Water-cooling heat dissipation assembly, computer case and computer host

Abstract

The utility model belongs to the technical field of computer equipment, and provides a water-cooling heat dissipation assembly which comprises a first water-cooling plate, a second water-cooling plate and a heat dissipation water row, the first water-cooling plate is used for being arranged on a computer mainboard and covering a CPU of the mainboard, and a water pump is arranged on the first water-cooling plate; the second water cooling plate further comprises a back plate, and the second water cooling plate and the back plate clamp and fix the computer graphics card from the two sides. The heat dissipation water row comprises a heat dissipation fan and a heat dissipation device with heat dissipation fins, and the heat dissipation fan is arranged on the heat dissipation device and located within the arrangement range of the heat dissipation fins; liquid flow channels are arranged in the first water cooling plate, the second water cooling plate and the heat dissipation water row, and the liquid flow channels are communicated by additionally arranging connecting pipelines on the first water cooling plate, the second water cooling plate and the heat dissipation water row. The utility model further provides a computer case with the water-cooling heat dissipation assembly and a computer host with the computer case. The heat dissipation problem of an ITX compact computer host in the prior art is solved.

Description

Technical Field

[0001] The present application belongs to the technical field of computer equipment, and in particular relates to a water cooling heat dissipation component, a computer case and a computer host for an ITX compact computer. Background Art

[0002] The desktop computer (computer) motherboards on the market mainly include AT motherboards, ATX motherboards and ITX motherboards. Among them, AT motherboards are large boards of standard size, with large available space on the motherboard, good expansion performance, and conducive to heat dissipation, which are suitable for computer players with high requirements for configuration.

[0003] The ATX motherboard is a small board improved on the basis of the above-mentioned AT motherboard. It is suitable for use in small host cases and can meet the needs of daily office and users with requirements on space.

[0004] The ITX motherboard is a smaller motherboard. The size of the ITX motherboard is similar to a square structure and has little expandability. It is mainly used in non-ordinary hosts such as embedded systems, barebones systems and HTPC.

[0005] As the performance of CPU, graphics card and other components increases, the heat generated during operation increases. However, for ITX computer hosts, due to the small internal space of the ITX computer case, the electrical components installed inside the case are very compact. The CPU, graphics card and power supply can only be gathered together, resulting in the easy accumulation of heat. It is also impossible to independently install a radiator on each electrical component, making it difficult to meet the heat dissipation requirements. The common heat dissipation solution is to install a cooling fan on the case for heat dissipation, or to use computer accessories with low heat generation and slightly poor performance, thereby limiting the performance of the entire machine.

[0006] It can be seen that the current heat dissipation problem on ITX compact computer hosts makes it impossible to use high-performance accessories, affecting the performance of the entire machine. Summary of the invention

[0007] The purpose of the embodiments of the present application is to provide a water-cooling heat dissipation component, a computer case and a computer host to solve the heat dissipation problem of the ITX compact computer host in the prior art.

[0008] To achieve the above purpose, the technical solution adopted in this application is:

[0009] In a first aspect, the present application provides a water-cooling heat dissipation component, comprising:

[0010] A first water cooling plate, which is used to be arranged on the computer motherboard and covers the CPU of the motherboard, and a water pump is arranged on the first water cooling plate;

[0011] A second water cooling plate, used to be arranged on a computer graphics card, the second water cooling plate also includes a back plate, the second water cooling plate and the back plate clamp and fix the graphics card from both sides;

[0012] A heat dissipation water row, comprising a heat dissipation fan and a radiator with heat dissipation fins, wherein the heat dissipation fan is arranged on the radiator and is located within the setting range of the heat dissipation fins;

[0013] Liquid flow channels are provided inside the first water-cooling plate, the second water-cooling plate and the heat dissipating water row, and the liquid flow channels are connected by installing connecting pipes on the first water-cooling plate, the second water-cooling plate and the heat dissipating water row respectively.

[0014] In this way, the first water-cooling plate and the second water-cooling plate can replace the original CPU heat dissipation structure on the motherboard and the heat dissipation structure on the graphics card, and directly cover the motherboard and the graphics card. On the one hand, the CPU, GPU and other electrical components can be cooled separately to effectively ensure the heat dissipation effect. On the other hand, the noise generated by the fan of the original heat dissipation structure on the CPU and the graphics card during operation can be eliminated, thereby improving the silent effect. On the third hand, the first water-cooling plate and the second water-cooling plate both adopt a plate structure. Compared with the fan independently set on the original CPU or graphics card, the plate structure is smaller in size, which is conducive to reducing the occupied space.

