Large-density device test host

Abstract

The utility model discloses a high-density device test host, relates to the technical field of test hosts, and aims to solve the problem that test data is not specific enough due to the fact that internal test parts of an existing high-density device test host are not perfect enough, the technical scheme is characterized in that the high-density device test host comprises a case, and the case comprises two first side plates, a second side plate and a third side plate; the inner side of the second side plate is provided with a plurality of optical power meters and a plurality of HDMI interface boards. The bottom of the inner wall of the cabinet is provided with a plurality of optical device test AD / DA boards. A light source plate is arranged at the bottom of the inner wall of the case. The testing host integrates a plurality of optical power meter interfaces, an optical device testing AD / DA board interface, an HDMI interface board and other interfaces, so that the side-looking host can meet various testing purposes of electronic devices, and the side-looking host is reasonable in internal layout, sufficient in space utilization, small in size and capable of keeping long-time stable work.

Description

Technical Field

[0001] The utility model belongs to the field of test host machines, in particular to a high-density device test host machine. Background Art

[0002] The high-density device test host is a device used to test high-density electronic devices (such as integrated circuits, microprocessors, etc.). These devices usually have complex circuit structures and high integration, and require precise functional testing and performance evaluation. The high-density device test host can test multiple devices at the same time by providing multiple test channels and various test functions, speeding up the test speed and efficiency. The high-density device test host is widely used in integrated circuit production, quality control, and research and development. It can help detect the normal function, performance parameters, electrical characteristics, etc. of the device, and evaluate the quality and reliability of the device through test results. At the same time, it can also provide test data and feedback to assist engineers in fault analysis and performance improvement.

[0003] The internal test components of the existing high-density device test host are not perfect, resulting in the problem that the test data is not specific enough.

[0004] In summary, the utility model provides a high-density device testing host to solve the above problems. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of the utility model is to provide a high-density device testing host, which has the advantage that the test host integrates multiple interfaces such as a plurality of optical power meter interfaces, an optical device test AD DA board interface, an HDMI interface board, etc., so that the side-view host can meet various testing purposes of electronic devices, and the internal layout of the device is reasonable, and the space is fully utilized. It is not only small in size but also can maintain stable operation for a long time.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A high-density device testing host comprises a chassis, wherein the chassis comprises two first side panels, a second side panel, and a third side panel;

[0008] Several optical power meters and several HDMI interface boards are installed on the inner side of the second side panel, and several optical device test AD DA boards are installed on the bottom of the inner wall of the chassis;

[0009] A light source board is installed at the bottom of the inner wall of the chassis, two first fans are installed at an angle at the bottom of the inner wall of the chassis, a plurality of MUart boards and HDMI expansion boards are installed on the inner side of the third side panel, and an MCU board is also installed at the bottom of the inner wall of the chassis;

[0010] A second fan and a plurality of MUart boards are installed on the inner side of the third side board, and the second fan is located on one side of the light source board.

[0011] By adopting the above technical solution and setting up several optical power meters, optical device test AD DA boards, HDMI interface boards and other interfaces, the side-view host can meet various testing purposes of electronic devices, and the internal layout of the device is reasonable, the space is fully utilized, and it is not only small in size but also can maintain stable operation for a long time.

[0012] The utility model is further configured as follows: a power switch is installed on the inner side of the third side plate, and the lower side of the power switch is fixedly connected to the bottom of the chassis.

[0013] By adopting the above technical solution, a certain amount of space is left at the bottom and left side of the power switch. The bottom space is convenient for heat dissipation, and the left space can be used for heat dissipation and storage of excess connection cables.

[0014] The utility model is further configured as follows: two power supply boards are installed at the bottom of the inner wall of the chassis, and the light source board is installed on the upper sides of the two power supply boards.

[0015] By adopting the above technical solution, the power board is used for power control and outputs different voltages / currents to meet the requirements of various voltages / currents in the equipment.

[0016] The utility model is further configured as follows: a power switch is installed on the second side plate, and a grounding column is installed on the third side plate.

[0017] By adopting the above technical solution, the power switch is used for equipment power control, and the grounding column is used for equipment grounding.

[0018] The utility model is further configured as follows: two groups of MUart board supporting structural members are installed on the inner side of the third side plate, and a plurality of MUart boards are divided into two groups and fixed on the two groups of MUart board supporting structural members.

[0019] By adopting the above technical solution, the MUart board support structure is used to connect and install 6 Muart boards, which are locked on the third side panel by screws, thus saving space and avoiding obstacles to the greatest extent.

[0020] The utility model is further configured as follows: a plurality of optical device test AD DA boards are distributed in two groups in an upper and lower manner, and an AD DA board bracket is fixed between upper and lower adjacent optical device test AD DA boards.

[0021] By adopting the above technical solution, the AD DA board bracket is used to connect the upper and lower AD DA boards, and the bracket structure is stable, which prevents the PCB from shaking when the connector is plugged in.

[0022] The utility model is further configured as follows: two first side panels are arranged opposite to each other, and a plurality of heat dissipation holes are opened on the first side panels, and a portion of the third side panel where the second fan is installed is opened with a plurality of air inlet holes.

