Chip production equipment

Abstract

The utility model relates to the semiconductor technology, in particular to chip production equipment, which comprises a base; the supporting table is located above the base, the upper surface of the supporting table is used for supporting an adhesive tape, a plurality of cut chips adhere to the surface of the adhesive tape, and a channel penetrating through the upper surface and the lower surface of the base is formed in the base; the jacking device is arranged on the upper surface of the base, the jacking device comprises a jacking part, the jacking part can jack up and descend, and when the jacking part jacks up, the jacking part penetrates through the channel to jack up one chip on the adhesive tape; and the UV edge irradiation part is fixed on the surface of the base at the two sides of the jacking device and is used for carrying out secondary UV light irradiation on the adhesive tape at the edge position of the bottom of the chip when and / or before the jacking part jacks the chip so as to further weaken or eliminate the adhesion between the edge position of the bottom of the jacked chip and the adhesive tape. The chip production equipment can prevent the risk of chip fragmentation when the chip is picked up.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular to a chip production device. Background Art

[0002] In the process of semiconductor manufacturing, chip cutting is an important link. It not only determines the size and shape of the chip, but also directly affects the performance and use of the chip. With the continuous advancement of science and technology, chip cutting technology is also constantly developing and becoming a technological door to fine craftsmanship in the field of semiconductor manufacturing.

[0003] DAF (Die Attach Film) is a chip film (or tape) that is attached to the back of a wafer that is formed of several chips before the chips are cut. During chip cutting (cutting the wafer to form several chips), several chips can be cut, separated, and peeled together, so that the cut chips can still be attached to the film (or tape) and will not fall apart due to cutting. After the chip cutting is completed, the cut chips need to be peeled off (or picked up) from the film (or tape) one by one. Since some chips may have abnormal cutting problems (such as abnormal adhesion at the bottom of the cut), the chip may break during the peeling (or picking) process. Utility Model Content

[0004] The technical problem to be solved by the present application is to provide a chip production device to prevent the chip from being chipped during the peeling (or picking) process.

[0005] To this end, the present application provides a chip production device, including:

[0006] Pedestal;

[0007] A support platform is located above the base, the upper surface of the support platform is used to support the tape, a plurality of cut chips are adhered to the surface of the tape, and the base has a channel running through the upper and lower surfaces of the base;

[0008] A lifting device is arranged on the upper surface of the base, the lifting device comprises a lifting part, the lifting part can rise and fall, and when the lifting part rises, it passes through the channel to lift a chip on the tape;

[0009] The UV edge irradiation part is fixed to the base surface outside the lifting device, and is used to perform a second UV light irradiation on the tape at the bottom edge position of the chip when and / or before the lifting part lifts the chip, so as to further weaken or eliminate the adhesion between the bottom edge position of the lifted chip and the tape.

[0010] Optionally, it also includes: a picking device, arranged above the supporting platform, for picking up the lifted chip; and a cutting unit, for cutting the wafer to form a plurality of cut chips.

[0011] Optionally, it also includes: a UV overall irradiation unit, which is arranged around or on one side of the support platform, and is used to perform a first UV light irradiation on the tape on the entire bottom of the chip to be lifted up before the chip to be lifted up is lifted up by the lifting unit, so as to weaken or eliminate the adhesion between the entire bottom of the chip to be lifted up and the tape.

[0012] Optionally, the lifting device further includes a driving device connected to the lifting part, for driving the lifting part to rise or fall.

[0013] Optionally, the lifting portion includes a plurality of ejector pins, or includes a boss or a plurality of bosses, or includes a plurality of concentric disks.

[0014] Optionally, when the lifting portion includes multiple concentric disks, when the lifting portion rises, all the concentric disks rise from an initial position at the same time, and when the lifted chip is picked up, the multiple concentric disks gradually descend to the initial position from the outermost disk to the inner disk.

[0015] Optionally, the UV edge irradiation part includes a plurality of UV lamps, the UV lamps are used to generate UV light, and the plurality of UV lamps are evenly distributed on the base surface around the lifting device.

[0016] Optionally, the UV edge irradiation unit includes a UV lamp driving unit for driving the UV lamp to operate.

[0017] Optionally, the multiple UV lamps have the same luminous power and the same irradiation time.

