Chip packaging structure, display device and electronic device

Abstract

The utility model relates to a chip packaging structure, a display device and an electronic device. The chip packaging structure comprises a flexible substrate, an input golden finger, an output golden finger and a reinforcing sheet, wherein the input golden finger and the output golden finger are arranged on the front surface of the flexible substrate and extend out of the flexible substrate; the reinforcing sheet is fixed in a target area on the back surface of the flexible substrate, the target area at least comprises an area, corresponding to the area where the input golden finger is located, of the back surface, and the input golden finger is detachably connected with a connector on the display driving circuit board through the reinforcing sheet; the front face of the flexible substrate comprises a circuit area, a solder mask area and a chip installation area. The complexity of design and production is reduced, and the cost is saved. And the display driving circuit board can be directly inserted and quickly detached, so that the system test and maintenance cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic packaging, and in particular to a chip packaging structure, a display device and an electronic device. Background Art

[0002] One way to implement the display driver chip packaging is to assemble the display driver IC onto a flexible substrate (Film), and then form a flexible circuit board with input and output through printing and other processes. This packaging method is called chip-on-film (COF). Then the input and output pins of the COF need to be bonded to the display panel (Panel) pins (output pins) or the gold fingers (input pins) of the display driver circuit board (PCB) through automatic or manual bonding equipment using ACF glue (Anisotropic Conductive Film, a kind of anisotropic conductive film), so that the COF, display panel and display driver circuit board are connected into one. It is not conducive to the fast and effective operation of quality inspection and maintenance. Utility Model Content

[0003] Technical issues

[0004] In view of this, the technical problem to be solved by the present invention is how to reduce the quality inspection and maintenance costs of COF, display panel and display driver circuit board.

[0005] Solution

[0006] In order to solve the above technical problems, according to an embodiment of the utility model, a chip packaging structure is provided, including: a flexible substrate, an input gold finger, an output gold finger and a reinforcement sheet.

[0007] The input gold finger and the output gold finger are arranged on the front side of the flexible substrate and extend out of the flexible substrate;

[0008] The reinforcing sheet is fixed to a target area on the back side of the flexible substrate, the target area at least including an area on the back side corresponding to an area where the input gold finger is located, and the input gold finger is detachably connected to a connector on a display driver circuit board by means of the reinforcing sheet;

[0009] Wherein, the front side of the flexible substrate includes a circuit area, a solder resist area and a chip mounting area.

[0010] In a possible implementation, a locking mechanism is further provided on the reinforcing sheet for limiting the insertion depth of the input gold finger into the connector and / or limiting the relative position of the input gold finger and the connector when the input gold finger is detachably connected to the connector.

[0011] In a possible implementation, the locking mechanism and the reinforcement sheet are an integral structure, and the locking mechanism includes a first protrusion and a second protrusion extending from the reinforcement sheet body, wherein the extension direction of the first protrusion and the second protrusion is parallel to the arrangement direction of the input gold fingers, and the extension directions of the first protrusion and the second protrusion are opposite.

[0012] In a possible implementation, the input gold finger is arranged on a first side of the flexible substrate, the output gold finger is arranged on a second side of the flexible substrate opposite to the first side, and the first protrusion and the second protrusion are respectively arranged on two sides adjacent to the first side.

[0013] In a possible implementation, a display driver chip is installed in the chip mounting area, and each pin of the display driver chip is connected to the input gold finger or the output gold finger through a wiring arranged in the circuit area, and a solder resist layer is arranged on the solder resist area, and the solder resist layer covers the wiring, a partial area of ​​the input gold finger, and a partial area of ​​the output gold finger.

[0014] In a possible implementation manner, the circuit area is located within the range of the solder resist area.

[0015] In a possible implementation, the material of the reinforcing sheet includes polyimide, a first width of the reinforcing sheet is greater than a second width of the input gold finger, and a difference between the first width and the second width is 1 mm to 2 mm.

[0016] In order to solve the above technical problem, according to another embodiment of the utility model, a display device is provided, comprising: a plurality of display panels, a plurality of the above chip packaging structures and at least one display driving circuit board;

[0017] The input gold fingers on each chip packaging structure are detachably connected to the connector on the corresponding display driver circuit board by means of a reinforcement sheet, and the output gold fingers on each chip packaging structure are fixedly connected to a corresponding display panel.

[0018] In one possible implementation, the display panel includes at least one of a liquid crystal display panel, a micro light emitting diode display panel, a light emitting diode display panel, a mini light emitting diode display panel, a quantum dot light emitting diode display panel, an organic light emitting diode display panel, a cathode ray tube display panel, a digital light processing display panel, a field emission display panel, a plasma display panel, an electrophoretic display panel, an electrowetting display panel and a small pitch display panel.

