Wafer ring reversing device
By designing a wafer inverted ring device to automatically remove metal ring parts and install plastic ring parts, the problems of low detection efficiency and thermal conductivity in the prior art are solved, the detection efficiency is improved and the wafer performance is protected.
Patent Information
- Application Number
- CN202420591714.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-26
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-03-26
AI Technical Summary
In the prior art, the wafer needs to be manually removed before detection, resulting in low detection efficiency, and the thermal conductivity of the metal reinforcement leads to an increase in temperature affecting the wafer performance.
A wafer inverting ring device is designed, including feeding module, transfer module, de-ring module and upper ring module. The separation of metal ring parts and wafers and adsorption and pasting of plastic ring parts is achieved through the lifting component and the adsorption and pasting of plastic ring parts. Attached, the removal of metal ring parts and the installation of plastic ring parts are automated to improve detection efficiency and reduce thermal conductivity.
It realizes automatic removal of metal ring parts and installation of plastic ring parts, improves the detection efficiency of wafers, protects the wafers from mechanical damage, and reduces the influence of thermal conductivity, and is suitable for batch inspection and detection under power-on state.
Smart Images
Figure CN222260974U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of wafer transfer, and in particular relates to a wafer inverting ring device. Background Art
[0002] Due to the complex manufacturing process of wafers, and because their surfaces are fragile and brittle, they require multiple steps for transportation, which usually requires industry wafer transport boxes, or fixed reinforcement on the periphery of the wafers. At this time, most of the reinforcements used are made of metal, which is easy to process and can be reused. This proprietary metal ring is located at the edge of the wafer and can effectively filter and adsorb particles and chemicals in the surrounding environment, thereby maintaining the high purity and defect-free state of the wafer during the manufacturing process. In addition, this metal ring can protect the periphery of the wafer during transportation, thereby absorbing and dispersing the mechanical stress caused by the impact to a certain extent, protecting the surface of the wafer.
[0003] After the wafer is fixed, this metal ring reinforcement will be greatly affected when the wafer needs to be tested, especially when it is powered on (the metal itself generates electricity). Therefore, after the transfer is completed, the metal reinforcement on the periphery of the wafer needs to be removed before the power-on test can be performed, and then manual testing is used. However, manual testing is difficult to meet the needs of large-scale wafer testing, resulting in low testing efficiency. In addition, the thermal conductivity of the metal ring itself is also high. Long-term friction (friction between each other during transportation) will cause the temperature of the metal ring to rise, thereby affecting the performance of the wafer connected to it. Utility Model Content
[0004] In view of the deficiencies in the prior art, the purpose of the present invention is to provide a wafer ring inversion device to solve the above-mentioned technical problems existing in the prior art.
[0005] The purpose of the utility model can be achieved through the following technical solutions:
[0006] A wafer ring inversion device includes a feeding module, a transfer module, a ring removal module, and a ring loading module.
[0007] The feeding module is used to carry the wafer carrying the ring;
[0008] The transfer module includes a material taking component, a carrying platform, and a lifting component. The material taking component is used to take out the wafers carried in the feeding module, and then the taken out wafers are transferred to the carrying platform. The lifting component is located below the carrying platform, and is used to push the metal ring located on the periphery of the wafer in the vertical direction through the lifting component to separate the metal ring from the wafer body. A moving component is provided below the transfer module, and is used to transfer the transfer module carrying the wafers to the ring removal module and the ring loading module in sequence.
[0009] When the transfer module is transferred to the bottom of the ring removal module, the metal ring located at the periphery of the wafer is separated from the wafer body by pressing down the ring removal module, and the separated metal ring is rotated out, and the separated wafer body is transferred to the upper ring module through the transfer module;
[0010] The upper ring module includes a second pressure plate, a second telescopic rod, a second moving assembly, a second adsorption assembly and a clamping assembly. The second pressure plate realizes vertical lifting movement through the second telescopic rod. The second adsorption assembly is used to adsorb the plastic ring, which is then transferred to the top of the wafer on the supporting platform through the second moving assembly. The clamping assembly presses down the plastic ring, and the clamping assembly slides along the upper surface of the plastic ring so that the plastic ring is attached to the outer peripheral edge of the wafer as a whole.
