Diode heat dissipation device

Abstract

The utility model relates to the technical field of diodes, in particular to a diode heat dissipation device, which comprises a printed board, a ceramic substrate is mounted on the upper surface of the printed board, mounting seats are symmetrically arranged on the upper surface of the ceramic substrate, a PIN diode is arranged between the mounting seats, pins of the PIN diode are detachably connected with the mounting seats, and the pins of the PIN diode are detachably connected with the mounting seats. According to the utility model, the PIN diode is arranged on the upper surface of the ceramic base and is in contact with the ceramic base through the arrangement of the mounting seat, heat dissipation is carried out on the PIN diode by utilizing the heat dissipation performance of ceramic, and the heat dissipation performance of the PIN diode is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of diodes, in particular to a diode heat dissipation device. Background Art

[0002] The PIN diode is composed of a thin layer of low-doped intrinsic semiconductor layer added between P and N semiconductor materials. Because of the existence of the intrinsic layer, the PIN diode is widely used, ranging from low-frequency to high-frequency applications.

[0003] PIN diodes are commonly used in high-frequency communications, optical communications, radar receivers, photodetectors, and other fields. In photodetectors, it can convert optical signals into electrical signals. In radar receivers, it is used to receive and amplify weak radio frequency signals.

[0004] In the actual development and design of optical communication products, PIN diodes are sensitive to ambient temperature, which will affect their detection efficiency. Therefore, it is necessary to dissipate heat for the PIN diodes. Utility Model Content

[0005] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a diode heat dissipation device, which utilizes the heat dissipation performance of ceramics to dissipate heat for a PIN diode, thereby greatly improving the heat dissipation performance of the PIN diode.

[0006] The purpose of the utility model is achieved through the following technical scheme: a diode heat dissipation device, comprising a printed circuit board, a ceramic substrate is installed on the upper surface of the printed circuit board, mounting seats are symmetrically arranged on the upper surface of the ceramic substrate, a PIN diode is arranged between the mounting seats, the pins of the PIN diode are detachably connected to the mounting seats, the mounting seats are connected to a second connecting piece, and the other end of the second connecting piece is connected to the printed circuit board circuit.

[0007] Preferably, the second connecting piece is made of a copper sheet, and the second connecting piece is connected to the printed circuit board by welding.

[0008] Preferably, the ceramic substrate comprises a base and a support base, and the PIN diode is arranged inside the support base.

[0009] Preferably, the mounting seat includes a mounting plate, the mounting plate is fixedly mounted on the upper surface of the ceramic substrate, and a pressing plate is detachably connected to the mounting plate, the pressing plate is detachably connected to the mounting plate via bolts, the pressing plate is arranged in an arch shape, a threaded hole is arranged at the arch back position of the pressing plate, the pressing plate is spirally connected to the bolt via the threaded hole, and the mounting plate is connected to the second connecting plate.

[0010] Preferably, a contact sheet is provided on the upper surface of the mounting plate, and the bottom of the contact sheet is connected to the first connecting sheet, and the other end of the first connecting sheet is connected to the second connecting sheet.

[0011] Preferably, the ceramic substrate is mounted on the printed circuit board by bolts.

[0012] Preferably, the mounting plate and the pressing sheet are both made of ceramic.

[0013] The utility model provides a diode heat dissipation device, which has the following beneficial effects:

[0014] 1. In the utility model, the PIN diode is arranged on the upper surface of the ceramic base and contacts the ceramic base through the provided mounting seat, and the heat dissipation performance of the ceramic is used to dissipate the heat of the PIN diode, thereby greatly improving the heat dissipation performance of the PIN tube.

[0015] 2. In the utility model, the provided pressing sheet and mounting plate facilitate the disassembly and replacement of the PIN diode, thereby improving the maintenance efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall structure of the PIN diode heat dissipation device in the utility model;

[0017] Figure 2 It is a schematic diagram of the overall structure of the mounting seat in the utility model;

[0018] Figure 3 It is a schematic diagram of the overall structure of the ceramic substrate in the utility model.

[0019] In the figure: 1-printed board, 2-ceramic substrate, 21-base, 22-support seat, 3-bolt, 4-mounting seat, 41-mounting plate, 42-connecting piece 1, 43-pressing piece, 44-contact piece, 5-PIN diode, 6-printed board circuit, 7-connecting piece 2. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0021] See also Figure 1-3 The utility model provides a technical solution:

[0022] A diode heat dissipation device comprises a printed circuit board 1, a ceramic substrate 2 is mounted on the upper surface of the printed circuit board 1, mounting seats 4 are symmetrically arranged on the upper surface of the ceramic substrate 2, PIN diodes 5 are arranged between the mounting seats 4, pins of the PIN diodes 5 are detachably connected to the mounting seats 4, the mounting seats 4 are connected to a second connecting piece 7, and the other end of the second connecting piece 7 is connected to a printed circuit board circuit 6.

