ni, and C, so that the high entropy alloy particles 203 have excellent wear resistance and stability. For example, in some embodiments, the high entropy alloy particles 203 include elements such as Fe, Cr, Ti, Mo, Nb, W, Mn, Si, and B; in some embodiments, the high entropy alloy particles 203 include elements such as Fe, Cr, W, Ni, Mo, Si, B, Mn, and C; in some embodiments, the high entropy alloy particles 203 include elements such as Cr, W, Ni, Mo, Si, B, Mn, and C. The element ratio within the high entropy alloy particles 203 can be adjusted according to the specific wear resistance and stability requirements to meet the needs of different cutting products. Taking the last embodiment as an example, an element ratio is provided to prepare high-entropy alloy particles 203, optimizing the wear resistance and stability of the high-entropy alloy particles 203. Specifically, the high-entropy alloy particles 203 are uniformly mixed with 10% by weight of 2000-mesh W powder and 300-mesh powder containing 3% by weight of Cr, 3% by weight of Ni, 3% by weight of Mo, 0.5% by weight of Si, 2.5% by weight of B, 0.7% by weight of Mn, 0.3% by weight of C, and 75% by weight of Fe, and then formed by melting and atomization.

[0038] See also Figure 4 As shown, the high entropy alloy particles 203 on the periphery of the diamond particles 202 provide sufficient support for the diamond particles 202, slowing down the wear rate of local eccentric wear caused by uneven local force on the beads. In practical applications, the exposed height H of the diamond particles on the matrix surface should be greater than the exposed height h of the high entropy alloy particles on the matrix surface, so that the diamond particles 202 can work normally when the beads are grinding the products to be cut. The size and shape of the diamond particles 202 are very critical for controlling the exposed height H of the diamond particles on the matrix surface. Generally speaking, the larger the diameter of the diamond particles 202, the higher the exposed height H of the diamond particles on the matrix surface. Therefore, it is preferred that the mesh size of the diamond particles 202 is smaller than that of the high entropy alloy particles 203, so that the diameter of the diamond particles 202 is greater than that of the high entropy alloy particles 203, so as to control the exposed height H of the diamond particles on the matrix surface to be greater than the exposed height h of the high entropy alloy particles on the matrix surface. This embodiment provides a specific implementation method, that is, the diamond particles 202 are 30-60 mesh diamonds, and the high-entropy alloy particles 203 are 40-80 mesh diamonds. Regardless of the mesh size ranges of the diamond particles 202 and the mesh size ranges of the high-entropy alloy particles 203, it is necessary to ensure that the mesh size of the diamond particles 202 is smaller than that of the high-entropy alloy particles 203.

[0039] To accelerate the exposure of diamond particles 202 during grinding, the hardness of matrix 201 can be appropriately weakened. This allows the matrix 201 to wear more quickly when the beads are grinding the product to be cut, allowing the diamond particles 202 to be more easily exposed and functioning properly. Matrix 201 is typically formed from matrix powder. To this end, the hardness of matrix 201 can be weakened by adjusting the ratio of the original matrix powder, or by adding new components that are susceptible to wear. The following uses the addition of new components as an example to further illustrate the present invention. For example, by adding 2-4% SiC to the matrix powder, SiC is highly brittle and susceptible to wear. This accelerates the wear of the matrix 201 surrounding the diamond particles 202, allowing them to be exposed quickly. This improves the efficiency of the diamond particles 202 in coming out of the cutting edge and increases the exposed height H of the diamond particles on the matrix surface. Furthermore, it creates chip removal space between adjacent diamond particles 202, improving grinding efficiency. The SiC provided in this embodiment may be 1000-2000 mesh. 1000-2000 mesh SiC particles are fine, which can improve the density and adhesion of the matrix 201, making the matrix 201 easier to shape.

[0040] To further illustrate this embodiment, the following specific embodiment of the present invention is provided. 3% including 10% by weight of 2000 mesh W powder and 300 mesh powder with weight proportions of 3% Cr, 3% Ni, 3% Mo, 0.5% Si, 2.5% B, 0.7% Mn, 0.3% C and 75% Fe are uniformly mixed and then prepared into high entropy alloy particles 203 by melting and atomization; 2-4% SiC is added to the matrix 201 powder, and the high entropy alloy particles 203, diamond particles 202 and matrix 201 powder are uniformly mixed and pressed at high temperature to obtain a matrix 201 embedded with high entropy alloy particles 203 and diamond particles 202, i.e., an abrasive layer 20, and then the obtained abrasive layer 20 is sintered with the bead base 10 to obtain diamond beads.

[0041] It should be noted that although the above embodiments have been described herein, this does not limit the scope of patent protection of the present utility model. Therefore, based on the innovative concept of the present utility model, changes and modifications to the embodiments described herein, or equivalent structural or process transformations made using the contents of the present utility model specification and drawings, and direct or indirect application of the above technical solutions to other related technical fields are all included in the scope of protection of the present utility model patent.

Claims

1. A highly wear-resistant diamond wire saw bead, comprising a bead base and an abrasive layer; the abrasive layer is sleeved on the outer surface of the bead base and fixedly connected to the bead base; characterized in that: The abrasive grain layer includes a matrix, high entropy alloy particles and diamond particles, wherein the high entropy alloy particles and diamond particles are dispersed and embedded in the matrix.

2. The highly wear-resistant diamond wire saw bead according to claim 1, characterized in that: A plurality of high entropy alloy particles are distributed around each diamond particle.

3. The highly wear-resistant diamond wire saw bead according to claim 1, characterized in that: The mesh size of the diamond particles is smaller than that of the high entropy alloy particles.

4. The highly wear-resistant diamond wire saw bead according to claim 3, characterized in that: The diamond particles have a mesh size of 30-60, and the high entropy alloy particles have a mesh size of 40-80.

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