[0011] The feeding module transfers the wafers that have completed the inverted ring.
[0012] Furthermore, the feeding module includes a wafer material box and a lifting cylinder, and the lifting cylinder is used to control the lifting and lowering operation of the wafer material box, so that the feeding height is the same as the height of the discharged wafers.
[0013] Furthermore, the front end portion of the material taking component is a clip extending forward, and a sensor is provided on the side of the clip, and the clip can move in the horizontal direction and the height direction;
[0014] When loading, the clip is inserted into the hopper of the wafer cassette, the wafer is lifted and then transferred out;
[0015] When unloading, the clip is inserted into the hopper of the wafer box to drop the wafer and then transfer it out;
[0016] The sensor is used to detect whether the wafer on the clamp is in place for detection;
[0017] The material taking assembly is located above the carrying platform and moves in the horizontal direction.
[0018] Furthermore, the lifting assembly realizes the lifting and lowering operation of the lifting rods arranged in the vertical direction through the driving member at the bottom, and the lifting rods lift the metal ring located at the outer periphery of the wafer, thereby realizing the separation between the metal ring and the wafer located in the middle.
[0019] Furthermore, the de-ring module includes a first pressure plate, a first telescopic rod, a first moving assembly, and a first adsorption assembly. The first telescopic rod is used to realize the lifting and moving of the first pressure plate in the vertical direction, and to press the wafer located in the middle of the carrying platform. The first moving assembly is used to move the first pressure plate in the horizontal direction.
[0020] The first adsorption component is used to adsorb the separated metal rings, and then the whole is transferred to the ring collection component located on the side through the first moving component.
[0021] Furthermore, the first adsorption component is composed of multiple groups of suction cups, and are evenly distributed on the outer peripheral edge where the first pressure plate is located, so that when the lifting component of the transfer module lifts the metal ring, the lifted metal ring is adsorbed by the first adsorption component and then transferred to the ring collection component for recovery.
[0022] Furthermore, a buffer component is provided at the outer edge of the lower end surface where the first pressure plate component is located, and is in contact with the outer edge of the upper surface where the wafer on the supporting platform is located through the buffer component.
[0023] Furthermore, an upper ring assembly is arranged on the side where the upper ring module is located, and the upper ring assembly and the ring collection assembly adopt the same structure, and a lifting mechanism is arranged below the upper ring assembly, and the plastic ring carried above is lifted by the lifting mechanism, so that the second adsorption assembly is always at the same height to adsorb the plastic ring located at the top layer;
[0024] A lifting mechanism is arranged below the ring collecting assembly, and the metal rings carried above are dropped by the lifting mechanism, so that the metal rings located on the uppermost layer are always at the same height as the metal rings transported by the first adsorption assembly.
[0025] Furthermore, the clamping assembly includes a roller member and a rotating mechanism located at the top, so that multiple groups of roller members are distributed in a ring shape on the periphery with the second pressure plate member as the center, and movement in the rotation direction is achieved through the rotating mechanism.
[0026] Furthermore, the second adsorption component adopts an independent lifting component, and after the second adsorption component adsorbs the plastic ring into place, it makes way in the vertical direction through an independently arranged lifting mechanism to realize the movement of the clamping component in the rotation direction.
[0027] Beneficial effects of the utility model:
[0028] 1. The ring removal module and the ring attachment module used in this device are combined with each other, which can realize the removal of the metal ring on the periphery of the wafer, and can also synchronously reinforce a layer of plastic ring on the periphery of the wafer. By reinforcing the wafer with the plastic ring, the wafer after the ring is inverted can be placed in the detection equipment for batch detection, thereby improving the detection efficiency. While effectively protecting the periphery of the wafer, it does not affect the detection under power-on conditions, and this plastic ring has low thermal conductivity.
[0029] 2. In the upper ring module used in this device, the plastic ring is grasped and then the outer periphery of the wafer below is attached to the plastic ring through the clamping assembly, so that multiple process operations can be completed in one workstation.
[0030] 3. The lifting assembly arranged on the feeding module adopted by the device, in cooperation with the downward pressure of the ring-removing module, can realize the removal of the metal ring located at the periphery of the wafer without damaging the periphery of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.