[0018] Optionally, the adhesive tape includes a base film, a sensitive film on the base film, and an adhesive film on the sensitive film, wherein the sensitive film eliminates or reduces stickiness when irradiated with UV light, and the adhesive film is used to adhere the chip.

[0019] Compared with the prior art, the advantages of the technical solution of this application are:

[0020] The chip production equipment of the present application includes: a base; a support table, located above the base, the upper surface of the support table is used to support the tape, a plurality of cut chips are adhered to the surface of the tape, and the base has a channel running through the upper and lower surfaces of the base; a lifting device, arranged on the upper surface of the base, the lifting device includes a lifting part, the lifting part can rise and fall, and the lifting part lifts up a chip on the tape through the channel when rising; a UV edge irradiation part, fixed to the base surface outside the lifting device, used for performing a second UV light irradiation on the tape at the bottom edge position of the chip when and / or before the lifting part lifts the chip, so as to further weaken or eliminate the adhesion between the bottom edge position of the lifted chip and the tape. The chip production equipment in the present application, after the entire bottom of the chip to be lifted is subjected to the first UV light irradiation, due to the presence of the UV edge irradiation part, the tape at the bottom edge of the chip that is to be lifted or has been lifted by the lifting part can also be subjected to a second UV light irradiation, so as to further weaken or eliminate the adhesion between the bottom edge of the lifted chip and the tape, thereby eliminating the abnormal adhesion between the bottom edge of the lifted chip and the tape after the wafer is cut and / or the entire bottom of the chip to be lifted is subjected to the first UV light irradiation, thereby preventing the lifted chip from being fragmented due to abnormal adhesion when picking up (or peeling) after the chip is lifted. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the structure of a chip production device in one embodiment of the present application;

[0022] Figure 2 In one embodiment of this application Figure 1 A schematic cross-sectional structure diagram of a chip production device shown;

[0023] Figure 3 This is a schematic diagram of the structure when the chip production equipment lifts up the chip in another embodiment of the present application. DETAILED DESCRIPTION

[0024] The specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. When describing the embodiments of the present application in detail, for the sake of convenience, the schematic diagrams will not be partially enlarged according to the general proportion, and the schematic diagrams are only examples, which should not limit the scope of protection of the present application. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0025] The present application first provides a chip production device, please refer to Figure 1-Figure 3 ,include:

[0026] Base 101;

[0027] The support platform 102 is located above the base 101, and the upper surface of the support platform 102 is used to support the tape 200 (refer to Figure 3 ), a plurality of diced chips 300 are adhered to the surface of the tape 200, and the base 102 has a channel 103 penetrating the upper and lower surfaces of the base 102;

[0028] A lifting device 104 is disposed on the upper surface of the base 101. The lifting device 104 includes a lifting portion 105. The lifting portion 105 can rise and fall. When the lifting portion 105 rises, it passes through the channel 103 to lift a chip 300P on the tape 200.

[0029] The UV edge irradiation unit 106 is fixed to the surface of the base 101 outside the lifting device 104, and is used to perform a second UV light irradiation on the tape 200 at the bottom edge position of the chip 300P when and / or before the lifting unit 105 lifts the chip 300P, so as to further weaken or eliminate the adhesion between the bottom edge position of the lifted chip 300P and the tape 200.

[0030] In one embodiment, the chip production equipment also includes: a picking device (not shown in the figure), which is arranged above the support table 101, and is used to pick up (or peel off) the raised chip 300P. In a specific embodiment, the picking device can pick up the raised chip 300P by vacuum adsorption; a cutting part (not shown in the figure), which is used to cut the wafer to form a plurality of cut chips 300. In a specific embodiment, the wafer is cut by a blade to form a plurality of cut chips 300. In one embodiment, the chip production equipment also includes: a UV overall irradiation unit (not shown in the figure), which is arranged around or on one side of the support platform 102, and is used to perform a first UV light irradiation on the tape 200 on the entire bottom of the chip 300P to be lifted up before the chip 300P to be lifted up is lifted up by the lifting unit 105, so as to weaken or eliminate the adhesion between the entire bottom of the chip 300P to be lifted up and the tape 200, so that the chip 300P to be lifted up can be easily lifted up and easily picked up (or peeled off).

[0031] The base 101 is used as a base to support other components of the chip production equipment. In a specific embodiment, the upper surface of the base 101 is a support table.

