Solid state disk radiator structure
By using the wire buckle design of the warping structure with low and high ends in the middle in the solid-state drive radiator, the problem of manual operation errors during factory assembly is solved, and the good heat dissipation effect and operation simplicity of the solid-state drive is achieved. It is suitable for different Manufacturer's SSD.
Patent Information
- Application Number
- CN202421190209.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-27
AI Technical Summary
Existing solid-state hard disk radiators are prone to manual operation errors during factory assembly, increasing operation difficulty and cost. Especially due to different chip layouts of different manufacturers, the radiator design is inconsistent, and additional auxiliary devices are needed to ensure good contact.
Design a solid-state hard disk radiator structure, including the first and second buckles of the mounting base and the warped structure at the lower ends of the middle, through which the structures are pressed against the heat sink in the installation state and abut against the mounting base Connect to ensure that both the upper and lower sides of the solid state hard disk come into contact with the heat dissipation gasket, forming an overall structure, providing balanced force application, and reducing manual operation errors.
Through this structural design, the good heat dissipation effect of the solid-state drive is achieved, which reduces the difficulty and cost of operation, and is compatible with the solid-state drives of different manufacturers, avoiding the use of additional auxiliary devices, and ensuring balanced force application and stability.
Smart Images
Figure CN222260526U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of radiators, in particular to a solid state hard disk radiator structure. Background Art
[0002] At present, different SSD manufacturers have different chip layouts on the motherboard. Currently, tool-free SSD heat sinks, such as Figure 1 As shown, for the solid state drive 3' of manufacturer A, since the chip 31' thereon does not cover the entire solid state drive 3', a heat dissipation pad 4' is needed to fill the empty part of the solid state drive 3' to prevent the heat sink from tilting and ensure good contact between the heat sink and the chip; Figure 2 As shown, for the solid state drive 3' of manufacturer B, since the chip 31' thereon has covered the entire solid state drive 3', no heat dissipation pad is needed. Such a design is prone to manual operation errors during factory assembly, increasing the difficulty and cost of operation. Utility Model Content
[0003] In view of this, the utility model provides a solid state hard disk heat sink structure to solve the problem that manual operation errors are easily caused in the process of assembling solid state hard disk heat sinks in existing factories, thereby increasing operation difficulty and cost.
[0004] The utility model provides a solid state hard disk heat sink structure, comprising:
[0005] An installation base is provided with a first heat dissipation pad, a solid state hard disk, a second heat dissipation pad and a heat sink in sequence from bottom to top;
[0006] A first wire buckle and a second wire buckle, the first wire buckle and the second wire buckle are separately arranged, wherein the first wire buckle and the second wire buckle are both warped structures with a low middle part and high two ends, and the lowest parts of the first wire buckle and the second wire buckle are staggered, in the installed state, the first wire buckle and the second wire buckle are pressed tightly on the heat sink and abut against the mounting base, and the lowest parts of the first wire buckle and the second wire buckle act on different positions in the length direction of the solid state hard disk respectively.
[0007] Beneficial effect: The mounting base provides accommodation space for the first heat dissipation gasket, the solid state drive, the second heat dissipation gasket and the heat sink, and the first wire clip and the second wire clip are used to press these components on the mounting base into the mounting base to form an integral structure. Since the upper and lower surfaces of the solid state drive are in contact with the heat dissipation gasket, a good heat dissipation effect can be guaranteed.
[0008] Furthermore, by setting the first wire buckle and the second wire buckle to a warping structure with a low middle part and high two ends, when installing the first wire buckle and the second wire buckle, the two ends of the first wire buckle and the second wire buckle are pressed down and fixed on the mounting base, so that the lowest parts of the first wire buckle and the second wire buckle are applied to the solid state drive as the fulcrum, and because the lowest parts of the first wire buckle and the second wire buckle are staggered, they act on different positions in the length direction of the solid state drive, thereby ensuring balanced force, good contact between the heat dissipation gasket and the solid state drive, and no additional auxiliary devices are required, thereby reducing manual operation errors, and reducing operation difficulty and cost.
