Package structure
By using a combination of insulating support mesh and filling glue in the chip packaging structure and combining through-hole design, the hollowing problem of bottom filling glue and the deformation problem of conductive connectors is solved, and the stability and performance of the packaging structure are improved.
Patent Information
- Application Number
- CN202420947159.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-04-30
AI Technical Summary
In traditional chip packaging technology, the bottom filler easily wraps bubbles during the flow process, resulting in voids in the cured filler, reducing support performance, and conductive connectors are prone to deformation and tin connection or open welding during dense arrangement. Problem affecting the stability and performance of the packaging structure.
Adopt a packaging structure including insulated support mesh, filler glue and through holes. The insulated support mesh is filled with glue and penetrates through holes, and the conductive connection is placed in the through holes, and the synergistic effect of the insulated support mesh and filler is used to improve support. Performance, reduce deformation of conductive connectors and isolate adjacent connectors through through holes to avoid bridging problems.
It effectively improves the stability and support performance of the packaging structure, reduces the occurrence of hollows in the filling glue, reduces the probability of packaging abnormalities, and enhances the stability and support strength of the substrate.
Smart Images
Figure CN222261051U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to a packaging structure. Background Art
[0002] In the traditional chip packaging process, after the chip, components and other structures are welded or pasted on the top surface of the packaging substrate, the bottom of the chip is filled by dispensing glue from the side of the chip, and the bottom filling glue is filled between the chip and the substrate by the capillary action of the liquid. After that, the bottom filling glue is cured by a high-temperature curing process. The cured bottom filling glue plays a role in protecting the conductive connectors between the chip and the substrate, and fixes and supports the conductive connectors and the chip. However, when filling chips with large sizes or dense conductive connectors, the bottom filling glue can easily wrap bubbles during the flow process, resulting in voids in the bottom filling glue after curing, which leads to a reduction in the supporting performance of the bottom filling glue, affecting the overall structural stability of the packaging structure.
[0003] During the packaging process of flip chips, the chip and the substrate are soldered together through the reflow process. When the conductive connectors are densely arranged, the conductive connectors will deform and cause solder joints or open solder joints, which will lead to abnormal packaging performance problems such as chip pad bridging and delamination.
[0004] Therefore, how to improve the stability of the packaging structure and reduce the deformation of the conductive connector, thereby improving the performance of the packaging structure, is a technical problem that needs to be solved urgently. Summary of the invention
[0005] The utility model provides a packaging structure, which is used for improving the supporting performance of bottom filling glue, thereby improving the overall stability of the packaging structure, and reducing the deformation of the conductive connecting piece, thereby improving the performance of the packaging structure.
[0006] According to some embodiments, the utility model provides a packaging structure, including:
[0007] A substrate having a groove therein;
[0008] A support structure is located in the groove, and the support structure includes an insulating support mesh body, a filling glue filled in the insulating support mesh body, and a through hole penetrating the insulating support mesh body;
[0009] A chip is located on the support structure. A side of the chip facing the support structure has a conductive connector located in the through hole. One end of the conductive connector is electrically connected to the chip, and the other end is electrically connected to the substrate.
[0010] In some embodiments, the top surface of the insulating support mesh is flush with the top surface of the substrate.
[0011] In some embodiments, the insulating support mesh fills the gap between the chip and the substrate, and the projection area of the insulating support mesh on the top surface of the substrate is greater than or equal to the projection area of the chip on the top surface of the substrate.
[0012] In some embodiments, the insulating support mesh is a rigid mesh, and the insulating support mesh includes a plurality of pores evenly distributed in a grid shape, and the filling glue evenly fills all of the pores.
[0013] In some embodiments, the bottom of the chip has a plurality of the conductive connectors arranged at intervals, the support structure includes a plurality of the through holes corresponding one-to-one to the plurality of the conductive connectors, and the plurality of the through holes are isolated from each other by the filling glue.
[0014] In some embodiments, the diameter of the through hole is greater than or equal to the diameter of the conductive connection.
[0015] In some embodiments, the support structure further includes thermally conductive particles filled in the insulating support mesh, and the thermally conductive particles are evenly distributed in the insulating support mesh.
