Double-sided pin type packaging structure

Abstract

The utility model provides a double-sided pin type packaging structure, comprising a plastic package body having a first surface and a second surface which are oppositely arranged in a first direction; the base island is arranged on the first surface of the plastic package body, and the surface of the base island is exposed out of the first surface; the chip is arranged on the surface, deviating from the first surface of the plastic package body, of the base island; the first pin is arranged on the first surface of the plastic package body, and the surface of the first pin is exposed out of the first surface; the lead is arranged in the plastic package body, one end of the lead is connected with the chip, and the other end of the lead is connected with the first pin; and the second pin is arranged on the second surface of the plastic package body, the surface of the second pin is exposed on the second surface, and the surface, deviating from the second surface, of the second pin is connected with the lead on the extension path of the lead. According to the packaging structure, the reliability of the packaging structure is ensured while the heat dissipation performance of the packaging structure is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a double-sided pin type packaging structure. Background Art

[0002] QFN (Quad Flat No-lead) / DFN (Dual Flat No-lead Package) packaging is an advanced packaging form. It has the advantages of small size, high density, good thermal conductivity, etc., and is widely used in the field of integrated circuit packaging.

[0003] The traditional QFN / DFN has a relatively simple heat dissipation channel. Since it can only rely on the back of the base island located in the center of the bottom of the package to dissipate heat, and its heat dissipation area is small, the heat dissipation speed is slow. To improve this phenomenon, the industry has introduced reverse QFN / DFN. Reverse QFN / DFN sets the base island and the external pins on two opposite surfaces of the plastic package, so that the base island can dissipate heat upwards. However, its internal pins are an overhead structure, which is easy to cause abnormal operation or poor solder joint bonding due to jitter during wire bonding operations, causing reliability problems.

[0004] Therefore, how to improve the heat dissipation performance of the QFN / DFN packaging structure while ensuring the reliability of the packaging structure has become one of the technical problems that need to be solved urgently. Summary of the invention

[0005] The technical problem to be solved by the utility model is to provide a new packaging structure, which can improve the heat dissipation performance of the packaging structure while ensuring the reliability of the packaging structure.

[0006] In order to solve the above problems, the utility model provides a packaging structure, which includes: a plastic package body, having a first surface and a second surface arranged opposite to each other in a first direction; a base island, arranged on the first surface of the plastic package body, and a surface exposed to the first surface; a chip, arranged on the surface of the base island away from the first surface of the plastic package body; a first pin, arranged on the first surface of the plastic package body, and a surface exposed to the first surface; a lead, arranged in the plastic package body, one end of the lead is connected to the chip, and the other end is connected to the first pin; a second pin, arranged on the second surface of the plastic package body, and a surface exposed to the second surface, and on the extension path of the lead, the surface of the second pin away from the second surface is connected to the lead.

[0007] In one embodiment, on the second side, the surface of the plastic package body has a recessed area, part of the lead is exposed in the recessed area, and the second pin is mounted in the recessed area to be connected to the lead.

[0008] In one embodiment, the recessed area is disposed at an edge of the second surface of the plastic package body, and a side surface of the second pin is exposed to the side surface of the plastic package body.

[0009] In one embodiment, the recessed area is disposed within an edge of the second surface of the plastic package body, and a side surface of the second pin is covered by the plastic package body.

[0010] In one embodiment, a highest region of the lead in the first direction is connected to a surface of the second pin facing away from the second surface.

[0011] In one embodiment, on the second surface, the surface of the plastic package body is a flat surface, and the surface of the second pin protrudes from the second surface.

[0012] In one embodiment, a solder block is further included. The solder block is disposed in the plastic package and located on an extension path of the lead. The second pin is welded to the solder block and further connected to the lead.

[0013] In one embodiment, on the second surface, the surface of the plastic package body has a recessed area, and the solder block is arranged at the bottom of the recessed area.

[0014] In one embodiment, a groove is provided on the second surface of the plastic package body, and the groove cuts off the lead on the extension path of the lead, and the cross section of the lead is exposed to the side wall of the groove. The solder block is arranged in the groove and connected to the cross section of the lead.

