Test system

Abstract

The utility model provides a test system. The test system comprises a main chuck, a test probe, a cleaning chuck and a first temperature control device. The main chuck is used for carrying an object to be tested. The test probe is used for testing an object to be tested at a first temperature. The first temperature control device is used for adjusting the temperature of the cleaning chuck to a second temperature. The cleaning chuck is used for cleaning the test probe at a second temperature. A temperature difference exists between the second temperature and the first temperature.

Description

Technical Field

[0001] The present disclosure relates to a testing system, and in particular to a testing system with a cleaning function. Background Art

[0002] During the semiconductor manufacturing process, wafers need to be tested with probe cards to ensure the reliability of wafer and chip processes and filter out defective wafers and chips. During the test process, different test temperatures are often required to confirm the stability of the wafer at different temperatures. When the test is completed, in order to avoid affecting the accuracy of subsequent tests, the test probes usually need to be cleaned to facilitate subsequent tests. Among them, the temperature difference between the cleaning process and the test process will significantly affect the efficiency of the overall process.

[0003] For example, before performing a cleaning procedure, since there is usually a considerable difference between the temperature of the cleaning device and the temperature of the test probe, it is necessary to wait for a period of temperature stabilization time to allow the temperature of the test probe to be close to the temperature of the cleaning device before the cleaning device can be controlled to clean the test probe to avoid damage or abnormality of the test probe due to drastic temperature changes. Then, before performing a subsequent test procedure, since the test environment of the subsequent test stage needs to be raised (usually to a temperature higher than that of the cleaning device), it is necessary to wait for the test probe to heat up to the temperature to be tested before the test probe can be controlled to test the object to be tested. However, the time spent waiting for the temperature to rise or fall for cleaning or testing is usually long, which will significantly affect the test process. Therefore, how to improve the efficiency of the testing and cleaning processes is an urgent problem to be solved in this field.

[0004] The above “prior art” description is only to provide background technology, and does not admit that the above “prior art” description reveals the subject matter of the present disclosure, does not constitute the prior art of the present disclosure, and any description of the above “prior art” should not be regarded as any part of this case. Utility Model Content

[0005] In view of this, in order to solve the problem of low testing efficiency in the prior art, the present disclosure aims to provide a testing system.

[0006] One embodiment of the present disclosure provides a test system. The test system includes a main chuck, a test probe, a cleaning chuck, and a first temperature control device. The main chuck is used to carry a test object. The test probe is used to test the test object at a first temperature. The first temperature control device is used to adjust the temperature of the cleaning chuck to a second temperature. The cleaning chuck is used to clean the test probe at the second temperature. There is a temperature difference between the second temperature and the first temperature.

[0007] In some embodiments, the test probe comprises a plurality of probes.

[0008] In some embodiments, a plurality of probes contact a plurality of joints of the object to be tested at a first temperature to test the object to be tested.

[0009] In some embodiments, the cleaning chuck includes a cleaning layer for contacting and cleaning the plurality of probes at the second temperature.

[0010] In some embodiments, the temperature difference is greater than or equal to zero.

[0011] In some embodiments, the testing system further comprises a first moving device for controlling the position of the main chuck.

[0012] In some embodiments, the testing system further comprises a second moving device for controlling the position of the cleaning chuck.

[0013] In some embodiments, the testing system further comprises a second temperature control device for adjusting the temperature of the main chuck to the first temperature.

[0014] In some embodiments, the testing system further includes a housing for accommodating the main chuck and the cleaning chuck.

[0015] Accordingly, since the test system disclosed in the present invention can control the temperature of the cleaning chuck to rise to a second temperature while the test probe is testing the object to be tested at a first temperature, when the second temperature is controlled to be close to the first temperature, the cleaning chuck can be used to clean the test probe directly after the test is completed without waiting for the temperature of the test probe to drop, thereby effectively improving the fluency of the test process.

[0016] The above has outlined the technical features and advantages of the present disclosure in a fairly broad manner, so that the detailed description of the present disclosure below can be better understood. Other technical features and advantages that constitute the subject matter of the claims of the present disclosure will be described below. It should be understood by those with ordinary knowledge in the technical field to which the present disclosure belongs that the concepts and specific embodiments disclosed below can be used to modify or design other structures or processes to achieve the same purpose as the present disclosure. It should also be understood by those with ordinary knowledge in the technical field to which the present disclosure belongs that such equivalent constructions cannot depart from the spirit and scope of the present disclosure as defined by the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] A more complete understanding of the disclosure of the present application may be obtained by referring to the embodiments and claims in conjunction with the drawings, in which the same reference numerals refer to the same elements.

