Liquid cooling optical module

Abstract

A liquid cooling optical module comprises a PCB, a PEI LENS, an optical fiber patch cord and an injection molding hot melting piece, a photoelectric chip is packaged on the front face of the PCB, the PEI LENS is installed on the front face of the PCB and seals the photoelectric chip, and the photoelectric chip is sealed for the first time; the optical fiber patch cord is connected with the PEI LENS, and the PEI LENS is used for coupling an optical signal emitted by the photoelectric chip and transmitting the optical signal to the optical fiber patch cord, or receiving the optical signal transmitted by the optical fiber patch cord and coupling the optical signal to the photoelectric chip; a heat dissipation copper layer used for absorbing heat of the photoelectric chip is arranged at the position, opposite to the photoelectric chip, of the back face of the PCB. The injection molding hot melting piece is used for covering the PEI LENS and the connector of the optical fiber patch cord on the front face of the PCB in a sealing mode and covering the corresponding PCB on the opposite position of the back face of the PCB in a sealing mode to form second sealing, the injection molding hot melting piece is provided with a window at the position of the heat dissipation copper layer, and the heat dissipation copper layer is used for making contact with cooling liquid to achieve heat dissipation of the photoelectric chip. The optical module structure design scheme of a DSFP packaging protocol is met, and a high-integration-level packaging structure based on a bare DIE chip scheme can be achieved.

Description

Technical Field

[0001] The utility model relates to the field of optical modules, in particular to a liquid-cooled optical module. Background Art

[0002] At present, optical modules are widely used in data centers. Optical module chips and electronic components generate a lot of heat during operation. If the heat is not evacuated in time, the temperature of the optical module will rise, resulting in reduced performance of the optical module. Data centers now generally use air cooling to control the temperature of the computer room through air conditioning. The disadvantage of this method is that it consumes a lot of energy and cannot achieve the goal of PUE below 1.3 under the trend of energy conservation and carbon reduction. Immersion liquid cooling is another solution to the heat dissipation problem. Liquid cooling uses cooling liquid to contact the heat source for cooling. Compared with air cooling, liquid cooling can achieve a PUE close to 1.0.

[0003] The optical module needs to operate normally in the coolant, but the current multi-mode optical modules generally use non-airtight packaging. If the optical components are directly immersed in the coolant without protection, it will cause optical path abnormalities and the optical module will not work properly. Utility Model Content

[0004] In view of the technical defects and technical drawbacks in the prior art, the embodiments of the present utility model provide a liquid-cooled optical module that overcomes the above problems or at least partially solves the above problems. The specific solution is as follows:

[0005] As a first aspect of the utility model, a liquid-cooled optical module is provided, comprising a PCB, a PEI LENS, an optical fiber jumper and an injection-molded hot-melt component, wherein an optoelectronic chip is encapsulated on the front side of the PCB, the PEI LENS is mounted on the front side of the PCB and seals and covers the optoelectronic chip, thereby forming a first seal for the optoelectronic chip; the optical fiber jumper is connected to the PEI LENS, and the PEI LENS is used to couple an optical signal emitted by the optoelectronic chip and transmit it to the optical fiber jumper, or to receive an optical signal transmitted by the optical fiber jumper and couple it to the optoelectronic chip; a heat dissipation copper layer for absorbing heat from the optoelectronic chip is provided at a position opposite to the optoelectronic chip on the back side of the PCB; the injection-molded hot-melt component is used to seal and cover the PEI LENS, the LENS cover plate and the connector of the optical fiber jumper on the front side of the PCB, and seal and cover the corresponding PCB at a relative position on the back side of the PCB, thereby forming a second seal, and the injection-molded hot-melt component is designed with a window at the position of the heat dissipation copper layer, and the heat dissipation copper layer is used to contact with a cooling liquid to achieve heat dissipation of the optoelectronic chip.

[0006] Furthermore, the edges of the PEI LENS are sealed and bonded to the PCB by UV glue, and the outer layers of the UV glue on the left and right sides of the PEILENS are covered with a layer of black glue.