[0015] In one embodiment, a groove is provided on the second surface of the plastic package body, and the lead is exposed at the bottom of the groove on the extension path of the lead. The solder block is provided in the groove and connected to the surface of the lead.

[0016] In one embodiment, the plastic package body covers the base island and a portion of the surface of the first pin, and fills the space between the base island and the first pin.

[0017] In one embodiment, in the second direction, the side surface of the second pin facing the plastic package body protrudes beyond the side surface of the first pin facing the plastic package body, and the second direction is perpendicular to the first direction.

[0018] In the double-sided pin-type packaging structure provided by the embodiment of the utility model, the first pin and the base island are located on the same side of the plastic package body, that is, the first pin and the base island are basically located on the same horizontal plane, and there is no situation where the first pin is suspended. Therefore, when the wire bonding operation is performed on the surface of the first pin, the wire bonding operation is stable, and no abnormal operation or poor solder joint bonding will be caused by jitter, thereby improving the reliability of the packaging structure. At the same time, the lead is connected to the second pin, so that the electrical signal of the chip can be output through the second pin. The second pin and the base island are located on different sides of the plastic package body, which can realize the upward heat dissipation of the base island, and the heat can be dissipated above the base island by water cooling or other means, further improving the heat dissipation performance of the packaging structure. In this double-sided pin-type packaging structure, the lead is connected to the first pin and the second pin, so that there are pins on both the upper and lower sides of the packaging structure for electrical output, which can meet more packaging unit integration and application scenario requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 It is a schematic diagram of a reverse QFN / DFN package structure;

[0021] Figure 2 It is a schematic diagram of a double-sided pin-type packaging structure provided by an embodiment of the utility model;

[0022] Figure 3 It is a schematic diagram of removing the second pin from the packaging structure provided by an embodiment of the utility model;

[0023] Figure 4 It is a schematic diagram of a packaging structure provided by an embodiment of the utility model;

[0024] Figure 5 It is a schematic diagram of a packaging structure provided by an embodiment of the utility model;

[0025] Figure 6 yes Figure 5 Schematic diagram of removing the second pin and solder block;

[0026] Figure 7 is a schematic diagram of a packaging structure provided by another embodiment of the utility model;

[0027] Figure 8 yes Figure 7Schematic diagram of removing the second pin and solder block;

[0028] Fig. 9 is a schematic diagram of a packaging structure provided by yet another embodiment of the utility model;

[0029] Fig.10 yes Fig. 9 Schematic diagram of removing the second pin and solder block;

[0030] Fig.11 It is a schematic diagram of a packaging structure provided by yet another embodiment of the utility model. DETAILED DESCRIPTION

[0031] like Figure 1 As shown, it is a schematic diagram of a reverse QFN / DFN packaging structure, in which the base island 110 and the outer pin 111A are arranged on two opposite surfaces (such as the bottom surface and the top surface) of the plastic package 112, the inner pin 111B is arranged in the plastic package 112, and the chip 113 is arranged on the surface of the base island 110 facing the inside of the plastic package 112, and is connected to the side of the inner pin 111B facing the bottom surface of the plastic package 112 through the lead 114, wherein the inner pin 111B and the outer pin 111A are different regions of the same pin. In this packaging structure, the base island 110 can dissipate heat upward, thereby increasing the heat dissipation performance of the packaging structure. Since the inner pin 111B and the base island 110 are located at different horizontal planes, and the inner pin 111B is an overhead structure, when the wire bonding operation is performed on the side of the inner pin 111B facing the bottom surface of the plastic package 112, it is easy to cause abnormal operation or poor solder joint bonding due to jitter, affecting the reliability of the packaging structure.

[0032] In view of the above technical problems existing in the packaging structure, the utility model provides a double-sided pin type packaging structure, in which the base island can dissipate heat upward and there are no overhead inner pins, which greatly improves the reliability of the packaging structure.

[0033] The specific implementation of the double-sided pin type packaging structure provided by the utility model is described in detail below with reference to the accompanying drawings.