[0015] The structure of the first water-cooling plate is improved, and a water outlet and an input connector connected to the internal liquid flow channel are provided on the plate surface of the first water-cooling plate, and an input port and an output connector are provided on the water pump. The input port of the water pump is connected to the water outlet on the first water-cooling plate, and the output connector extends outward from the side of the water pump; a storage box is also provided on the first water-cooling plate, and the storage box has a bottom opening, and the water pump is embedded in the storage box from the bottom opening; a notch is provided on the side wall of the storage box, and the output connector of the water pump passes through the notch of the storage box to reduce the occupied space.

[0016] In one embodiment, the first water-cooling plate further includes a clamp, an elastic fastener, and a heat-conducting plate for attaching to the CPU, wherein the heat-conducting plate is arranged on the plate surface of the first water-cooling plate away from the water pump; the four corners of the clamp are respectively provided with connecting shafts for attaching the elastic fasteners, the four corners of the storage box are respectively provided with connecting ears, and the connecting ears are provided with connecting holes; the first water-cooling plate is provided with perforations corresponding to the positions of the connecting ears, and the elastic fasteners are successively passed through the connecting holes and the perforations and fixed on the connecting shafts. In this way, the elastic fasteners arranged on the four corners are used to adjust the balance of the heat-conducting plate and the CPU surface, ensuring that the plate surface of the heat-conducting plate is in stable contact with the surface of the CPU and the force is balanced.

[0017] In one embodiment, the first water-cooled plate is also provided with a boss and a clamp for mounting a solid-state hard disk, the boss is integrally connected to the side of the first water-cooled plate, and the interior of the boss is connected to the liquid flow channel inside the first water-cooled plate; the edge of the first water-cooled plate is provided with a screw hole for fixing the clamp, the clamp is provided with a heat sink and a fixing hole corresponding to the position of the screw hole, and the clamp covers the boss. In this way, the clamp clamps the solid-state hard disk such as an SSD hard disk on the boss, uses the boss on the first water-cooled plate to absorb heat from the solid-state hard disk, and combines with the heat sink on the clamp to dissipate heat, effectively ensuring the heat dissipation effect of the solid-state hard disk.

[0018] In one embodiment, thermal pads are respectively provided on the facing surfaces of the boss and the clamping plate, so that the heat generated by the solid state drive can be quickly absorbed from the upper and lower end surfaces, thereby improving the heat dissipation effect.

[0019] The structure of the second water cooling plate is improved, and the second water cooling plate and the back plate are respectively provided with corresponding mounting holes, and are fixed on the graphics card by installing fasteners through the corresponding mounting holes; the second water cooling plate is also provided with a heat-conducting block corresponding to the position of the heating element on the graphics card, so as to absorb heat and quickly absorb the heat on the graphics card.

[0020] The structure of the heat dissipation water row is improved, and the two ends of the radiator are respectively provided with a first guide cavity and a second guide cavity, and the first guide cavity and the second guide cavity are connected through a plurality of liquid flow channels arranged side by side, and the heat dissipation fin is arranged between two adjacent liquid flow channels; the heat dissipation fin is a corrugated sheet formed by repeated wrinkling along the length direction of the liquid flow channel, so that the heat dissipation fin has a guide gap located outside the radiator. The airflow generated by the heat dissipation fan flows in the guide gap to accelerate the heat dissipation, effectively improving the heat dissipation efficiency.

[0021] In one embodiment, the radiator is further provided with a liquid inlet connector and a liquid outlet connector, the first flow guiding cavity or the second flow guiding cavity is provided with a partition plate, the partition plate divides the first flow guiding cavity or the second flow guiding cavity into a liquid inlet chamber and a liquid outlet chamber, the liquid inlet connector is arranged on the liquid inlet chamber, and the liquid outlet connector is arranged on the liquid outlet chamber. The interior of the radiator forms a one-way flow channel, and this one-way flow channel can maximize the use of the entire internal space of the radiator and effectively improve the heat dissipation effect.