[0007] Furthermore, the liquid-cooled optical module also includes a LENS cover plate, which covers the PEI LENS and covers the connector of the optical fiber jumper, and is used to seal the connection between the PEI LENS and the optical fiber jumper. The edges of the LENS cover plate are sealed with UV glue and bonded to the PEI LENS.

[0008] Furthermore, the gaps between the LENS cover plate, the PEI LENS and the optical fiber jumper connector are sealed by UV glue.

[0009] Furthermore, the liquid-cooled optical module also includes an assembly structure, and the PCB and the injection-molded hot melt component are both encapsulated in the assembly structure.

[0010] Furthermore, one end of the assembly structure has a reserved opening for an optical fiber jumper, through which the optical fiber jumper passes, and the other end of the assembly structure has a plug-in port for docking with a client switch.

[0011] Furthermore, a first positioning column is provided at the bottom of the PEI LENS, a second positioning column is provided at the docking surface of the PEI LENS and the optical fiber jumper, a first positioning groove adapted to the first positioning column is provided on the PCB, and a second positioning groove adapted to the second positioning column is provided on the connector of the optical fiber jumper. When the PEI LENS is installed on the front side of the PCB, the first positioning column is embedded in the first positioning groove, and when the optical fiber jumper is docked with the PEI LENS, the second positioning column is embedded in the second positioning groove.

[0012] Furthermore, the PEI LENS also includes an optical docking bevel, which includes an RX reflective surface, a TX reflective surface, an RX LENS and a TX LENS; the optical signal emitted by the VCSEL of the optoelectronic chip is reflected to the TXLENS through the TX reflective surface, and is transmitted to the optical fiber jumper through the TX LENS; the optical signal transmitted by the optical fiber jumper passes through the RX LENS and then is incident on the RX reflective surface, and is reflected to the PD of the optoelectronic chip through the RX reflective surface.

[0013] Furthermore, the PCB is designed with a through-hole structure at a position corresponding to the optoelectronic chip, and the heat of the optoelectronic chip on the front side of the PCB is transferred to the heat dissipation copper layer on the back side of the PCB through the through-hole structure.

[0014] The utility model has the following beneficial effects:

[0015] The utility model provides a liquid-cooled optical module and an assembly method thereof, which meet the optical module structure design scheme of the DSFP packaging protocol, can realize a highly integrated packaging structure based on a bare DIE chip scheme, has the characteristics of low power consumption, and has a large comprehensive power consumption advantage when combined with liquid cooling application scenarios. The structure adopts packaging forms different from conventional multi-mode optical module packaging structures in many places, thereby realizing the high-integration packaging requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 An exploded diagram of a liquid-cooled optical module provided in an embodiment of the utility model;

[0018] Figure 2 A schematic diagram of a PCB and an optoelectronic chip provided in an embodiment of the utility model;

[0019] Figure 3 A schematic diagram of an assembled PEI LENS provided in an embodiment of the utility model;

[0020] Figure 4 A schematic diagram of an assembled optical fiber jumper provided in an embodiment of the utility model;

[0021] Figure 5 A schematic diagram of an embodiment of the utility model after assembling a LENS;

[0022] Figure 6 A schematic diagram of an embodiment of the utility model after assembling an injection hot melt part is provided;

[0023] Figure 7 A schematic diagram of an assembled structural member provided for an embodiment of the utility model;

[0024] Figure 8 A schematic diagram of a copper-exposed window on the back of a PCB for heat dissipation provided by an embodiment of the utility model;

[0025] Fig. 9 A first-view stereoscopic diagram of a PEI LENS provided by an embodiment of the utility model;

[0026] Fig.10 A second-view stereoscopic diagram of the PEI LENS provided by an embodiment of the utility model;

[0027] Fig.11 A third-angle perspective schematic diagram of the PEI LENS provided by an embodiment of the utility model;

[0028] Fig.12 A schematic diagram of the TX optical path provided by an embodiment of the utility model;

[0029] Fig.13 A schematic diagram of the RX optical path provided by an embodiment of the utility model;

[0030] Fig.14 A flow chart of a method for assembling a liquid-cooled optical module provided in an embodiment of the utility model.