[0034] Figure 2 This is a schematic diagram of a double-sided pin package structure provided by an embodiment of the utility model. Figure 2The packaging structure includes a plastic package body 200, having a first surface 201 and a second surface 202 arranged opposite to each other in a first direction D1; a base island 210, arranged on the first surface 201 of the plastic package body 200, and a surface exposed to the first surface 201; a chip 220, arranged on a surface of the base island 210 away from the first surface 201 of the plastic package body 200; a first pin 230, arranged on the first surface 201 of the plastic package body 200, and a surface exposed to the first surface 201; a lead 240, arranged in the plastic package body 200, one end of the lead 240 is connected to the chip 220, and the other end is connected to the first pin 230; a second pin 250, arranged on the second surface 202 of the plastic package body 200, and a surface exposed to the second surface 202, and on the extension path of the lead 240, the surface of the second pin 250 away from the second surface 202 is connected to the lead 240.

[0035] In the double-sided pin type packaging structure provided by the embodiment of the utility model, the first pin 230 and the base island 210 are located on the same side of the plastic package 200, that is, the first pin 230 and the base island 210 are basically located on the same horizontal plane, and there is no situation where the first pin 230 is suspended. Therefore, when the wire bonding operation is performed on the surface of the first pin 230, the wire bonding operation is stable, and no abnormal operation or poor solder joint bonding due to jitter will be caused, thereby improving the reliability of the packaging structure. At the same time, the lead 240 is connected to the second pin 250, so that the electrical signal of the chip 220 can be output through the second pin 250. The second pin 250 and the base island 210 are located on different sides of the plastic package 200, so that the base island 210 can dissipate heat upward, and the heat can be dissipated above the base island 210 by water cooling or other methods, further improving the heat dissipation performance of the packaging structure. In the double-sided pin-type packaging structure, the lead 240 is connected to the first pin 230 and the second pin 250, so that there are pins on both the upper and lower sides of the packaging structure for electrical output, which can meet more packaging unit integration and application scenario requirements.

[0036] In some embodiments, the first surface 201 and the second surface 202 of the plastic packaging body 200 refer to two surfaces of the plastic packaging body 200 that are relatively arranged in the first direction D1. In this embodiment, the first surface 201 of the plastic packaging body 200 is the bottom surface of the plastic packaging body 200, and the second surface 202 of the plastic packaging body 200 is the top surface of the plastic packaging body 200.

[0037] The base island 210 dissipates heat through the exposed surface. Specifically, the base island 210 is located in the plastic package body 200, and the bottom surface of the base island 210 is exposed to the first surface 201 of the plastic package body 200, and the base island 210 dissipates heat through the bottom surface.

[0038] The chip 220 can be arranged on the surface of the base island 210 away from the first surface 201 of the plastic package body 200 through an adhesive layer 221. Specifically, the chip 220 is arranged on the top surface of the base island 210 through the adhesive layer 221, and the top surface and the bottom surface of the base island 210 are arranged opposite to each other in the first direction D1.

[0039] The first pin 230 is located in the plastic package 200, and the first pin 230 can be electrically connected to an external device through the exposed surface. Specifically, the first pin 230 has a top surface and a bottom surface that are arranged opposite to each other in the first direction D1, the bottom surface of the first pin 230 is exposed to the first surface 201 of the plastic package 200, and is used to be electrically connected to an external device, and the top surface of the first pin 230 is located in the plastic package 200, and is used to be connected to the lead 240. In this embodiment, one side of the first pin 230 is also exposed to the side of the plastic package 200 to increase the electrical connection area of ​​the first pin 230; in other embodiments, the side surfaces of the first pin 230 are covered by the plastic package 200 to strengthen the support and protection of the first pin 230.

[0040] In one embodiment, the base island 210 and the first pins 230 may be formed on the same lead frame, which can further ensure that the base island 210 and the first pins 230 are substantially located at the same horizontal plane.

[0041] In some embodiments, the plastic package 200 covers the base island 210 and a portion of the surface of the first pin 230, and fills between the base island 210 and the first pin 230 to improve the strength of the package structure. Specifically, in this embodiment, the plastic package 200 covers the side surface of the base island 210 and the top surface of the base island 210, a portion of the side surface of the first pin 230 and the top surface of the first pin 230, and fills between the base island 210 and the first pin 230 to increase the stability of the package structure.