[0019] In order to solve the above technical problem, according to another embodiment of the present utility model, an electronic device is provided, comprising the above display device.

[0020] Beneficial Effects

[0021] The chip packaging structure, display device and electronic device provided by the embodiment of the utility model reduce the complexity of chip packaging structure design and production through the fixed length reinforcement sheet, saving costs. It can be directly plugged into the display driver circuit board and can be quickly disassembled, saving system testing and maintenance costs. When verifying COF monomers, FOB (film on board) wiring is omitted, saving verification costs and shortening verification time.

[0022] Other features and aspects of the present invention will become apparent from the following detailed description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the invention and, together with the description, serve to explain the principles of the invention.

[0024] Figure 1 A top view of the front side of a chip packaging structure according to an embodiment of the present invention is shown.

[0025] Figure 2 A top view of the back side of a chip packaging structure according to an embodiment of the present invention is shown.

[0026] Figure 3 A schematic diagram of a chip packaging structure according to an embodiment of the present invention is shown.

[0027] Figure 4 A schematic structural diagram of a chip packaging structure according to an embodiment of the utility model is shown.

[0028] Figure 5 A schematic diagram of the processing flow of a chip packaging structure according to an embodiment of the utility model is shown. DETAILED DESCRIPTION

[0029] Various exemplary embodiments, features and aspects of the present invention will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise specified.

[0030] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0031] In addition, in order to better illustrate the utility model, numerous specific details are given in the specific embodiments below. It should be understood by those skilled in the art that the utility model can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the main purpose of the utility model.

[0032] Figure 1 A top view of the front side of a chip packaging structure according to an embodiment of the present invention is shown. Figure 2 A top view of the back side of a chip packaging structure according to an embodiment of the present invention is shown. Figure 3 FIG. 2 is a schematic diagram showing a chip packaging structure according to an embodiment of the present invention. Figure 1-Figure 3 As shown, the chip packaging structure mainly includes: a flexible substrate 10, an input gold finger 20, an output gold finger 30 and a reinforcing sheet 40. This is a chip packaging structure that is packaged and manufactured based on COF.

[0033] Among them, Figure 1 , Figure 3 As shown, the input gold finger 20 and the output gold finger 30 are arranged on the front side of the flexible substrate 10 and extend out of the flexible substrate 10 .

[0034] The reinforcing sheet 40 is fixed in a target area M on the back side of the flexible substrate 10, and the target area M at least includes an area on the back side corresponding to an area where the input gold finger 20 is located (i.e., an input gold finger installation area), and the input gold finger 20 is detachably connected to a connector on a display driver circuit board (also referred to as a screen driver circuit board) by means of the reinforcing sheet 40.

[0035] The front side of the flexible substrate 10 includes a circuit area 101, a solder resist area 102 and a chip mounting area 103. In some embodiments, the circuit area 101 is within the range of the solder resist area 102.

[0036] In this way, the fixed length reinforcement sheet reduces the complexity of design and production, saving costs. It can be directly plugged into the display driver circuit board and quickly disassembled. The COF is fastened to the connector of the display driver circuit board through the COF locking mechanism to ensure good connection performance and save system testing and maintenance costs. When verifying the COF unit, FOB (film on board) wiring is omitted, saving verification costs and shortening the verification process.

[0037] Figure 4 FIG. 1 is a schematic diagram showing a chip packaging structure according to an embodiment of the present invention. Figure 4As shown, a display driver chip 50 can be installed in the chip mounting area 103. The circuit area 101 is used to set the wiring 60, and the wiring 60 makes each pin of the display driver chip 50 correspondingly connected to the input gold finger 20 and the output gold finger 30 respectively. The solder resist area 102 is covered with a solder resist layer 70. The solder resist layer 70 at least covers the wiring 60. In some embodiments, the solder resist layer 70 can also cover a part of the input gold finger 20 and / or a part of the output gold finger 30, that is, the solder resist layer 70 can also cover a part of the input gold finger 20 and / or a part of the output gold finger 30. In some embodiments, the material of the solder resist layer 70 can be a solder resist material such as ink, and the utility model is not limited to this.

[0038] In some embodiments, a heat sink may be provided in the chip packaging structure, which at least covers the display driver chip 50 and contacts at least a portion of the top and side surfaces of the display driver chip 50 to achieve heat dissipation of the display driver chip 50.

[0039] In some embodiments, the material of the reinforcing sheet 40 may be a relatively hard material such as polyimide, and the first width w1 of the reinforcing sheet 40 is greater than the second width w2 of the input gold finger 20. In some embodiments, the difference between the first width w1 and the second width w2 may be 1 mm to 2 mm, so as to ensure that the entire area of ​​the input gold finger 20 is within the reinforcement range of the reinforcing sheet 40, and at the same time, avoid the reinforcing sheet 40 being too wide, which may cause the flexibility of the entire chip packaging structure to deteriorate and affect the use.