[0023] By adopting the above technical solution, heat dissipation holes and air inlet holes are set to dissipate heat inside the chassis to ensure that the equipment can work stably for a long time.

[0024] The utility model is further configured as follows: an optical device test AD DA board interface connected to an optical device test AD DA board is installed on the outer side of the second side panel, a MUart board interface connected to an MUart board is installed on the outer side of the third side panel, and an MCU board interface connected to an MCU board is installed on the outer side of the third side panel.

[0025] By adopting the above technical solution, the optical device test AD DA board is used to control the DC end of TOSA&ROSA optical devices, the MUart board is used for subsequent equipment software upgrades, and the MCU board is the equipment main control board for equipment control.

[0026] In summary, the beneficial technical effects of the utility model are:

[0027] This test host integrates several optical power meter interfaces, optical device test AD DA board interfaces, HDMI interface boards and other interfaces, so that the side-view host can meet various test purposes of electronic devices. The internal layout of the device is reasonable and the space is fully utilized. It is not only small in size but also can maintain stable operation for a long time.

[0028] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings described below are only some embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. In the drawings:

[0030] Figure 1 This is a schematic diagram of the main structure of an embodiment of the utility model;

[0031] Figure 2 This is a schematic diagram of the internal structure of a chassis according to an embodiment of the utility model;

[0032] Figure 3 This is a third side structural schematic diagram of an embodiment of the utility model;

[0033] Figure 4 This is a top view of the internal structure of an embodiment of the utility model;

[0034] Figure 5 It is a side structural schematic diagram of an embodiment of the utility model;

[0035] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0036] 1. Chassis; 102. First side panel; 1021. Heat dissipation hole; 103. Second side panel; 104. Third side panel; 1041. Air inlet hole; 2. Optical power meter; 3. HDMI interface board; 4. Optical device test AD DA board; 401. Optical device test AD DA board interface; 5. ADDA board bracket; 6. Power switch; 7. Light source board; 8. Power board; 9. First fan; 10. MUart board; 1001. MUart board interface; 11. HDMI expansion board; 12. MCU board; 1201. MCU board interface; 13. MUart board supporting structure; 14. Grounding column; 15. Second fan; 16. Power switch. DETAILED DESCRIPTION

[0037] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0038] Reference Figure 1-5 , is a high-density device test host disclosed in the utility model, comprising: a chassis 1, the chassis 1 comprising two first side panels 102, a second side panel 103, and a third side panel 104;

[0039] Several optical power meters 2 and several HDMI interface boards 3 are installed on the inner side of the second side panel 103, and several optical device test AD DA boards 4 are installed on the bottom of the inner wall of the chassis 1;

[0040] The device has a total of 6 optical power meters 2, which are panel mounted with interfaces exposed on the panel and are used to measure device optical power and LIV curve scanning, and are connected to the optical device test AD DA board 4 through cables.

[0041] The device has a total of 6 HDMI interface boards 3, the interfaces are exposed on the panel, and are connected to the optical device test AD DA board 4 through DuPont cables, and are used for signal expansion and switching on the optical device test AD DA board 4.

[0042] There are a total of 6 optical device test AD DA boards 4 in the device, which are installed in a 2x3 structure. The interface is exposed on the panel and is used for controlling the DC end of TOSA&ROSA optical devices. The 2x3 structural installation is conducive to saving the internal structural space of the chassis 1.

[0043] A light source board 7 is installed at the bottom of the inner wall of the chassis 1, and the light source board 7 is used for device expansion functions. Two inclined first fans 9 are installed at the bottom of the inner wall of the chassis 1. Several MUart boards 10 and HDMI expansion boards 11 are installed on the inner side of the third side panel 104. An MCU board 12 is also installed at the bottom of the inner wall of the chassis 1; the interface of the MUart board 10 is exposed on the third side panel 104, and the 2x3 installation structure saves internal space of the chassis 1 for subsequent device software upgrades.

[0044] The interface of the HDMI expansion board 11 is exposed on the third side board 104 and is used to transfer the signal of the light source board 7 .

[0045] The first fan 9 is a 80*80mm cooling fan, which is used to dissipate heat for the optical device test AD DA board 4. The inclined design can dissipate heat for 6 optical device test AD DA boards 4 at the same time to the greatest extent, so as to ensure that the equipment can work stably for a long time.

[0046] A second fan 15 and a plurality of MUart boards 10 are installed on the inner side of the third side board 104 , and the second fan 15 is located at one side of the light source board 7 .

[0047] The second fan 15 is a 80*80mm cooling fan, which is installed on the third side plate 104. The third side plate 104 has holes for heat dissipation, which is beneficial to the overall heat dissipation of the device and avoids device failure caused by overheating.

[0048] Reference Figure 2 In this embodiment, a power switch 6 is installed on the inner side of the third side plate 104, and the lower side of the power switch 6 is fixedly connected to the bottom of the chassis 1. The power switch 6 is used for power supply of the equipment and is connected to the bottom plate of the chassis 1 through a copper column. A certain space is left at the bottom and on the left side. The bottom space is convenient for heat dissipation, and the left space can be used for heat dissipation and storage of excess connection lines.