[0032] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the utility model;
[0033] Figure 2 It is a side structural schematic diagram of an embodiment of the utility model;
[0034] Figure 3 It is a schematic diagram of the top view of the structure of an embodiment of the utility model;
[0035] Figure 4 It is a schematic diagram of the structure of the feeding module of an embodiment of the utility model;
[0036] Figure 5 This is a schematic diagram of the overall structure of the transfer module of an embodiment of the utility model;
[0037] Figure 6 It is a schematic cross-sectional structure diagram of a transfer module according to an embodiment of the utility model;
[0038] Figure 7 It is a schematic diagram of the structure of the material taking component of an embodiment of the utility model;
[0039] Figure 8 It is a schematic diagram of the overall structure of a wafer in an embodiment of the utility model;
[0040] Fig. 9 This is a schematic diagram of the structure of the ring-removing module of an embodiment of the utility model;
[0041] Fig.10 It is an embodiment of the utility model Fig. 9 Schematic diagram of the mid-section structure;
[0042] Fig.11 This is a schematic diagram of the structure of the ring-collecting assembly of an embodiment of the utility model;
[0043] Fig.12 This is a schematic structural diagram of the connection state of the ring-removing module and the ring-on module of an embodiment of the utility model;
[0044] Fig.13 This is a schematic diagram of the upper ring module structure of an embodiment of the utility model;
[0045] Fig.14 It is an embodiment of the utility model Fig.13 Schematic diagram of the mid-section structure;
[0046] Fig.15 It is a schematic diagram of the structure of the clamping assembly of an embodiment of the utility model. DETAILED DESCRIPTION
[0047] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0048] like Figure 1 , Figure 2 As shown, an embodiment of the utility model provides a wafer ring inversion device, including a feeding module 1, a transfer module 2, a ring removal module 3, and a ring application module 4.
[0049] like Figure 4 As shown, the feeding module 1 is used to carry the wafers with the rings; at the same time, the feeding module 1 is also used to carry and output the wafers after the rings are inverted. At this time, the feeding module 1 includes a wafer material box 11 and a lifting cylinder 12. The lifting cylinder 12 controls the lifting operation of the wafer material box 11. At the beginning, the wafer material box 11 will hold the wafers with the metal rings 101 (refer to Figure 8 As shown in the figure, the wafer box 11 is lifted to a specified height and then transferred out through the transfer module 2. When the ring is reversed, the wafer box 11, under the action of the bottom lifting cylinder 12, lifts the unloaded area to a specified height, thereby inserting the wafer after the ring is reversed into the unloaded wafer box 11. At this time, the feeding height is the same as the height of the discharged wafer, and there is no need to adjust the height of the wafer carried by the transfer module 2.
[0050] like Figure 5-6As shown, the transfer module 2 includes a material taking component 21, a carrying platform 22, and a lifting component 23. The material taking component 21 is used to take out the wafers contained in the feeding module 1. Figure 7 As shown, the material taking component 21 includes a clip 211 extending forward from the front end, and a sensor 212 is arranged on the side of the clip 211, so that the clip 211 can move in the horizontal direction and the height direction.
[0051] When loading, the clip 211 is extended into the material bin of the wafer material box 11, and the wafer is lifted and then transferred out. At this time, the sensor 212 is used to detect whether the wafer on the clip 211 is in place. After it is in place, the wafer is moved horizontally to the top of the carrying platform;
[0052] When unloading, the clamped wafer is inserted into the material bin of the wafer material box 11 through the clamp 211 (the position of the wafer material box 11 is in an empty state at this time), the wafer is lowered and then transferred out, and preparations are made for loading new wafers.
[0053] The extracted wafer is transferred to the carrying platform 22 through the material picking component 21, and the lifting component 23 is located below the carrying platform 22. The lifting component 23 is used to push the metal ring 101 located on the periphery of the wafer in the vertical direction to separate the metal ring 101 from the wafer body (at the beginning, the metal ring 101 is annular in structure as a whole, located on the periphery of the wafer body, forming peripheral protection for the wafer body). A moving component 201 (forming horizontal movement) is provided below the transfer module 2, which is used to transfer the transfer module 2 carrying the wafer as a whole to the position below the ring removal module 3 and the ring upper module 4 in sequence.
