Projector heat dissipation device combining TEC and flat heat pipe

Abstract

The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a projector heat dissipation device combining a TEC and a flat heat pipe, which comprises a projector body and a TEC semiconductor radiator, and the cold end of the TEC semiconductor radiator is fixedly mounted on an LED lamp base of an LED on the projector body; the plane heat pipe is fixedly arranged on the hot end of the TEC semiconductor radiator; heat dissipation fins are fixedly mounted at the phase change cold ends of the planar heat pipes; and the electric fan is arranged on one side of the heat dissipation fins and is used for blowing air to the heat dissipation fins for heat dissipation. The device not only can provide efficient heat dissipation performance, but also can maintain the portability of the projector on the premise of not increasing extra volume; sufficient heat dissipation performance is provided in a limited space so as to cope with a larger thermal load caused by improvement of brightness and power consumption of a household small portable projector. During passive heat dissipation, the electric fan is not started, and noise and vibration generated when the heat dissipation system works are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a projector heat dissipation device combining TEC with a flat-plate heat pipe. Background Art

[0002] In the internal structure of home projectors, the cooling system usually uses air cooling or water cooling, and very few solutions use heat pipe structures. Heat pipe cooling is the existing technology closest to this solution, which has efficient heat dissipation performance, but due to the efficiency and size limitations of the liquid wick, it still cannot exert the highest heat exchange efficiency. In the future, as the projection brightness and power consumption of projectors increase, the heat generation will also increase exponentially, so the future heat dissipation demand will also increase. Therefore, this solution is proposed.

[0003] The heat dissipation structure of existing home projectors basically uses heat dissipation fins and fans to dissipate heat. A few manufacturers also add heat pipes to speed up heat exchange.

[0004] In the current market, the heat dissipation technologies of small portable projectors for home use mainly include the following:

[0005] Air cooling: This is the most common way of cooling, which uses a built-in fan to drive air flow to transfer heat from the inside of the projector to the outside. This method is simple and low-cost, but the efficiency is relatively low, and it may generate noise when the fan speed is high.

[0006] Water cooling: Some high-end or professional projectors may use a water cooling system to remove heat through flowing water. Water cooling has high heat dissipation efficiency, but the system is complex and costly, and is rarely seen in small portable projectors for home use.

[0007] Heat pipe cooling: Use heat pipes as a medium for heat conduction, and use the phase change cycle of the working fluid in the heat pipe to remove heat. Heat pipes have high heat dissipation efficiency and small size, which are suitable for compact design, but the cost is relatively high, and the performance is limited by the efficiency and size of the liquid absorption core.

[0008] The above are the heat dissipation technologies commonly used in projectors on the market.

[0009] When the brightness and power consumption of small portable home projectors increase, resulting in increased internal heat generation, existing heat dissipation technologies (especially heat pipe heat dissipation technology) are not effective enough in solving the heat dissipation problem.

[0010] To this end, a cooling system design that integrates TEC semiconductor radiator and planar heat pipe is used to achieve better thermal management, ensure the normal operation of the equipment and extend its service life. Utility Model Content

[0011] The technical problem to be solved by the utility model is to overcome the defects of the prior art. The utility model proposes a projector heat dissipation device combining TEC and a flat-plate heat pipe, which can achieve better thermal management, ensure the normal operation of the equipment and extend the service life.

[0012] In order to solve the above technical problems, the technical solution adopted by the utility model is: a projector heat dissipation device combining TEC and flat heat pipe, comprising:

[0013] Projector body,

[0014] A TEC semiconductor heat sink, wherein the cold end of the TEC semiconductor heat sink is fixedly mounted on the LED lamp base of the LED on the projector body;

[0015] A planar heat pipe, wherein the planar heat pipe is fixedly mounted on the hot end of the TEC semiconductor heat sink;

[0016] The phase change cold end of the planar heat pipe is fixedly mounted with a heat dissipation fin;

[0017] The electric fan is placed on one side of the heat dissipation fins and is used to blow air to the heat dissipation fins to dissipate heat.

[0018] Furthermore, an air inlet is provided on the shell of the projector body, an air inlet filter is installed on the air inlet, an air outlet is provided on the shell of the projector body, an air outlet filter is installed on the air outlet, and the heat dissipation fin is close to the air outlet filter;

[0019] The LED lamp base, TEC semiconductor radiator, planar heat pipe and heat dissipation fins are placed in the projector body.

[0020] Furthermore, it also includes an auxiliary mounting plate, on which a rotating column is rotatably connected, on which an electric fan mounting plate is fixedly mounted, and on which the electric fan is mounted;

[0021] A notch is provided on the shell of the projector body, the rotating column passes through the notch, and the auxiliary mounting plate is fixedly mounted on the projector body to block the notch.

[0022] Furthermore, a through hole is formed on the auxiliary mounting plate, a threaded hole is formed on the shell of the projector body, a screw passes through the through hole and is threaded in the threaded hole, and the auxiliary mounting plate is fixedly mounted on the shell of the projector body.