[0040] In some embodiments, a locking mechanism is also provided on the reinforcing sheet 40, which is used to limit the insertion depth of the input gold finger 20 into the connector and / or limit the relative position of the input gold finger 20 and the connector when the input gold finger 20 is detachably connected to the connector. In this way, it can be ensured that the input gold finger and the connector can be accurately connected. At the same time, the setting of the locking mechanism can still ensure the stability and reliability of the connection between the input gold finger 20 and the connector in the event of vibration, external force pulling, etc. during transportation and use, and prevent the chip packaging structure from falling off.

[0041] In some embodiments, the locking mechanism and the reinforcing sheet 40 may be an integral structure, such as Figure 2-Figure 4 As shown, the locking mechanism includes a first protrusion 401 and a second protrusion 402 extending from the reinforcing sheet body, the extending directions of the first protrusion 401 and the second protrusion 402 are parallel to the arrangement direction of the input gold fingers 20, and the extending direction S1 of the first protrusion 401 is opposite to the extending direction S2 of the second protrusion 402. In some embodiments, as Figure 3-Figure 4As shown, the input gold finger 20 is arranged on a first side of the flexible substrate 10, the output gold finger 30 is arranged on a second side of the flexible substrate 10 opposite to the first side, and the first protrusion 401 and the second protrusion 402 are respectively arranged on two sides adjacent to the first side.

[0042] Reference Figure 2-Figure 4 It can be known that the first protrusion 401 and the second protrusion 402 can themselves be part of the reinforcing sheet 40, and are arranged on both sides of the reinforcing sheet 40 in a form similar to "ears". In this way, when the input gold finger 20 is connected to the connector, the input gold finger 20 and the reinforcing sheet 40 are inserted into the connector together, and are engaged with the limiting mechanism in the connector under the action of the first protrusion 401 and the second protrusion 402.

[0043] Among them, the thickness of the reinforcement sheet can be set according to the structural size of the connector to which the input gold finger 20 is to be connected, so as to ensure that the input gold finger 20 and the reinforcement sheet 40 can be inserted into the connector together, and ensure that the gold finger 20 and the reinforcement sheet 40 can be smoothly pulled out of the connector when maintenance or replacement is required.

[0044] In this embodiment, the locking mechanism includes a first protrusion 401 and a second protrusion 402 extending from the reinforcing sheet, which can also simplify the processing of the chip packaging structure and improve the processing efficiency and speed. Figure 5 As shown, the transmission holes SPH and the limiting holes can be set in the entire flexible substrate to be cut according to the size of the required chip packaging structure and the size of the reinforcing sheet, so that the reinforcing sheet to be cut can be mounted based on the two limiting holes and the two SPHs near the limiting holes to achieve accurate positioning of the reinforcing attachment area, thereby ensuring the accurate mounting of the reinforcing sheet to be cut. Then the manufacturing process can be: after completing the production of the input gold finger and the output gold finger on the front of the flexible substrate, the reinforcing sheet to be cut is mounted to the reinforcing attachment area based on the two limiting holes and the two SPHs near the limiting holes. Then the flexible substrate to be cut and the reinforcing sheet to be cut are cut along the cutting line to obtain the chip packaging structure. In this way, since the flexible substrate to be cut is also cut to obtain the finished product in the normal processing process, the setting of the utility model only needs to add a pasting step of the reinforcing sheet to be cut in the normal processing process, and then the reinforcing sheet to be cut is completed by the way in the process of cutting the flexible substrate to be cut, and the process is simple and easy.

[0045] In some embodiments, the locking mechanism can also be a protrusion or other structure provided on the reinforcement plate 40. The implementation method of the locking mechanism can be set according to actual needs, under the premise of ensuring that the locking mechanism can limit the insertion depth of the input gold finger into the connector and limit the relative position of the input gold finger and the connector. The present utility model does not impose any restrictions on this.

[0046] The utility model also provides a display device, which includes: multiple display panels, multiple chip packaging structures and at least one display driver circuit board. The input gold finger 20 on each chip packaging structure is detachably connected to the connector on the corresponding display driver circuit board by means of a reinforcement sheet 40, and the output gold finger 30 on each chip packaging structure is fixedly connected to a corresponding display panel. In this way, when there is a need for replacement (such as maintenance or testing), since the chip packaging structure and the display driver circuit board are detachably connected, the display panel and the chip packaging structure can be directly replaced, and the display driver circuit board is retained, which saves the operation process, reduces the operation time, and saves costs.