[0054] like Figure 9-10 As shown, the de-ring module 3 includes a first pressure plate 31, a first telescopic rod 32, a first moving assembly 33, and a first adsorption assembly 34. When the transfer module 2 transfers the carried wafer as a whole to the bottom of the de-ring module 3, the first telescopic rod 32 is used to realize the vertical lifting and lowering movement of the first pressure plate 31, and presses the upper part of the wafer located in the middle of the carrying platform 22 (in order to avoid crushing of the wafer when pressing down, a buffer 311 is provided on the outer edge of the lower end surface of the first pressure plate 31, and the buffer 311 contacts the outer edge of the upper surface of the wafer on the carrying platform 22, thereby protecting the wafer from being crushed).
[0055] The lifting assembly 23 realizes the lifting and lowering operation of the lifting rod 232 arranged in the vertical direction through the driving member 231 at the bottom, and the lifting rod 232 lifts the metal ring 101 located at the outer peripheral edge of the wafer (at this time, the wafer body is located in the middle, and its lifting process is restricted by the first pressure plate 31), thereby realizing the separation between the metal ring 101 and the wafer located in the middle. Since the first pressure plate 31 is divided into an inner and outer two-layer structure (the lifting and lowering of the inner layer is controlled by the first telescopic rod 32, and the outer layer structure is only sleeved on the outer edge of the first pressure plate 31 of the inner layer), when the lifting rod 232 of the lifting assembly 23 is lifted, it will simultaneously drive the lifting of the first pressure plate 31 located in the outer layer, and the inner layer located in the first pressure plate 31 always forms a pressing state for the wafer located in the middle.
[0056] After the metal ring 101 is separated from the wafer, the first adsorption component 34 disposed on the first pressure plate 31 of the outer layer adsorbs the separated metal ring 101 (the first adsorption component 34 is composed of multiple groups of suction cups and is evenly distributed on the outer circumference of the first pressure plate 31 to form an annular structure, thereby adsorbing the same annular metal ring 101). At this time, the lifting rod 232 is lowered and reset under the action of the driving member 231, and then the first pressure plate 31 of the inner layer is also lifted under the action of the first telescopic rod 32, thereby achieving separation from the supporting platform 22 supporting the wafer below, and then the first moving component 33 moves the first pressure plate 31 in the horizontal direction, and the metal ring 101 adsorbed by the first adsorption component 34 is transported to the side ring collection component 35 for recovery. Fig.11 As shown, a lifting mechanism is provided below the ring collecting assembly 35, and the metal ring 101 carried above is dropped by the lifting mechanism, so that the metal ring 101 located on the top layer is always at the same height as the metal ring 101 transported by the first adsorption assembly 34. This method can reduce the movement stroke of the first moving assembly 33 during operation.
[0057] Then, the carrying platform 22 where the wafer body is located is moved as a whole to the lower position where the upper ring module 4 is located under the moving action of the moving assembly 201 (at this time, the ring removal module 3 and the upper ring module 4 are on the same straight line, which facilitates the straight-line transfer of the transfer module 2 between the two groups of modules, see Fig.12 As shown in Fig.13 , 14As shown, the upper ring module 4 includes a second pressure plate 41, a second telescopic rod 42, a second moving assembly 43, a second adsorption assembly 44 and a clamping assembly 45. The second pressure plate 41 realizes lifting and lowering movement in the vertical direction through the second telescopic rod 42. The second adsorption assembly 44 is used to adsorb the plastic ring 102. At this time, the second adsorption assembly 44 also adopts multiple groups of suction cup seats and forms a ring structure. When it is necessary to take the material, it is moved as a whole to the top of the upper ring assembly 46 through the second moving assembly 43. The upper ring assembly 46 carries multiple groups of placed plastic rings 102 (this plastic ring 102 and the metal ring 101 adopt the same structure, only the material is different). The upper ring assembly 46 and the ring collection assembly 35 adopt the same structure, and a lifting mechanism is arranged below the upper ring assembly 46. The plastic ring 102 carried above is lifted by the lifting mechanism, so that the second adsorption assembly 44 is always at the same height to adsorb the plastic ring 102 located on the top layer, thereby reducing the setting of the movement stroke.
