Surface acoustic wave filter module for radio frequency front-end reception
By integrating multi-band filters into the same die in the RF front-end reception module and adopting packaging technology, the problems of multi-filter separation and frequency band integration in the existing technology are solved, and high integration and miniaturization design is achieved, which meets 4G The full frequency band of communication covers the needs.
Patent Information
- Application Number
- CN202421016029.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-11
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-11
AI Technical Summary
The existing RF front-end receiving filters have the problems of multi-band integration caused by complex multi-filter separation and manufacturing processes, large area occupied, high cost, and different film thicknesses of metal structures in different frequency bands.
Design a surface acoustic wave filter module for RF front-end reception. By integrating low-frequency, medium- and high-frequency filters on the same die, it adopts up to two metal film thicknesses and is packaged by welding balls and sealing materials. Achieve the integration and miniaturization of multi-band filters.
It realizes a high-integration and low-cost RF front-end reception module, covering the entire frequency band of 4G communication, reducing size and improving frequency band coverage, taking into account both electrical performance and production yield.
Smart Images

Figure CN222262690U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of radio frequency front-end receiving filters, and specifically relates to a multi-band filter integration solution and a system-level packaging design of multiple filters, and in particular to a surface acoustic wave filter module for radio frequency front-end reception. Background Art
[0002] The RF front-end module refers to a collection of components used to receive and send wireless signals, usually including RF transceivers, filters, amplifiers, mixers, power amplifiers and other components. Its function is to transmit the wireless signal from the antenna to the digital processing part, and convert the digital signal into a wireless signal and send it out. The RF front-end module plays a vital role in wireless communication equipment, and its performance directly affects the reception, transmission quality and power consumption efficiency of the equipment. With the development of mobile communication technology, the RF front-end module is also constantly evolving, becoming more and more miniaturized and more and more integrated to meet the requirements of modern communication equipment for high performance, low power consumption and small size.
[0003] A filter is a circuit or device used to selectively pass or block signals within a specific frequency range. In RF front-end modules, filters play a vital role, mainly used to remove or attenuate unnecessary frequency components to ensure that the receiver or transmitter only receives or sends signals in a specific frequency band. With the continuous development of RF front-end modules and filter technology, the requirements for miniaturization and high integration are getting higher and higher.
[0004] CN102487269A provides a surface wave filter and a communication device thereof, 1. A surface wave filter and a communication device thereof, characterized in that it includes a receiving adjustment module for adjusting the phase and amplification factor of the equivalent resistance value of the transmitting device and the surface wave filter to be consistent and has two receiving connectors, one of which is connected to the receiving connector of the surface wave filter (O), and also includes a transmitting adjustment module (O) for adjusting the phase and amplification factor of the equivalent resistance value of the receiving device and the surface wave filter to be consistent and has two transmitting connectors, one of which is connected to the transmitting connector of the surface wave filter (O).
[0005] The existing RF front-end receiving filters in mobile phones have the problems of multiple filter separation, complicated manufacturing process and large occupied area, which increases the wiring difficulty and the cost of the motherboard and filter chip. In addition, the different film thicknesses of the metal structures of filters in different frequency bands make it difficult to manufacture multi-band integrated filters. Utility Model Content
[0006] In order to solve the above problems, the utility model provides a novel RF front-end receiving surface acoustic wave filter module, which integrates discrete filters, improves integration, and realizes the design of Rx full-band coverage.
[0007] The utility model adopts the following technical solutions to solve the above problems:
[0008] A surface acoustic wave filter module for radio frequency front-end reception includes multiple tube cores, multiple filters are integrated on the tube cores, the filters include low-frequency filters, medium-frequency filters and high-frequency filters, the low-frequency filters are integrated on the same tube core, the medium-frequency filters and high-frequency filters are integrated on the same tube core, and each of the tube cores includes one and / or two metal film thicknesses.
[0009] Furthermore, the low-frequency filter is targeted at the 4G communication low-frequency band, with a frequency band range of 500MHz-1000MHz.
[0010] Furthermore, the multi-band low-frequency filters are integrated on one die with a maximum of two film thicknesses, which can take into account both electrical performance and production yield.
[0011] Furthermore, the medium and high frequency filters are targeted at the medium and high frequency bands of 4G communications, with a frequency band range of 1700MHz-2700MHz.
