Microwave probe
By designing microwave probes based on circuit board technology, the existing probes are solved by solving the problems of high cost and easy damage, and a lower cost and high durability chip detection equipment is achieved.
Patent Information
- Application Number
- CN202420444266.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-07
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-03-07
AI Technical Summary
Due to the fine structure and high cost of existing semiconductor chip probes, they are prone to damage during operation and have high production costs, and are difficult to reduce.
A microwave probe based on circuit board technology is designed, including a circuit board and an adapter. The circuit board is composed of a dielectric layer, a first conductive layer and a second conductive layer. The signal line and the ground line extend from the main body part to the tip part. The adapter is Connected with signal and ground wire, simple structure, low cost and improved durability.
It reduces production costs, improves the durability of microwave probes, avoids damage problems caused by complex structures, and achieves more economical and reliable chip detection.
Smart Images
Figure CN222259436U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to semiconductor chip detection equipment technology, in particular to a microwave probe. Background Art
[0002] In the semiconductor device manufacturing process, probe testing technology is used to directly measure the characteristic parameters of chip devices in order to optimize the process in a timely manner. In addition, microwave probes can also be used to extract various electrical characteristic parameters of chip devices, establish device models for circuit design, and shorten product development cycles.
[0003] Existing probes are generally composed of a coaxial connector, a coaxial cable and a probe contact. The connector is used to connect to a coaxial test system. By pressing down the probe, the contact can be brought into close contact with the solder joint of the device under test.
[0004] Existing probes are all based on high-end precision processing and material selection, so the cost is relatively high. Due to their delicate structure, they are very easy to be damaged during operation. Utility Model Content
[0005] The utility model provides a microwave probe, which can reduce production costs and improve durability.
[0006] Microwave probes include:
[0007] A circuit board, the circuit board comprising a dielectric layer, a first conductive layer and a second conductive layer, the first conductive layer and the second conductive layer are respectively arranged on two opposite sides of the dielectric layer; the first conductive layer comprises a signal line and a ground line, the second conductive layer is a ground plane covering the side of the dielectric layer, the circuit board comprises a main body and a tip portion protruding from the main body, the signal line and the ground line extend from the main body to the tip portion;
[0008] The adapter is arranged on the circuit board and is connected to the signal line and the ground line respectively.
[0009] Optionally, the first conductive layer includes two grounding lines, and the two grounding lines are respectively arranged on both sides of the signal line.
[0010] Optionally, the signal line is arranged in parallel with the ground line.
[0011] Optionally, the ground line covers other areas outside the area where the signal line is located.
[0012] Optionally, the spacing distance between the signal line and the ground line is greater than 1.5 times the width of the signal line.
[0013] Optionally, the ground wire is electrically connected to the second conductive layer through a metal hole penetrating the dielectric layer.
[0014] Optionally, contacts are provided at the ends of the signal line and the ground line located at the tip portion.
[0015] Optionally, the surfaces of the signal line and the ground line are provided with a gold plating layer.
[0016] Optionally, a connection surface between the adapter and the circuit board is provided with a power feeding portion and a ground feeding portion, the power feeding portion abuts against the signal line, and the ground feeding portion abuts against the ground line.
[0017] Optionally, the power feeding part and the ground feeding part are both metal spring sheets.
[0018] The microwave probe provided by the utility model includes a circuit board and an adapter. The circuit board includes a dielectric layer, a first conductive layer and a second conductive layer. The first conductive layer and the second conductive layer are respectively arranged on two opposite sides of the dielectric layer. The first conductive layer includes a signal line and a ground line. The second conductive layer is a ground plane covering the side of the dielectric layer. The circuit board includes a main body and a tip portion protruding from the main body. The signal line and the ground line extend from the main body to the tip portion. The adapter is arranged on the circuit board, and the adapter is respectively connected to the signal line and the ground line. The microwave probe of the utility model is based on circuit board technology, is easy to process, has lower cost, and is not easy to be damaged due to its simple structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The utility model is further described in detail below based on the drawings and embodiments.