[0042] In this embodiment, one end of the lead 240 is connected to the top surface of the chip 220, and the other end is connected to the top surface of the first pin 230, and the lead 240 is formed by a wire bonding process. Since the first pin 230 and the base island 210 are located on the same side of the plastic package 200, that is, the first pin 230 and the base island 210 are basically located on the same horizontal plane, when the wire bonding operation is performed to form the lead 240, the wire bonding operation is stable, and there will be no abnormal operation or poor solder joint bonding due to jitter, thereby improving the reliability of the packaging structure.

[0043] The second pin 250 is located outside the plastic package 200 and on the second surface 202 of the plastic package 200. The second pin 250 can be electrically connected to an external device through the surface not covered by the plastic package 200. Specifically, the second pin 250 has a top surface and a bottom surface that are arranged opposite to each other in the first direction D1. The top surface of the second pin 250 is not covered by the plastic package 200 and is used to be electrically connected to an external device. The bottom surface of the second pin 250 faces the plastic package 200 and is used to be connected to the lead 240. The second pin 250 and the base island 210 are located on opposite sides of the plastic package 200. After the second pin 250 is mounted on the PCB board, the base island 210 can dissipate heat upward, and heat can be dissipated above the base island 210 by water cooling or other means, further improving the heat dissipation performance of the packaging structure.

[0044] On the extension path of the lead 240, the surface of the second pin 250 away from the second surface 202 is connected to the lead 240, wherein the extension path of the lead 240 refers to the path passed by the lead 240. In some embodiments, on the extension path of the lead 240, the highest area of ​​the lead 240 in the first direction D1 is connected to the surface of the second pin 250 away from the second surface 202. Specifically, the lead 240 is arc-shaped, and the highest area of ​​the lead 240 in the first direction D1 is the highest area of ​​the arc, which is connected to the bottom surface of the second pin 250.

[0045] In some embodiments, in the second direction D2, the side of the second pin 250 facing the plastic package body 200 protrudes beyond the side of the first pin 230 facing the plastic package body 200, that is, the vertical distance between the second pin 250 and the base island 210 is smaller than the vertical distance between the first pin 230 and the base island 210, or the second pin 250 and the base island 210 partially overlap in the first direction D1, which can further ensure that the second pin 250 is connected to the lead 240 on the extension path of the lead 240. The second direction D2 is perpendicular to the first direction D1. In this embodiment, the first direction D1 is the Z direction in the Cartesian coordinate system, and the second direction D2 is the X direction in the Cartesian coordinate system.

[0046] In some embodiments, see Figure 2 and Figure 3 ,in, Figure 3The schematic diagram of removing the second pin 250 from the packaging structure provided in one embodiment of the utility model, on the second surface 202 of the plastic package body 200, the surface of the plastic package body 200 has a recessed area 203, part of the lead 240 is exposed in the recessed area 203, and the second pin 250 is mounted in the recessed area 203 to be connected with the lead 240. In some embodiments, the second pin 250 can be adhered to the bottom of the recessed area 203 through a conductive layer (not shown in the drawings), and the bottom surface of the second pin 250 is electrically connected to the lead 240 through the conductive layer.

[0047] In some embodiments, the recessed area 203 is disposed at the edge of the second surface 202 of the plastic package 200, and after the second lead 250 is mounted on the recessed area 203, one side of the second lead 250 is exposed to the side of the plastic package 200. In some embodiments, in the process of forming the packaging structure, after the plastic package 200 is formed, the edge of the plastic package 200 is ground until the lead 240 is exposed, thereby forming the recessed area 203.

[0048] In some embodiments, the recessed area 203 is disposed within the edge of the second surface 202 of the plastic package 200, and the side surface of the second pin 250 is covered by the plastic package 200. Figure 4 As shown, it is a schematic diagram of a packaging structure provided by an embodiment of the utility model. In this embodiment, the recessed area 203 is arranged within the edge of the second surface 202 of the plastic package body 200, that is, the recessed area 203 is a groove recessed toward the plastic package body 200, and the second pin 250 is arranged in the groove. The side surfaces of the second pin 250 are all covered by the plastic package body 200, and only the top surface is exposed to the plastic package body 200.