[0022] In a second aspect, the present application provides a computer case, comprising a top plate, four side plates, a bottom plate, and the water-cooling heat dissipation assembly, wherein the top plate, the side plates, and the bottom plate are respectively provided with air holes; the heat dissipation water row in the water-cooling heat dissipation assembly is hoisted on the inner wall of the top plate. In conjunction with the air holes provided on the top plate, the heat inside the case can be pumped out of the case through the air holes on the top plate.

[0023] In the third aspect, the present application also provides a computer host, including a motherboard, a graphics card, a power supply and the computer case, wherein the motherboard is arranged on the bottom plate of the computer case; the motherboard is provided with a CPU and a slot for installing the graphics card, the graphics card is vertically plugged into the slot of the motherboard, and the second water-cooling plate is fixed on the graphics card; the first water-cooling plate is arranged on the motherboard, and a spacing space is formed in the height direction between the first water-cooling plate and the heat dissipation water row; the power supply is arranged in the spacing space, and one end of the power supply is fixedly connected to the side plate. The motherboard, graphics card, heat dissipation water row and power supply form an E-shaped layout, which reduces the occupied space, is conducive to matching the shape of the ITX computer case that is close to a cube, and maximizes the use of the internal space of the computer case.

[0024] The beneficial effects of the water-cooling heat dissipation component, computer case and computer host provided by the present application are: compared with the prior art, the present application is a compact case layout adopted for the ITX computer host, so that the motherboard, graphics card, heat dissipation water row and power supply form an E-shaped layout, which is conducive to matching the shape of the ITX computer case that is close to a cube, and maximizing the use of the internal space of the computer case.

[0025] The water-cooling heat dissipation component installed on the computer case is an integrated water-cooling heat dissipation structure composed of a first water-cooling plate, a second water-cooling plate and a heat dissipation water row, and the liquid flow channels inside the three components are connected by connecting pipes to form a complete circulation flow channel. The water pump is installed on the first water-cooling plate, and the water pump is used as a power source to drive the cold liquid to flow, and the heat is gathered on the heat dissipation water row, and then the heat is uniformly discharged to the outside of the computer case through the heat dissipation fan, effectively solving the heat dissipation problem on the ITX compact computer host. It allows the ITX computer host to also choose higher-performance desktop CPUs, memory and graphics cards, etc., so that the performance of the whole machine is effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0027] Figure 1 A schematic diagram of the three-dimensional structure of the main components of the computer host provided in the embodiment of the present application;

[0028] Figure 2 A schematic diagram of the exploded structure of the main components of the water cooling and heat dissipation assembly and the computer host provided in the embodiment of the present application;

[0029] Figure 3 Schematic diagram of the explosion structure of the first water cooling plate provided in the embodiment of the present application Figure 1 ;

[0030] Figure 4 Schematic diagram of the assembly structure of the second water cooling plate and the graphics card provided in the embodiment of the present application Figure 1 ;

[0031] Figure 5 A schematic diagram of the explosion structure of the heat dissipation water drain provided in an embodiment of the present application;

[0032] Figure 6 A schematic diagram of the assembly structure of the first water cooling plate and the mainboard provided in an embodiment of the present application;

[0033] Figure 7 Schematic diagram of the explosion structure of the first water cooling plate provided in the embodiment of the present application Figure 2 ;

[0034] Figure 8 Schematic diagram of the explosion structure of the first water cooling plate provided in the embodiment of the present application Figure 3 ;

[0035] Fig. 9 Schematic diagram of the explosion structure of the first water cooling plate provided in the embodiment of the present application Figure 4 ;

[0036] Fig.10 Schematic diagram of the assembly structure of the second water cooling plate and the graphics card provided in the embodiment of the present application Figure 2 ;

[0037] Fig.11 A schematic diagram of the three-dimensional structure of the second water-cooling plate provided in an embodiment of the present application;

[0038] Fig.12 A schematic diagram of the internal structure of a radiator provided in an embodiment of the present application;

[0039] Fig.13 A schematic diagram of the three-dimensional structure of a computer case provided in an embodiment of the present application;

[0040] Fig.14 A schematic diagram of the assembly structure of the main components of a computer case and a computer host provided in an embodiment of the present application.

