Connecting frame structure for H bridge and H bridge packaging module

Abstract

The utility model provides an H-bridge packaging module, and aims to simplify circuit layout, improve device stability and reduce production cost. The module adopts a metal bridge arm frame and a metal pin structure, a plurality of power switch tubes are effectively connected, and electrical connection is realized through bonding leads. According to the design of the upper bridge metal bridge arm frame, the length of the upper bridge metal bridge arm frame is equal to the total width of the lower bridge metal bridge arm frame, and stable supporting and electrical connection are provided. In addition, due to the design of the metal pins, the structural layout of the module is simplified, and meanwhile the fixity and stability of the pins are enhanced. And the packaging body adopts an epoxy resin plastic packaging structure, so that the reliability and the stability of the device are further improved. Through the design, the H-bridge module is improved in the aspects of circuit layout, heat dissipation effect and device consistency, so that the H-bridge module is easier to use, saves space, improves production efficiency, provides more reliable performance and is suitable for various application scenes.

Description

Technical Field

[0001] The utility model relates to the field of semiconductors, and in particular to a connection frame structure for an H-bridge and an H-bridge packaging module. Background Art

[0002] In the field of power electronics, the H-bridge is a typical DC motor control circuit, and its circuit shape resembles the letter "H", hence the name. H-bridge circuits are widely used in the direction control of DC motors and in inverters to invert DC power into AC power of a specific frequency for driving AC motors. However, the existing H-bridge modules on the market currently have some obvious disadvantages. First, these existing modules are usually large in size and occupy more circuit board space, resulting in complex circuit board layout and large stray inductance. Secondly, some modules use four independent MOS single tubes for connection. This layout is highly complex and not conducive to maintenance and debugging. In addition, the heat dissipation performance of existing modules is poor, the consistency of devices cannot be guaranteed, and the production cost is high.

[0003] In summary, the main disadvantages of existing H-bridge modules include large size, complex layout, poor heat dissipation, poor device consistency and high cost. These problems limit the flexibility and performance of H-bridge modules in practical applications. Therefore, it is of great significance to improve the size of H-bridge modules, simplify the layout, improve heat dissipation and reduce costs. Utility Model Content

[0004] The utility model provides a connection frame structure for an H-bridge and an H-bridge packaging module, which has a small size, a simple circuit layout, and a good heat dissipation effect. To achieve the purpose of the utility model, a connection frame structure for an H-bridge is provided, including a metal bridge arm frame, a plastic package frame, and a metal pin;

[0005] The metal bridge arm frame includes an output metal frame A, an output metal frame B, and an input metal frame C which are arranged adjacent to each other; the output metal frame A and the output metal frame B are arranged in parallel, and the sum of the overall outer widths is smaller than that of the input metal frame C; the input metal frame C is used to set at least two power switch tubes, and the output metal frame A and the output metal frame B are respectively set with at least one power switch tube; the plurality of metal pins are connected to the nearest power switch tube; the bottom surfaces of the output metal frame A, the output metal frame B, and the input metal frame C are used for external connection; the plastic package frame is used to fix the metal bridge arm frame and the metal pins.

[0006] Furthermore, the output metal frame A, the output metal frame B, and the input metal frame C are used as pads and connected to pins or connection points of other devices by welding, thereby achieving electrical connection and mechanical fixation.

[0007] The output metal frame A is provided with a positioning identification structure; the positioning identification structure includes at least one of a MARK point, a concave portion, a convex portion or a notch structure.

[0008] Furthermore, the input metal frame C corresponds to two pairs of metal pins, and the output metal frame A and the output metal B

[0009] Each of the metal pins corresponds to a pair of metal pins; any pair of metal pins includes a source pin and a gate pin, and between any two adjacent pairs of metal pins, the source pins are adjacently arranged.