[0009] In an optional embodiment, the first thread tie and the second thread tie are rod-shaped structures bent toward each other.
[0010] Beneficial effect: By arranging the first wire buckle and the second wire buckle as rod-shaped structures bent toward each other, the first wire buckle and the second wire buckle can be partially cross-overlapped when installed on the heat sink, thereby facilitating adjustment of the force application position.
[0011] In an optional embodiment, the first wire buckle and the second wire buckle are rod-shaped structures bent twice toward each other, and each of the rod-shaped structures has three vertical bending sections and two transverse bending sections.
[0012] Beneficial effect: Through two bendings, the first wire buckle and the second wire buckle can be cross-set and the distance between them can change from large to small and then from small to large, keeping the positions of the first wire buckle and the second wire buckle at both ends of the mounting base basically unchanged, thereby facilitating the two ends of the first wire buckle and the second wire buckle to be respectively buckled and limited with the side edges of the mounting base.
[0013] In an optional embodiment, at least one section of the vertical bending section on the first thread buckle and the second thread buckle has a different length, so that when the first thread buckle and the second thread buckle cross, a section of the vertical bending section and a section of the horizontal bending section of the first thread buckle and the second thread buckle are cross-arranged.
[0014] Beneficial effect: By cross-arranging a vertical bending section and a transverse bending section of the first thread tie and the second thread tie, the convenience and reliability of stacking the first thread tie and the second thread tie are increased, and the unstable stacking caused by the stacking of two transverse bending sections or two vertical bending sections is avoided.
[0015] In an optional embodiment, the lengths of the two transverse bending sections on the first wire buckle are different, and the lengths of the two transverse bending sections on the second wire buckle are also different.
[0016] Beneficial effect: Through this structural setting, the distance between the two ends of the first wire clip and the second wire clip can be kept unchanged after they are cross-set on the heat sink, which is convenient for locking and limiting with the side of the mounting base.
[0017] In an optional embodiment, the lowest parts of the first thread tie and the second thread tie are respectively located on one section of the transverse bending section.
[0018] Beneficial effect: The lowest parts of the first wire buckle and the second wire buckle are both force-applying parts. By locating the lowest parts of the first wire buckle and the second wire buckle respectively on one of the transverse bending sections, the force-bearing area in the width direction of the solid-state hard disk can be increased, so that the pressing force of the first wire buckle and the second wire buckle on the solid-state hard disk after acting on the heat sink is more stable, ensuring good contact between the heat sink gasket and the solid-state hard disk.
[0019] In an optional embodiment, the first wire tie and the second wire tie are both integrally bent and formed.
[0020] Beneficial effects: simple manufacturing, convenient processing, and good structural strength.
[0021] In an optional embodiment, the mounting base includes a base body and mounting plates arranged on opposite sides of the base body, and a pair of opposite sides of the mounting plates are respectively provided with stop buckles. In the installed state, the first wire buckle and the second wire buckle are pressed against the heat sink and abut against the bottom of the stop buckle.
[0022] Beneficial effects: The various components installed in the mounting base are only pressed together without any other complicated connection relationships, and the installation is convenient. After the first heat dissipation gasket, the solid state drive, the second heat dissipation gasket and the heat sink are assembled in the mounting base, the assembly is completed by only pressing the heat sink together with the cross-arranged first wire buckle and the second wire buckle and buckling them under the stop buckle. Moreover, the first wire buckle and the second wire buckle apply force to the two ends of the solid state drive respectively, so the force is balanced and the structure is stable.
[0023] In an optional embodiment, the heat sink includes a heat sink body and heat sink ribs arranged in an array on the heat sink body, and there are gaps between adjacent heat sink ribs. The first wire buckle and the second wire buckle are pressed in the gaps between the heat sink ribs.
[0024] Beneficial effect: Adding heat dissipation ribs is beneficial to the heat dissipation of the overall structure and is also convenient for positioning the first wire buckle and the second wire buckle.