[0041] Among them, the reference numerals in the figure are:

[0042] 100-motherboard; 200-graphics card; 300-power supply; 400-solid state drive;

[0043] 1-first water cooling plate; 11-water pump; 111-output connector; 12-water outlet; 13-input connector; 14-storage box; 141-bottom opening; 142-notch; 143-connection ear; 144-connection hole;

[0044] 15-clamping frame; 151-connecting shaft; 16-elastic fastener; 17-heat conducting plate; 18-perforation; 19-fixing groove;

[0045] 2-second water cooling plate; 21-back plate; 22-output connection end; 23-input connection end; 24-mounting hole; 25-heat conducting block;

[0046] 3- cooling water row; 31- cooling fan;

[0047] 4- radiator; 40- liquid flow channel; 41- heat sink fin; 42- liquid inlet connector; 43- liquid outlet connector; 44- first flow guide cavity; 45- second flow guide cavity; 451- liquid inlet chamber; 452- liquid outlet chamber; 46- flow guide gap; 47- partition plate;

[0048] 51-first connecting pipe; 52-second connecting pipe; 53-third connecting pipe;

[0049] 6- boss; 61- clamp; 611- heat sink; 612- fixing hole; 62- screw hole; 63- thermal pad;

[0050] 7-computer case; 71-top panel; 72-side panel; 73-bottom panel; 74-air vent. DETAILED DESCRIPTION

[0051] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0052] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0053] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0054] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0055] The higher the performance of the CPU, graphics card, etc. in a computer, the greater the heat generated when it is working. However, for an ITX computer host, since the available space inside the ITX host case is small and the electrical components installed inside the case are very compact, the CPU, graphics card, power supply, etc. can only be gathered together, resulting in easy accumulation of heat. It is also impossible to independently set a radiator on each electrical component, making it difficult to meet the heat dissipation needs.

[0056] The common cooling solution is to install a cooling fan on the chassis to dissipate heat, or to use computer accessories with low heat generation and slightly poor performance, thereby limiting the performance of the entire machine. For example, the CPU and memory of a desktop computer are replaced with the CPU and memory of a laptop computer. Since the CPU and memory used in a laptop computer of the same specification are more expensive than those used in a desktop computer, the installation cost increases, and the performance of the machine body is still not as good as that of a desktop computer of the same specification.

[0057] It can be seen that the heat dissipation problem on the current ITX compact computer host will make it impossible to use high-performance computer accessories, affecting the performance of the entire machine.

[0058] Here, the embodiments of the present application provide a new type of water-cooling heat dissipation component, computer case and computer host. The water-cooling heat dissipation component is an integrated water-cooling heat dissipation structure specially used on a compact ITX desktop computer host, which can effectively solve the heat dissipation problem on a traditional ITX compact computer host and meet the heat dissipation needs. It is now described in detail.

[0059] Please also read Figure 1 and Figure 2, on a computer host, at least including a motherboard 100, a CPU, a graphics card 200, a memory, and a power supply 300, wherein the CPU, the memory, and the graphics card 200 are all plugged into the motherboard 100, and the power supply 300 is electrically connected to the motherboard 100 through a cable. These electrical components are all arranged on the computer case of the present application, and the computer case of the present application is provided with the water cooling heat dissipation component of the present application.

[0060] The water-cooled heat dissipation component includes a first water-cooled plate 1, a second water-cooled plate 2 and a heat dissipation water row 3, and the first water-cooled plate 1, the second water-cooled plate 2 and the heat dissipation water row 3 are each provided with a liquid flow channel for the flow of cooling liquid, and the liquid flow channels inside the three are connected by installing connecting pipes on the first water-cooled plate 1, the second water-cooled plate 2 and the heat dissipation water row 3 respectively.

[0061] Among them, the first water cooling plate 1 is used to be set on the computer motherboard 100 and covers the CPU of the motherboard 100, which is equivalent to a whole plate with water cooling function covering the motherboard 100 and can cool the CPU and other components on the motherboard 100.

[0062] like Figure 3 As shown, a water pump 11 is provided on the first water cooling plate 1, and the water pump 11 serves as a driving source for the internal liquid flow channels of the first water cooling plate 1, the second water cooling plate 2 and the heat dissipation water discharger 3, so that the cold liquid keeps flowing in each component to ensure the cooling effect.

[0063] Please also read Figure 2 and Figure 4 The second water cooling plate 2 is used to be set on the computer graphics card 200. The second water cooling plate 2 also includes a back plate 21. The second water cooling plate 2 and the back plate 21 clamp the graphics card 200 of the computer from both sides, so that the graphics card 200 is clamped and fixed between the second water cooling plate 2 and the back plate 21. This is because the graphics card 200 is generally set vertically in the ITX case and stands upright on the motherboard 100. Therefore, clamping and fixing the graphics card 200 from both sides on the front and back sides is conducive to improving balance and avoiding unbalanced force and easy tipping to one side.