[0010] The plastic encapsulation frame includes an upper bridge plastic encapsulation frame and a lower bridge plastic encapsulation frame. The upper bridge plastic encapsulation frame is arranged correspondingly to the input metal frame C and the metal pins close to the input frame, and the lower bridge plastic encapsulation frame is arranged correspondingly to the lower bridge first metal frame, the lower bridge second metal frame and the metal pins close to the lower bridge first metal frame and the lower bridge second metal frame.

[0011] Preferably, the upper bridge plastic encapsulation frame and the lower bridge plastic encapsulation frame include a pin fixing frame, and the pin fixing frame corresponds one-to-one to the metal bridge arm frame; the pin fixing frame is in the shape of a "mountain"; a "T"-shaped isolation fixing frame is arranged between the input metal frame C, the output metal frame A, and the output metal B, wherein the horizontal bar of the T-shaped structure is located between the three metal bridge arm frames, and the vertical bar of the T-shaped structure extends to the bottom of the bottom metal frame; a long strip-type fixed isolation frame is also arranged between the "T"-shaped isolation fixing frame and the corresponding pin fixing frame.

[0012] Furthermore, the connection frame structure for the H-bridge further includes a plurality of upper bridge power tubes and lower bridge power tubes;

[0013] Among them, two upper bridge power tubes are arranged in parallel in the input metal frame C, and one lower bridge power tube is arranged in each of the output metal frame B and the output metal frame A; the upper bridge power tube and the lower bridge power tube are connected to the corresponding source pins and gate pins nearby through bonding wires; the upper bridge power tube and the lower bridge power tube are both N-type MOSFET or P-type MOSFET.

[0014] Furthermore, the H-bridge packaging module includes a packaging body, which is used to encapsulate the metal frame and the plastic packaging frame, and the plastic packaging body is an epoxy plastic packaging body.

[0015] The utility model realizes an H-bridge packaging module through component replacement optimization, specific layout and internal connection mode. The design of the metal bridge arm frame minimizes the connection distance between the power switch tubes to reduce the influence of resistance and inductance on circuit performance. At the same time, this design also improves the heat dissipation performance of the module; the H-bridge packaging module is used to improve the device production yield and application fault tolerance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a bottom schematic diagram of the appearance of an H-bridge packaging module according to an embodiment of the present utility model;

[0017] Figure 2 A schematic diagram of the internal circuit connections of the H-bridge package module according to an embodiment of the utility model;

[0018] Figure 3 This is a diagram of the epoxy resin plastic packaging structure on the back of the H-bridge packaging module according to an embodiment of the utility model;

[0019] Figure 4 4 is a circuit diagram of an H-bridge packaging module according to an embodiment of the present utility model.

[0020] In the above drawings:

[0021] 1. Input metal frame C; 2. Output metal frame A; 3. Output metal frame B; 4. Metal pins (gate pin 4a, source pin 4b, gate pin 4c, source pin 4d, gate pin 4e, source pin 4f, gate pin 4g, source pin 4h); 5. Corner cut-off structure; 6. Power switch tube (upper bridge power tube 6a, upper bridge power tube 6b, lower bridge power tube 6c, lower bridge power tube 6d) 7. Pin fixing frame; 8. "T" type isolation fixing frame; 9. Fixed isolation frame. DETAILED DESCRIPTION

[0022] The embodiments of the utility model are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The exemplary embodiments can be implemented in various forms and should not be understood as being limited to the examples set forth herein; on the contrary, these embodiments are provided so that the utility model will be more comprehensive and complete, and the concept of the exemplary embodiments will be fully conveyed to those skilled in the art. The same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be understood as limiting the present invention.

[0023] In the description of the present invention, it should be noted that, unless otherwise clearly stipulated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] The utility model provides a connection frame structure for an H bridge, comprising a metal bridge arm frame, a plastic package frame, and a metal pin 4;

[0025] Specifically, Figure 1 As shown, the metal bridge arm frame includes an output metal frame A2, an output metal frame B3, and an input metal frame C1 which are adjacently arranged; the output metal frame A2 and the output metal frame B3 are arranged in parallel, and the sum of the overall outer widths is smaller than that of the input metal frame C1, the input metal frame C1 is used to set at least two power switching tubes, and the output metal frame A2 and the output metal frame B3 are respectively set with at least one power switching tube; the area of ​​the metal area is greater than the sum of the bottom areas of the power switching tubes 6 set in the corresponding metal bridge arm frames.