[0020] Figure 1 A schematic diagram of the structure of a circuit board in a microwave probe provided by an embodiment of the present invention;
[0021] Figure 2 for Figure 1 Schematic diagram of the first conductive layer in the microwave probe;
[0022] Figure 3 for Figure 1 Schematic diagram of the second conductive layer in the microwave probe;
[0023] Figure 4 for Figure 1 A cross-sectional view of the connection between the circuit board and the adapter;
[0024] Figure 5 A schematic diagram of the structure of a circuit board in another microwave probe provided by an embodiment of the present invention;
[0025] Figure 6 for Figure 5 Schematic diagram of the first conductive layer in the microwave probe;
[0026] Figure 7 for Figure 5 Schematic diagram of the second conductive layer in the microwave probe;
[0027] Figure 8 for Figure 5 Cross-sectional view of the connection between the circuit board and the adapter. DETAILED DESCRIPTION
[0028] In order to make the technical problems solved by the utility model, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the embodiments of the utility model will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.
[0029] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0030] In the present utility model, unless otherwise clearly stipulated and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, the first feature being "above", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature. In addition, the terms "first" and "second" are only used to distinguish in description and have no special meaning.
[0031] Figure 1 A schematic diagram of the structure of a circuit board in a microwave probe provided by an embodiment of the present invention, Figure 2 for Figure 1 Schematic diagram of the first conductive layer in the microwave probe. Figure 3 for Figure 1 Schematic diagram of the second conductive layer in the microwave probe. Figure 4 for Figure 1The cross-sectional view of the connection between the circuit board and the adapter, such as Figure 1-Figure 4 As shown, the microwave probe includes:
[0032] Circuit board 110, circuit board 110 includes dielectric layer 111, first conductive layer 112 and second conductive layer 113, the first conductive layer 112 and second conductive layer 113 are respectively arranged on two opposite sides of dielectric layer 111. First conductive layer 112 includes signal line 1121 and ground line 1122, second conductive layer 113 is a ground plane covering the side of dielectric layer 111, that is, the vertical projection of signal line 1121 and ground line 1122 on the plane where second conductive layer 113 is located is in second conductive layer 113, forming a microstrip line. Circuit board 110 includes main body 114 and tip 115 protruding from main body 114, signal line 1121 and ground line 1122 extend from main body 114 to tip 115.
[0033] The adapter 120 is disposed on the circuit board 110 , and the adapter 110 is connected to the signal line 1121 and the ground line 1122 respectively.
[0034] Exemplarily, during use, the adapter is connected to the test system, the tip 115 of the circuit board 110 is close to the chip device to be tested, so that the ends of the signal line 1121 and the ground line 1122 of the tip 115 are respectively in contact with the pads of the chip device to be tested. The data signal in the chip device to be tested is transmitted to the test system via the signal line 1121 and the adapter 120.
[0035] The microwave probe provided by the embodiment of the utility model includes a circuit board and an adapter. The circuit board includes a dielectric layer, a first conductive layer and a second conductive layer. The first conductive layer and the second conductive layer are respectively arranged on two opposite sides of the dielectric layer. The first conductive layer includes a signal line and a ground line. The second conductive layer is a ground plane covering the side of the dielectric layer. The circuit board includes a main body and a tip protruding from the main body. The signal line and the ground line extend from the main body to the tip. The adapter is arranged on the circuit board, and the adapter is respectively connected to the signal line and the ground line. The microwave probe of the utility model is based on circuit board technology, is easy to process, has lower cost, and is not easy to be damaged due to its simple structure.
[0036] like Figure 1 As shown, the microwave probe further includes a reinforcement layer 130, and the circuit board 110 and the reinforcement layer 130 are bonded together by an adhesive layer 131. The material of the reinforcement layer 130 can be an elastic material such as FR4 plate, steel sheet, beryllium copper, or a multilayer board, which is not limited in the embodiment of the utility model. The reinforcement layer 130 is used to improve the strength of the circuit board 110.
[0037] For example, Figure 2As shown, the first conductive layer 112 includes two grounding lines 1122 , and the two grounding lines 1122 are respectively arranged on both sides of the signal line 1121 , which can play a role in shielding external signal interference.
[0038] For example, Figure 2 As shown, the signal line 1121 and the ground line 1122 are arranged in parallel.
[0039] For example, Figure 1 As shown, the signal line 1121 and the ground line 1122 are insulated and spaced apart, and the spacing distance D between the signal line 1121 and the ground line 1122 is more than 1.5 times the width W of the signal line 1121, ensuring that there is no electric field interaction between the signal line 1121 and the ground line 1122, thereby avoiding damage to the microstrip line structure. In one embodiment, the spacing distance D between the signal line 1121 and the ground line 1122 is between 1.5 times and 2 times the width W of the signal line 1121.