[0016] In some embodiments, the thermally conductive particles include any one of carbon nanotube particles and resin particles, or a combination of the two.
[0017] In some embodiments, it also includes:
[0018] Functional devices are located on the substrate, and the functional devices are distributed on at least one side of the chip along a direction parallel to the top surface of the substrate;
[0019] A blocking structure is located on the substrate, and a projection of the blocking structure on the top surface of the substrate is located between a projection of the functional device on the top surface of the substrate and the supporting structure.
[0020] In some embodiments, the blocking structure is in a closed ring shape, and a projection of the blocking structure on the top surface of the substrate is distributed around the periphery of the supporting structure.
[0021] The packaging structure provided by the utility model is provided with a support structure between a substrate and a chip mounted on the substrate, and the support structure includes an insulating support mesh, a filling glue filled in the insulating support mesh, and a through hole penetrating the insulating support mesh, and a conductive connector electrically connecting the chip and the substrate is placed in the through hole. The insulating support mesh can effectively improve the support performance of the support structure, and the support performance of the insulating support mesh is not affected by the state of the filling glue and the filling uniformity, thereby effectively improving the overall stability of the packaging structure. By filling the filling glue in the insulating support mesh, the uniformity of the distribution of the filling glue between the chip and the substrate can be improved, and the generation of voids in the filling glue can be reduced, thereby further improving the support performance of the support structure. Placing the conductive connector electrically connecting the chip and the substrate in the through hole can not only reduce the deformation of the conductive connector through the support of the support structure, but also limit the deformation of the conductive connector through the through hole, and can also make the adjacent conductive connectors isolated by the insulating support mesh and the filling glue, thereby avoiding the problem of bridging of adjacent conductive connectors, thereby reducing the probability of packaging anomalies in the packaging structure during manufacturing and use. The utility model sets a groove in the substrate, and fills the support structure in the groove to form an embedded support structure, so that the support structure can also support the substrate, thereby improving the stability and support strength of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Attached Figure 1 It is a schematic diagram of a packaging structure in a specific implementation mode of the utility model;
[0023] Attached Figure 2 It is a schematic diagram of another packaging structure in a specific implementation manner of the utility model;
[0024] Attached Figure 3 -Attached Figure 5 It is a main structural schematic diagram of the support structure in the utility model during the formation process. DETAILED DESCRIPTION
[0025] The specific implementation of the packaging structure provided by the utility model is described in detail below with reference to the accompanying drawings.
[0026] This specific implementation provides a packaging structure, Figure 1 is a schematic diagram of a packaging structure in a specific implementation mode of the utility model, Figure 3 -Attached Figure 5 This is a schematic diagram of the main structure of the support structure in the utility model during the formation process. Figure 1 as well as Figure 3-Figure 5As shown, the packaging structure includes:
[0027] A substrate 10, wherein the substrate 10 has a groove therein;
[0028] A support structure 12 is located in the groove, and the support structure 12 includes an insulating support mesh 30, a filling glue 41 filled in the insulating support mesh 30, and a through hole penetrating the insulating support mesh 30;
[0029] The chip 11 is located on the support structure 12 . The side of the chip 11 facing the support structure 12 has a conductive connector 13 located in the through hole. One end of the conductive connector 13 is electrically connected to the chip 11 , and the other end is electrically connected to the substrate 10 .
