Semiconductor packaging structure
By introducing vibrating components and shunt channels into the semiconductor package structure, the bubble problem and low efficiency problems during the packaging process are solved, and more efficient semiconductor package is achieved, reducing yield loss and improving packaging efficiency.
Patent Information
- Application Number
- CN202421030560.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-13
- Publication Date
- 2024-12-27
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The plastic packaging method during the existing semiconductor packaging process results in a large number of bubbles in the packaged semiconductor, which affects product performance and is low in injection efficiency, making it impossible to package multiple semiconductors at the same time.
A semiconductor package structure is designed, including a vibrating assembly, which drives the fixing rod and the shock-cushioning spring to generate vibrations through the rotation of the eccentric wheel, eliminates bubbles in the packaging material, and realizes the simultaneous packaging of multiple semiconductors through the shunt channel in the upper mold plate.
It effectively reduces the yield loss caused by bubbles, improves the efficiency of semiconductor packaging, and can package multiple semiconductors at the same time, improving the uniform injection of packaging raw materials.
Smart Images
Figure CN222260983U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging structure. Background Art
[0002] Semiconductor refers to a material whose conductivity is between that of a conductor and an insulator at room temperature. Semiconductors are widely used in radios, televisions and temperature measurement. For example, a diode is a device made of semiconductors. Semiconductor refers to a material whose conductivity can be controlled, ranging from an insulator to a conductor. Existing semiconductor packaging includes multiple steps, including a plastic sealing procedure. The existing semiconductor packaging process only requires the semiconductor to be plastic-sealed to be coated with packaging materials. This plastic sealing method will cause a large number of bubbles in the semiconductor after plastic sealing, affecting product performance. When injecting packaging materials into semiconductors, most of them cannot be injected into multiple semiconductors at the same time, and the packaging efficiency is low. Utility Model Content
[0003] In view of the deficiencies in the prior art, the utility model provides a semiconductor packaging structure, which solves the problem that the plastic packaging method in the semiconductor packaging process may cause a large number of bubbles to exist in the packaged semiconductor, affecting product performance and low injection efficiency.
[0004] To achieve the above purpose, the utility model is implemented by the following technical solutions: a semiconductor packaging structure. It includes an injection component, a vibration component is arranged at the bottom of the injection component, the vibration component includes an upper mold plate, an opening and closing cylinder is fixedly connected to the bottom of the upper mold plate, a lower mold plate is fixedly connected to the bottom of the opening and closing cylinder, a lower plastic sealing groove is fixedly connected to the inside of the lower mold plate, an upper plastic sealing groove is fixedly connected to the bottom of the upper mold plate, a vibration plate is fixedly connected to the bottom of the lower mold plate, a fixing rod is arranged inside the vibration plate, an eccentric wheel is movably connected to the middle of the fixing rod, a transverse damping spring is fixedly connected to one end of the vibration plate, a transverse fixing rod is arranged inside the transverse damping spring, a fixing vertical rod is sleeved on the outside of the transverse fixing rod, a fixing hole is opened inside the fixing vertical rod, and the transverse fixing rod passes through the fixing hole.
[0005] Preferably, the injection assembly includes a top plate, a hole is opened in the middle of the top plate, a injection barrel is fixedly connected inside, a filling port is fixedly connected to the bottom of the injection barrel, a lifting cylinder is fixedly connected around the top plate, a fixing plate is fixedly connected below the lifting cylinder, and a connecting groove is opened inside the fixing plate.
[0006] Preferably, the lower mold plate is movably connected to the inside of the connecting groove, and the bottom of the opening and closing cylinder is fixedly connected to the top of the lower mold plate.
[0007] Preferably, an injection hole is provided on the top of the upper mold plate, and the injection hole is located below the injection port.
[0008] Preferably, a groove is provided inside the lower molding groove, and a groove is provided inside the upper molding groove, and the groove inside the lower molding groove corresponds to the groove provided inside the upper molding groove.
[0009] Preferably, the top of the vibration plate is bent inward, and the bottom of the bent part is movably connected to a stabilizing rod, the outside of the stabilizing rod is sleeved with a shock-absorbing spring, the shock-absorbing spring and the bottom of the stabilizing rod are connected to the top two ends of the fixed rod, and the bottom and top bending parts of the vibration plate where it is connected to the stabilizing rod are both recessed inward.