[0026] In this embodiment, the plurality of metal pins 4 are connected to the nearest power switch tube 6; the input metal frame C1 corresponds to two pairs of metal pins 4 (gate pin 4a, source pin 4b, gate pin 4c, source pin 4d), the output metal frame A2 corresponds to one pair of metal pins 4 (gate pin 4g, source pin 4h), and the output metal frame B3 corresponds to one pair of metal pins 4 (gate pin 4e, source pin 4f); any pair of metal pins 4 includes a source pin and a gate pin, and between any two adjacent pairs of metal pins, the source pins are arranged adjacently;

[0027] The plastic encapsulation frame is used to fix the metal bridge arm frame and the metal pins, and includes an upper bridge plastic encapsulation frame and a lower bridge plastic encapsulation frame. The upper bridge plastic encapsulation frame is arranged correspondingly to the input metal frame C1 and the metal pins 4 close to the input frame, and the lower bridge plastic encapsulation frame is arranged correspondingly to the lower bridge first metal frame, the lower bridge second metal frame and the metal pins 4 close to the lower bridge first metal frame and the lower bridge second metal frame.

[0028] In this embodiment, the output metal frame A2, the output metal frame B3, and the input metal frame C1 are used as pads and connected to the pins or connection points of other devices by welding, thereby achieving electrical connection and mechanical fixation.

[0029] The output metal frame A2, output metal frame B3, and input metal frame C1 of the H-bridge connection frame structure are arranged adjacent to each other. This design effectively reduces the overall size of the connection frame, making the H-bridge connection structure more compact, which is conducive to integration and arrangement in a limited space; the setting of the metal bridge arm frame provides good structural support, which can effectively withstand the connection and load of the power tube. At the same time, the design of the metal pin 4 also helps to stabilize the connection, improve the overall strength and stability, thereby enhancing the durability and reliability of the H-bridge connection structure; through the reasonable design of the metal bridge arm frame and the metal pin, the power transmission path can be effectively optimized, the influence of resistance and inductance on circuit performance can be reduced, and the efficiency and stability of power transmission can be improved, thereby improving the performance of the entire H-bridge system.

[0030] The thickness of the metal bridge arm frame does not exceed 5 mm, and the thickness of the metal frame is limited to a wider range, which can ensure that the module has high compatibility and selectivity in design and application. For example, when there are design requirements such as lightweight products and compact space, a thinner substrate may have more advantages; in some high-power application scenarios, a thicker substrate has the advantages of heat dissipation performance and electromagnetic compatibility.

[0031] In this embodiment, the output metal frame A is provided with a positioning identification structure. Any corner of the output metal frame A 2 is cut off to form a corner cut structure 5. Corner cut refers to cutting off a part of metal or material at a corner of the output metal frame A 2, so that the corner part is missing or a depression is formed. The purpose of this operation is to more easily identify the pin position of the device during production and subsequent application to the PCB circuit board, thereby improving production efficiency and application fault tolerance.

[0032] In this embodiment, in the input metal frame C1, the output metal frame A2 and the output metal frame B3 arranged in parallel, as shown in FIG. Figure 2 As shown, the power switch tube 6 set in any metal bridge arm frame is an N-type MOSFET, and two N-type MOSFET power tubes, an upper bridge power tube 6a and an upper bridge power tube 6b, are set in parallel in the upper bridge metal frame, an N-type MOSFET is set in the second metal frame of the lower bridge as a lower bridge power tube 6c, and an N-type MOSFET is set in the first metal frame of the lower bridge as a lower bridge power tube 6d;

[0033] In this embodiment, any metal pin includes at least one pair of source pins and gate pins, and between any two adjacent pairs of source pins and gate pins, the source pins are adjacently arranged, wherein:

