Vapor chamber structure with locally thickened plate thickness
The locally thickened temperature-averaging plate structure addresses the inefficiencies of thin plates by using differently thickened lower plates and supporting structures to improve heat transfer and storage in thin electronic products.
Patent Information
- Application Number
- CN202420567658.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-22
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-03-22
AI Technical Summary
Existing temperature equalizing plates in thin electronic products struggle to effectively contact and store heat due to their thin upper and lower plates, limiting heat transfer efficiency.
A temperature-averaging plate structure with locally thickened plate thickness is achieved by assembling lower plates of different thicknesses, incorporating supporting structures and chambers to enhance heat transfer contact with the heat source.
The locally thickened design improves heat transfer and storage capabilities, enhancing the heat transfer contact effect and overall thermal performance.
Smart Images
Figure CN222257863U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a heat conduction component, in particular to a temperature-averaging plate structure with locally thickened plate thickness. Background Art
[0002] In the existing temperature equalizing plate, a capillary structure is mainly provided in both the upper plate and the lower plate, and the working fluid inside the temperature equalizing plate undergoes a vapor phase change when heated, thereby quickly conducting heat from the heated lower plate to the upper plate, and then the vaporized working fluid is condensed on the upper plate to return to a liquid state, and then flows back to the lower plate through the capillary structure.
[0003] However, since the current temperature vapor chamber is often used in thin electronic products, the thickness of the upper and lower plates is relatively thin, and the thicker plates cannot contact the heat source and store heat. Therefore, it needs to be improved.
[0004] In view of this, the inventors have devoted themselves to research and applied theories to improve and solve the above-mentioned deficiencies, and finally proposed a utility model which has a reasonable design and effectively improves the above-mentioned deficiencies. Utility Model Content
[0005] The main purpose of the utility model is to provide a temperature averaging plate structure with locally thickened plate thickness, which is constructed by joining the lower plate of the temperature averaging plate used for contacting the heat source in a manner of assembling different thicknesses, so that the local portion used for contacting the heat source can be thickened to improve the heat transfer contact effect of the temperature averaging plate.
[0006] In order to achieve the above-mentioned purpose, the utility model provides a temperature-averaging plate structure with locally thickened plate thickness, including an upper plate and a lower plate, the lower plate and the upper plate are overlapped and a chamber is formed between the upper plate, and a plurality of supporting structures supported between the upper plate and the lower plate are arranged in the chamber; wherein the lower plate includes a first lower plate component and a second lower plate component, and the first lower plate component has a first thickness, and the second lower plate component is provided with a through hole for the first lower plate component to be inserted and sealed, and the through hole has a second thickness, and the first thickness is greater than the second thickness.
[0007] By assembling the first lower plate and the second lower plate with different thicknesses, the thickness of the part contacting the heat source can be locally increased to improve the heat transfer contact effect of the temperature equalizer. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Figure 1 It is a cross-sectional schematic diagram of the internal structure of the first embodiment of the utility model.
[0009] Figure 2 It is a schematic cross-sectional exploded view of the upper plate and the lower plate of the first embodiment of the utility model.
[0010] Figure 3 It is a partial three-dimensional exploded view of the upper plate and the lower plate of the first embodiment of the utility model.
[0011] Figure 4 It is a partial cross-sectional schematic diagram of the first embodiment of the utility model.
[0012] Figure 5 It is a partial cross-sectional schematic diagram of the second embodiment of the utility model.
[0013] Figure 6 It is a partial cross-sectional schematic diagram of the third embodiment of the utility model.
[0014] Figure 7 It is a partial cross-sectional schematic diagram of the fourth embodiment of the utility model.
[0015] Figure 8 It is a partial cross-sectional schematic diagram of the fifth embodiment of the utility model.
[0016] Fig. 9 It is a partial cross-sectional schematic diagram of the sixth embodiment of the utility model.
[0017] Explanation of symbols in the accompanying drawings:
[0018] 1: upper plate;
[0019] 10: upper capillary tissue;
[0020] 2: Lower the board;
[0021] 20: first lower plate;
[0022] 200: contact surface;
[0023] 201: inner surface;
[0024] 202: support part;
[0025] 203: concave edge;
[0026] 21: second lower plate;
[0027] 210: through hole;
[0028] 211: outer surface;
[0029] 212: inner surface;
[0030] 22: lower capillary tissue;
[0031] 3: Support structure;
[0032] C: chamber;
[0033] T1: first thickness;
[0034] T2: second thickness;
[0035] T3: The third thickness. DETAILED DESCRIPTION
[0036] In order to further disclose the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only provided for reference and description and are not intended to limit the present invention.
