Warp-direction surface mounting film capacitor

Abstract

The utility model discloses a warp-wise surface-mounted film capacitor, which comprises a film capacitor body, the film capacitor body is mounted along the warp-wise surface of a circuit substrate, the film capacitor body comprises a core, the outer wall of the core is provided with a gold plating layer, the outer side of the core is covered with a plastic shell, and the plastic shell is provided with a metal layer. The utility model discloses a thin film capacitor, which comprises a circuit substrate, a core and a plastic shell, epoxy resin is arranged between the core and the plastic shell, the two sides of the core are connected with leads, each lead is composed of a vertical connecting section and a horizontal welding section, and the horizontal welding sections extend out of the plastic shell and are attached to the surface of the circuit substrate. The automatic AI operation is adopted for surface mounting of the film capacitor and the circuit substrate, surface mounting is automatically completed through a mechanical arm, and compared with a traditional mode that the capacitor and the circuit substrate adopt a direct insertion type structure and need manual plug-in installation, input of human resources is reduced, labor force is greatly saved, production efficiency is effectively improved, and assembly quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of film capacitor production, in particular to a warp surface mounted film capacitor. Background Art

[0002] Two conductors close to each other with a layer of non-conductive insulating medium in between constitute a capacitor; film capacitors are a type of capacitor that uses plastic film as a dielectric. They are used in many household appliances and have a wide range of applications.

[0003] When installing, film capacitors need to be fixed to the circuit substrate by soldering. The two leads of traditional film capacitors are vertically led out, and through holes need to be opened in advance on the circuit substrate. When the film capacitors and the circuit substrate are installed, the two leads of the film capacitors are passed through the corresponding through holes and then soldered. This direct plug-in installation method requires manual plug-in installation, resulting in high manpower investment. Manual plug-in relies on the workers' experience accumulation, and the quality is uneven. In addition, it is impossible to realize the automated installation of film capacitors, resulting in low production efficiency, difficulty in ensuring quality, and increased production costs. Utility Model Content

[0004] 1. Technical problems to be solved by the utility model

[0005] In view of the shortcomings of the prior art, the purpose of the present utility model is to provide a longitudinal surface mounted film capacitor, which aims to solve the problems of the prior art adopting a direct plug-in installation method, which requires manual plug-in installation, resulting in low production efficiency, difficult quality assurance, and increased production costs.

[0006] 2. Technical solution

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] A warp-surface mounted film capacitor, comprising a film capacitor body, the film capacitor body being mounted along the warp-surface of a circuit substrate, the film capacitor body comprising a core, a gold-plated layer being arranged on the outer wall of the core, a plastic shell being arranged on the outer side of the core, epoxy resin being arranged between the core and the plastic shell, and leads being connected to both sides of the core;

[0009] The lead wire is composed of a vertical connection section and a horizontal welding section, wherein the vertical connection section is fixedly connected to the core, the horizontal welding section extends out of the plastic shell and fits the surface of the circuit substrate, and the horizontal welding section is fixed to the circuit substrate by soldering;

[0010] It also includes a limiting structure, which is arranged on the outside of the plastic shell and is used to limit and fix the horizontal welding section.

[0011] When installing the film capacitor of the present technical solution, the film capacitor is positioned on the circuit substrate, and the horizontal welding section of the lead can be attached to the circuit substrate. The horizontal welding section is then fixed to the circuit substrate through a soldering process to complete the mounting of the film capacitor and the circuit substrate. A limiting structure is provided to limit and fix the horizontal welding section of the lead, thereby effectively avoiding bending of the horizontal welding section and improving the mounting effect of the horizontal welding section and the circuit substrate. The film capacitor and the circuit substrate are mounted using automatic AI operations, and the mounting is automatically completed using a robot without the need for manual installation, which reduces the investment in human resources, greatly saves labor, effectively improves production efficiency, and improves assembly quality.

[0012] Optionally, both sides of the bottom of the plastic shell are provided with limiting holes for the horizontal welding section to pass through. The position of the horizontal welding section is limited by the provided limiting holes, so as to avoid the position deviation of the horizontal welding section and improve the accuracy of the soldering position of the film capacitor.