[0049] In the above embodiment, the lead 240 is exposed at the bottom of the recessed area 203, and can be directly connected to the second pin 250, or electrically connected through a conductive layer. In other embodiments, the double-sided pin type package structure further includes a solder block 270 (shown in FIG. Figure 5 ), the solder block 270 is disposed in the plastic package 200 and is located on the extension path of the lead 240 , and the second pin 250 is welded to the solder block 270 and further connected to the lead 240 .

[0050] Specifically, see Figure 5, which is a schematic diagram of a packaging structure provided by an embodiment of the utility model. In this embodiment, on the second surface 202, the surface of the plastic package body 200 has a recessed area 203, the solder block 270 is arranged at the bottom of the recessed area 203 and is located on the extension path of the lead 240, and the second pin 250 is welded to the solder block 270 and further connected to the lead 240. The solder block 270 being located on the extension path of the lead 240 includes the solder block 270 cutting off the lead 240, or the solder block 270 contacting the surface of the lead 240.

[0051] In this embodiment, the top surface of the lead 240 is exposed to the bottom surface of the recessed area 203, the solder block 270 extends into the plastic package 200 and cuts off the lead 240, and the solder block 270 is connected to the cross section of the lead 240, and the bottom surface of the second pin 250 is connected to the solder block 270, thereby electrically connecting the second pin 250 to the lead 240. The solder block 270 can realize the electrical connection between the second pin 250 and the lead 240, and can assist the second pin 250 to be mounted on the surface of the plastic package 200. In some embodiments, a groove 204 is provided on the second surface 202 of the plastic package body 200, for example, at the bottom of the recessed area 203. On the extension path of the lead 240, the groove 204 cuts off the lead 240, and the cross section of the lead 240 is exposed to the side wall of the groove 204. The solder block 270 is provided in the groove 204 and connected to the cross section of the lead 240. Specifically, please refer to Figure 6 , which is Figure 5 Schematic diagram of removing the second pin 250 and the solder block 270. On the extension path of the lead 240, the groove 204 cuts off the lead 240, and the cross section of the lead 240 is exposed to the side wall of the groove 204. In some embodiments, in the process of forming the packaging structure, after forming the recessed area 203, the groove 204 can be formed by a through molding via (TMV) process; and then solder is filled in the groove 204 to form the solder block 270. Please refer to Figure 5 .

[0052] In other embodiments, the top surface of the lead 240 is located in the plastic package 200, that is, the top surface of the lead 240 is not exposed to the bottom surface of the recessed area 203, and the solder block 270 extends into the plastic package 200, cuts off the lead 240 and connects to the cross section of the lead 240. For example, see Figure 7, which is a schematic diagram of a packaging structure provided by another embodiment of the utility model. In this embodiment, the top surface of the lead 240 is not exposed to the bottom surface of the recessed area 203, and the solder block 270 extends into the plastic package 200 and cuts off the lead 240. In the process of forming the packaging structure, after the plastic package 200 is formed, the edge of the plastic package 200 is ground to a preset distance from the lead 240 to form the recessed area 203, and the top surface of the lead 240 is not exposed to the bottom surface of the recessed area 203. In this embodiment, please refer to Figure 8 , which is Figure 7 Schematic diagram of removing the second pin 250 and the solder block 270, the second surface 202 of the plastic package body 200, for example, at the bottom of the recessed area 203, is provided with a groove 204, and the groove 204 cuts off the lead 240 on the extension path of the lead 240, and the cross section of the lead 240 is exposed to the side wall of the groove 204. In some embodiments, in the process of forming the packaging structure, after forming the recessed area 203, the groove 204 can be formed by a through molding via (TMV) process; and then the solder is filled in the groove 204 to form the solder block 270, see Figure 7 .