[0018] Figure 1A is a schematic diagram of a test system according to some embodiments of the present disclosure.

[0019] Figure 1B is a schematic diagram of a test system according to some embodiments of the present disclosure.

[0020] Figure 2A is a schematic diagram of a test system according to some embodiments of the present disclosure.

[0021] Figure 2B is a schematic diagram of a test system according to some embodiments of the present disclosure.

[0022] The reference numerals are described as follows:

[0023] 1: Test system

[0024] 11: Main chuck

[0025] 11S: Surface

[0026] 12: Test probe

[0027] 13: Clean the chuck

[0028] 14: The first temperature control device

[0029] 2: Test system

[0030] 21: Main chuck

[0031] 21S: Surface

[0032] 22: Test probe

[0033] 221: Probe

[0034] 23: Clean the chuck

[0035] 231: Cleaning layer

[0036] 24: First temperature control device

[0037] 25: Second temperature control device

[0038] 26: First mobile device

[0039] 27: Second mobile device

[0040] 29: Shell

[0041] 8: Object to be tested

[0042] 81: Contact

[0043] 9: Object to be tested

[0044] TP11: First Temperature

[0045] TP12: Second temperature

[0046] TP21: First Temperature

[0047] TP22: Second temperature DETAILED DESCRIPTION

[0048] The following description of the present disclosure is accompanied by the drawings which are incorporated into and constitute a part of the specification, and illustrates an embodiment of the present disclosure, but the present disclosure is not limited to the embodiment. In addition, the following embodiments can be properly integrated to complete another embodiment.

[0049] "One embodiment", "embodiment", "illustrative embodiment", "other embodiments", "another embodiment", etc. mean that the embodiments described in the present disclosure may include specific features, structures or characteristics, but not every embodiment must include the specific features, structures or characteristics. Furthermore, repeated use of the phrase "in an embodiment" does not necessarily refer to the same embodiment, but may refer to the same embodiment. In addition, the socket assembly mentioned in this specification is mainly a socket assembly for wafer testing in semiconductor testing.

[0050] In order to make the present disclosure fully understood, the following description provides detailed steps and structures. Obviously, the implementation of the present disclosure will not be limited to the specific details known to those skilled in the art. In addition, the known structures and steps are no longer described in detail to avoid unnecessarily limiting the present disclosure. The preferred embodiments of the present disclosure are described in detail below. However, in addition to the detailed description, the present disclosure can also be widely implemented in other embodiments. The scope of the present disclosure is not limited to the content of the detailed description, but is defined by the claims.

[0051] It should be understood that the following disclosure provides many different embodiments or examples for implementing the different features of the present disclosure. The following describes specific embodiments or examples of components and arrangements to simplify the present disclosure. Of course, these are only examples and are not intended to be limiting. For example, the size of the element is not limited to the disclosed range or value, but may depend on the process conditions and / or the desired properties of the device. In addition, the following description of forming a first feature "on" or "on" a second feature may include an embodiment in which the first feature and the second feature are formed to be in direct contact, and may also include an embodiment in which an additional feature may be formed between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. For the sake of simplicity and clarity, various features may be drawn arbitrarily at different scales. In the accompanying drawings, some layers / features may be omitted for simplicity.

[0052] Furthermore, for ease of description, spatially relative terms such as "beneath," "below," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or feature shown in the figures to another (other) element or feature. The spatially relative terms are intended to encompass different orientations of the elements in use or operation in addition to the orientation depicted in the figures. The device may have other orientations (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.

[0053] The embodiments of the present disclosure are related to a test system with a cleaning function, including a main chuck, a test probe, a cleaning chuck and a first temperature control device. The main chuck is used to carry the object to be tested. The test probe is used to test the object to be tested at a first temperature. The first temperature control device is used to adjust the temperature of the cleaning chuck to a second temperature. The cleaning chuck is used to clean the test probe at the second temperature. There is a temperature difference between the second temperature and the first temperature. When the temperature difference is controlled to be close to zero, the cleaning chuck can be used to clean the test probe directly after the test process is completed, so as to significantly reduce the time waiting for the test probe temperature to drop before cleaning; in addition, when the temperature difference is controlled to be close to zero, the time to increase the test probe temperature to the temperature to be tested after the cleaning process is completed can also be shortened. In this way, the fluency of the test process can be efficiently improved. The detailed structure and description are shown in the following embodiments.