[0013] Optionally, the limiting structure includes a limiting plate disposed on the top of the horizontal welding section, the top of the limiting plate is fixedly connected to the outer wall of the plastic shell by a connecting rib plate, and the bottom of the limiting plate is in contact with the horizontal welding section. The limiting plate is connected and fixed to the plastic shell by providing a connecting rib plate, and the setting of the limiting plate can prevent the horizontal welding section from bending upward, thereby increasing the contact area between the horizontal welding section and the circuit substrate.

[0014] Optionally, the size of the limiting plate is smaller than the size of the horizontal welding section. Through this structural design, the limiting plate is prevented from protruding from the horizontal welding section, thereby preventing the soldering of the horizontal welding section from being hindered.

[0015] Optionally, the film capacitor body is a π-shaped structure. With this structural design, the film capacitor body and the circuit substrate are mounted in a mounting manner, which does not require manual plug-in installation compared to the traditional capacitor and circuit substrate adopting a direct plug-in structure.

[0016] Optionally, positioning grooves are provided on both sides of the top of the outer wall of the plastic shell, and the positioning grooves are adapted to the clamping ends of the manipulator. Through the provided positioning grooves, the manipulator for automatic AI operation can be clamped in the positioning grooves, ensuring the accuracy of grabbing and installing the film capacitors, and ensuring the consistency of installing the film capacitors.

[0017] Optionally, a retaining ring is provided in an annular shape on the inner wall of the bottom end of the plastic shell, and the retaining ring is used to block the epoxy resin, and an isolation gap exists between the bottom of the epoxy resin and the lower surface of the plastic shell. The isolation gap is formed so that the epoxy resin and the circuit substrate are not in contact, so as to avoid the heat transfer of the circuit substrate to damage the film capacitor, thereby improving the service life of the film capacitor.

[0018] 3. Beneficial effects

[0019] Compared with the prior art, the beneficial effects of the utility model are:

[0020] (1) The utility model provides a thin film capacitor body with a π-shaped structure, wherein the lead wire consists of a vertical connection section and a horizontal welding section. The horizontal welding section of the lead wire is attached to the surface of the circuit substrate, and then the horizontal welding section is fixed to the circuit substrate through a soldering process to complete the mounting of the thin film capacitor and the circuit substrate. The mounting method of the thin film capacitor and the circuit substrate adopts an automatic AI operation, and the mounting is automatically completed by a robot. Compared with the traditional capacitor and circuit substrate adopting a direct plug-in structure and requiring manual plug-in installation, the investment of human resources is reduced, labor is greatly saved, production efficiency is effectively improved, and assembly quality is improved.

[0021] (2) The utility model sets a limiting structure, which includes a limiting plate and a connecting rib plate. The limiting plate abuts against the horizontal welding section of the lead wire to prevent the horizontal welding section from bending upward. In addition, the size of the limiting plate is smaller than the size of the horizontal welding section. When the limiting plate blocks the horizontal welding section, it prevents the limiting plate from protruding from the horizontal welding section and hindering the soldering of the horizontal welding section, thereby increasing the contact area between the horizontal welding section and the circuit substrate and improving the stability of the soldering. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall three-dimensional structure of a warp surface mounted film capacitor;

[0023] Figure 2 A cross-sectional view of a warp-type surface mounted film capacitor;

[0024] Figure 3 It is a schematic diagram of the three-dimensional structure of the limiting hole and the limiting structure;

[0025] Figure 4 This is a schematic diagram of the installation status of a warp-type surface-mounted film capacitor on a circuit substrate.