[0031] In the figure: 1-PCB, 2-PEI LENS, 3-optical fiber jumper, 4-LENS cover, 5-injection hot melt part, 6-assembly structure, 21-TX LENS, 22-RX LENS, 23-optical docking bevel, 24-first positioning column, 25-second positioning column, 26-TX reflecting surface, 27-RX reflecting surface, 31-connector, 61, base, 62-upper cover. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the utility model, not all embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0034] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; in the description of the present utility model, unless otherwise specified, "multiple" and "several" mean two or more.

[0035] refer to Figure 1-8As shown, a liquid-cooled optical module provided by an embodiment of the utility model includes PCB1, PEILENS2, an optical fiber jumper 3, a LENS cover plate 4 and an injection hot melt part 5, wherein an optoelectronic chip is encapsulated on the front of the PCB1, the PEILENS2 is installed on the front of the PCB1 and seals and covers the optoelectronic chip, and the PEI LENS2 is sealed by dispensing glue and fixed to the PCB1 by bonding, thereby forming a first seal for the optoelectronic chip; the optical fiber jumper 3 is connected to the PEI LENS2, and the PEI LENS2 is used to couple the optical signal emitted by the optoelectronic chip and transmit it to the optical fiber jumper 3, or receive the optical signal transmitted by the optical fiber jumper 3 and couple it to the optoelectronic chip; the LENS cover plate 4 is covered on the PEI LENS2 and covers the connector 31 of the optical fiber jumper 3, and is used to seal the connection between the PEI LENS2 and the optical fiber jumper 3, and the edges of the LENS cover plate 4 are sealed by UV glue and fixed to the PEI On LENS2, a heat dissipation copper layer for absorbing the heat of the optoelectronic chip is arranged at the back of the PCB1 and opposite to the optoelectronic chip; the injection molding hot melt component 5 is used to seal and cover the PEI LENS2 and the connector 31 of the optical fiber jumper 3 on the front of the PCB1, and seal and cover the corresponding PCB1 at the relative position on the back of the PCB1 to form a second seal. The injection molding hot melt component 5 is designed with a window at the position of the heat dissipation copper layer, and the heat dissipation copper layer is used to contact with the coolant to achieve heat dissipation of the optoelectronic chip.

[0036] The traditional PEI LENS2 only plays the role of optical path coupling. The utility model improves the optical module so that the PEI LENS2 not only plays the role of optical path coupling, but also plays the role of sealing the optoelectronic chip.

[0037] The utility model performs a first-layer sealing of the optoelectronic chip through PEI LENS2, and seals the connection between PEI LENS2 and the optical fiber jumper 3 through the LENS cover plate 4, and finally performs a second-layer sealing of the optoelectronic chip through the injection molding hot melt part 5, and arranges a heat dissipation copper layer on the back of PCB1 to transfer the heat on the front of PCB1 to the heat dissipation copper layer on the back of PCB1. The heat dissipation copper layer dissipates heat by contacting with the coolant, and meets the optical module structure design scheme of the DSFP packaging protocol, and can realize a high-integration packaging structure based on the bare DIE chip scheme, with the characteristics of low power consumption, and has a large comprehensive power consumption advantage in combination with the liquid cooling application scenario. The structure adopts a packaging form different from the conventional multi-mode optical module packaging structure in many places, thereby realizing the high-integration packaging requirements.

[0038] Among them, the edges of the PEI LENS2 are sealed and bonded to the PCB1 by applying UV glue, and the outer layer of the UV glue on the left and right sides of the PEILENS2 is covered with a layer of black glue. In addition, after assembling the optical fiber jumper 3, UV glue is applied on both sides of the optical fiber jumper 3 to make it bonded and fixed to the PEI LENS2, and the LENS cover plate 4 is covered on the PEI LENS2 and covers the connector 31 of the optical fiber jumper 3 to seal the connection between the PEI LENS2 and the optical fiber jumper 3, and finally the gap between the LENS cover plate 4, PEI LENS2 and the connector 31 of the optical fiber jumper 3 is sealed by applying UV glue to increase the overall sealing.