[0058] Under the action of the second telescopic rod 42, the second adsorption component 44 is controlled to descend, so as to adsorb the plastic ring 102 located on the upper ring component 46. After the adsorption is completed, it is lifted again, and under the movement of the second moving component 43, it is moved to above the wafer of the carrying platform 22, and the adsorbed plastic ring 102 is placed on the wafer of the carrying platform 22. Then the second telescopic rod 42 contracts the second adsorption component 44. At the same time, the second adsorption component 44 adopts an independent lifting component, and after the second adsorption component 44 adsorbs the plastic ring 102 into place, it is made to give way in the vertical direction through an independently arranged lifting mechanism to realize the movement of the clamping component 45 in the rotation direction, that is, at this time, the clamping component 45 falls to directly form contact with the upper surface of the plastic ring 102.
[0059] like Fig.15 As shown, the clamping assembly 45 includes a roller member 451 and a rotating mechanism 452 located at the top, so that multiple groups of roller members 451 are distributed in a ring shape on the periphery with the second pressure plate member 41 as the center, and form contact with the upper part of the plastic ring member 102, and then the movement in the rotation direction is realized by the rotating mechanism 452, so as to realize the rolling and squeezing of the upper surface of the plastic ring member 102 by the roller member 451 (that is, the plastic ring member 102 is in contact with the periphery of the wafer, and at this time, a layer of adhesive coating is attached to the position where the wafer body and the plastic ring member 102 are in contact, so as to realize the direct contact and fixation of the plastic ring member 102 with the wafer), after the clamping is completed, the plastic ring member 102 and the wafer form a whole, and then it is removed from the supporting platform 22 as a whole under the action of the material removal assembly 21, and then placed in the wafer material box 11 for recovery.
[0060] The whole device is easy to operate, and can realize replacing the metal ring 101 on the periphery of the wafer with a plastic ring 102. The wafer with the plastic ring 102 (the probability of wafer bumping in the detection link is low. Although the mechanical strength of the plastic ring 102 is not as good as that of the metal ring 101, it is sufficient to meet the operation of the experimental detection link. The metal ring 101 is currently commonly used in this field for fixing the wafer in long-term and long-distance transportation) can be directly placed on the detection mechanism for batch power-on performance testing, which greatly improves the detection efficiency of the wafer.
[0061] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.
Claims
1. A wafer ring inversion device, comprising a feeding module (1), a transfer module (2), a ring removal module (3), and a ring mounting module (4), characterized in that: The feeding module (1) is used to carry the wafer carrying the ring; The transfer module (2) comprises a material taking component (21), a carrying platform (22), and a lifting component (23); the material taking component (21) is used to take out the wafers held in the feeding module (1), and then the taken out wafers are transferred to the carrying platform (22); the lifting component (23) is located below the carrying platform (22); the lifting component (23) is used to push the metal ring (101) located on the periphery of the wafer in the vertical direction, so that the metal ring (101) and the wafer body are separated from each other; a moving component (201) is provided below the transfer module (2), and is used to transfer the transfer module (2) carrying the wafers as a whole to the ring removal module (3) and the ring loading module (4) in sequence; When the transfer module (2) is transferred to the bottom of the ring removal module (3), the metal ring (101) located at the periphery of the wafer is separated from the wafer body by pressing down the ring removal module (3), and the separated metal ring (101) is rotated out, and the separated wafer body is transferred to the upper ring module (4) through the transfer module (2); The upper ring module (4) comprises a second pressure plate (41), a second telescopic rod (42), a second moving assembly (43), a second adsorption assembly (44) and a clamping assembly (45); the second pressure plate (41) is lifted and lowered in the vertical direction by the second telescopic rod (42); the second adsorption assembly (44) is used to adsorb the plastic ring (102), and then transport it to the top of the wafer located on the supporting platform (22) by the second moving assembly (43); the clamping assembly (45) presses down the plastic ring (102), and the clamping assembly (45) slides along the upper surface of the plastic ring (102) so that the plastic ring (102) is attached to the outer peripheral edge of the wafer; The feeding module (1) rotates out the wafer that has completed the inversion.