[0026] In the figure: 1. film capacitor body; 11. core; 12. gold-plated layer; 13. epoxy resin; 14. plastic shell; 141. retaining ring; 142. positioning groove; 143. limiting hole; 15. lead; 151. vertical connecting section; 152. horizontal welding section; 16. limiting structure; 161. limiting plate; 162. connecting rib plate. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0028] Example:

[0029] See also Figure 1-Figure 4 The present embodiment provides a warp-surface mounted film capacitor, comprising a film capacitor body 1, the film capacitor body 1 being mounted along the warp-surface of a circuit substrate, the film capacitor body 1 comprising a core 11, a gold-plated layer 12 being arranged on the outer wall of the core 11, a plastic shell 14 being connected to the outer side of the core 11, an epoxy resin 13 being arranged between the core 11 and the plastic shell 14, and leads 15 being connected to both sides of the core 11;

[0030] Among them, the lead 15 is composed of a vertical connecting section 151 and a horizontal welding section 152, the vertical connecting section 151 and the horizontal welding section 152 are bent at 90 degrees, the vertical connecting section 151 is fixedly connected to the core 11, the horizontal welding section 152 extends out of the plastic shell 14 and fits the surface of the circuit substrate, and the horizontal welding section 152 is fixed to the circuit substrate by soldering. The lead 15 designed with this structure makes the film capacitor body 1 a π-type structure. When the film capacitor and the circuit substrate are installed, it is only necessary to position the film capacitor on the circuit substrate, and the horizontal welding section 152 of the lead 15 can be fit on the circuit substrate, and then the horizontal welding section 152 is fixed to the circuit substrate through the soldering process to complete the mounting of the film capacitor and the circuit substrate. The mounting method of the film capacitor and the circuit substrate adopts automatic AI operation, and the mounting is automatically completed by a robot. Compared with the traditional capacitor and the circuit substrate adopting a direct plug-in structure, which requires manual plug-in installation, it reduces the investment of human resources, greatly saves labor, effectively improves production efficiency, and improves assembly quality.

[0031] In this embodiment, if Figure 1 As shown, it also includes a limiting structure 16, which is arranged on the outside of the plastic shell 14 and is used to limit and fix the horizontal welding section 152. The limiting structure 16 is used to limit and fix the horizontal welding section 152 of the lead 15, thereby effectively avoiding bending of the horizontal welding section 152 and avoiding affecting the mounting effect of the horizontal welding section 152 and the circuit substrate.

[0032] As an implementation method of this embodiment, Figure 3As shown, the limiting structure 16 includes a limiting plate 161 arranged at the top of the horizontal welding section 152. The top of the limiting plate 161 is fixedly connected to the outer wall of the plastic shell 14 by a connecting rib plate 162. The bottom of the limiting plate 161 fits the horizontal welding section 152. The limiting plate 161 is connected and fixed to the plastic shell 14 by the connecting rib plate 162. The connecting rib plate 162 and the limiting plate 161 are integrally formed with the plastic shell 14. The limiting plate 161 is pressed against the horizontal welding section 152 of the lead 15 to prevent The horizontal welding section 152 is prevented from bending upward, and the size of the limiting plate 161 is smaller than that of the horizontal welding section 152. The length and width of the limiting plate 161 are smaller than those of the horizontal welding section 152. Through this structural design, when the limiting plate 161 limits and blocks the horizontal welding section 152, it is prevented from protruding from the horizontal welding section 152 and hindering the soldering of the horizontal welding section 152, thereby increasing the contact area between the horizontal welding section 152 and the circuit substrate and improving the stability of the soldering.

[0033] As an implementation method of this embodiment, Figure 3 As shown, both sides of the bottom of the plastic shell 14 are provided with limiting holes 143, and the limiting holes 143 are used for the horizontal welding section 152 to pass through. The limiting holes 143 are not only used for the horizontal welding section 152 to pass through for soldering, but also can limit the position of the horizontal welding section 152 to avoid the position of the horizontal welding section 152 from being offset, which affects the accuracy of the soldering position of the film capacitor.

[0034] As an implementation method of this embodiment, Figure 1 As shown, positioning grooves 142 are provided on both sides of the top of the outer wall of the plastic shell 14, and the positioning grooves 142 are adapted to the clamping ends of the manipulator. Through the provided positioning grooves 142, the manipulator for automatic AI operation can be clamped in the positioning grooves 142, thereby ensuring the accuracy of grasping and installing the film capacitors and ensuring the consistency of the installation of the film capacitors.