[0039] Among them, the liquid-cooled optical module also includes an assembly structure 6, the assembly structure 6 includes a base 61 and an upper cover 62, the PCB1 and the injection-molded hot-melt component 5 are both encapsulated in the assembly structure 6, one end of the assembly structure 6 has a reserved opening for the optical fiber jumper 3, the optical fiber jumper 3 passes through the reserved opening for the optical fiber jumper 3, the other end of the assembly structure 6 has a plug-in port for docking with a client switch, and the assembly structure 6 uses electromagnetic shielding material to shield external electromagnetic interference.

[0040] refer to Figure 9-11 As shown, a first positioning column 24 is provided at the bottom of the PEI LENS2, a second positioning column 25 is provided at the interface between the PEI LENS2 and the optical fiber jumper 3, a first positioning groove adapted to the first positioning column 24 is provided on the PCB1, and a second positioning groove adapted to the second positioning column 25 is provided on the connector 31 of the optical fiber jumper 3. When the PEI LENS2 is installed on the front of the PCB1, the first positioning column 24 is embedded in the first positioning groove, thereby realizing accurate alignment installation of the PEI LENS2, and after the PEI LENS2 is positioned, glue bonding and sealing are performed around the PEI LENS2, and when the optical fiber jumper 3 is docked with the PEI LENS2, the second positioning column 25 is embedded in the second positioning groove, thereby realizing accurate alignment docking of the optical fiber jumper 3 with the PEI LENS2;

[0041] refer to Figure 12-13As shown, the PEI LENS2 also includes an optical docking bevel 23, and the optical docking bevel 23 includes an RX reflection surface 27, a TX reflection surface 26, RX LENS22 and TX LENS21; when transmitting an optical signal, the optical signal emitted by the VCSEL of the optoelectronic chip is reflected to the TX LENS21 through the TX reflection surface 26, and is transmitted to the optical fiber jumper 3 through the TX LENS21, wherein a microlens is also provided on the VCSEL, and the microlens is used to reduce the divergence angle of the VCSEL output light beam and adjust the light beam to a collimated state; the optical signal transmitted by the optical fiber jumper 3 passes through the RX LENS22 and then enters the RX reflection surface 27, and is reflected to the PD of the optoelectronic chip through the RX reflection surface 27.

[0042] As a specific embodiment of the present invention, a through-hole structure is designed on PCB1 at a position corresponding to the optoelectronic chip, and the heat of the optoelectronic chip on the front side of PCB1 is transferred to the heat dissipation copper layer on the back side of PCB1 through the through-hole structure.

[0043] like Fig.14 As shown, the embodiment of the utility model also provides a method for assembling a liquid-cooled optical module, including a PCB1, wherein a photoelectric chip is packaged on the front of the PCB1, and a heat dissipation copper layer for absorbing the heat of the photoelectric chip is arranged on the back of the PCB1 opposite to the photoelectric chip, and the heat dissipation copper layer is used to contact with the cooling liquid to achieve heat dissipation of the photoelectric chip. Specifically, the PCB1 is designed with a through-hole structure at a position corresponding to the photoelectric chip, and the heat of the photoelectric chip is transferred to the heat dissipation copper layer through the through-hole structure. The method includes:

[0044] Step 1, assembling PEI LENS2: the PEI LENS2 is mounted on the front of the PCB1 and sealed to cover the optoelectronic chip, forming a first seal for the optoelectronic chip. The edges of the PEI LENS2 are sealed with UV glue and fixed to the PCB1 by bonding;

[0045] Step 2, assembling the LENS cover plate 4: the LENS cover plate 4 is covered on the PEI LENS 2 and covers the connector 31 of the optical fiber jumper 3, and is used to seal the connection between the PEI LENS 2 and the optical fiber jumper 3. The edges of the LENS cover plate 4 are sealed by UV glue and fixed on the PEI LENS 2;

[0046] Step 3, assembling the injection hot melt component 5: the injection hot melt component 5 seals and covers the PEI LENS 2 and the connector 31 of the optical fiber jumper 3 on the front of the PCB1, and seals and covers the corresponding PCB1 at the opposite position on the back of the PCB1 to form a second seal. The injection hot melt component 5 is designed with a window at the heat dissipation copper layer position;

[0047] Step 4, assemble the assembly structure 6: the PCB 1 and the injection hot melt component 5 are both encapsulated in the assembly structure 6, and the assembly structure 6 is also designed with a window corresponding to the heat dissipation copper layer. One end of the assembly structure 6 has a reserved opening for the optical fiber jumper 3, and the optical fiber jumper 3 passes through the reserved opening for the optical fiber jumper 3. The other end of the assembly structure 6 has a plug-in port for docking with the client switch.