[0054] refer to Figure 1A to Figure 1B . Figure 1A is a schematic diagram of a test system 1 according to some embodiments of the present disclosure, Figure 1B 1 is another schematic diagram of a test system 1 according to some embodiments of the present disclosure. Specifically, the test system 1 includes a main chuck 11, a test probe 12, a cleaning chuck 13, and a first temperature control device 14. The main chuck 11 has a surface 11S for carrying a test object 9. The test probe 12 is disposed on the upper portion for testing the test object 9 at a first temperature TP11. During the process of the test probe 12 testing the test object 9, the first temperature control device 14 can be used to adjust the temperature of the cleaning chuck 13 to a second temperature TP12.

[0055] In some embodiments, there is a temperature difference between the second temperature TP12 and the first temperature TP11. When the temperature difference is controlled to be close to zero, after the test probe 12 is finished testing the object 9, the cleaning chuck 13 can be used to clean the test probe 12 at the second temperature TP12. In this way, the time for waiting for the temperature of the test probe 12 to be lowered before cleaning can be significantly reduced. In addition, after the cleaning chuck 13 has finished cleaning the test probe 12, the temperature of the test probe 12 is usually close to the second temperature TP12 of the cleaning chuck 13. Therefore, when the temperature difference between the second temperature TP12 and the first temperature TP11 is controlled to be close to zero, the time for the test probe 12 to be raised to the first temperature TP11 can also be greatly shortened, so as to more efficiently test the next object.

[0056] For example, when the test probe 12 is testing the object to be tested 9 at a first temperature (e.g., 150 degrees Celsius), the first temperature control device 14 can be used to adjust the temperature of the cleaning chuck 13 to a second temperature (e.g., 130-150 degrees Celsius) close to the first temperature. Accordingly, after the test probe 12 is finished testing the object to be tested 9, the cleaning chuck 13 can be directly used to clean the test probe 12 at the second temperature close to the first temperature, so that the time for waiting for the temperature of the test probe 12 to be lowered for cleaning can be greatly reduced. In addition, after the cleaning chuck 13 has finished cleaning the test probe 12, the temperature of the test probe 12 is usually close to the second temperature of the cleaning chuck 13 (e.g., 130-150 degrees Celsius), so the time for the test probe 12 to be adjusted back to the first temperature (e.g., 150 degrees Celsius) can also be greatly shortened, so as to more efficiently test the next object to be tested.

[0057] refer to FIG. 2A to FIG. 2B . Figure 2A is a schematic diagram of a test system 2 according to some embodiments of the present disclosure, Figure 2B 2 is another schematic diagram of a test system 2 of some embodiments of the present disclosure. Specifically, the test system 2 includes a main chuck 21, a test probe 22, a cleaning chuck 23, a first temperature control device 24, a second temperature control device 25, a first moving device 26, a second moving device 27, and a housing 29. The housing 29 accommodates the main chuck 21, the cleaning chuck 23, the first temperature control device 24, the second temperature control device 25, the first moving device 26, and the second moving device 27.

[0058] In some embodiments, the main chuck 21 is disposed on the first moving device 26 and has a surface 21S for carrying a test object 8. The first moving device 26 is used to control the position of the main chuck 21. The test probe 22 is disposed on the upper portion and includes a plurality of probes 221. When a test is required, the first moving device 26 moves the main chuck 21 and the test object 8 carried thereon to a specific position, the second temperature control device 25 adjusts the temperature of the main chuck 21 and the test object 8 carried thereon to a first temperature TP21, and the test probe 22 uses the plurality of probes 221 to contact the plurality of contacts 81 of the test object 8 at the first temperature TP21 to test the test object 8 at the first temperature TP21. During the process of the plurality of probes 221 of the test probe 22 testing the test object 8, the first temperature control device 24 can be used to adjust the temperature of the cleaning chuck 23 to a second temperature TP22.