[0035] As an implementation method of this embodiment, Figure 2 As shown, a retaining ring 141 is annularly arranged on the inner wall of the bottom end of the plastic shell 14, and the retaining ring 141 is used to block the epoxy resin 13. There is an isolation gap between the bottom of the epoxy resin 13 and the lower surface of the plastic shell 14. The isolation gap formed ensures that when the film capacitor is installed on the circuit substrate, the epoxy resin 13 and the circuit substrate are not in contact, thereby avoiding damage to the film capacitor caused by heat transfer from the circuit substrate and improving the service life of the film capacitor.

[0036] Working principle: When in use, the film capacitor body 1 is grabbed by the robot through the automatic AI operation, and the clamping end of the robot is clamped into the positioning groove 142 of the plastic shell 14, and the film capacitor body 1 is positioned and mounted on the circuit substrate. The positioning groove 142 ensures the accuracy of grabbing and installing the film capacitor, and ensures the consistency of the installation of the film capacitor. When the film capacitor body 1 is mounted on the circuit substrate, the horizontal welding section 152 of the lead 15 is attached to the circuit substrate, and then the horizontal welding section 1 is fixed by the automatic AI operation with soldering equipment. 52 is used for soldering, and the film capacitor body 1 is installed along the longitudinal surface of the circuit substrate. During the soldering process of the film capacitor body 1, the horizontal welding section 152 of the lead 15 is supported by the limiting plate 161, which can prevent the horizontal welding section 152 from bending upward, thereby increasing the contact area between the horizontal welding section 152 and the circuit substrate. By making the size of the limiting plate 161 smaller than the size of the horizontal welding section 152, the limiting plate 161 is prevented from protruding from the horizontal welding section 152, thereby avoiding obstruction to the soldering of the horizontal welding section 152 and improving the stability of the solder.

[0037] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the protection scope of the present invention.

Claims

1. A warp-surface mounted film capacitor, comprising a film capacitor body (1), wherein the film capacitor body (1) is mounted along the warp-surface of a circuit substrate, characterized in that: The film capacitor body (1) comprises a core (11), a gold-plated layer (12) is provided on the outer wall of the core (11), a plastic shell (14) is connected to the outer side of the core (11), epoxy resin (13) is provided between the core (11) and the plastic shell (14), and leads (15) are connected to both sides of the core (11); The lead wire (15) is composed of a vertical connection section (151) and a horizontal welding section (152); the vertical connection section (151) is fixedly connected to the core (11); the horizontal welding section (152) extends out of the plastic shell (14) and fits the surface of the circuit substrate; the horizontal welding section (152) is fixed to the circuit substrate by soldering; It also includes a limiting structure (16), which is arranged on the outside of the plastic shell (14) and is used to limit and fix the horizontal welding section (152).

2. A longitudinal surface mounted film capacitor according to claim 1, characterized in that: Limiting holes (143) are provided on both sides of the bottom of the plastic shell (14), and the limiting holes (143) are used for the horizontal welding section (152) to pass through.

3. A longitudinal surface mounted film capacitor according to claim 1, characterized in that: The limiting structure (16) comprises a limiting plate (161) arranged at the top of the horizontal welding section (152); the top of the limiting plate (161) is fixedly connected to the outer wall of the plastic shell (14) via a connecting rib plate (162); and the bottom of the limiting plate (161) is in contact with the horizontal welding section (152).

4. A longitudinal surface mounted film capacitor according to claim 3, characterized in that: The size of the limiting plate (161) is smaller than the size of the horizontal welding section (152).

5. The warp surface mounted film capacitor according to claim 1, characterized in that: The film capacitor body (1) is a π-type structure.

6. A longitudinal surface mounted film capacitor according to claim 1, characterized in that: Positioning grooves (142) are provided on both sides of the top end of the outer wall of the plastic shell (14), and the positioning grooves (142) are adapted to the clamping ends of the robot.

7. The warp surface mounted film capacitor according to claim 1, characterized in that: A retaining ring (141) is provided in an annular shape on the inner wall of the bottom end of the plastic shell (14), and the retaining ring (141) is used to block the epoxy resin (13). An isolation gap exists between the bottom of the epoxy resin (13) and the lower surface of the plastic shell (14).

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