[0037] See also Figure 1 and Figure 2 , are respectively a cross-sectional schematic diagram of the internal structure of the first embodiment of the utility model, and a cross-sectional exploded schematic diagram of the upper plate and the lower plate. The utility model provides a temperature-averaging plate structure with locally increased plate thickness, comprising an upper plate 1 and a lower plate 2; wherein:
[0038] The upper plate 1 and the lower plate 2 can be made of materials with good thermal conductivity such as copper or aluminum, and the lower plate 2 is composed of a first lower plate member 20 and a second lower plate member 21; please refer to Figure 3 As shown, the second lower plate 21 is provided with a through hole 210, and the through hole 210 is formed to match the contour shape of the first lower plate 20, so that the first lower plate 20 is arranged on the through hole 210 in a pressing or tight fitting manner, and the second lower plate 21 is sealed and joined with the first lower plate 20 by means such as welding to form the lower plate 2.
[0039] Please see again Figure 1 and Figure 2 As shown, the lower plate 2 is covered with the upper plate 1 to form a chamber C between the upper plate 1 and the lower plate 2; specifically, a concave shape can be formed on the second lower plate member 21 of the lower plate 2 and faces the upper plate 1, so that when the upper plate 1 is placed on the lower plate 2, the concave shape is covered by the upper plate 1 and sealed with the periphery of the second lower plate member 21, thereby forming the chamber C. In addition, Figure 1 As shown, an upper capillary structure 10 may be provided on a surface of the upper plate 1 opposite to the lower plate 2 . The upper capillary structure 10 is located in the chamber C and may be a woven mesh, powder sintering, or grooves formed on the surface of the upper plate 1 .
[0040] like Figure 4As shown, the utility model mainly makes the first lower plate 20 of the lower plate 2 have a first thickness T1, and the second lower plate 21 of the lower plate 2 has a second thickness T2, and the thickness of the through hole 210 provided on the second lower plate 21 is substantially the second thickness T2, and the first thickness T1 is greater than the second thickness T2. In this way, the effect of local thickening can be achieved through the first thickness T1 of the first lower plate 20, so that the first lower plate 20 can be used as a contact with the heat source (omitted in the figure) and have good heat storage and heat transfer effects.
[0041] Therefore, by means of the above-mentioned structural composition, the temperature equalizing plate structure with locally thickened plate thickness of the utility model can be obtained.
[0042] Please see again Figures 1 to 4 As shown, in the embodiment of the present invention, further, a plurality of supporting structures 3 supported between the upper plate 1 and the lower plate 2 may be provided in the above-mentioned chamber C; further, the first lower plate 20 of the lower plate 2 has a contact surface 200, and an inner surface 201 relative to the contact surface 200, and a plurality of supporting portions 202 may also be provided on the inner surface 201 of the first lower plate 20, and the plurality of supporting portions 202 may be the aforementioned supporting structure 3 (that is, the supporting structure 3 may also be the supporting portion 202 arranged on the inner surface 201 of the first lower plate 20), or the supporting structure 3 and the supporting portion 202 may coexist, and the plurality of supporting portions 202 may be integrally formed with the first lower plate 20, for example, by extrusion. Furthermore, the second lower plate 21 has an outer surface 211 and an inner surface 212, wherein the inner surface 212 may be provided with a lower capillary structure 22, the lower capillary structure 22 is located in the chamber C, and may be a woven mesh, powder sintering, or grooves formed on the inner surface 212, and the contact surface 200 of the first lower plate 20 may be aligned with the outer surface 211 of the second lower plate 21, so that the inner surface 201 of the first lower plate 20 protrudes into the chamber C. In addition, the aforementioned support structure 3 abuts between the upper plate 1 and the inner surface 212 of the second lower plate 21.