[0032] The support platform 102 is located above the base 101. In a specific embodiment, the support platform 102 includes a middle portion and an edge portion surrounding the middle portion, and a portion of the surface of the bottom of the edge portion of the support platform 102 is fixed to the edge surface of the base 101 through a supporting structure, so that the middle portion of the support platform 102 is suspended above the base 101. In an embodiment, the supporting structure is a movable or immovable supporting structure, so that the support platform 102 is movable or immovable. When the supporting structure is movable (for example, it moves in a direction perpendicular to the upper surface of the base 101 and / or parallel to the upper surface of the base, and the corresponding support platform 102 moves in a direction perpendicular to the upper surface of the base 101 and / or parallel to the upper surface of the base), the supporting structure is specifically driven to move by a corresponding driving device.

[0033] The upper surface of the support platform 102 is used to support the tape 200 (refer to Figure 3 ), the tape 200 is used to adhere the chips 300 formed after the cutting when the wafer is cut, so as to prevent the chips 300 formed after the cutting from scattering during and after the cutting process. The wafer has a plurality of grains arranged in rows and columns, and an integrated circuit is formed in each grain through a semiconductor integrated manufacturing process. Each grain corresponds to a chip. After the wafer is cut, the plurality of discrete grains after the cutting correspond to a plurality of discrete chips 300. In one embodiment, the support platform 102 may have a vacuum adsorption function, and the support platform 102 adsorbs the tape 200 located on the upper surface of the support platform 102 by vacuum adsorption, so that the upper surface of the support platform 102 can fix and support the tape 200, so that the lifting portion 105 can lift the corresponding chip 300P, so that the lifted chip 300P is easy to detach from the tape 200, and the chips 300 at other positions on the tape 200 will not be affected.

[0034] The tape 200 includes an upper surface and a lower surface relative to each other. The lower surface of the tape 200 contacts the upper surface of the support platform 102. The lower surface of the tape 200 is not sticky. The upper surface of the tape 200 is sticky. The upper surface of the tape 200 adheres to the cut chips 300.

[0035] The adhesive tape 200 may be a multi-layer stacked structure. In one embodiment, the adhesive tape 200 is a three-layer stacked structure, including a base film, a sensitive film on the base film, and an adhesive film on the sensitive film. The sensitive film eliminates or reduces the stickiness when irradiated with UV light. When the lifting portion 105 of the lifting device 104 rises through the channel 103 to lift a chip on the adhesive tape 200 (for example, referring to Figure 3The lifted chip 300P in the substrate is easily separated from the base film and picked up or peeled off. The adhesive film is sticky and is used to adhere the several chips 300 after cutting, and the adhesiveness of the adhesive film does not change when irradiated by UV light.

[0036] In one embodiment, the material of the base film may be a resin or a resin composition, the resin may be a polyester (polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate, etc.), a polyolefin (polyethylene film, polypropylene, etc.), a polycarbonate; the resin composition may be a resin film of polyamide, polyimide, polyamide-imide, polyetherimide, polyether sulfide, polyether sulfone, polyether ketone, polyether and polysulfide. The base film may be a single-layer film or a multi-layer film consisting of two or more film layers.

[0037] In one embodiment, the sensitive film is a film formed by an ultraviolet (UV) curing adhesive, and the ultraviolet curing adhesive is an adhesive having the property of reducing viscosity by ultraviolet (UV) irradiation. In one embodiment, the ultraviolet curing adhesive may include an acrylic resin having a (meth) acryloyl group. The ultraviolet curing adhesive may also contain other components such as a photoinitiator and a crosslinking agent (such as a polyisocyanate compound) as needed. The crosslinking agent is a compound having a reactive group that reacts with an acrylic resin, and may specifically be a polyisocyanate compound.

[0038] In one embodiment, the adhesive film may be a film formed by a thermosetting adhesive, and the thermosetting adhesive includes a high molecular weight resin component and a thermosetting component. In one embodiment, the high molecular weight resin component may include acrylic rubber, polyimide, and at least one resin selected from the group consisting of phenoxy resins. The thermosetting component is a compound and / or curing agent having a reactive group that forms a cross-linked structure by reacting with self-polymerization. The thermosetting component may include at least one of epoxy resin, maleimide resin, triazine resin, and a group consisting of phenolic resins.