2. The wafer ring inversion device according to claim 1, characterized in that: The feeding module (1) comprises a wafer material box (11) and a lifting cylinder (12), and the lifting cylinder (12) is used to control the lifting operation of the wafer material box (11) and achieve the same height of the feeding height and the discharged wafers.
3. The wafer ring inversion device according to claim 2, characterized in that: The front end portion of the material taking component (21) is a clip (211) extending forward, and a sensor (212) is arranged on the side of the clip (211). The clip (211) can move in the horizontal direction and the height direction. When loading, the clamping piece (211) extends into the material bin of the wafer material box (11), lifts the wafer and then transfers it out; When discharging the material, the clamping piece (211) extends into the material bin of the wafer material box (11) to drop the wafer and then transfer it out; The sensor (212) is used to detect whether the wafer on the clamp (211) is in place; The material taking component (21) is located above the carrying platform (22) and is movable in the horizontal direction.
4. The wafer ring inversion device according to claim 1, characterized in that: The lifting assembly (23) achieves lifting and lowering operations of a lifting rod (232) arranged in a vertical direction through a driving member (231) at the bottom, and the lifting rod (232) lifts the metal ring (101) located at the outer peripheral edge of the wafer, thereby achieving separation between the metal ring (101) and the wafer located in the middle.
5. The wafer ring inversion device according to claim 4, characterized in that: The de-ring module (3) comprises a first pressure plate (31), a first telescopic rod (32), a first moving assembly (33), and a first adsorption assembly (34); the first telescopic rod (32) is used to realize the lifting and lowering movement of the first pressure plate (31) in the vertical direction, and to press the top of the wafer located in the middle of the carrying platform (22); and the first moving assembly (33) is used to move the first pressure plate (31) in the horizontal direction; The first adsorption component (34) is used to adsorb the separated metal ring (101), and then the whole is transferred to the ring collection component (35) located on the side through the first moving component (33).
6. The wafer ring inversion device according to claim 5, characterized in that: The first adsorption component (34) is composed of a plurality of groups of suction cups, and is evenly distributed on the outer peripheral edge where the first pressure plate (31) is located, so that when the lifting component (23) of the transfer module (2) lifts the metal ring (101), the lifted metal ring (101) is adsorbed by the first adsorption component (34) and then transferred to the ring collection component (35) for recovery.
7. The wafer ring inversion device according to claim 5, characterized in that: A buffer member (311) is provided at the outer edge of the lower end surface where the first pressure plate member (31) is located, and contacts the outer edge of the upper surface where the wafer on the carrying platform (22) is located through the buffer member (311).
8. The wafer ring inversion device according to claim 5, characterized in that: An upper ring assembly (46) is arranged on the side where the upper ring module (4) is located. The upper ring assembly (46) and the ring closing assembly (35) have the same structure. A lifting mechanism is arranged below the upper ring assembly (46). The plastic ring (102) carried above is lifted by the lifting mechanism, so that the second adsorption assembly (44) is always at the same height to adsorb the plastic ring (102) located at the top layer. A lifting mechanism is provided below the ring collecting assembly (35), and the metal ring (101) carried above is lowered by the lifting mechanism, so that the metal ring (101) located at the top is always at the same height as the metal ring (101) transported by the first adsorption assembly (34).
9. The wafer ring inversion device according to claim 1, characterized in that: The clamping assembly (45) comprises a roller member (451) and a rotating mechanism (452) located at the top, so that multiple groups of roller members (451) are distributed in a ring shape on the outer circumference with the second pressure plate member (41) as the center, and movement in a rotation direction is achieved through the rotating mechanism (452).
10. The wafer ring inversion device according to claim 1, characterized in that: The second adsorption component (44) adopts an independent lifting component, and after the second adsorption component (44) adsorbs the plastic ring (102) into place, it makes way in the vertical direction through an independently arranged lifting mechanism, so as to realize the movement of the pressing component (45) in the rotation direction.