[0034] The drain of any power switch tube 6 is connected to one of the input metal frame C1, the output metal frame A2 or the output metal frame B3;

[0035] The source of the upper bridge power tube 6a is respectively connected to the source pin 4b and the output metal frame B3, and its gate is connected to the gate pin 4a;

[0036] The source of the upper bridge power tube 6b is respectively connected to the source pin 4d and the output metal frame A2, and its gate is connected to the gate pin 4c;

[0037] The source of the lower bridge power tube 6c is connected to the source pin 4f, and the gate thereof is connected to the gate pin 4e;

[0038] The source of the lower bridge power tube 6d is connected to the source pin 4h, and the gate thereof is connected to the gate pin 4g;

[0039] Each electrode is connected according to the H-bridge circuit to realize the electrical connection of the H-bridge circuit. In this embodiment, Figure 2 As shown, the connection between each module represents the metal bridge arm frame, and the metal pins are connected to each power switch tube through bonding wires. The common H-bridge module uses four independent MOS tubes to connect, which requires a relatively large space area, and the PCB board layout and wiring are relatively complex, the heat dissipation is poor, the consistency of the device cannot be guaranteed, and the cost is high. The package of this H-bridge module is smaller, which is the same size as the ordinary PPAK5*6 single tube package, avoiding complex circuit layout, saving circuit board space and device use costs, improving the heat dissipation effect and device consistency, and more convenient to use.

[0040] In this embodiment, Figure 3As shown, the H-bridge packaging module also includes a packaging body, which is a plastic packaging frame for packaging the metal bridge arm frame and the metal pin; the epoxy resin plastic packaging structure includes an upper bridge plastic packaging frame and a lower bridge plastic packaging frame including a pin fixing frame 7, and the pin fixing frame corresponds to the metal bridge arm frame one by one, wherein the pin fixing frame surrounding the metal pin 4 is in a "mountain" shape. This epoxy resin plastic packaging structure surrounding the pin can increase the contact area between the pin and the plastic packaging material, improve the bonding strength between the pin and the plastic packaging material, thereby enhancing the fixation and stability of the pin. This helps to improve production yield and product reliability, and reduce production problems and product quality problems caused by pins falling off or loosening; a "T"-shaped isolation fixing frame 8 is set between the input metal frame C1, the output metal frame A2, and the output metal B3, wherein the horizontal direction structure of the T-shaped structure is located between the three metal bridge arm frames, and the vertical direction structure of the T-shaped structure extends to the bottom of the bottom metal frame; a long strip type fixed isolation frame 10 is also set between the "T"-shaped isolation fixing frame 8 and the corresponding pin fixing frame 7; it can increase the connection strength between the bottom metal frames, improve the overall anti-torsion and anti-deformation capabilities of the module, and thus enhance the structural stability and durability of the device. This helps to keep the shape of the module stable during production and subsequent application to the PCB circuit board, and reduce performance and reliability problems caused by device structural deformation.

[0041] In this embodiment, Figure 4 As shown, the following working principle is realized:

[0042] The power switch tubes included in this H-bridge module are four N-type MOSFETs, Q1 and Q2 are lower bridges, Q3 and Q4 are upper bridges, VCC is the power input terminal, A and B are drive output terminals, and G1-G4 are control signal input terminals. To control the rotation direction of the motor, we can connect a single-phase motor between AB, and output high and low levels through PWM1. The high and low levels output by PWM2 are opposite to those of PWM1, forming a high-low-high-low cycle to control the working state of the module;

[0043] When PWM1 output is high, the gates G2 and G4 of Q2 and Q4 are high, the gates G1, G3 and PWM2 of Q1 and Q3 are low, Q2 and Q4 are turned on, Q1 and Q3 are turned off, and the motor rotates forward;

[0044] When the PWM1 output is low, the gates G2 and G4 of Q2 and Q4 are low, the gates G1, G3 and PWM2 of Q1 and Q3 are high, Q2 and Q4 are cut off, Q1 and Q3 are turned on, and the motor rotates in the reverse direction.