[0010] Preferably, the shock absorbing spring and the stabilizing rod are symmetrically arranged with respect to the fixing rod.
[0011] Preferably, the eccentric wheel is semicircular, the middle portion of the fixing rod protrudes toward both ends, and the eccentric wheels are symmetrically arranged at both ends.
[0012] Preferably, the bottom of the fixed vertical rod is fixedly connected to a floor, and both ends of the transverse shock-absorbing spring are respectively fixedly connected to the side surfaces of the vibration plate and the fixed vertical rod.
[0013] Beneficial Effects
[0014] The utility model provides a semiconductor packaging structure. Compared with the prior art, it has the following beneficial effects:
[0015] 1. A semiconductor packaging structure, through the rotation of an eccentric wheel, since the eccentric wheel is semicircular, due to its own gravity when rotating, it will drive the fixed rod to swing to both ends, due to the damping springs arranged at both ends of the fixed rod, and the transverse damping springs arranged at both ends of the vibration plate, can rebound and drive the device to return to its original position, and provide vibration to the top lower mold plate under the rotation of the eccentric wheel, and eliminate the bubbles generated by the packaging material injected into the semiconductor placed in the upper mold plate and the injection hole through vibration, thereby reducing the loss of the yield rate of the packaged product caused by the bubbles.
[0016] 2. A semiconductor packaging structure, through the diversion channel set inside the upper mold plate, when the packaging raw material is injected downward from the injection port, the packaging raw material is diverted and flows into the closed space formed inside each lower plastic sealing groove and the upper plastic sealing groove, and the placed semiconductor material is plastic-sealed. This plastic sealing method can package multiple semiconductors at the same time, improving the efficiency of semiconductor material packaging. The diversion setting enables the semiconductor packaging raw material to be evenly injected into the packaging space formed by the lower plastic sealing groove and the upper plastic sealing groove. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1It is a schematic diagram of the overall structure of the utility model;
[0018] Figure 2 This is a schematic diagram of the structure of the injection assembly of the utility model;
[0019] Figure 3 This is a schematic diagram of the structure of the vibration component of the utility model;
[0020] Figure 4 This is a detailed diagram of the vibration component of the utility model;
[0021] Figure 5 It is a partial schematic diagram of the vibration component of the utility model.
[0022] In the figure: 1. injection assembly; 2. vibration assembly; 11. top plate; 12. lifting cylinder; 13. injection barrel; 14. injection port; 15. connecting groove; 16. fixed plate; 21. upper mold plate; 22. injection hole; 23. lower mold plate; 24. opening and closing cylinder; 25. lower plastic sealing groove; 26. upper plastic sealing groove; 27. eccentric wheel; 28. fixing rod; 29. shock absorbing spring; 210. stabilizing rod; 211. transverse shock absorbing spring; 212. transverse fixing rod; 213. vibration plate; 214. fixed vertical rod; 215. floor; 216. fixing hole. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] See also Figure 1-5The utility model provides a technical solution: a semiconductor packaging structure. It includes an injection component 1, a vibration component 2 is arranged at the bottom of the injection component 1, and the vibration component 2 includes an upper mold plate 21, an opening and closing cylinder 24 is fixedly connected to the bottom of the upper mold plate 21, and a lower mold plate 23 is fixedly connected to the bottom of the opening and closing cylinder 24, and a lower molding groove 25 is fixedly connected to the interior of the lower mold plate 23, and an upper molding groove 26 is fixedly connected to the bottom of the upper mold plate 21. A diversion channel is arranged inside the upper mold plate 21 to divert the packaging material injected from the top into the molding space formed by the lower molding groove 25 and the upper molding groove 26. A vibration plate 213 is fixedly connected to the bottom of the lower mold plate 23. The vibration plate 213 fixes the eccentric wheel 27 and the fixed rod 28 inside due to the shock absorbing spring 29 and the stabilizing rod 210. When the eccentric wheel 27 rotates, the gravity of the eccentric wheel 27 drives the vibration plate 213 to vibrate, and a fixed channel is arranged inside the vibration plate 213. Rod 28, the middle part of the fixed rod 28 is movably connected with an eccentric wheel 27, which is semicircular. When rotating, the vibration plate 213 is driven to vibrate at both ends due to lifelong gravity. A double-headed motor is arranged in the middle part of the fixed rod 28, and both ends of the double-headed motor are connected to the middle part of the eccentric wheel 27 to drive the eccentric wheel 27 to rotate. One end of the vibration plate 213 is fixedly connected with a transverse damping spring 211, and a transverse fixing rod 212 is arranged inside the transverse damping spring 211. The outside of the transverse fixing rod 212 is sleeved with a fixed vertical rod 214, and a fixing hole 216 is opened inside the fixed vertical rod 214. The transverse fixing rod 212 passes through the fixing hole 216. When the transverse damping spring 211 is subjected to transverse vibration, due to the fixing effect of the transverse fixing rod 212, when the transverse damping spring 211 is extended and retracted, it moves inside the fixed vertical rod 214 along with the transverse vibration of the vibration plate 213.