[0025] In an optional embodiment, the solid-state hard disk includes a hard disk body and a plurality of chips disposed on the hard disk body, the plurality of chips are arranged side by side along the length direction of the hard disk body, and the length of the plurality of chips after arrangement is less than or equal to the length of the hard disk body. When the length of the plurality of chips after arrangement is less than the length of the hard disk body, the lowest parts of the first wire buckle and the second wire buckle respectively act on the chip and the hard disk body where the chip is not disposed; when the length of the plurality of chips after arrangement is equal to the length of the hard disk body, the lowest parts of the first wire buckle and the second wire buckle respectively act on the chips at both ends of the hard disk body.
[0026] Beneficial effects: For different types of solid-state drives, that is, for solid-state drives with chips at both ends, the fulcrums of the first and second wire buckles are on the chip, which can ensure that the heat sink gasket and the chip on the solid-state drive are in good contact. For solid-state drives with a chip on one end and no chip on the other end, one of the fulcrums of the first and second wire buckles has no chip support underneath, and the other fulcrum has a chip support underneath. One of the wire buckles plays a major role, and the heat sink gasket will not tilt, which also ensures that the heat sink gasket and the chip on the solid-state drive are in good contact. This makes it compatible with solid-state drives from different manufacturers and easy to operate in the factory. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0028] Figure 1 A schematic diagram of a solid state hard disk having a solid state hard disk heat sink structure in the prior art;
[0029] Figure 2 A schematic diagram of another solid state drive of a solid state drive heat sink structure in the prior art;
[0030] Figure 3 It is an exploded schematic diagram of a solid state hard disk heat sink structure in the prior art;
[0031] Figure 4 It is an exploded schematic diagram of a solid state hard disk heat sink structure according to an embodiment of the utility model;
[0032] Figure 5 It is an exploded schematic diagram of another solid state hard disk heat sink structure according to an embodiment of the utility model;
[0033] Figure 6 It is a schematic diagram of the assembly of a solid state hard disk heat sink structure according to an embodiment of the utility model;
[0034] Figure 7 The present invention is a schematic structural diagram of a center line buckle in a solid state hard disk heat sink structure according to an embodiment of the present invention.
[0035] Description of reference numerals:
[0036] In the prior art: 3', solid state drive; 31', chip; 4', heat sink; 6', wire buckle.
[0037] In the utility model: 1. mounting base; 2. first heat dissipation gasket; 3. solid state hard disk; 31. chip; 4. second heat dissipation gasket; 5. heat sink; 6. first wire buckle; 7. second wire buckle; 8. lowest part. DETAILED DESCRIPTION
[0038] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.
[0039] In related technologies, such as Figures 1 to 3 As shown, due to the structure of the wire buckle 6', the force point of the wire buckle 6' can only be in the middle of the solid state drive 3'. Since there are two types of solid state drives 3', one is that the chip 31' on the solid state drive 3' is not fully covered, so a heat dissipation pad 4' is needed to fill the empty part of the solid state drive 3' to prevent the radiator from tilting and ensure good contact between the radiator and the chip 31'; the other type of solid state drive 3' has a chip 31' on the entire solid state drive 3', so there is no need to match a heat dissipation pad. Such a design is prone to manual operation errors during factory assembly, increasing operational difficulty and cost.
[0040] Combine the following Figures 4 to 7 , describing an embodiment of the utility model.
[0041] According to an embodiment of the utility model, a heat sink structure of a solid state hard disk 3 is provided, which specifically includes:
[0042] The mounting base 1 has an open mounting cavity, on which a first heat dissipation pad 2, a solid state drive 3 (SSD), a second heat dissipation pad 4 and a heat sink 5 are sequentially mounted from bottom to top;
[0043] The first wire buckle 6 and the second wire buckle 7 are separately arranged, wherein the first wire buckle 6 and the second wire buckle 7 are both warped structures with a low middle part and high two ends, and the lowest parts 8 of the first wire buckle 6 and the second wire buckle 7 are staggered. In the installed state, the first wire buckle 6 and the second wire buckle 7 are pressed tightly on the heat sink 5 and abut against the mounting base 1, and the lowest parts 8 of the first wire buckle 6 and the second wire buckle 7 act on different positions in the length direction of the solid state drive 3 respectively.