[0045] The utility model realizes an H-bridge packaging module and its internal common connection scheme through component replacement optimization, specific layout and internal connection mode. The design of the metal bridge arm frame minimizes the connection distance between each power switch tube to reduce the influence of resistance and inductance on circuit performance, and this design also improves the heat dissipation performance of the module; using this H-bridge module, any corner of the lower bridge metal bridge arm frame A is cut off so that the position of the control pin can be quickly found during production and subsequent application to the PCB circuit board, thereby improving the device production yield and application fault tolerance.

[0046] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the present invention, which should be included in the scope of the claims of the present invention.

Claims

1. A connection frame structure for an H-bridge, characterized in that: It includes a metal bridge arm frame and a plastic package frame; The metal bridge arm frame includes an output metal frame A, an output metal frame B, an input metal frame C arranged adjacent to each other, and several metal pins; the output metal frame A and the output metal frame B are arranged in parallel, and the sum of their overall outer widths is less than that of the input metal frame C. The input metal frame C is used to arrange at least two power switching tubes, and the output metal frame A and the output metal frame B are respectively used to arrange at least 1 power switching tube; the several metal pins are connected to the nearest power switching tube; The bottom surfaces of the output metal frame A, the output metal frame B, and the input metal frame C are used for external connection; The plastic package frame is used to reinforce and protect the metal bridge arm frame and the metal pins.

2. A connection frame structure for an H-bridge according to claim 1, characterized in that: The input metal frame C corresponds to 2 pairs of metal pins, and the output metal frame A and the output metal frame B respectively correspond to 1 pair of metal pins.

3. A connection frame structure for an H-bridge according to claim 2, characterized in that: Any one pair of metal pins includes a source pin and a gate pin. Between any two adjacent pairs of metal pins, the source pins are arranged adjacent to each other.

4. A connection frame structure for an H-bridge according to claim 1, characterized in that: The output metal frame A is provided with a positioning and identification structure; the positioning and identification structure at least includes one of MARK points, concave parts, convex parts, or notch structures.

5. The connection frame structure for an H-bridge according to claim 1, characterized in that: The plastic package frame includes an upper bridge plastic package frame and a lower bridge plastic package frame. The upper bridge plastic package frame is correspondingly arranged with the input metal frame C and the metal pins near the input frame, and the lower bridge plastic package frame is correspondingly arranged with the lower bridge first metal frame, the lower bridge second metal frame, and the metal pins near the lower bridge first metal frame and the lower bridge second metal frame.

6. A connection frame structure for an H-bridge according to claim 5, characterized in that: The upper bridge plastic package frame and the lower bridge plastic package frame include pin fixing frames, and the pin fixing frames correspond one-to-one with the metal bridge arm frame.

7. A connection frame structure for an H-bridge according to claim 6, characterized in that: The pin fixing frame is in the shape of a "mountain".

8. The connection frame structure for an H-bridge according to claim 7, characterized in that: A "T" - shaped isolation and fixing frame is arranged between the input metal frame C, the output metal frame A, and the output metal B, and a long - strip fixing and isolation frame is also arranged between the "T" - shaped isolation and fixing frame and the corresponding pin fixing frame.

9. An H-bridge package module, characterized in that: It includes a connection frame structure for an H - bridge according to any one of claims 1 to 8, and also includes several upper - bridge power tubes and lower - bridge power tubes; Among them, two upper - bridge power tubes are arranged in parallel in the input metal frame C, and one lower - bridge power tube is arranged in each of the output metal frame B and the output metal frame A; the upper - bridge power tubes and the lower - bridge power tubes are connected to the corresponding source pins and gate pins near them through bonding wires; A package body, and the package body is used to package the metal frame and the plastic package frame, and the plastic package frame is an epoxy plastic package body.

10. The H-bridge package module according to claim 9, characterized in that : The upper - bridge power tubes and the lower - bridge power tubes are both N - type MOSFETs or P - type MOSFETs.

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