[0047] In some embodiments, the display panel may include at least one of a liquid crystal display panel, a micro light emitting diode display panel, a light emitting diode display panel, a mini light emitting diode display panel, a quantum dot light emitting diode display panel, an organic light emitting diode display panel, a cathode ray tube display panel, a digital light processing display panel, a field emission display panel, a plasma display panel, an electrophoretic display panel, an electrowetting display panel, and a small pitch display panel.

[0048] The utility model also provides an electronic device, comprising the above-mentioned display device.

[0049] Exemplarily, the electronic devices in this embodiment include but are not limited to desktop computers, televisions, mobile devices with large screens such as mobile phones, tablet computers, and other common electronic devices that require multiple chips to be cascaded to achieve driving.

[0050] Exemplarily, the electronic device may also be a user equipment (UE), a mobile device, a user terminal, a terminal, a handheld device, a computing device or a vehicle-mounted device, etc., which needs to display content. Exemplarily, some examples of terminals are: displays, smart phones or portable devices, mobile phones, tablet computers, laptops, PDAs, mobile Internet devices (MID), wearable devices, virtual reality (VR) devices, augmented reality (AR) devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical surgery, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, wireless terminals in smart homes, wireless terminals in Internet of Vehicles, etc.

[0051] It should be noted that although the above embodiments are used as examples to introduce the chip packaging structure, display device and electronic device, those skilled in the art will understand that the present invention should not be limited thereto. In fact, users can flexibly set each component according to personal preferences and / or actual application scenarios, as long as they comply with the technical solution of the present invention.

[0052] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A chip packaging structure, characterized in that: include: Flexible substrate, input gold finger, output gold finger and reinforcement sheet, The input gold finger and the output gold finger are arranged on the front side of the flexible substrate and extend out of the flexible substrate; The reinforcing sheet is fixed to a target area on the back side of the flexible substrate, the target area at least including an area on the back side corresponding to an area where the input gold finger is located, and the input gold finger is detachably connected to a connector on a display driver circuit board by means of the reinforcing sheet; Wherein, the front side of the flexible substrate includes a circuit area, a solder resist area and a chip mounting area.

2. The chip packaging structure according to claim 1, characterized in that: The reinforcing sheet is also provided with a locking mechanism for limiting the insertion depth of the input golden finger into the connector and / or limiting the relative position of the input golden finger and the connector when the input golden finger is detachably connected to the connector.

3. The chip packaging structure according to claim 2, characterized in that: The locking mechanism is an integral structure with the reinforcement sheet, and includes a first protrusion and a second protrusion extending from the reinforcement sheet body, wherein the extension direction of the first protrusion and the second protrusion is parallel to the arrangement direction of the input gold fingers, and the extension directions of the first protrusion and the second protrusion are opposite.

4. The chip packaging structure according to claim 3, characterized in that: The input gold finger is arranged on a first side of the flexible substrate, the output gold finger is arranged on a second side of the flexible substrate opposite to the first side, and the first protrusion and the second protrusion are respectively arranged on two sides adjacent to the first side.

5. The chip packaging structure according to claim 1, characterized in that: A display driver chip is installed in the chip mounting area, and each pin of the display driver chip is connected to the input gold finger or the output gold finger through a wiring arranged in the circuit area. A solder resist layer is arranged on the solder resist area, and the solder resist layer covers the wiring, a partial area of ​​the input gold finger, and a partial area of ​​the output gold finger.

6. The chip packaging structure according to claim 5, characterized in that: The circuit area is located within the range of the solder resist area.

7. The chip packaging structure according to claim 1, characterized in that: The reinforcing sheet is made of polyimide, a first width of the reinforcing sheet is greater than a second width of the input gold finger, and a difference between the first width and the second width is 1 mm to 2 mm.

8. A display device, characterized in that: include: A plurality of display panels, a plurality of chip packaging structures and at least one display driver circuit board, wherein the chip packaging structure comprises the chip packaging structure according to any one of claims 1 to 7; The input gold fingers on each chip packaging structure are detachably connected to the connector on the corresponding display driver circuit board by means of a reinforcement sheet, and the output gold fingers on each chip packaging structure are fixedly connected to a corresponding display panel.

9. The display device according to claim 8, characterized in that The display panel includes at least one of a liquid crystal display panel, a micro light emitting diode display panel, a light emitting diode display panel, a mini light emitting diode display panel, a quantum dot light emitting diode display panel, an organic light emitting diode display panel, a cathode ray tube display panel, a digital light processing display panel, a field emission display panel, a plasma display panel, an electrophoretic display panel, an electrowetting display panel and a small pitch display panel.

10. An electronic device, characterized in that: A display device comprising the display device described in claim 8 or 9.

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