[0049] Reference Figure 2 In this embodiment, two power boards 8 are installed at the bottom of the inner wall of the chassis 1, and the light source board 7 is installed on the upper side of the two power boards 8. There are two power boards 8 installed inside the chassis for power control and outputting different voltages / currents to meet the requirements of various voltages / currents in the device.

[0050] Reference Figure 1 , 4 In this embodiment, a power switch 16 is installed on the second side plate 103, and a grounding column 14 is installed on the third side plate 104. The power switch 16 is installed on the panel and is used for equipment power control.

[0051] The grounding column 14 is installed on the third side plate 104 and is used for equipment grounding.

[0052] Reference Figure 4In this embodiment, two groups of MUart board support structures 13 are installed on the inner side of the third side plate 104, and a plurality of MUart boards 10 are divided into two groups and fixed on the two groups of MUart board support structures 13. The MUart board support structures 13 are used to connect and install the six MUart boards 10, and are screwed on the third side plate 104 to save space and avoidance to the greatest extent.

[0053] Reference Figure 2 In this embodiment, the plurality of optical device test AD DA boards 4 are distributed in two groups, and an AD DA board bracket 5 is fixed between the upper and lower adjacent optical device test AD DA boards 4. There are 4 AD DA board brackets 5, which are used to connect the upper and lower AD DA boards 4. The bracket structure is stable to prevent the PCB from shaking when the connector is plugged in.

[0054] Reference Figure 2 In this embodiment, the two first side panels 102 are arranged opposite to each other, and a plurality of heat dissipation holes 1021 are opened on the first side panels 102 , and a portion of the third side panel 104 where the second fan 15 is installed is opened with a plurality of air inlet holes 1041 .

[0055] Reference Figure 1-3 In this embodiment, the second side panel 103 is provided with an optical device test AD DA board interface 401 connected to the optical device test AD DA board 4, the third side panel 104 is provided with an MUart board interface 1001 connected to the MUart board 10, and the third side panel 104 is provided with an MCU board interface 1201 connected to the MCU board 12. The MCU board 12 is a device main control board used for device control, and its interface is exposed on the third side panel 104.

[0056] The above-mentioned embodiments may be combined with each other.

[0057] The embodiments of this specific implementation method are all preferred embodiments of the utility model, and are not intended to limit the protection scope of the utility model. Therefore, all equivalent changes made based on the structure, shape, and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. High-density device test host, including: The chassis (1) is characterized in that the chassis (1) comprises two first side panels (102), a second side panel (103), and a third side panel (104); A plurality of optical power meters (2) and a plurality of HDMI interface boards (3) are installed on the inner side of the second side panel (103), and a plurality of optical device test AD DA boards (4) are installed on the bottom of the inner wall of the chassis (1); A light source board (7) is installed at the bottom of the inner wall of the chassis (1), two first fans (9) are installed at an angle at the bottom of the inner wall of the chassis (1), a plurality of MUart boards (10) and HDMI expansion boards (11) are installed on the inner side of the third side panel (104), and an MCU board (12) is also installed at the bottom of the inner wall of the chassis (1); A second fan (15) and a plurality of MUart boards (10) are installed on the inner side of the third side board (104), and the second fan (15) is located on one side of the light source board (7).

2. The high-density device testing host according to claim 1, characterized in that: A power switch (6) is installed on the inner side of the third side plate (104), and the lower side of the power switch (6) is fixedly connected to the bottom of the chassis (1).

3. The high-density device testing host according to claim 1, characterized in that: Two power boards (8) are installed at the bottom of the inner wall of the chassis (1), and the light source board (7) is installed on the upper sides of the two power boards (8).

4. The high-density device testing host according to claim 1, characterized in that: A power switch (16) is installed on the second side plate (103), and a grounding column (14) is installed on the third side plate (104).

5. The high-density device testing host according to claim 1, characterized in that: Two groups of MUart board support structures (13) are installed on the inner side of the third side plate (104), and a plurality of MUart boards (10) are divided into two groups and fixed on the two groups of MUart board support structures (13).

6. The high-density device testing host according to claim 1, characterized in that: A plurality of optical device test AD DA boards (4) are distributed in two groups up and down, and an AD DA board bracket (5) is fixed between the upper and lower adjacent optical device test AD DA boards (4).

7. The high-density device testing host according to claim 1, characterized in that: The two first side panels (102) are arranged opposite to each other, and a plurality of heat dissipation holes (1021) are provided on the first side panels (102), and a portion of the third side panel (104) on which the second fan (15) is installed is provided with a plurality of air inlet holes (1041).

8. The high-density device testing host according to claim 6, characterized in that: An optical device test AD DA board interface (401) connected to an optical device test AD DA board (4) is installed on the outer side of the second side panel (103), an MUart board interface (1001) connected to an MUart board (10) is installed on the outer side of the third side panel (104), and an MCU board interface (1201) connected to an MCU board (12) is installed on the outer side of the third side panel (104).

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