[0043] In addition, if Figure 5 As shown, the contact surface 200 and the inner surface 201 of the first lower plate 20 may also protrude from the outer surface 211 and the inner surface 212 of the second lower plate 21, respectively; that is, the first lower plate 20 is centered at the height of the through hole 210. Figure 6 As shown, the inner surface 201 of the first lower plate 20 and the inner surface 212 of the second lower plate 21 may also be aligned with each other so that the contact surface 200 of the first lower plate 20 protrudes from the outer surface 211 of the second lower plate 21 .
[0044] Furthermore, by Figures 7 to 9As shown, further, the utility model can also form a concave edge 203 on the first lower plate 20 and match with the through hole 210 of the second lower plate 21, and the concave edge 203 has a third thickness T3, and the third thickness T3 is substantially greater than or equal to the second thickness T2, so that the first lower plate 20 can be expected to be assembled on the through hole 210 of the second lower plate 21. And similarly, as Figure 7 As shown, when the concave edge 203 is substantially equal to the second thickness T2 and is adjacent to the contact surface 200 of the first lower plate 20, the contact surface 200 of the first lower plate 20 and the outer surface 211 of the second lower plate 21 are aligned with each other; Figure 8 As shown, when the concave edge 203 is substantially larger than the second thickness T2, the contact surface 200 of the first lower plate 20 can be made to protrude from the outer surface 211 of the second lower plate 21, or the inner surface 201 of the first lower plate 20 can be made to protrude from the inner surface 212 of the second lower plate 21 (not shown); Fig. 9 As shown, when the concave edge 203 is substantially equal to the second thickness T2 and is adjacent to the inner surface 201 of the first lower plate 20, the inner surface 201 of the first lower plate 20 and the inner surface 212 of the second lower plate 21 are aligned with each other. Therefore, by setting the concave edge 203, the above-mentioned various embodiments can still be varied.
[0045] The above description is only a preferred feasible embodiment of the present invention, which does not limit the patent scope of the present invention. Therefore, all equivalent structural changes made using the contents of the specification and drawings of the present invention are also included in the scope of the present invention and are hereby stated.
Claims
1. A temperature-homing plate structure with locally increased plate thickness, characterized in that: include: Once on the board; as well as A lower plate is overlapped with the upper plate and forms a chamber with the upper plate, and a plurality of supporting structures supported between the upper plate and the lower plate are arranged in the chamber; The lower plate includes a first lower plate component and a second lower plate component, and the first lower plate component has a first thickness, and the second lower plate component is provided with a through hole for the first lower plate component to be inserted and sealed, and the through hole has a second thickness, and the first thickness is greater than the second thickness.
2. The temperature equalizing plate structure with locally increased plate thickness according to claim 1, characterized in that: The upper plate has a surface and is opposite to the lower plate, and an upper capillary structure is arranged on the surface of the upper plate.
3. The temperature equalizing plate structure with locally increased plate thickness according to claim 1, characterized in that: A concave shape is formed on the second lower plate member of the lower plate and faces the upper plate to form the chamber.
4. The temperature equalizing plate structure with locally increased plate thickness according to claim 1, characterized in that: A concave edge is formed on the first lower plate and matches with the through hole. The concave edge has a third thickness, and the third thickness is greater than or equal to the second thickness.
5. The temperature equalizing plate structure with locally thickened plate thickness according to claim 1 or 4, characterized in that: The first lower plate and the second lower plate are sealed and joined by welding.
6. The temperature equalizing plate structure with locally increased plate thickness according to claim 1, characterized in that: The first lower plate has a contact surface, and the contact surface protrudes from the outer surface of the second lower plate, or is aligned with the outer surface of the second lower plate.
7. The temperature equalizing plate structure with locally increased plate thickness according to claim 1 or 6, characterized in that: The first lower plate has an inner surface, and a plurality of supporting parts are arranged on the inner surface of the first lower plate.
8. The temperature equalizing plate structure with locally increased plate thickness according to claim 7, characterized in that: The plurality of support parts are integrally formed with the first lower plate.
9. The temperature equalizing plate structure with locally increased plate thickness according to claim 7, characterized in that: The second lower plate has an inner surface, and the plurality of supporting structures abut between the upper plate and the inner surface of the second lower plate.
10. The temperature equalizing plate structure with locally increased plate thickness according to claim 9, characterized in that: A lower capillary structure is provided on the inner surface of the second lower plate.