[0064] Please also read Figure 2 and Figure 5 The heat dissipation water row 3 includes a heat dissipation fan 31 and a radiator 4, and the radiator 4 has a heat dissipation fin 41 that penetrates the radiator 4. The heat dissipation fan 31 is arranged on the radiator 4 and is located within the setting range of the heat dissipation fin 41, so that the heat dissipation fan 31 is used to take the heat out of the computer case.

[0065] Compared with the prior art, the water-cooled heat dissipation assembly provided in the embodiment of the present application is an integrated water-cooled heat dissipation structure composed of a first water-cooled plate 1, a second water-cooled plate 2 and a heat dissipation water row 3, and the liquid flow channels inside the three components are connected by a connecting pipe to form a complete circulation flow channel. The water pump 11 is arranged on the first water-cooled plate 1, and the water pump 11 is used as a power source to drive the cold liquid in the liquid flow channel to flow, and the heat is gathered on the heat dissipation water row 3, so that the heat dissipation fan 31 uniformly discharges the heat to the outside of the computer case, effectively solving the heat dissipation problem on the ITX compact computer host.

[0066] The first water-cooling plate 1 and the second water-cooling plate 2 in the water-cooling heat dissipation assembly replace the original CPU heat dissipation structure on the motherboard 100 and the heat dissipation structure on the graphics card 200, and directly cover the motherboard 100 and the graphics card 200. On the one hand, it can cool down the CPU, GPU and other electrical components respectively, quickly take away the heat generated by these components when they are working, and effectively ensure the heat dissipation effect. On the second hand, it can eliminate the noise generated by the fan of the original heat dissipation structure on the CPU and the graphics card 200 during operation, thereby improving the silent effect. On the third hand, the first water-cooling plate 1 and the second water-cooling plate 2 both adopt a plate structure. Compared with the fan independently set on the original CPU or graphics card 200, the plate structure is smaller in size, which is conducive to reducing the occupied space.

[0067] It can be seen that the computer mainframe of the present application uses an integrated water-cooling heat dissipation assembly composed of the first water-cooling plate 1, the second water-cooling plate 2 and the heat dissipation water row 3, which effectively replaces the heat dissipation structure installed on the original CPU and graphics card 200, and can simultaneously play the role of cooling and heat dissipation, reducing noise and reducing the occupied space, and effectively solves the problem that the heat dissipation structure cannot be installed in the traditional ITX computer case due to the small internal space, resulting in the heating temperature affecting the body performance. It allows the ITX computer host to also select a higher-performance desktop CPU, memory and graphics card 200, etc., so that the performance of the whole machine is effectively improved.

[0068] For the structure of the first water cooling plate 1, please refer to the embodiment of the present application. Figures 2 to 6 A water outlet 12 and an input connector 13 connected to the internal liquid flow channel are provided on the plate surface of the first water-cooling plate 1. The water pump 11 has an input port (not shown) and an output connector 111. The input port of the water pump 11 is connected to the water outlet 12 on the first water-cooling plate 1, and the output connector 111 extends outward from the side of the water pump 11.

[0069] The second water cooling plate 2 is provided with an output connection end 22 and an input connection end 23 , and the radiator 4 is provided with a liquid inlet connector 42 and a liquid outlet connector 43 .

[0070] like Figure 2As shown, the connecting pipes on the entire water-cooling heat dissipation assembly include a first connecting pipe 51, a second connecting pipe 52 and a third connecting pipe 53. Among them, the two ends of the first connecting pipe 51 are respectively connected to the liquid outlet connector 43 on the heat dissipation water row 3 and the input connector 13 on the first water-cooling plate 1; the two ends of the second connecting pipe 52 are respectively connected to the output connector 111 of the water pump 11 and the input connector 23 on the second water-cooling plate 2; the two ends of the third connecting pipe 53 are respectively connected to the output connector 22 on the second water-cooling plate 2 and the liquid inlet connector 42 on the heat dissipation water row 3.

[0071] In this way, the liquid flow channels inside the first water-cooling plate 1 , the second water-cooling plate 2 and the heat dissipation water discharger 3 are connected to form a circulation channel.

