Wafer processing feeding device

Abstract

The utility model relates to the technical field of wafer processing, in particular to a wafer processing feeding device which comprises a connecting end, an auxiliary connecting frame, an adsorption frame body and an adsorption air disc. The connecting end is connected with an external operation end, and the auxiliary connecting frame is installed at the lower end of the connecting end. The adsorption frame body is mounted at the lower end of the auxiliary connecting frame; the plurality of adsorption gas discs are arranged on the adsorption frame body; by the adoption of the device, the overall structure is simple, the auxiliary connecting frame expands the overall installation angle range of the adsorption air disc, the I-shaped adsorption frame body is matched with the installation clamp, the installation flexibility of the adsorption air disc at the operation end is further improved, and various different feeding and carrying requirements are met; the adaptive capacity of the wafer feeding device to various tray bins is improved, and the overall maintenance and debugging efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer processing feeding device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. The main processing methods for wafers are sheet processing and batch processing, that is, processing one or more wafers at the same time. As the feature size of semiconductors becomes smaller and smaller, and the processing and measurement equipment becomes more and more advanced, new data characteristics have emerged in wafer processing.

[0003] When an existing continuous loading device for wafer processing removes a wafer from a testing device, it is necessary to first remove the wafer, place the tested wafer, and then place the wafer to be tested on the testing device, which prolongs the testing time and affects the testing efficiency. Therefore, a technical personnel in this field provides a continuous loading device for wafer processing to solve the problems raised in the above background technology. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer processing loading device to solve the above-mentioned technical problems.

[0005] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions:

[0006] A wafer processing loading device comprises a connecting end, an auxiliary connecting frame, an adsorption frame and an adsorption gas disk; the connecting end is connected to an external operation end, the auxiliary connecting frame is installed at the lower end of the connecting end; the adsorption frame is installed at the lower end of the auxiliary connecting frame; a plurality of adsorption gas disks are arranged on the adsorption frame;

[0007] Furthermore, the auxiliary connecting frame includes an auxiliary upper frame, an adjustment turntable connected to the auxiliary upper frame, and a mounting lower frame for assembling the adsorption frame body;

[0008] Furthermore, the adjustment turntable is provided with an adjustment hole and an adjustment arc groove;

[0009] Furthermore, the adsorption frame includes an adsorption horizontal frame and adsorption side frames mounted on both ends of the adsorption horizontal frame; the adsorption horizontal frame and the adsorption side frames are both equipped with adsorption gas disks;

[0010] Furthermore, the adsorption side frame is provided with a mounting clamp, and an anti-slip pad is further provided between the mounting clamp and the adsorption side frame; the adsorption gas disk is arranged below the mounting clamp.

[0011] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0012] The utility model has a simple overall structure, and the auxiliary connecting frame expands the overall installation angle range of the adsorption gas plate. The I-shaped adsorption frame cooperates with the mounting clamp to further improve the installation flexibility of the adsorption gas plate at the operating end, and is suitable for a variety of different loading and handling needs; the adaptability of the wafer loading device to cope with a variety of material trays and silos is improved, and the overall maintenance and debugging efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the internal structure of the utility model;

[0014] Figure 2 It is an oblique schematic diagram of the overall structure of the utility model. DETAILED DESCRIPTION

[0015] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0016] refer to Figure 1-2 As shown, a wafer processing loading device comprises a connecting end 1, an auxiliary connecting frame, an adsorption frame body and an adsorption gas plate 5; the connecting end 1 is connected to an external operation end, the auxiliary connecting frame is installed at the lower end of the connecting end 1; the adsorption frame body is installed at the lower end of the auxiliary connecting frame; a plurality of the adsorption gas plates 5 are arranged on the adsorption frame body;

[0017] In this embodiment, the connecting terminal 1 is connected to an external driving device to achieve displacement and rotation; the auxiliary connecting frame is used to connect the connecting terminal 1 to the adsorption frame and realize the diversification of the installation angle of the adsorption frame. Through external drive and the adsorption gas disk 5 with freely adjustable position angle, efficient loading and transportation of wafers and chips can be achieved.