[0044] The "upper" and "lower" mentioned in this embodiment are Figure 4 This is for the installation orientation shown.
[0045] In this way, the mounting base 1 provides accommodation space for the first heat dissipation gasket 2, the solid state drive 3, the second heat dissipation gasket 4 and the heat sink 5, and the first wire clip 6 and the second wire clip 7 are used to press these components on the mounting base 1 into the mounting base 1, thereby forming an integral structure. Other auxiliary connection structures are required, and the structure is simple. Since the upper and lower surfaces of the solid state drive 3 are in contact with the heat dissipation gasket, a good heat dissipation effect can be guaranteed.
[0046] Furthermore, by setting the first cable tie 6 and the second cable tie 7 to be a warped structure with a low middle portion and high ends, when installing the first cable tie 6 and the second cable tie 7, both ends of the first cable tie 6 and the second cable tie 7 are pressed down and fixed on the mounting base 1, so that the lowest portion 8 of the first cable tie 6 and the second cable tie 7 is applied to the solid state drive 3 as a fulcrum, as shown in FIG. Figure 6 As shown, since the lowest parts 8 of the first wire buckle 6 and the second wire buckle 7 are staggered, they act on different positions in the length direction of the solid state drive 3, so that the force can be balanced, the heat dissipation gasket and the solid state drive 3 are in good contact, and no additional auxiliary components are required, which reduces manual operation errors, operation difficulty and cost. The problem that the existing wire buckle can only exert force on the middle part of the solid state drive 3 and cause uneven force is solved.
[0047] In a specific embodiment, the first thread tie 6 and the second thread tie 7 are rod-shaped structures bent toward each other.
[0048] In this embodiment, by configuring the first wire tie 6 and the second wire tie 7 to be rod-shaped structures bent toward each other, the first wire tie 6 and the second wire tie 7 can be partially cross-overlapped when installed on the heat sink 5, thereby facilitating adjustment of the force application location.
[0049] In a specific embodiment, the first thread tie 6 and the second thread tie 7 are rod-shaped structures bent twice toward each other, and each rod-shaped structure has three vertical bending sections and two transverse bending sections.
[0050] In this embodiment, Figure 7As shown, by bending twice, the first wire tie 6 and the second wire tie 7 can be cross-set and the distance between them can be changed from large to small and then from small to large, so that the positions of the first wire tie 6 and the second wire tie 7 at both ends of the mounting base 1 remain basically unchanged, thereby facilitating the two ends of the first wire tie 6 and the second wire tie 7 to be respectively buckled and limited with the side edges of the mounting base 1.
[0051] In a specific embodiment, at least one vertical bending section on the first thread tie 6 and the second thread tie 7 has a different length, so that when the first thread tie 6 and the second thread tie 7 cross, a vertical bending section and a horizontal bending section of the first thread tie 6 and the second thread tie 7 are cross-arranged.
[0052] In this embodiment, by cross-setting a vertical bending section and a transverse bending section of the first thread tie 6 and the second thread tie 7, the convenience and reliability of stacking the first thread tie 6 and the second thread tie 7 are increased, and the unstable stacking caused by the overlapping of two transverse bending sections or two vertical bending sections is avoided.
[0053] In a specific embodiment, the lengths of the two transverse bending sections on the first thread tie 6 are different, and the lengths of the two transverse bending sections on the second thread tie 7 are also different.
[0054] Through this structural setting, the present embodiment can ensure that the distance between the two ends of the first wire tie 6 and the second wire tie 7 remains unchanged after they are cross-arranged on the heat sink 5, so as to facilitate locking and limiting with the side of the mounting base 1.