[0039] In one embodiment, after the chip 300P lifted by the lifting portion 105 is picked up (or peeled off), the tape 200 can move so that the next chip 300 that needs to be lifted and adhered to the tape 200 moves above the channel 103. In a specific embodiment, the chip growing device further includes a tape driving device connected to the tape 200 for driving the tape 200 to move.

[0040] The support platform 102 also has a channel 103 that passes through the upper and lower surfaces of the base 102. The channel 103 serves as a channel for the lifting portion 105 of the lifting device 104 to rise and fall. When the lifting portion 105 rises, it passes through the channel 103 to lift a corresponding chip 300P on the tape 200. In one embodiment, the size of the channel 103 is larger than or slightly larger than the size of the lifting portion 105, the shape of the channel 103 is the same as or corresponds to the shape of the lifting portion 105, and the number of the channels 103 is the same as the number of the lifting portions 105. In a specific embodiment, when the lifting portion 105 is a plurality of ejector pins, the channel 103 is a plurality of through holes corresponding to the positions and sizes of the plurality of ejector pins; when the lifting portion 105 is a boss or a plurality of bosses, the channel 103 is a through opening or a plurality of through openings corresponding to the positions and sizes of the boss or the plurality of bosses; when the lifting portion 105 is a plurality of concentric disks, the channel 103 is located at a through opening corresponding to the positions and sizes of the plurality of concentric disks.

[0041] In one embodiment, the support platform 102 further has a window 109 that passes through the upper and lower surfaces of the support platform. The window 109 can be an air window filled with a filling material or a filling window filled with a light-transmitting (UV light) material. The window 109 is used for the UV edge irradiation unit 106 to emit UV light 107 (Ul travi ol et, UV, ultraviolet light or ultraviolet light), the UV light 107 can pass through the open window 109, and perform a second UV light irradiation on the tape 200 at the bottom edge of the chip 300P that is to be lifted or has been lifted by the lifting portion 105 (before lifting, the tape at the entire bottom of the chip 300P to be lifted is irradiated with UV light for the first time), so as to further weaken or eliminate the adhesion between the bottom edge of the lifted chip 300P and the tape 200, thereby eliminating the abnormal adhesion between the bottom edge of the lifted chip 300P and the tape 200 after the wafer is cut and / or the tape 200 at the entire bottom of the chip 300P to be lifted is irradiated with UV light for the first time, thereby preventing the lifted chip 300P from being fragmented due to abnormal adhesion when picking up (or peeling) after the chip 300P is lifted. In a specific embodiment, the second UV light irradiation may be performed when the lifting portion 105 lifts the chip 300P, or before the lifting portion 105 lifts the chip 300P, or when the lifting portion 105 lifts the chip 300P and when the lifting portion 105 lifts the chip 300P.

[0042] The chip production equipment also includes a lifting device 104, which is arranged on the upper surface of the base 101. The lifting device 104 includes a lifting portion 105, and the lifting portion 105 can rise and fall. When the lifting portion 105 rises, it passes through the channel 103 to lift a chip 300P on the tape 200, so that the lifted chip 300P is separated from the tape 200.

[0043] In one embodiment, the lifting device 104 further includes a driving device 108 connected to the lifting portion 105, for driving the lifting portion 105 to rise or fall. In a specific embodiment, the driving device 108 includes a cylinder.

[0044] In one embodiment, the lifting portion 105 includes a plurality of lifting pins, or includes a boss or a plurality of bosses, or includes a plurality of concentric disks. Figure 3 The shown jacking portion includes a boss, and the corresponding channel 103 is a through opening corresponding to the position and size of the boss.

[0045] In a specific embodiment, when the lifting portion 105 includes a plurality of ejector pins, the plurality of ejector pins rise simultaneously from an initial position to lift the chip 300P, and after the lifted chip 300P is picked up, the plurality of ejector pins simultaneously descend to the initial position. In another specific embodiment, when the lifting portion 105 includes a boss, the boss rises from an initial position to lift the chip 300P, and after the lifted chip 300P is picked up, the boss descends to the initial position. In another specific embodiment, when the lifting portion 105 includes a plurality of bosses, the plurality of bosses rise simultaneously from an initial position to lift the chip 300P, and after the lifted chip 300P is picked up, the plurality of bosses simultaneously descend to the initial position. In another specific embodiment, when the lifting part 105 includes a plurality of concentric disks, when the lifting part 105 rises, all the concentric disks rise from the initial position at the same time, and when the lifted chip 300P is picked up, the plurality of concentric disks gradually descend to the initial position from the outermost disk to the inner disk, so as to facilitate the separation of the lifted chip 300P from the tape, and make the lifted chip evenly stressed, effectively preventing the lifted chip 300P from breaking.