[0072] Please also read Figure 3 , Figure 6 and Figure 7 The first water cooling plate 1 is further provided with a receiving box 14, which has a bottom opening 141. The receiving box 14 covers the water pump 11 with the bottom opening 141. The water pump 11 is received in the receiving box 14 to improve the sealing effect.

[0073] A notch 142 is formed on the side wall of the storage box 14 , and the output connector 111 of the water pump 11 passes through the notch 142 to reduce occupied space.

[0074] In the embodiments of this application, please refer to Figure 3 , Figure 7 and Figure 8 The first water cooling plate 1 also includes a clamp 15, an elastic fastener 16 and a heat conducting plate 17, and the heat conducting plate 17 is arranged on the plate surface of the first water cooling plate 1 away from the water pump 11. The heat conducting plate 17 is used to fit on the CPU to conduct heat, so that the heat on the CPU is quickly absorbed into the first water cooling plate 1.

[0075] The four corners of the clamp frame 15 are respectively provided with connecting shafts 151 for installing elastic fasteners 16, and the four corners of the storage box 14 are respectively provided with connecting ears 143, and the connecting ears 143 are provided with connecting holes 144. The first water-cooling plate 1 is provided with through holes 18 corresponding to the positions of the connecting ears 143, and the elastic fastener 16 is fixed on the connecting shaft 151 through the connecting holes 144 and the through holes 18 in sequence.

[0076] Among them, the elastic fastener 16 can preferably be made of a spring sleeved on a screw, which is conducive to adjusting the balance between the heat conducting plate 17 and the CPU surface, ensuring that the plate surface of the heat conducting plate 17 is in stable contact with the surface of the CPU and the force is balanced, avoiding damage to the CPU.

[0077] Preferably, if Figure 7As shown, a fixing groove 19 matching the shape of the heat conducting plate 17 is further provided on the bottom surface of the first water cooling plate 1 , and the heat conducting plate 17 is embedded in the fixing groove 19 to prevent the heat conducting plate 17 from being easily displaced, thereby playing a role in positioning the heat conducting plate 17 .

[0078] In another embodiment of the present application, please refer to Figure 3 , Figure 7 and Fig. 9 The first water-cooling plate 1 is also provided with a boss 6 and a clamping plate 61 for mounting the solid-state hard disk 400. The boss 6 is integrally connected to the side of the first water-cooling plate 1, and the interior of the boss 6 is connected to the liquid flow channel inside the first water-cooling plate 1 so that the cold liquid can flow through the boss 6.

[0079] like Fig. 9 As shown, the edge of the first water-cooling plate 1 is provided with a screw hole 62 for fixing the clamping plate 61 , and the clamping plate 61 is provided with a heat sink 611 and a fixing hole 612 , which corresponds to the position of the screw hole 62 on the first water-cooling plate 1 , and the clamping plate 61 covers the boss 6 .

[0080] Thus, the clamping plate 61 clamps the solid state hard disk 400, such as an SSD hard disk, on the boss 6, ensuring the fixing effect of the solid state hard disk 400. The boss 6 on the first water cooling plate 1 is used to absorb heat from the solid state hard disk 400, and the heat sink 611 on the clamping plate 61 is used to dissipate heat, effectively ensuring the heat dissipation effect of the solid state hard disk 400.

[0081] Preferably, if Fig. 9 As shown, heat-conducting pads 63 are respectively disposed on the facing surfaces of the boss 6 and the clamping plate 61 , so that the heat generated by the solid state drive 400 can be quickly absorbed from the upper and lower end surfaces, thereby improving the heat dissipation effect.

[0082] For the installation structure of the second water cooling plate 2, please refer to the embodiment of the present application. Figure 4 and Fig.10 The second water cooling plate 2 and the back plate 21 are respectively provided with mounting holes 24 corresponding to the positions of the holes on the graphics card 200, and fasteners such as screws are installed to penetrate the mounting holes 24 corresponding to the positions to fix them on the graphics card 200. The structure is simple and easy to disassemble and assemble.

[0083] Among them, Fig.11 As shown, a plurality of heat-conducting blocks 25 are also provided on the second water cooling plate 2. These heat-conducting blocks 25 correspond to the positions of the heating elements on the graphics card 200, such as the GPU, so as to absorb heat and quickly absorb the heat generated by the heating elements on the graphics card 200.