[0023] Furthermore, it also includes a motor, which is fixedly mounted on the auxiliary mounting plate, and a power output end of the motor is connected to the rotating column.

[0024] Furthermore, the electric fan mounting plate is fixedly connected to a first connecting plate on both sides, the two first connecting plates are fixedly connected to a second connecting column, the two second connecting columns are fixedly connected to a limiting sliding block on the side away from the first connecting plate, a T-shaped circular ring groove is provided on one side of the auxiliary mounting plate, the limiting sliding block is connected in the T-shaped circular ring groove for limited rotation, and the second connecting column passes through the groove.

[0025] Compared with the prior art, the beneficial effects of the utility model include:

[0026] The device not only provides efficient heat dissipation, but also maintains the portability of the projector without adding extra volume;

[0027] Provide sufficient heat dissipation performance in a limited space to cope with the greater heat load caused by the increase in brightness and power consumption of small portable projectors for home use;

[0028] It can ensure the long-term reliability of the cooling system and reduce equipment damage and failure rate caused by insufficient cooling;

[0029] During passive cooling, the electric fan is not started, which reduces the noise and vibration generated by the cooling system when it is working, thereby improving the user's comfort when using it. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The disclosure of the present invention is described with reference to the accompanying drawings. It should be understood that the drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention. In the accompanying drawings, the same reference numerals are used to refer to the same components. Among them:

[0031] Figure 1 Schematically shows a cross-sectional structural diagram of a device proposed according to one embodiment of the utility model;

[0032] Figure 2 The enlarged structural diagram at A of the device proposed according to one embodiment of the utility model is schematically shown.

[0033] Numbers in the figure: 1. Projector body; 2. Air outlet filter; 3. LED lamp base; 4. TEC semiconductor radiator; 5. Planar heat pipe; 6. Heat dissipation fins; 7. Electric fan; 8. Electric fan mounting plate; 9. First connecting plate; 10. Rotating column; 11. Threaded hole; 12. Through hole; 13. Screw; 14. Second connecting column; 15. Notch; 16. Auxiliary mounting plate; 17. T-shaped ring groove; 18. Limiting sliding block; 19. Air inlet filter; 20. Motor. DETAILED DESCRIPTION

[0034] It is easy to understand that according to the technical solution of the utility model, without changing the essential spirit of the utility model, a person skilled in the art can propose a variety of interchangeable structural modes and implementation modes. Therefore, the following specific implementation modes and drawings are only exemplary descriptions of the technical solution of the utility model, and should not be regarded as the entirety of the utility model or as a limitation or restriction to the technical solution of the utility model.

[0035] Example:

[0036] like Figure 1-2 As shown, this device is designed to improve the heat dissipation effect of the projector. It is found that the main heat source is the heat emitted by the LED lamp base, so we have made design improvements in this position.

[0037] A TEC semiconductor heat sink 4 is fixedly mounted on an LED lamp base 3 of an LED lamp in a projector body 1 .

[0038] The projector body 1 is a device that uses the Peltier effect generated when current passes through to achieve a temperature difference between the cold and hot ends. In this design, the cold end of the projector body 1 is close to the LED lamp base 3 to absorb heat, while the hot end of the TEC semiconductor heat sink 4 is connected to the planar heat pipe 5 to transfer the heat.

[0039] A heat dissipation fin 6 is installed at one end of the gas-to-liquid transition of the planar heat pipe 5 .

[0040] An air inlet and an air outlet are provided on the shell of the projector body 1 . The air inlet is fixedly installed with an air inlet filter 19 , and the air outlet is fixedly installed with an air outlet filter 2 . The heat dissipation fins 6 are close to the air outlet filter 2 .

[0041] The LED lamp base 3, the TEC semiconductor radiator 4, the planar heat pipe 5, the heat dissipation fins 6, and the electric fan 7 are all placed in the projector body 1. In the initial state, the electric fan 7 is facing the end of the heat dissipation fin 6.

[0042] A notch 15 is formed on the shell of the projector body 1 .

[0043] The auxiliary mounting plate 16 is rotatably connected with a rotating column 10, and an electric fan mounting plate 8 is fixedly mounted on the side of the rotating column 10 away from the auxiliary mounting plate 16, and an electric fan 7 is fixedly mounted on the electric fan mounting plate 8. The rotating column 10 passes through the notch 15. The motor 20 is fixedly mounted on the outer side of the auxiliary mounting plate 16, and the power output end of the motor 20 is connected to the rotating column 10.

[0044] The auxiliary mounting plate 16 is provided with a plurality of through holes 12 , the projector body 1 is provided with threaded holes 11 matching the through holes 12 , and the screws 13 pass through the through holes 12 and are threadedly connected in the threaded holes 11 , so that the auxiliary mounting plate 16 is fixedly mounted on the projector body 1 .