[0030] Specifically, the substrate 10 includes a top surface and a bottom surface that are relatively distributed along a first direction D1, a redistribution layer is arranged inside the substrate 10, a plurality of solder balls 15 are arranged on the bottom surface of the substrate 10, and the solder balls 15 are electrically connected to the redistribution layer inside the substrate 10, so as to transmit control signals to the redistribution layer inside the substrate 10 through the solder balls 15 or to lead out signals in the substrate 10 through the solder balls 15. The first direction D1 is perpendicular to the top surface of the substrate 10. The chip 11 can be flip-mounted on the top surface of the substrate 10. In one example, the packaging structure includes a plurality of the chips 11 stacked in sequence along the first direction D1 to form a chip stacking structure, thereby improving the integration of the packaging structure and expanding the function of the packaging structure. The support structure 12 is filled in the groove in the substrate 10 along the first direction D1, so that the support structure 12 is located between the substrate 10 and the chip 11, so as to support the chip 11. The material of the insulating support mesh 30 in the support structure 12 is an insulating material, and the material of the filling glue filled in the insulating support mesh 30 is also an insulating material (for example, bottom filling glue (underfill)). The bottom surface of the insulating support mesh 30 (that is, the surface of the insulating support mesh 30 facing the substrate 10) is in contact and connected with the bottom surface of the groove, and the top surface of the insulating support mesh (that is, the surface of the insulating support mesh 30 facing the chip 11) is in contact and connected with the surface of the chip 11 (for example, the bottom chip 11 in the chip stacking structure) facing the substrate 10, so that the support structure 12 fills the gap between the chip 11 and the substrate 10. In one example, the packaging structure also includes a plastic packaging layer 14 that encapsulates the chip 11. Among them, the material of the plastic packaging layer 14 can be but is not limited to epoxy resin molding material.
[0031] In this specific embodiment, by setting the support structure 12 including the insulating support mesh 30 between the chip 11 and the substrate 10, and filling the filling glue 41 in the insulating support mesh 30, the connection strength between the insulating support mesh 30 and the substrate 10 and the chip 11 can be enhanced, and the chip 11 and the conductive connector 13 can be supported by the synergistic effect of the insulating support mesh 30 and the filling glue. The supporting performance of the insulating support mesh is not affected by the state of the filling glue 41 and the filling uniformity, thereby effectively improving the overall stability of the packaging structure. By setting the through hole penetrating the insulating support mesh 30 along the first direction D1 in the insulating support mesh 30, and placing the conductive connector 13 in the through hole, not only can the conductive connector 13 be protected by the support structure 12, but also the deformation of the conductive connector can be reduced by the support of the support structure, and the deformation of the conductive connector can be limited by the through hole, and the adjacent conductive connectors can be isolated by the insulating support mesh and the filling glue, thereby avoiding the problem of bridging of adjacent conductive connectors, thereby reducing the probability of packaging abnormalities in the packaging structure during manufacturing and use. This specific embodiment forms a buried support structure by setting a groove in the substrate 10 and filling the support structure 12 in the groove, so that the support structure can also support the substrate 10, thereby improving the stability and support strength of the substrate 10, and helping to further reduce the size of the packaging structure.
[0032] In one example, when an insulating material is used to make Figure 3 The insulating support mesh 30 shown in the figure is a porous structure, that is, the insulating support mesh 30 has a plurality of pores arranged in a grid shape. Then, the liquid filling glue 41 can be filled into the container 40, and the insulating support mesh 30 can be soaked in the liquid filling glue 41. Figure 4As shown. After the liquid filling glue 41 fills all the pores in the insulating support mesh 30, the insulating support mesh 30 is taken out of the container 40 to form an initial support structure including the insulating support mesh 30 and the liquid filling glue 41. Next, the initial support structure is heat-treated so that the liquid filling glue 41 is solidified to form the support structure 12 including the insulating support mesh 30 and the solid filling glue 41. Then, the support structure 12 is mounted on the top surface of the substrate 10. Thereafter, the through hole is formed in the support structure 12 to penetrate the insulating support mesh 30 along the first direction D1, and the chip 11 is fixed to the support structure 12 by aligning the through hole and the conductive connector 13, and the chip 11 is electrically connected to the substrate 10 through the conductive connector 13. By immersing the insulating support mesh 30 in the liquid filling glue 41, the filling glue can fully fill the pores in the insulating support mesh 30, avoiding the air being enclosed by the flow of the liquid filling glue 41, thereby effectively avoiding the generation of holes in the filling glue 41 after curing, and further improving the supporting performance of the support structure 12.
[0033] In some embodiments, the top surface of the insulating support mesh 30 is flush with the top surface of the substrate 10 to better support the substrate 10 and reduce the size of the packaging structure.