[0040] For example, Figure 1-Figure 3 As shown, the grounding wire 1122 is electrically connected to the second conductive layer 113 through the metal hole 1111 penetrating the dielectric layer 111, ensuring that the potential of the grounding wire 1122 is consistent with that of the second conductive layer 113. Exemplarily, a plurality of metal holes 1111 may be evenly arranged on each grounding wire 1122 to ensure the consistency of the potential at each position on the grounding wire 1122.
[0041] For example, Figure 2 As shown, the signal line 1121 and the ground line 1122 are provided with a contact 1123 at the end of the tip portion 115. The contact 1123 is a metal contact. When the tip portion 115 abuts against the chip device to be tested, the contact 1123 abuts against the soldering point of the chip device to be tested.
[0042] For example, Figure 1 As shown, in order to improve the conductivity of the signal line 1121 and the ground line 1122, in an embodiment of the utility model, a gold plating layer 116 is provided on the surface of the signal line 1121 and the ground line 1122, and the gold plating layer 116 can be formed on the surface of the signal line 1121 and the ground line 1122 by electroplating.
[0043] For example, Figure 2-Figure 4 As shown, the circuit board 110 is provided with a fixing hole 117, and the adapter 120 can be fixed to the circuit board 110 by screws passing through the fixing hole 117. It should be noted that in other embodiments of the utility model, the adapter 120 can also be fixed to the circuit board 110 by other fixing methods, and the utility model embodiment is not limited here.
[0044] For example, Figure 4As shown, a feeder 121 and a ground feeder 122 are provided on the connection surface between the adapter 120 and the circuit board 110 . The feeder 121 abuts against the signal line 1121 , and the ground feeder 122 abuts against the ground line 1122 .
[0045] Illustratively, in some embodiments of the present invention, the power feeding portion 121 and the ground feeding portion 122 are both metal springs, which have a certain elasticity. When the adapter 120 is fixed on the circuit board 110, the metal springs are compressed to ensure stable contact with the ground feeding portion 122 and the grounding wire 1122.
[0046] Figure 5 A schematic diagram of the structure of a circuit board in another microwave probe provided by an embodiment of the present invention, Figure 6 for Figure 5 Schematic diagram of the first conductive layer in the microwave probe. Figure 7 for Figure 5 Schematic diagram of the second conductive layer in the microwave probe. Figure 8 for Figure 5 The cross-sectional view of the connection between the circuit board and the adapter, such as Figure 5-Figure 8 As shown, the microwave probe includes:
[0047] Circuit board 110, circuit board 110 includes dielectric layer 111, first conductive layer 112 and second conductive layer 113, the first conductive layer 112 and second conductive layer 113 are respectively arranged on two opposite sides of dielectric layer 111. First conductive layer 112 includes signal line 1121 and ground line 1122, second conductive layer 113 is a ground plane covering the side of dielectric layer 111, that is, the vertical projection of signal line 1121 and ground line 1122 on the plane where second conductive layer 113 is located is in second conductive layer 113, forming a microstrip line. Circuit board 110 includes main body 114 and tip 115 protruding from main body 114, signal line 1121 and ground line 1122 extend from main body 114 to tip 115.
[0048] The adapter 120 is disposed on the circuit board 110 , and the adapter 110 is connected to the signal line 1121 and the ground line 1122 respectively.
[0049] Exemplarily, during use, the adapter is connected to the test system, the tip 115 of the circuit board 110 is close to the chip device to be tested, so that the ends of the signal line 1121 and the ground line 1122 of the tip 115 are respectively in contact with the pads of the chip device to be tested. The data signal in the chip device to be tested is transmitted to the test system via the signal line 1121 and the adapter 120.
[0050] like Figure 5As shown, the microwave probe further includes a reinforcement layer 130, and the circuit board 110 and the reinforcement layer 130 are bonded together by an adhesive layer 131. The material of the reinforcement layer 130 can be an elastic material such as FR4 plate, steel sheet, beryllium copper, or a multilayer board, which is not limited in the embodiment of the utility model. The reinforcement layer 130 is used to improve the strength of the circuit board 110.
[0051] For example, Figure 6 As shown, the first conductive layer 112 includes two grounding lines 1122 , and the two grounding lines 1122 are respectively arranged on both sides of the signal line 1121 , which can play a role in shielding external signal interference.
[0052] For example, Figure 6 As shown, the grounding line 1122 covers other areas except the area where the signal line 1121 is located. That is, on the side where the signal line 1121 is located, grounding surfaces are provided on both sides of the signal line 1121.