[0045] The first connecting plates 9 are fixedly connected to both sides of the electric fan mounting plate 8, and the second connecting columns 14 are fixedly connected to the two first connecting plates 9. The two second connecting columns 14 pass through the notch 15, and the side of the second connecting column 14 away from the first connecting plate 9 is fixedly connected to a limiting sliding block 18. A T-shaped circular ring groove 17 is provided on the inner side of the auxiliary mounting plate 16, and the limiting sliding block 18 is connected in the T-shaped circular ring groove 17 for limited rotation.

[0046] In specific implementation, the device is divided into two modes: active heat dissipation and passive heat dissipation.

[0047] During passive heat dissipation, the device starts the TEC semiconductor radiator 4. At this time, the heat on the LED lamp base 3 is transferred from the cold end of the TEC semiconductor radiator 4 to the TEC semiconductor radiator 4, and then the heat is transferred to the planar heat pipe 5. The heat dissipation of the heat dissipation fins 6 allows the planar heat pipe 5 to transfer the heat of the TEC semiconductor radiator 4, thereby realizing passive heat dissipation of the LED lamp base 3.

[0048] During active heat dissipation, it includes not only passive heat dissipation but also heat dissipation by the electric fan 7. Active heat dissipation also includes two levels: fast active heat dissipation and ultra-fast active heat dissipation. During fast active heat dissipation, the electric fan 7 remains stationary facing the end of the air outlet filter 2 and blows air to the heat dissipation fins 6 for heat dissipation. During ultra-fast active heat dissipation, the motor 20 is started, so that the electric fan 7 swings left and right while blowing air, so that the heat dissipation fins 6 swing back and forth to blow air and dissipate heat.

[0049] The technical scope of the present invention is not limited to the contents described above. Those skilled in the art can make various deformations and modifications to the above embodiments without departing from the technical concept of the present invention, and these deformations and modifications should all fall within the protection scope of the present invention.

Claims

1. A projector heat dissipation device combining TEC and flat heat pipe, characterized in that: include: Projector body (1), A TEC semiconductor heat sink (4), wherein a cold end of the TEC semiconductor heat sink (4) is fixedly mounted on an LED lamp base (3) of an LED on the projector body (1); A planar heat pipe (5), wherein the planar heat pipe (5) is fixedly mounted on the hot end of the TEC semiconductor heat sink (4); A heat dissipation fin (6) is fixedly mounted on the phase-change cold end of the planar heat pipe (5); An electric fan (7) is disposed on one side of the heat dissipation fins (6) and is used to blow air to the heat dissipation fins (6) to dissipate heat.

2. The projector heat dissipation device combining TEC and flat-plate heat pipe according to claim 1, characterized in that: The shell of the projector body (1) is provided with an air inlet, the air inlet is equipped with an air inlet filter (19), the shell of the projector body (1) is provided with an air outlet, the air outlet is equipped with an air outlet filter (2), and the heat dissipation fins (6) are close to the air outlet filter (2); The LED lamp base (3), TEC semiconductor heat sink (4), planar heat pipe (5), and heat dissipation fins (6) are placed inside the projector body (1).

3. The projector heat dissipation device combining TEC and flat-plate heat pipe according to claim 2, characterized in that: It also comprises an auxiliary mounting plate (16), the auxiliary mounting plate (16) is rotatably connected to a rotating column (10), an electric fan mounting plate (8) is fixedly mounted on the rotating column (10), and the electric fan (7) is mounted on the electric fan mounting plate (8); A notch (15) is provided on the shell of the projector body (1), the rotating column (10) passes through the notch (15), and the auxiliary mounting plate (16) is fixedly mounted on the projector body (1) and blocks the notch (15).

4. The projector heat dissipation device combining TEC and flat-plate heat pipe according to claim 3, characterized in that: The auxiliary mounting plate (16) is provided with a through hole (12), the shell of the projector body (1) is provided with a threaded hole (11), and a screw (13) passes through the through hole (12) and is threaded in the threaded hole (11), thereby fixing the auxiliary mounting plate (16) on the shell of the projector body (1).

5. The projector heat dissipation device combining TEC and flat-plate heat pipe according to claim 4, characterized in that: It also includes a motor (20), which is fixedly mounted on the auxiliary mounting plate (16), and a power output end of the motor (20) is connected to the rotating column (10).

6. The projector heat dissipation device combining TEC and flat-plate heat pipe according to claim 5, characterized in that: The two sides of the electric fan mounting plate (8) are fixedly connected to the first connecting plate (9), the two first connecting plates (9) are fixedly connected to the second connecting column (14), the two second connecting columns (14) are fixedly connected to the side away from the first connecting plate (9) with a limiting sliding block (18), one side of the auxiliary mounting plate (16) is provided with a T-shaped circular ring groove (17), the limiting sliding block (18) is connected in a limited rotation in the T-shaped circular ring groove (17), and the second connecting column (14) passes through the notch (15).

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