[0046] The UV edge irradiation unit 106 includes a plurality of UV lamps, which are used to generate UV light. The plurality of UV lamps are evenly distributed on the surface of the base 101 around the lifting device 104, so that all the tapes at the bottom edge position of the lifted chip 300P can be evenly irradiated by the UV light generated by the UV edge irradiation unit 106, thereby better reducing or eliminating the adhesion between the bottom edge position of the lifted chip 300P and the tape 200, thereby better eliminating the abnormal adhesion phenomenon between the bottom edge position of the lifted chip 300P and the tape 200 after the wafer is cut and / or the first UV light irradiation of the tape 200 on the entire bottom of the chip 300P to be lifted, thereby better preventing the lifted chip 300P from being fragmented due to abnormal adhesion when picking up (or peeling) after the chip 300P is lifted.

[0047] In one embodiment, the UV edge irradiation unit 106 includes a UV lamp driving unit for driving the UV lamp to work. In one embodiment, the multiple UV lamps have the same luminous power and the same irradiation time, which further improves the effect of reducing or eliminating the adhesion between the bottom edge of the lifted chip 300P and the tape 200.

[0048] Although the present application has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present application. Any technical personnel in this field can use the methods and technical contents disclosed above to make possible changes and modifications to the technical solution of the present application without departing from the spirit and scope of the present application. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are within the protection scope of the technical solution of the present application.

Claims

1. A chip production device, characterized in that: include: Pedestal; A support platform is located above the base, the upper surface of the support platform is used to support the tape, a plurality of cut chips are adhered to the surface of the tape, and the base has a channel running through the upper and lower surfaces of the base; A lifting device is arranged on the upper surface of the base, the lifting device comprises a lifting part, the lifting part can rise and fall, and when the lifting part rises, it passes through the channel to lift a chip on the tape; The UV edge irradiation part is fixed to the base surface outside the lifting device, and is used to perform a second UV light irradiation on the tape at the bottom edge position of the chip when and / or before the lifting part lifts the chip, so as to further weaken or eliminate the adhesion between the bottom edge position of the lifted chip and the tape.

2. The chip production equipment according to claim 1, characterized in that: Also includes: A picking device, disposed above the supporting platform, for picking up the lifted chip; The cutting part is used to cut the wafer to form a plurality of cut chips.

3. The chip production equipment according to claim 1 or 2, characterized in that: Also includes: The UV overall irradiation part is arranged around or on one side of the support platform, and is used for performing the first UV light irradiation on the tape on the entire bottom of the chip to be lifted up before the chip to be lifted up is lifted up by the lifting part, so as to weaken or eliminate the adhesion between the entire bottom of the chip to be lifted up and the tape.

4. The chip production equipment according to claim 1, characterized in that: The lifting device also includes a driving device connected to the lifting part, which is used to drive the lifting part to rise or fall.

5. The chip production equipment according to claim 1 or 4, characterized in that: The jacking portion includes a plurality of jack pins, or includes a boss or a plurality of bosses, or includes a plurality of concentric disks.

6. The chip production equipment according to claim 5, characterized in that: When the lifting part includes multiple concentric disks, when the lifting part rises, all the concentric disks rise from the initial position at the same time. When the lifted chip is picked up, the multiple concentric disks gradually descend to the initial position from the outermost disk to the inner disk.

7. The chip production equipment according to claim 1, characterized in that: The UV edge irradiation part includes a plurality of UV lamps, and the UV lamps are used to generate UV light. The plurality of UV lamps are evenly distributed on the surface of the base around the lifting device.

8. The chip production equipment according to claim 7, characterized in that: The UV edge irradiation unit includes a UV lamp driving unit for driving the UV lamp to operate.

9. The chip production equipment according to claim 8, characterized in that: The multiple UV lamps have the same luminous power and the same irradiation time.

10. The chip production equipment according to claim 1, characterized in that: The adhesive tape comprises a base film, a sensitive film on the base film, and an adhesive film on the sensitive film, wherein the sensitive film can eliminate or reduce stickiness when irradiated with UV light, and the adhesive film is used for adhering the chip.

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