[0018] Further, the auxiliary connecting frame includes an auxiliary upper frame 21, an adjustment turntable 22 connected to the auxiliary upper frame 21, and a mounting lower frame 23 for assembling the adsorption frame; further, the adjustment turntable 22 is provided with an adjustment hole 222 and an adjustment arc groove 221;

[0019] In this embodiment, the adjustment turntable 22 takes the adjustment hole 222 as the origin and the adjustment arc groove 221 as the adjustment stroke, so that the adjustment turntable 22 and the mounting bracket 23 can be installed in an angle-adjustable manner, ensuring that the mounting bracket 23 can be adjusted to different installation angles to adapt to different position requirements.

[0020] Furthermore, the adsorption frame includes an adsorption horizontal frame 31 and adsorption side frames 32 mounted on both ends of the adsorption horizontal frame 31; the adsorption horizontal frame 31 and the adsorption side frames 32 are both equipped with adsorption gas discs 5;

[0021] In this embodiment, the I-shaped design ensures the structural strength of the adsorption cross frame 31 and the adsorption side frame 32. The adsorption side frame 32 is mounted on both ends of the adsorption cross frame 31 and fixed by bolts. The installation position can be determined as needed, and then the installation position of the adsorption gas disk 5 can be adjusted; the flexible adjustment of the position of the mounting lower frame 23 provides more adjustment space for the distribution position of the adsorption gas disk 5.

[0022] Furthermore, the adsorption side frame 32 is provided with a mounting clamp 33 , and an anti-slip pad 331 is further provided between the mounting clamp 33 and the adsorption side frame 32 ; the adsorption gas disk 5 is provided below the mounting clamp 33 .

[0023] In this embodiment, the adsorption gas plate 5 can be effectively assembled and installed by the mounting clamp 33 with the anti-skid pad 331. The adsorption gas plate 5 can be fine-tuned by the mounting clamp 33 to ensure the transportation of wafers in various placement positions.

[0024] The utility model has a simple overall structure, and the auxiliary connecting frame expands the overall installation angle range of the adsorption gas plate. The I-shaped adsorption frame cooperates with the mounting clamp to further improve the installation flexibility of the adsorption gas plate at the operating end, and is suitable for a variety of different loading and handling needs; the adaptability of the wafer loading device to cope with a variety of material trays and silos is improved, and the overall maintenance and debugging efficiency is improved.

[0025] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the scope defined by the spirit of the present invention.

Claims

1. A wafer processing loading device, characterized in that: It comprises a connecting end (1), an auxiliary connecting frame, an adsorption frame body and an adsorption gas disk (5); the connecting end (1) is connected to an external operation end, the auxiliary connecting frame is installed at the lower end of the connecting end (1); the adsorption frame body is installed at the lower end of the auxiliary connecting frame; and a plurality of the adsorption gas disks (5) are arranged on the adsorption frame body.

2. A wafer processing loading device according to claim 1, characterized in that: The auxiliary connecting frame comprises an auxiliary upper frame (21), an adjustment turntable (22) connected to the auxiliary upper frame (21), and a mounting lower frame (23) for assembling an adsorption frame body.

3. A wafer processing loading device according to claim 2, characterized in that: The adjustment rotating disk (22) is provided with an adjustment hole (222) and an adjustment arc groove (221).

4. The wafer processing loading device according to claim 1, characterized in that: The adsorption frame comprises an adsorption horizontal frame (31) and adsorption side frames (32) mounted on both ends of the adsorption horizontal frame (31); adsorption gas disks (5) are mounted on both the adsorption horizontal frame (31) and the adsorption side frames (32).

5. The wafer processing loading device according to claim 4, characterized in that: The adsorption side frame (32) is provided with a mounting clamp (33), and an anti-slip pad (331) is further provided between the mounting clamp (33) and the adsorption side frame (32), and the adsorption gas disk (5) is arranged below the mounting clamp (33).

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