[0084] For the structure of the heat dissipation water row 3, please refer to the embodiment of the present application. Figure 5 and Fig.12The radiator 4 has a first guide cavity 44 and a second guide cavity 45 at both ends, respectively. The first guide cavity 44 and the second guide cavity 45 are connected through a plurality of liquid flow channels 40 arranged side by side, and the heat dissipation fin 41 is arranged between two adjacent liquid flow channels 40.

[0085] The heat dissipation fins 41 are preferably corrugated sheets repeatedly corrugated along the length direction of the liquid flow channel 40, so that the heat dissipation fins 41 have a guide gap 46 located outside the radiator 4. The airflow generated by the heat dissipation fan 31 flows in the guide gap 46 to accelerate the heat dissipation, effectively improving the heat dissipation efficiency.

[0086] In this embodiment, if Fig.12 As shown, a partition plate 47 is provided in the second flow guiding chamber 45 , and the partition plate 47 divides the second flow guiding chamber 45 into a liquid inlet chamber 451 and a liquid outlet chamber 452 . The liquid inlet connector 42 is arranged on the liquid inlet chamber 451 , and the liquid outlet connector 43 is arranged on the liquid outlet chamber 452 .

[0087] In other embodiments (not shown), a partition plate 47 may also be disposed in the first flow guiding cavity 44 to divide the first flow guiding cavity 44 into the two liquid passage chambers mentioned above, which is not specifically limited here.

[0088] In this way, the liquid enters the liquid inlet chamber 451 in the guide cavity at one end from the liquid inlet connector 42, then flows to the guide cavity at the other end through a part of the liquid flow channel 40 in the middle of the radiator 4, and then flows from another part of the liquid flow channel 40 in the middle of the radiator 4 to the liquid outlet chamber 452 in the original guide cavity at one end, and finally is output through the liquid outlet connector 43, thereby forming a one-way flow channel in the radiator 4. This one-way flow channel can maximize the use of the internal space of the entire radiator 4 and effectively improve the heat dissipation effect.

[0089] For computer cases in this application, please also refer to Fig.13 and Fig.14 The computer case 7 is formed into a nearly square case according to the specifications of the ITX motherboard 100. The computer case 7 includes a top plate 71, four side plates 72 and a bottom plate 73. The top plate 71, the side plates 72 and the bottom plate 73 are respectively provided with air holes 74. Specifically, the air holes 74 can be provided on the two opposite side plates 72. The air holes 74 are preferably in a grid shape.

[0090] Among them, Fig.14 As shown, the heat sink 3 in the water cooling assembly is suspended on the inner wall of the top plate 71. Specifically, fasteners such as screws can be installed on the radiator 4 to fix it on the inner wall of the top plate 71. In this way, in conjunction with the air holes 74 opened on the top plate 71, the heat inside the computer case 7 can be drawn out of the case through the air holes 74 on the top plate 71.

[0091] For the internal structure of the computer host for this application, please refer to Figure 1 , Figure 2 and Fig.14 The ITX motherboard 100 is arranged on the bottom plate 73 of the computer case 7. The motherboard 100 is provided with a CPU and a slot for installing a graphics card 200. The graphics card 200 is vertically plugged into the slot of the motherboard 100. The second water cooling plate 2 is fixed on the graphics card 200. The first water cooling plate 1 is arranged on the motherboard 100, and a spacing space is formed in the height direction between the first water cooling plate 1 and the heat dissipation water row 3. The power supply 300 is arranged in the spacing space, and one end of the power supply 300 is fixedly connected to the side plate 72 of the case.

[0092] In this way, for the compact chassis layout adopted by the ITX computer host, the motherboard 100, graphics card 200, heat sink 3 and power supply 300 form an E-shaped layout, which reduces the occupied space and is conducive to matching the shape of the ITX computer case 7 which is close to a cube, and maximizing the use of the internal space of the computer case 7.

[0093] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A water-cooling heat dissipation component, characterized in that: include: A first water cooling plate, which is used to be arranged on the computer motherboard and covers the CPU of the motherboard, and a water pump is arranged on the first water cooling plate; A second water cooling plate, used to be arranged on a computer graphics card, the second water cooling plate also includes a back plate, the second water cooling plate and the back plate clamp and fix the graphics card from both sides; A heat dissipation water row, comprising a heat dissipation fan and a radiator with heat dissipation fins, wherein the heat dissipation fan is arranged on the radiator and is located within the setting range of the heat dissipation fins; Liquid flow channels are provided inside the first water-cooling plate, the second water-cooling plate and the heat dissipating water row, and the liquid flow channels are connected by installing connecting pipes on the first water-cooling plate, the second water-cooling plate and the heat dissipating water row respectively.