[0048] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A liquid-cooled optical module, characterized in that: The invention comprises a PCB, a PEI LENS, an optical fiber jumper and an injection hot melt component, wherein an optoelectronic chip is packaged on the front of the PCB, the PEI LENS is installed on the front of the PCB and completely covers the optoelectronic chip, the PEI LENS is sealed on all sides by dispensing glue and is fixed on the PCB1 by bonding, so as to realize the first sealing of the optoelectronic chip; the optical fiber jumper is connected to the PEI LENS, and the PEI LENS is used to couple the optical signal emitted by the optoelectronic chip and transmit it to the optical fiber jumper, or receive the optical signal transmitted by the optical fiber jumper and couple it to the optoelectronic chip; a heat dissipation copper layer for absorbing the heat of the optoelectronic chip is arranged at the back of the PCB opposite to the optoelectronic chip; the injection hot melt component is used to seal and cover the PEILENS and the connector of the optical fiber jumper on the front of the PCB, and seal and cover the corresponding PCB at the relative position on the back of the PCB to form a second sealing, and the injection hot melt component is designed with a window at the position of the heat dissipation copper layer, and the heat dissipation copper layer is used to contact with the coolant to realize the heat dissipation of the optoelectronic chip.

2. The liquid-cooled optical module according to claim 1, characterized in that: The edges of the PEI LENS are sealed by UV glue and bonded to the PCB, and the outer layers of the UV glue on the left and right sides of the PEI LENS are covered with a layer of black glue.

3. The liquid-cooled optical module according to claim 2, characterized in that: The liquid-cooled optical module also includes a LENS cover plate, which covers the PEI LENS and covers the connector of the optical fiber jumper, and is used to seal the connection between the PEI LENS and the optical fiber jumper. The edges of the LENS cover plate are sealed by UV glue and bonded to the PEI LENS.

4. The liquid-cooled optical module according to claim 3, characterized in that: The gaps between the LENS cover plate, the PEI LENS and the optical fiber jumper connector are sealed by UV glue.

5. The liquid-cooled optical module according to claim 1, characterized in that: The liquid-cooled optical module also includes an assembly structure, and the PCB and the injection-molded hot melt component are both packaged in the assembly structure.

6. The liquid-cooled optical module according to claim 5, characterized in that: One end of the assembly structure has a fiber jumper reserved opening, through which the fiber jumper passes, and the other end of the assembly structure has a plug-in port for docking with a client switch.

7. The liquid-cooled optical module according to claim 1, characterized in that: A first positioning column is provided at the bottom of the PEI LENS, a second positioning column is provided on the interface between the PEI LENS and the optical fiber jumper, a first positioning groove adapted to the first positioning column is provided on the PCB, and a second positioning groove adapted to the second positioning column is provided on the connector of the optical fiber jumper. When the PEI LENS is installed on the front side of the PCB, the first positioning column is embedded in the first positioning groove, and when the optical fiber jumper is docked with the PEI LENS, the second positioning column is embedded in the second positioning groove.

8. The liquid-cooled optical module according to claim 1, characterized in that: The PEI LENS also includes an optical docking bevel, which includes an RX reflective surface, a TX reflective surface, an RX LENS and a TX LENS; the optical signal emitted by the VCSEL of the optoelectronic chip is reflected to the TX LENS through the TX reflective surface, and is transmitted to the optical fiber jumper through the TX LENS; the optical signal transmitted by the optical fiber jumper passes through the RX LENS and then is incident on the RX reflective surface, and is reflected to the PD of the optoelectronic chip through the RX reflective surface.

9. The liquid-cooled optical module according to claim 1, characterized in that: The heat of the optoelectronic chip on the front side of the PCB is transferred to the heat dissipation copper layer on the back side of the PCB through the through-hole structure.

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