[0034] In some embodiments, the insulating support mesh 30 fills the gap between the chip 11 and the substrate 10, and the projection area of the insulating support mesh 30 on the top surface of the substrate 10 is greater than or equal to the projection area of the chip 11 on the top surface of the substrate 10. That is, the size of the insulating mesh 30 is the same as the size of the groove, so that the insulating support mesh 30 can be firmly embedded in the groove to prevent the position of the support structure 12 from shifting.
[0035] In some embodiments, the insulating support mesh 30 is a rigid mesh, and the insulating support mesh 30 includes a plurality of pores evenly distributed in a grid shape, and the filling glue 41 evenly fills all of the pores.
[0036] Specifically, by setting the insulating support mesh 30 as a rigid mesh, the stress generated by mounting the chip 11 can be avoided to cause the support structure 12 to deform, thereby further improving the support performance of the support structure 12. By making the multiple pores in the insulating support mesh 30 evenly distributed in a grid shape, the filling glue 41 can be further evenly dispersed, further reducing the number of holes in the filling glue, thereby further improving the support strength of the support structure 12.
[0037] In some embodiments, the bottom of the chip 11 has a plurality of the conductive connectors 13 arranged at intervals, the support structure 12 includes a plurality of the through holes corresponding to the plurality of the conductive connectors 13 , and the plurality of the through holes are isolated from each other by the filling glue 41 .
[0038] For example, if Figure 1 As shown, the chip 11 has a plurality of conductive connectors 13 arranged at intervals along a second direction D2 on one side facing the substrate 10, and the second direction D2 is parallel to the top surface of the substrate 10. The support structure 12 includes a plurality of through holes corresponding to the plurality of conductive connectors 13, and adjacent through holes are physically isolated by the insulating support mesh 30 and the filling glue 41, thereby avoiding bridging between adjacent conductive connectors 13.
[0039] In some embodiments, the diameter of the through hole is greater than or equal to the diameter of the conductive connection member 13 , so that the conductive connection member 13 can be inserted into the through hole.
[0040] In some embodiments, the support structure 12 further includes thermally conductive particles filled in the insulating support mesh 30 , and the thermally conductive particles are evenly distributed in the insulating support mesh 30 .
[0041] Specifically, when the chip 11 is mounted on the substrate 10, since the thermal expansion coefficient of the chip 11 is different from that of the substrate 10, the stress generated by the temperature change during mounting will be applied to the conductive connector 13. The conductive connector 13 is supported by the support structure 12 to avoid the conductive connector 13 from breaking when the chip is mounted. Moreover, by adding the thermal conductive particles to the insulating support mesh 30 and absorbing and dispersing the heat generated during the chip mounting process through the evenly distributed thermal conductive particles, the conductive connector 13 is reduced or even prevented from breaking. In one example, a mixture of the liquid filling glue and the thermal conductive particles can be placed in the container 40, and the insulating support mesh 30 can be soaked in the mixture to ensure that the thermal conductive particles are evenly distributed in the insulating support mesh 30.
[0042] In some embodiments, the thermally conductive particles include any one of carbon nanotube particles and resin particles, or a combination of the two.
[0043] Attached Figure 2 Schematic diagram of another packaging structure in a specific embodiment of the utility model. Figure 2 As shown, the packaging structure also includes:
[0044] A functional device 21 is located on the substrate 10, and the functional device 21 is distributed on at least one side of the chip 11 along a direction parallel to the top surface of the substrate 10;
[0045] The blocking structure 20 is located on the substrate 10 , and the projection of the blocking structure 20 on the top surface of the substrate 10 is located between the projection of the functional device 21 on the top surface of the substrate 10 and the supporting structure 12 .
[0046] For example, if Figure 2 , Figure 3 and Figure 5 As shown, the functional device 21 is located outside the chip 11 along the second direction D2, and the functional device 21 is mounted on the top surface of the substrate 10. The second direction D2 is parallel to the top surface of the substrate 10. The functional device 21 can be a discrete device or a passive device. In one example, the functional device 21 is electrically connected to the chip 11. The blocking structure 20 is located between the functional device 21 and the support structure 12 along the second direction D2, and is used to prevent the filling glue 41 in the support structure 12 from escaping and contaminating the functional device 21 or other device areas on the substrate 10. For example, the cured filling glue 41 flows at high temperatures (such as high temperatures generated by chip mounting or other packaging processes), and the insulating support mesh 30 can prevent the filling glue 41 from flowing to the functional device 21 and contaminating the functional device 21.