[0012] Furthermore, the multi-band medium and high frequency filters are integrated on one die, with a maximum of two film thicknesses, which can take into account both electrical performance and production yield.
[0013] Furthermore, the plurality of tube cores are soldered on the substrate by soldering balls, and a gap is left between the tube core and the upper surface of the substrate.
[0014] Furthermore, the tube core includes one and / or more of the three frequency bands of low, medium and high.
[0015] Furthermore, the welding balls are tin balls or gold balls.
[0016] Furthermore, a sealing material is provided above the tube core and the substrate, a dry film continuously bonded to the tube core is provided between the sealing material and the tube core, and the dry film is extended and laid on the substrate.
[0017] Furthermore, the sealing material is made of injection molding material or black film.
[0018] The beneficial effects of the utility model are:
[0019] 1. The utility model proposes a surface acoustic wave filter module for RF front-end reception. The module fully considers the process characteristics of the surface acoustic wave filter, combines the RF front-end reception requirements, integrates the discrete filter, and achieves high integration and low cost;
[0020] 2. For 4G communication terminal applications, the 4G communication low-frequency 500MHz-1000MHz band and the medium and high-frequency 1700MHz-2700MHz bands, multi-band filters are integrated on one die with a maximum of 2 film thicknesses, which can take into account both electrical performance and production yield;
[0021] 3. For the low, medium and high frequency 500MHz-2700MHz full frequency bands of 4G communication, multiple tube cores of low, medium and high frequency bands are integrated on a PCB substrate to achieve Rx full frequency band coverage. This design not only improves the frequency band coverage, but also reduces the size to achieve miniaturization design. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the specific implementation of the utility model, the following will briefly introduce the drawings required for the description of the specific implementation. The drawings described below are example diagrams of the novel RF front-end receiving surface acoustic wave filter module described above. Obviously, the drawings described below are only exemplary. For ordinary technicians in this field, other embodiment drawings can be derived from the provided drawings without creative work.
[0023] Figure 1 This is a plan view of the integrated low-frequency filter in Embodiment 1 of the present patent;
[0024] Figure 2 It is a plan schematic diagram of the integrated medium and high frequency filters in Example 2 of this patent;
[0025] Figure 3 This is a plan view of the integrated medium and high frequency filters in Example 3 of this patent;
[0026] Figure 4 It is a plan view of the multi-die integration of the novel RF front-end receiving surface acoustic wave filter module in Example 4 of the present patent;
[0027] Figure 5 This is a schematic diagram of the packaging of the new RF front-end receiving surface acoustic wave filter module in the embodiment of this patent.
[0028] In the figure: 1-tube core; 2-filter; 201-B8 filter; 202-B26 filter; 203-B28F filter; 204-B34 filter; 205-B39 filter; 206-B40 filter; 207-B41 filter; 208-B66 filter; 209-B3 filter; 210-B25 filter; 211-B7 filter; 3-substrate; 4-soldering ball; 5-sealing material. DETAILED DESCRIPTION
[0029] The exemplary embodiments of the present patent will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present patent are shown in the accompanying drawings, it should be understood that the present patent can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present patent and to fully convey the scope of the present patent to those skilled in the art. It should be noted that the embodiments in the present patent and the features in the embodiments can be combined with each other without conflict. The present patent will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.
[0030] In order to demonstrate the novel RF front-end receiving surface acoustic wave filter module proposed by the utility model, the utility model makes a specific implementation method of the RF front-end receiving surface acoustic wave filter module by integrating three frequency bands of B8, B26 and B28F through a low-frequency filter; integrating four frequency bands of B34, B39, B40 and B41 through a medium- and high-frequency filter; integrating four frequency bands of B66, B3, B25 and B7 through a medium- and high-frequency filter and a packaging substrate.
[0031] like Figure 1-3 As shown, the utility model provides a novel RF front-end receiving surface acoustic wave filter module, including multiple tube cores 1, multiple filters 2 are integrated on the tube core 1, the filter 2 includes a multi-band low-frequency filter integrated on the first tube core 101, and multi-band medium and high-frequency filters are integrated on the second tube core 102 and the third tube core 103. Each tube core 1 includes one and / or two metal film thicknesses. The multi-band can be two, three, or four bands. For example: B66+B3 is two bands, B8+B26+B28F is three bands, B66+B3+B25+B7 is four bands, the low-frequency filter band range is 500MHz-1000MHz, and the medium-frequency filter and high-frequency filter band range are 1700MHz-2700MHz.