[0053] In some other embodiments, the solder block 270 does not cut through the lead 240 and is connected to the surface of the lead 240. For example, see Fig. 9 , which is a schematic diagram of a packaging structure provided by another embodiment of the utility model. In this embodiment, the top surface of the lead 240 is not exposed to the bottom surface of the recessed area 203, and the solder block 270 extends into the plastic package 200 and is connected to the surface of the lead 240. In this embodiment, please refer to Fig.10 , which is Fig. 9 Schematic diagram of removing the second pin 250 and the solder block 270, the second surface 202 of the plastic package body 200, for example, at the bottom of the recessed area 203, is provided with a groove 204, and the lead 240 is exposed at the bottom of the groove 204 on the extension path of the lead 240. In some embodiments, in the process of forming the packaging structure, after forming the recessed area 203, the groove 204 can be formed by a through molding via (TMV) process; and then solder is filled in the groove 204 to form the solder block 270, see Fig. 9 .

[0054] In some other embodiments, on the second surface 202, the surface of the plastic package body 200 is a flat surface, and the surface of the second pin 250 protrudes from the second surface 202, which facilitates the welding of the second pin 250 and components such as a PCB board, and the packaging structure has good solderability. Fig.11 , which is a schematic diagram of a packaging structure provided by another embodiment of the utility model. In this embodiment, the recessed area does not exist on the surface of the plastic package body 200, the second surface 202 is a flat surface, the highest area of ​​the lead 240 in the first direction D1 is exposed to the second surface 202, and the second pin 250 is mounted on the second surface 202 and connected to the lead 240. In some embodiments, when preparing the double-sided pin-type packaging structure, the height of the plastic molding mold can be controlled so that the plastic molding compound does not cover the highest area of ​​the lead 240, thereby exposing the highest area of ​​the lead 240 in the first direction D1 to the second surface 202. Alternatively, after forming the plastic molding body 200, the plastic molding body 200 is ground to expose the highest area of ​​the lead 240 in the first direction D1. After molding or grinding, the second surface 202 of the plastic molding body 200 is a flat surface, and the second pin 250 is mounted on the second surface 202, that is, the second pin protrudes from the second surface 202 of the plastic molding body 200, which facilitates the welding of the second pin 250 with devices such as a PCB board, and the packaging structure has good solderability.

[0055] In some embodiments, on the second surface 202, the surface of the plastic package body 200 is a flat surface, and the solder block 270 may be further disposed on the second surface 202 of the plastic package body 200, and the solder block 270 is located on the extension path of the lead 240. The solder block 270 being located on the extension path of the lead 240 includes the solder block 270 cutting off the lead 240, or the solder block 270 being in contact with the surface of the lead 240. The specific arrangement of the solder block 270 may be referred to in Figure 5 , Figure 7 or Fig. 9 .

[0056] The method for forming a double-sided pin-type packaging structure provided in an embodiment of the utility model comprises the following steps: providing a lead frame, wherein the lead frame comprises the first pin 230 and the base island 210; pasting the chip 220 on the base island 210; performing a wire bonding operation to form the lead 240, wherein one end of the lead 240 is connected to the chip 220, and the other end is connected to the first pin 230; and performing a plastic encapsulation to form the plastic encapsulation body 200, wherein the plastic encapsulation body 200 covers the lead 240, a part of the surface of the first pin 230, and a part of the surface of the base island 210, wherein the base A surface of the island 210 and a surface of the first pin 230 are both exposed to the first surface 201 of the plastic package body 200; on the second surface 202 of the plastic package body 200, the edge area of ​​the plastic package body 200 is ground to form a recessed area 203, or the second surface 202 of the plastic package body 200 is ground to form a flat surface, or the height of the plastic package mold is controlled during plastic packaging so that the plastic packaging material does not cover the highest area of ​​the lead 240; the second pin 250 is mounted on the recessed area 203, and the second pin 250 is connected to the lead 240 on the extension path of the lead 240.