2. The water cooling heat dissipation assembly according to claim 1, characterized in that: A water outlet and an input connector connected to the internal liquid flow channel are provided on the plate surface of the first water-cooling plate, and an input port and an output connector are provided on the water pump. The input port of the water pump is connected to the water outlet on the first water-cooling plate, and the output connector extends outward from the side of the water pump; a storage box is also provided on the first water-cooling plate, and the storage box has a bottom opening, and the water pump is embedded in the storage box from the bottom opening; a notch is provided on the side wall of the storage box, and the output connector of the water pump passes through the notch of the storage box.

3. The water cooling heat dissipation assembly according to claim 2, characterized in that: The first water-cooling plate also includes a clamp, an elastic fastener and a heat-conducting plate for fitting on the CPU, wherein the heat-conducting plate is arranged on the plate surface of the first water-cooling plate away from the water pump; connecting shafts for installing the elastic fasteners are respectively provided at the four corners of the clamp, and connecting ears are respectively provided at the four corners of the storage box, and connecting holes are provided on the connecting ears; a through hole corresponding to the position of the connecting ear is provided on the first water-cooling plate, and the elastic fastener passes through the connecting hole and the through hole in sequence and is fixed on the connecting shaft.

4. The water cooling heat dissipation assembly according to claim 2, characterized in that: The first water-cooling plate is also provided with a boss and a clamping plate for installing a solid-state hard disk, the boss is integrally connected to the side of the first water-cooling plate, and the interior of the boss is connected to the liquid flow channel inside the first water-cooling plate; the edge of the first water-cooling plate is provided with screw holes for fixing the clamping plate, the clamping plate is provided with a heat sink and fixing holes corresponding to the positions of the screw holes, and the clamping plate covers the boss.

5. The water cooling heat dissipation assembly according to claim 4, characterized in that: Thermal pads are respectively arranged on the facing surfaces of the boss and the clamping plate.

6. The water cooling heat dissipation assembly according to claim 1, characterized in that: The second water cooling plate and the back plate are respectively provided with corresponding mounting holes, and are fixed on the graphics card by installing fasteners through the corresponding mounting holes; the second water cooling plate is also provided with a heat conductive block corresponding to the position of the heating element on the graphics card.

7. The water cooling heat dissipation assembly according to any one of claims 1 to 6, characterized in that: The two ends of the radiator are respectively provided with a first guide cavity and a second guide cavity, the first guide cavity is connected to the second guide cavity through a plurality of liquid flow channels arranged side by side, and the heat dissipation fin is arranged between two adjacent liquid flow channels; the heat dissipation fin is a corrugated sheet formed by repeated corrugation along the length direction of the liquid flow channel, so that the heat dissipation fin has a guide gap located outside the radiator.

8. The water cooling heat dissipation assembly according to claim 7, characterized in that: The radiator is also provided with a liquid inlet connector and a liquid outlet connector. A partition plate is provided in the first flow guide cavity or the second flow guide cavity. The partition plate divides the first flow guide cavity or the second flow guide cavity into a liquid inlet chamber and a liquid outlet chamber. The liquid inlet connector is arranged on the liquid inlet chamber, and the liquid outlet connector is arranged on the liquid outlet chamber.

9. A computer case, characterized in that: It includes a top plate, four side plates, a bottom plate and a water-cooled heat dissipation component as described in any one of claims 1 to 8, wherein the top plate, the side plate and the bottom plate are respectively provided with air holes; the heat dissipation water row in the water-cooled heat dissipation component is hoisted on the inner wall of the top plate.

10. A computer host, characterized in that: It includes a motherboard, a graphics card, a power supply and a computer case as claimed in claim 9, wherein the motherboard is arranged on the bottom plate of the computer case; the motherboard is provided with a CPU and a slot for installing the graphics card, the graphics card is vertically plugged into the slot of the motherboard, and the second water-cooling plate is fixed to the graphics card; the first water-cooling plate is arranged on the motherboard, and a spacing space in the height direction is formed between the first water-cooling plate and the heat dissipation water row; the power supply is arranged in the spacing space, and one end of the power supply is fixedly connected to the side panel.

Images