[0055] Specifically, two stop buckles are provided on each of the two opposite sides of the mounting base 1, and the four stop buckles on both sides are arranged opposite to each other in pairs. The first wire buckle 6 is fixed on a pair of stop buckles at the diagonal corners, and the second wire buckle 7 is fixed on a pair of stop buckles at the other diagonal corners.
[0056] In a specific embodiment, the lowest parts 8 of the first and second thread buckles 6 and 7 are respectively located on one of the transverse bending sections. Since the lowest parts 8 of the first and second thread buckles 6 and 7 are both force-applying parts, by locating the lowest parts 8 of the first and second thread buckles 6 and 7 on one of the transverse bending sections, the force-bearing area in the width direction of the solid-state drive 3 can be increased, so that the pressing force of the first and second thread buckles 6 and 7 on the solid-state drive 3 after acting on the heat sink 5 is more stable, ensuring good contact between the heat sink and the solid-state drive 3.
[0057] Furthermore, the lowest parts 8 of the first cable tie 6 and the second cable tie 7 can be symmetrically arranged with respect to the axis in the width direction of the solid state drive 3 after installation, and can certainly be asymmetrically arranged.
[0058] In a specific embodiment, the first thread tie 6 and the second thread tie 7 are both bent and formed as one piece, which is simple to manufacture, convenient to process, and has good structural strength.
[0059] In a specific embodiment, the mounting base 1 includes a base body and mounting plates arranged on opposite sides of the base body, and stop buckles are respectively provided on opposite sides of a pair of mounting plates. In the installed state, the first wire buckle 6 and the second wire buckle 7 are pressed against the heat sink 5 and abut against the bottom of the stop buckle.
[0060] In the present embodiment, the various components installed in the mounting base 1 are only pressed together without any other complicated connection relationships, and the installation is convenient. After the first heat dissipation gasket 2, the solid state drive 3, the second heat dissipation gasket 4 and the heat sink 5 are assembled in the mounting base 1, the assembly is completed by only pressing the heat sink 5 with the cross-arranged first wire buckle 6 and the second wire buckle 7 and buckling them under the stop buckle. In addition, the first wire buckle 6 and the second wire buckle 7 apply force to the two ends of the solid state drive 3 respectively, so the force is balanced and the structure is stable.
[0061] In a specific embodiment, the heat sink 5 includes a heat sink body and heat sink ribs arranged in an array on the heat sink body, and there are gaps between adjacent heat sink ribs, and the first wire buckle 6 and the second wire buckle 7 are pressed in the gaps between the heat sink ribs. Adding heat sink ribs is beneficial to the heat dissipation of the overall structure, and it is also convenient to position the first wire buckle 6 and the second wire buckle 7.
[0062] In a specific embodiment, the solid-state hard disk 3 includes a hard disk body and a plurality of chips 31 disposed on the hard disk body, wherein the plurality of chips 31 are arranged side by side along the length direction of the hard disk body, and the length of the plurality of chips 31 after arrangement is less than or equal to the length of the hard disk body. When the length of the plurality of chips 31 after arrangement is less than the length of the hard disk body, the lowest portions 8 of the first wire buckle 6 and the second wire buckle 7 act on the chip 31 and the hard disk body where the chip 31 is not disposed, respectively; when the length of the plurality of chips 31 after arrangement is equal to the length of the hard disk body, the lowest portions 8 of the first wire buckle 6 and the second wire buckle 7 act on the chips 31 at both ends of the hard disk body, respectively.
[0063] This embodiment is directed to different types of solid state drives 3, such as Figure 4 As shown, for a solid state drive 3 having chips 31 at both ends, the first wire buckle 6 and the second wire buckle 7 both have their fulcrums on the chip 31, which can ensure that the heat sink and the chip 31 on the solid state drive 3 are in good contact. Figure 5 As shown, for the solid-state drive 3 with a chip 31 at one end and no chip 31 at the other end, there is no chip 31 supporting the bottom of one of the fulcrums of the first wire buckle 6 and the second wire buckle 7, and there is a chip 31 supporting the bottom of the other fulcrum. One of the wire buckles plays a major role, and the heat sink gasket will not tilt, which also ensures good contact between the heat sink gasket and the chip 31 on the solid-state drive 3. In this way, it can be compatible with solid-state drives 3 from different manufacturers, and the factory is easy to operate.