[0053] For example, Figure 5 As shown, the signal line 1121 and the ground line 1122 are insulated and spaced apart, and the spacing distance D between the signal line 1121 and the ground line 1122 is more than 1.5 times the width W of the signal line 1121, ensuring that there is no electric field interaction between the signal line 1121 and the ground line 1122, thereby avoiding damage to the microstrip line structure. In one embodiment, the spacing distance D between the signal line 1121 and the ground line 1122 is between 1.5 times and 2 times the width W of the signal line 1121.
[0054] For example, Figure 5-Figure 7 As shown, the grounding wire 1122 is electrically connected to the second conductive layer 113 through the metal hole 1111 penetrating the dielectric layer 111, ensuring that the potential of the grounding wire 1122 is consistent with that of the second conductive layer 113. Exemplarily, a plurality of metal holes 1111 may be evenly arranged at the edge of each grounding wire 1122, ensuring that the potential of each position on the grounding wire 1122 is consistent.
[0055] For example, Figure 6 As shown, the signal line 1121 and the ground line 1122 are provided with a contact 1123 at the end of the tip portion 115. The contact 1123 is a metal contact. When the tip portion 115 abuts against the chip device to be tested, the contact 1123 abuts against the soldering point of the chip device to be tested.
[0056] For example, Figure 5 As shown, in order to improve the conductivity of the signal line 1121 and the ground line 1122, in an embodiment of the utility model, a gold plating layer 116 is provided on the surface of the signal line 1121 and the ground line 1122, and the gold plating layer 116 can be formed on the surface of the signal line 1121 and the ground line 1122 by electroplating.
[0057] For example, Figure 6-Figure 8 As shown, the circuit board 110 is provided with a fixing hole 117, and the adapter 120 can be fixed to the circuit board 110 by screws passing through the fixing hole 117. It should be noted that in other embodiments of the utility model, the adapter 120 can also be fixed to the circuit board 110 by other fixing methods, and the utility model embodiment is not limited here.
[0058] For example, Figure 8 As shown, a feeder 121 and a ground feeder 122 are provided on the connection surface between the adapter 120 and the circuit board 110 . The feeder 121 abuts against the signal line 1121 , and the ground feeder 122 abuts against the ground line 1122 .
[0059] Illustratively, in some embodiments of the present invention, the power feeding portion 121 and the ground feeding portion 122 are both metal springs, which have a certain elasticity. When the adapter 120 is fixed on the circuit board 110, the metal springs are compressed to ensure stable contact with the ground feeding portion 122 and the grounding wire 1122.
[0060] In the description of this article, it is necessary to understand that the terms "up", "down", "left", "right", and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0061] In the description of this specification, the description with reference to the terms "an embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example.
[0062] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.
[0063] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.
Claims
1. A microwave probe, characterized in that: include: A circuit board, the circuit board comprising a dielectric layer, a first conductive layer and a second conductive layer, the first conductive layer and the second conductive layer are respectively arranged on two opposite sides of the dielectric layer; the first conductive layer comprises a signal line and a ground line, the second conductive layer is a ground plane covering the side of the dielectric layer, the circuit board comprises a main body and a tip portion protruding from the main body, the signal line and the ground line extend from the main body to the tip portion; The adapter is arranged on the circuit board and is connected to the signal line and the ground line respectively.
2. The microwave probe according to claim 1, characterized in that: The first conductive layer includes two grounding lines, and the two grounding lines are respectively arranged on both sides of the signal line.
3. The microwave probe according to claim 2, characterized in that: The signal line is arranged in parallel with the ground line.
4. The microwave probe according to claim 2, characterized in that: The ground line covers other areas except the area where the signal line is located.
5. The microwave probe according to any one of claims 1 to 4, characterized in that: The spacing distance between the signal line and the ground line is greater than 1.5 times the width of the signal line.
6. The microwave probe according to claim 5, characterized in that: The grounding line is electrically connected to the second conductive layer through a metal hole penetrating the dielectric layer.
7. The microwave probe according to claim 5, characterized in that: Contacts are provided at the ends of the signal line and the ground line located at the tip portion.
8. The microwave probe according to claim 5, characterized in that: The surfaces of the signal line and the ground line are provided with a gold plating layer.
9. The microwave probe according to any one of claims 1-4, 6-8, characterized in that: A power feeding portion and a ground feeding portion are provided on the connection surface between the adapter and the circuit board. The power feeding portion abuts against the signal line, and the ground feeding portion abuts against the ground line.
10. The microwave probe according to claim 9, characterized in that: The power feeding part and the ground feeding part are both metal spring sheets.