[0023] Specifically, Figure 1 As shown in : the second connecting piece 7 is made of copper sheet, and the second connecting piece 7 is connected to the printed circuit board 6 by welding.

[0024] Specifically, Figure 3 As shown in: the ceramic substrate 2 includes a base 21 and a support base 22, and the PIN diode 5 is arranged inside the support base 22, so that the PIN diode 5 can maintain contact with the support base 22, and the heat dissipation performance of the ceramic is used to dissipate the heat of the PIN diode, thereby greatly improving the heat dissipation performance of the PIN diode.

[0025] Specifically, Figure 2 As shown in: the mounting seat 4 includes a mounting plate 41, the mounting plate 41 is fixedly arranged on the upper surface of the ceramic substrate 2, and a pressing plate 43 is detachably connected to the mounting plate 41, the pressing plate 43 is detachably connected to the mounting plate 41 by a bolt 3, the pressing plate 43 is arranged in an arch shape, a threaded hole is arranged at the arch back position of the pressing plate 43, the pressing plate 43 is spirally connected to the bolt 3 through the threaded hole, and the mounting plate 41 is connected to the connecting plate 2 7, so that the pin of the PIN diode 5 is arranged inside the arch space of the pressing plate 43, firstly, the mounting plate 41 and the pressing plate 43 are fixedly connected by the bolt 3, after completion, the pin is compressed by the bolt 3 located at the arch back position, the connection between the mounting plate 41 and the pin is realized, and then the transmission of the current signal is realized.

[0026] Specifically, Figure 2 As shown in the figure: a contact piece 44 is provided on the upper surface of the mounting plate 41, and the bottom of the contact piece 44 is connected to the connecting piece 1 42, and the other end of the connecting piece 1 42 is connected to the connecting piece 2 7, so as to facilitate the transmission of the current signal.

[0027] Specifically, Figure 1 As shown in : the ceramic substrate 2 is mounted on the printed circuit board 1 by bolts 3.

[0028] Furthermore, the mounting plate 41 and the pressing plate 43 are both made of ceramics, which facilitates heat dissipation.

[0029] In this embodiment, the PIN diode is set on the upper surface of the ceramic base 2 and in contact with the ceramic base 2 through the setting of the mounting seat 4, and the heat dissipation performance of the ceramic is used to dissipate the heat of the PIN diode, thereby greatly improving the heat dissipation performance of the PIN tube; at the same time, the setting of the pressing sheet 43 and the mounting plate 41 facilitates the disassembly and replacement of the PIN diode, thereby improving the maintenance efficiency.

[0030] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A diode heat dissipation device, characterized in that: The invention comprises a printed circuit board (1), wherein a ceramic substrate (2) is mounted on the upper surface of the printed circuit board (1), mounting seats (4) are symmetrically arranged on the upper surface of the ceramic substrate (2), PIN diodes (5) are arranged between the mounting seats (4), pins of the PIN diodes (5) are detachably connected to the mounting seats (4), the mounting seats (4) are connected to a second connecting piece (7), and the other end of the second connecting piece (7) is connected to a printed circuit board circuit (6).

2. A diode heat dissipation device as claimed in claim 1, characterized in that: The second connecting piece (7) is made of a copper sheet, and the second connecting piece (7) is connected to the printed circuit board (6) by welding.

3. A diode heat dissipation device as claimed in claim 1, characterized in that: The ceramic substrate (2) comprises a base (21) and a support seat (22), and the PIN diode (5) is arranged inside the support seat (22).

4. A diode heat dissipation device as claimed in claim 1, characterized in that: The mounting seat (4) comprises a mounting plate (41), the mounting plate (41) is fixedly mounted on the upper surface of the ceramic substrate (2), and a pressing plate (43) is detachably connected to the mounting plate (41), the pressing plate (43) is detachably connected to the mounting plate (41) via a bolt (3), the pressing plate (43) is arranged in an arch shape, a threaded hole is arranged at the arch back position of the pressing plate (43), the pressing plate (43) is spirally connected to the bolt (3) via the threaded hole, and the mounting plate (41) is connected to a second connecting plate (7).

5. A diode heat dissipation device as claimed in claim 4, characterized in that: A contact sheet (44) is provided on the upper surface of the mounting plate (41), and the bottom of the contact sheet (44) is connected to the first connecting sheet (42), and the other end of the first connecting sheet (42) is connected to the second connecting sheet (7).

6. A diode heat dissipation device as claimed in claim 1, characterized in that: The ceramic substrate (2) is mounted on the printed circuit board (1) via bolts (3).

7. A diode heat dissipation device as claimed in claim 4, characterized in that: The mounting plate (41) and the pressing sheet (43) are both made of ceramics.

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