[0025] See also Figure 1-2 The injection assembly 1 includes a top plate 11, a hole is opened in the middle of the top plate 11, a injection barrel 13 is fixedly connected inside, a filling port 14 is fixedly connected to the bottom of the injection barrel 13, a lifting cylinder 12 is fixedly connected around the top plate 11, a fixing plate 16 is fixedly connected below the lifting cylinder 12, and a connecting groove 15 is opened inside the fixing plate 16.
[0026] See also Figure 1-5The lower mold plate 23 is movably connected to the inside of the connection groove 15, and the bottom of the opening and closing cylinder 24 is fixedly connected to the top of the lower mold plate 23, so that the upper mold plate 21 can be moved upward away from the top of the lower mold plate 23, and the semiconductor is placed inside for plastic sealing. The top of the upper mold plate 21 is provided with an injection hole 22, and the injection hole 22 is below the injection port 14. The lower plastic sealing groove 25 is provided with a groove, and the upper plastic sealing groove 26 is provided with a groove. The groove inside the lower plastic sealing groove 25 corresponds to the groove set inside the upper plastic sealing groove 26. The top of the vibration plate 213 is bent inward, and the bottom of the bent part is movably connected to the stabilizing rod 210. The outside of the stabilizing rod 210 is sleeved with a damping spring 29. The damping spring 29 and the bottom of the stabilizing rod 210 are connected to the top two ends of the fixed rod 28. The bottom and the top bending part where the vibration plate 213 is connected to the stabilizing rod 210 are both concave inward. When the damping spring 29 is subjected to the longitudinal vibration of the eccentric wheel 27, it can shrink to the top and bottom concave parts of the vibration plate 213 for buffering. The damping spring 29 and the stabilizing rod 210 are symmetrically arranged about the fixed rod 28. The eccentric wheel 27 is semicircular, and the middle part of the fixed rod 28 protrudes toward both ends, and the eccentric wheels 27 are symmetrically arranged at both ends. The bottom of the fixed vertical rod 214 is fixedly connected to the floor 215, and the two ends of the transverse shock-absorbing spring 211 are respectively fixedly connected to the side of the vibration plate 213 and the fixed vertical rod 214. The transverse shock-absorbing spring 211 can be extended and retracted between the inside of the fixed vertical rod 214 and the outside of the vibration plate 213, driving the top lower mold plate 23 to vibrate.
[0027] During use, when it is necessary to perform injection molding on a semiconductor, firstly, the opening and closing cylinder 24 is driven upward to drive the upper mold plate 21 away from the top of the lower mold plate 23, and the semiconductor is placed inside the lower molding groove 25 provided at the top of the lower mold plate 23. When the opening and closing cylinder 24 descends, the upper mold plate 21 is closed on the top of the lower mold plate 23, and a molding space is formed between the upper molding groove 26 and the lower molding groove 25 provided inside the upper mold plate 21. The lifting cylinder 12 descends to drive the injection port 14 at the bottom of the injection barrel 13 to enter the injection hole 22 to inject the packaging material. Since a diversion channel is provided on the top of the upper mold plate 21, the packaging material injected from the injection port 14 is evenly diverted into the space between the lower molding groove 25 and the upper molding groove 26 to perform molding on the internal semiconductor.