[0047] In order to prevent the filling glue 41 from escaping from all directions, in some embodiments, the blocking structure 20 is in a closed ring shape, and the projection of the blocking structure on the top surface of the substrate 10 is distributed around the periphery of the support structure 12. In one example, the material of the blocking structure 20 is an insulating glue material, such as DAM glue (dam glue).
[0048] The packaging structure provided in this specific embodiment is provided with a support structure between a substrate and a chip mounted on the substrate, and the support structure includes an insulating support mesh, a filling glue filled in the insulating support mesh, and a through hole penetrating the insulating support mesh, and a conductive connector electrically connecting the chip and the substrate is placed in the through hole. The insulating support mesh can effectively improve the support performance of the support structure, and the support performance of the insulating support mesh is not affected by the state of the filling glue and the filling uniformity, thereby effectively improving the overall stability of the packaging structure. By filling the filling glue in the insulating support mesh, the uniformity of the distribution of the filling glue between the chip and the substrate can be improved, and the generation of voids in the filling glue can be reduced, thereby further improving the support performance of the support structure. Placing the conductive connector electrically connecting the chip and the substrate in the through hole can not only reduce the formation of the conductive connector through the support of the support structure, but also limit the deformation of the conductive connector through the through hole, and can also make the adjacent conductive connectors isolated by the insulating support mesh and the filling glue, thereby avoiding the problem of bridging of adjacent conductive connectors, thereby reducing the probability of packaging anomalies in the packaging structure during manufacturing and use. In this specific embodiment, a groove is set in the substrate, and the support structure is filled in the groove to form a buried support structure, so that the support structure can also support the substrate, thereby improving the stability and support strength of the substrate.
[0049] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A packaging structure, characterized in that: include: A substrate having a groove therein; A support structure is located in the groove, and the support structure includes an insulating support mesh body, a filling glue filled in the insulating support mesh body, and a through hole penetrating the insulating support mesh body; A chip is located on the support structure. A side of the chip facing the support structure has a conductive connector located in the through hole. One end of the conductive connector is electrically connected to the chip, and the other end is electrically connected to the substrate.
2. The packaging structure according to claim 1, characterized in that: The top surface of the insulating support mesh is flush with the top surface of the substrate.
3. The packaging structure according to claim 1, characterized in that: The insulating support mesh fills the gap between the chip and the substrate, and the projection area of the insulating support mesh on the top surface of the substrate is greater than or equal to the projection area of the chip on the top surface of the substrate.
4. The packaging structure according to claim 1, characterized in that: The insulating support mesh is a rigid mesh, and includes a plurality of pores evenly distributed in a grid shape, and the filling glue evenly fills all the pores.
5. The packaging structure according to claim 1, characterized in that: The bottom of the chip has a plurality of the conductive connecting members arranged at intervals, the supporting structure includes a plurality of the through holes corresponding to the plurality of the conductive connecting members one by one, and the plurality of the through holes are isolated from each other by the filling glue.
6. The packaging structure according to claim 1, characterized in that: The diameter of the through hole is greater than or equal to the diameter of the conductive connecting member.
7. The packaging structure according to claim 1, characterized in that: The support structure further includes heat-conducting particles filled in the insulating support mesh, and the heat-conducting particles are evenly distributed in the insulating support mesh.
8. The packaging structure according to claim 7, characterized in that: The thermally conductive particles include any one of carbon nanotube particles and resin particles or a combination of the two.
9. The packaging structure according to claim 1, characterized in that: Also includes: Functional devices are located on the substrate, and the functional devices are distributed on at least one side of the chip along a direction parallel to the top surface of the substrate; A blocking structure is located on the substrate, and a projection of the blocking structure on the top surface of the substrate is located between a projection of the functional device on the top surface of the substrate and the supporting structure.
10. The packaging structure according to claim 9, characterized in that: The blocking structure is in a closed ring shape, and a projection of the blocking structure on the top surface of the substrate is distributed around the periphery of the supporting structure.