[0064] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.
Claims
1. A solid state hard disk heat sink structure, characterized in that: include: A mounting base (1) is provided with a first heat dissipation pad (2), a solid state hard disk (3), a second heat dissipation pad (4) and a heat sink (5) in sequence from bottom to top; A first cable tie (6) and a second cable tie (7), wherein the first cable tie (6) and the second cable tie (7) are separately arranged, wherein the first cable tie (6) and the second cable tie (7) are both warped structures with a lower middle portion and higher ends, and the lowest portions (8) of the first cable tie (6) and the second cable tie (7) are staggered. In the installed state, the first cable tie (6) and the second cable tie (7) are pressed tightly against the heat sink (5) and abut against the installation base (1), and the lowest portions (8) of the first cable tie (6) and the second cable tie (7) act on different positions in the length direction of the solid state hard disk (3) respectively.
2. The solid state hard disk heat sink structure according to claim 1, characterized in that: The first thread tie (6) and the second thread tie (7) are respectively rod-shaped structures bent towards each other.
3. The solid state hard disk heat sink structure according to claim 2, characterized in that: The first thread tie (6) and the second thread tie (7) are respectively rod-shaped structures bent twice towards each other, and each of the rod-shaped structures has three vertical bending sections and two transverse bending sections.
4. The solid state hard disk heat sink structure according to claim 3, characterized in that: At least one of the vertical bending sections on the first thread tie (6) and the second thread tie (7) has a different length, so that when the first thread tie (6) and the second thread tie (7) cross, a section of the vertical bending section and a section of the horizontal bending section of the first thread tie (6) and the second thread tie (7) are arranged crosswise.
5. The solid state hard disk heat sink structure according to claim 3, characterized in that: The two transverse bending sections on the first thread buckle (6) have different lengths, and the two transverse bending sections on the second thread buckle (7) also have different lengths.
6. The solid state hard disk heat sink structure according to claim 3, characterized in that: The lowest parts (8) of the first thread fastener (6) and the second thread fastener (7) are respectively located on one of the transverse bending sections.
7. The solid state hard disk heat sink structure according to any one of claims 1 to 6, characterized in that: The first thread tie (6) and the second thread tie (7) are both integrally bent and formed.
8. The solid state hard disk heat sink structure according to any one of claims 1 to 6, characterized in that: The mounting base (1) comprises a base body and mounting plates arranged on opposite sides of the base body, and a pair of opposite sides of the mounting plates are respectively provided with stop buckles. In the mounted state, the first wire buckle (6) and the second wire buckle (7) are pressed tightly against the heat sink (5) and abut against the bottom of the stop buckle.
9. The solid state hard disk heat sink structure according to any one of claims 1 to 6, characterized in that: The heat sink (5) comprises a heat sink body and heat sink ribs arranged in an array on the heat sink body, there are gaps between adjacent heat sink ribs, and the first wire buckle (6) and the second wire buckle (7) are pressed tightly in the gaps between the heat sink ribs.
10. The solid state hard disk heat sink structure according to any one of claims 1 to 6, characterized in that: The solid state hard disk (3) comprises a hard disk body and a plurality of chips (31) arranged on the hard disk body, wherein the plurality of chips (31) are arranged side by side along the length direction of the hard disk body, and the length of the plurality of chips (31) after being arranged is less than or equal to the length of the hard disk body. When the length of the plurality of chips (31) after being arranged is less than the length of the hard disk body, the lowest parts (8) of the first wire buckle (6) and the second wire buckle (7) respectively act on the chip (31) and the hard disk body without the chip (31); when the length of the plurality of chips (31) after being arranged is equal to the length of the hard disk body, the lowest parts (8) of the first wire buckle (6) and the second wire buckle (7) respectively act on the chips (31) at both ends of the hard disk body.