[0059] In some embodiments, there is a temperature difference between the second temperature TP22 and the first temperature TP21, and the temperature difference is greater than or equal to zero. When the temperature difference is controlled to be close to zero, after the process of the test probe 22 testing the object 8 is completed, the object 8 can be removed first, and the main chuck 21 is moved away by the first moving device 26. Then, the second moving device 27 moves the cleaning chuck 23 to a specific position, and the cleaning chuck 23 can be directly used to clean the multiple probes 221 of the test probe 22 at the second temperature TP22. In this way, the time of waiting for the temperature of the test probe 22 to drop before cleaning can be greatly shortened. In addition, after the cleaning chuck 23 has finished cleaning the multiple probes 221 of the test probe 22, the temperature of the test probe 22 will usually be close to the second temperature TP22 of the cleaning chuck 23. Therefore, when the temperature difference between the second temperature TP22 and the first temperature TP21 is controlled to be close to zero, the time required by the second temperature control device 25 to raise the multiple probes 221 of the test probe 22 back to the first temperature TP21 can also be greatly shortened, so as to more efficiently test the next piece of the object to be tested.

[0060] In some embodiments, the cleaning chuck 23 includes a cleaning layer 231 for contacting the plurality of probes 221 of the test probe 22 at the second temperature TP22 and cleaning the plurality of probes 221 by absorbing or adhering impurities on the plurality of probes 221 .

[0061] For example, when the test probe 22 is testing the object 8 at a first temperature (e.g., 120 degrees Celsius), the first temperature control device 24 can be used to adjust the temperature of the cleaning chuck 23 to a second temperature (e.g., 100-120 degrees Celsius) close to the first temperature. Accordingly, after the test probe 22 is finished testing the object 8, the cleaning chuck 23 can be directly used to clean the multiple probes 221 of the test probe 22 at the second temperature close to the first temperature, so that the time for waiting for the temperature of the test probe 22 to be lowered for cleaning can be greatly reduced. In addition, after the cleaning chuck 23 has finished cleaning the multiple probes 221 of the test probe 22, the temperature of the test probe 22 is usually close to the second temperature (e.g., 100-120 degrees Celsius) of the cleaning chuck 23. Therefore, the time for the second temperature control device 25 to raise the multiple probes 221 of the test probe 22 to the first temperature (e.g., 120 degrees Celsius) can also be greatly shortened, so as to more efficiently test the next piece of the object.

[0062] In summary, the test system of the embodiment of the present disclosure controls the temperature of the cleaning chuck through a temperature control device so that the temperature of the cleaning chuck is close to the temperature of the test probe when testing the object to be tested. In this way, it can significantly shorten: (1) the time waiting for the temperature of the test probe to drop for cleaning; and (2) the time waiting for the temperature of the test probe to rise to the temperature to be tested for subsequent testing, thereby effectively improving the fluency of the test process.

[0063] Although the present disclosure and its advantages have been described in detail, it should be understood that various changes, substitutions and replacements may be made without departing from the spirit and scope of the present disclosure as defined in the claims. For example, many of the above processes may be implemented in different ways, and other processes or combinations thereof may be used to replace many of the above processes.

[0064] Furthermore, the scope of the present application is not limited to the specific embodiments of the processes, machines, manufactures, compositions of matter, means, methods, and steps described in the specification. A person skilled in the art can understand from the disclosure of the present disclosure that existing or future developed processes, machines, manufactures, compositions of matter, means, methods, or steps that have the same functions or achieve substantially the same results as the corresponding embodiments described herein can be used according to the present disclosure. Accordingly, such processes, machines, manufactures, compositions of matter, means, methods, or steps are included in the claims of the present application.

Claims

1. A testing system, characterized in that: Include: A main chuck for carrying an object to be tested; A test probe, used to test the object to be tested at a first temperature; A cleaning chuck; as well as a first temperature control device, used to adjust the temperature of the cleaning chuck to a second temperature; The cleaning chuck is used to clean the test probe at the second temperature, and there is a temperature difference between the second temperature and the first temperature.

2. The test system according to claim 1, characterized in that: The test probe includes a plurality of probes.

3. The test system according to claim 2, characterized in that: The plurality of probes contact a plurality of joints of the object to be tested at the first temperature to test the object to be tested.

4. The test system according to claim 2, characterized in that: The cleaning chuck comprises a cleaning layer for contacting and cleaning the plurality of probes at the second temperature.

5. The test system according to claim 1, characterized in that: The temperature difference is greater than or equal to zero.

6. The test system according to claim 1, characterized in that: Also includes: A first moving device is used to control the position of the main chuck.

7. The test system according to claim 1, characterized in that: Also includes: A second moving device is used to control the position of the cleaning chuck.

8. The test system according to claim 1, characterized in that: Also includes: A second temperature control device is used to adjust the temperature of the main chuck to the first temperature.

9. The test system according to claim 1, characterized in that: Also includes: A housing is used to accommodate the main chuck and the cleaning chuck.

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