[0057] In the double-sided pin-type packaging structure provided by the embodiment of the utility model, the first pin 230 and the base island 210 are basically located at the same horizontal plane, and there is no situation where the first pin 230 is suspended. The wire bonding operation is stable, and there will be no abnormal operation or poor solder joint bonding due to jitter, thereby improving the reliability of the packaging structure. In addition, in the double-sided pin-type packaging structure, the second pin 250 and the base island 210 are located on different sides of the plastic package 200, which can achieve the upward heat dissipation of the base island 210, and the heat can be dissipated above the base island 210 by water cooling or other methods, thereby improving the heat dissipation performance of the packaging structure. At the same time, the upper and lower surfaces of the packaging structure can both output electrical properties, which can meet the needs of more packaging unit integration and application scenarios.

[0058] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present utility model are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, unless the context clearly indicates, and it should be understood that the data used in this way can be interchanged under appropriate circumstances. The term "one or more" depends at least in part on the context, and can be used to describe features, structures or characteristics in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. The term "based on" can be understood as not necessarily intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow the presence of other factors that are not necessarily explicitly described. In addition, in the absence of conflict, the embodiments of the present utility model and the features in the embodiments can be combined with each other. In addition, in the above description, the description of known components and technologies is omitted to avoid unnecessary confusion of the concept of the present utility model. In the above embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0059] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A double-sided pin type packaging structure, characterized in that: include: The plastic package body has a first surface and a second surface which are arranged opposite to each other in a first direction; A base island, disposed on the first surface of the plastic package body, and with a surface exposed to the first surface; A chip is arranged on a surface of the base island away from the first surface of the plastic package body; A first pin is disposed on the first surface of the plastic package body, and a surface thereof is exposed to the first surface; A lead wire is disposed in the plastic package, one end of the lead wire is connected to the chip, and the other end of the lead wire is connected to the first pin; The second pin is arranged on the second surface of the plastic package body and has a surface exposed to the second surface. On the extension path of the lead, the surface of the second pin facing away from the second surface is connected to the lead.

2. The double-sided pin type packaging structure according to claim 1, characterized in that: On the second surface, the surface of the plastic package body has a recessed area, part of the lead is exposed in the recessed area, and the second pin is mounted in the recessed area to be connected to the lead.

3. The double-sided pin type packaging structure according to claim 2, characterized in that: The recessed area is arranged at the edge of the second surface of the plastic package body, and one side surface of the second pin is exposed to the side surface of the plastic package body.

4. The double-sided pin type packaging structure according to claim 2, characterized in that: The recessed area is arranged within the edge of the second surface of the plastic package body, and the side surface of the second pin is covered by the plastic package body.

5. The double-sided pin type packaging structure according to claim 1, characterized in that: A highest region of the lead in the first direction is connected to a surface of the second pin facing away from the second surface.

6. The double-sided pin type packaging structure according to claim 1, characterized in that: On the second surface, the surface of the plastic package body is a flat surface, and the surface of the second pin protrudes from the second surface.

7. The double-sided pin type packaging structure according to claim 1, characterized in that: It also includes a solder block, which is arranged in the plastic package and located on the extension path of the lead. The second pin is welded to the solder block and further connected to the lead.

8. The double-sided pin type packaging structure according to claim 7, characterized in that: On the second surface, the surface of the plastic package body has a recessed area, and the solder block is arranged at the bottom of the recessed area.

9. The double-sided pin type packaging structure according to claim 7, characterized in that: A groove is arranged on the second surface of the plastic package body, and the groove cuts off the lead on the extension path of the lead. The cross section of the lead is exposed to the side wall of the groove, and the solder block is arranged in the groove and connected to the cross section of the lead.

10. The double-sided pin type packaging structure according to claim 7, characterized in that: A groove is arranged on the second surface of the plastic package body. On the extension path of the lead, the lead is exposed at the bottom of the groove. The solder block is arranged in the groove and connected to the surface of the lead.

11. The double-sided lead type package structure according to any one of claims 1 to 10, characterized in that: The plastic package body covers the base island and a portion of the surface of the first pin, and fills the space between the base island and the first pin.

12. The double-sided lead type package structure according to any one of claims 1 to 10, characterized in that: In the second direction, the second pin protrudes toward the side of the plastic package body more than the side of the first pin toward the plastic package body, and the second direction is perpendicular to the first direction.

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