[0028] When the packaging material needs to be vibrated and defoamed when it is required to be re-sealed, the double-headed motor arranged in the middle of the fixed rod 28 is started to drive the eccentric wheel 27 to rotate. Since the center of gravity of the eccentric wheel 27 is low, it generates vibration when rotating. Since the shock-absorbing springs 29 arranged at both ends of the fixed rod 28 can buffer the force of the longitudinal vibration during longitudinal vibration, the vibration frequency of the eccentric wheel 27 is more stable. Since the vibration plate 213 fixes the internal eccentric wheel 27 and the fixed rod 28, the lateral force brought by the rotation of the eccentric wheel 27 is expanded and recovered to the left and right under the buffering action of the lateral shock-absorbing spring 211. After the vibration frequency is slowed down, the bubbles inside the packaging material injected into the top lower mold plate 23 are defoamed during the vibration process, thereby reducing the loss of the yield rate of the packaging product caused by bubbles.
[0029] In this embodiment, a semiconductor packaging structure, in the above-mentioned components, its own structural features and working principles all adopt the existing technology and will not be described in detail here.
[0030] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0031] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A semiconductor packaging structure, comprising a material injection component (1), characterized in that: A vibration component (2) is provided at the bottom of the injection component (1); The vibration assembly (2) comprises an upper mold plate (21), the bottom of the upper mold plate (21) is fixedly connected to an opening and closing cylinder (24), the bottom of the opening and closing cylinder (24) is fixedly connected to a lower mold plate (23), the interior of the lower mold plate (23) is fixedly connected to a lower plastic sealing groove (25), the bottom of the upper mold plate (21) is fixedly connected to an upper plastic sealing groove (26), the bottom of the lower mold plate (23) is fixedly connected to a vibration plate (213), and the interior of the vibration plate (213) is provided with a fixed A fixed rod (28), wherein the middle part of the fixed rod (28) is movably connected to an eccentric wheel (27), one end of the vibration plate (213) is fixedly connected to a transverse damping spring (211), a transverse fixed rod (212) is arranged inside the transverse damping spring (211), a fixed vertical rod (214) is sleeved on the outside of the transverse fixed rod (212), a fixed hole (216) is provided inside the fixed vertical rod (214), and the transverse fixed rod (212) passes through the inside of the fixed hole (216); The injection assembly (1) comprises a top plate (11), a hole is provided in the middle of the top plate (11), a injection barrel (13) is fixedly connected inside the top plate (11), a filling port (14) is fixedly connected to the bottom of the injection barrel (13), a lifting cylinder (12) is fixedly connected to the top plate (11) on all sides, a fixing plate (16) is fixedly connected below the lifting cylinder (12), and a connecting groove (15) is provided inside the fixing plate (16).
2. A semiconductor package structure according to claim 1, characterized in that: The lower mold plate (23) is movably connected to the inside of the connecting groove (15), and the bottom of the opening and closing cylinder (24) is fixedly connected to the top of the lower mold plate (23) around.
3. The semiconductor package structure according to claim 1, wherein: The top of the upper mold plate (21) is provided with an injection hole (22), and the injection hole (22) is located below the injection port (14).
4. The semiconductor package structure according to claim 1, wherein: The lower plastic sealing groove (25) is provided with a groove inside, and the upper plastic sealing groove (26) is provided with a groove inside. The groove inside the lower plastic sealing groove (25) corresponds to the groove provided inside the upper plastic sealing groove (26).
5. The semiconductor package structure according to claim 1, wherein: The top of the vibration plate (213) is bent inward, and the bottom of the bent portion is movably connected to a stabilizing rod (210), the outside of the stabilizing rod (210) is sleeved with a shock-absorbing spring (29), the shock-absorbing spring (29) and the bottom of the stabilizing rod (210) are connected to the top ends of the fixed rod (28), and the bottom and top bending parts of the vibration plate (213) connected to the stabilizing rod (210) are both recessed inward.
6. The semiconductor package structure according to claim 5, characterized in that: The shock absorbing spring (29) and the stabilizing rod (210) are symmetrically arranged with respect to the fixing rod (28).
7. The semiconductor package structure according to claim 1, characterized in that: The eccentric wheel (27) is semicircular, and the middle part of the fixing rod (28) protrudes toward both ends, and the eccentric wheels (27) are symmetrically arranged at both ends.
8. The semiconductor package structure according to claim 1, wherein: The bottom of the fixed vertical rod (214) is fixedly connected to a floor (215), and the two ends of the transverse shock absorbing spring (211) are respectively fixedly connected to the side surfaces of the vibration plate (213) and the fixed vertical rod (214).