[0032] Embodiment 1:
[0033] like Figure 1 As shown, three frequency bands of low-frequency filters B8+B26+B28F are integrated on the first tube core 101, with two kinds of metal film thicknesses, the first frequency band B8 filter 201, the second frequency band B26 filter 202, the third frequency band B28F filter 203, the first metal film thickness h1, and the second metal film thickness h2.
[0034] Two photolithography steps are performed to realize multi-band integration with different film thicknesses. The first photolithography step realizes the first frequency band B8 and the second frequency band B26 metal film with a thickness of h1; the second photolithography step realizes the third frequency band B28F metal film with a thickness of h2.
[0035] Embodiment 2:
[0036] like Figure 2As shown, four frequency bands of medium and high frequency filters B34+B39+B40+B41 are integrated on the second tube core 102, with 1 metal film thickness, the first frequency band B34 filter 204, the second frequency band B39 filter 205, the third frequency band B40 filter 206, the fourth frequency band B41 filter 207, and the metal film thickness h3.
[0037] The first frequency band B34, the second frequency band B39, the third frequency band B40 and the fourth frequency band B41 metal films are realized by one-time photolithography.
[0038] Embodiment 3:
[0039] like Figure 3 As shown, four frequency bands of medium and high frequency filters B66+B3+B25+B7 are integrated on the third tube core 103, with two kinds of metal film thicknesses, the first frequency band B66 filter 208, the second frequency band B3 filter 209, the third frequency band B25 filter 210, the fourth frequency band B7 filter 211, the first metal film thickness h4, and the second metal film thickness h5.
[0040] Two photolithography processes are performed to realize multi-band integration with different film thicknesses. The first photolithography process realizes the first frequency band B66, the second frequency band B3, and the third frequency band B25 metal films with a thickness of h4; the second photolithography process realizes the fourth frequency band B7 metal film with a thickness of h5.
[0041] Embodiment 4:
[0042] like Figure 4 As shown, the first tube die 101, the second tube die 102, and the third tube die 103 in embodiments 1-3 are integrated on a substrate 3. In this embodiment, the substrate 3 is a PCB substrate.
[0043] Low-cost applications for domestic version terminals include B8+B26+B28F, B34+B39+B40+B41, and B66+B3; low-cost applications for foreign version terminals include B8+B26, B66+B3+B25+B7, and B66+B3; low-cost applications for global version terminals include B8+B26+B28F, B34+B39+B40+B41, and B66+B3+B25+B7.
[0044] Embodiment 5:
[0045] like Figure 5As shown, multiple tube cores 1 are soldered on the substrate 3 invertedly through soldering balls 4, and a gap is left between the tube core 1 and the upper surface of the substrate 3. The tube core 1 can be one and / or more of the low-frequency first tube core 101, the medium- and high-frequency second tube core 102, and the third tube core 103. The soldering balls 4 can be gold balls or tin balls. The sealing material 5 covers the tube core 1 and the substrate 3 to achieve protection. A dry film that continuously fits the tube core 1 is provided between the sealing material 5 and the tube core 1, and the dry film is extended and laid on the substrate 3. The sealing material 5 can be an injection molding material or a black film.
[0046] It should be noted that the content and exemplary embodiments of this article are only used to illustrate the technical solution of this patent, but the implementation of this patent is not limited by the above content. Any other changes, modifications, substitutions, combinations, etc. that do not deviate from the innovative essence and principles of this patent are included in the protection scope of this patent. For those skilled in the art, the specific meanings of the above terms in the patent can be understood according to the specific circumstances.
Claims
1. A surface acoustic wave filter module for radio frequency front-end reception, comprising a plurality of tube cores (1), a plurality of filters (2) being integrated on the tube cores (1), characterized in that: The filter (2) comprises a low-frequency filter and a medium- and high-frequency filter, wherein the low-frequency filter is integrated on the same tube core (1), and the medium-frequency filter and / or high-frequency filter are integrated on the same tube core (1), and each of the tube cores (1) comprises one and / or two metal film thicknesses.
2. A surface acoustic wave filter module for radio frequency front-end reception according to claim 1, characterized in that: The low-frequency filter is targeted at the 4G communication low-frequency band, with a frequency band range of 500MHz-1000MHz.
3. A surface acoustic wave filter module for radio frequency front-end reception according to claim 2, characterized in that: The multi-band low-frequency filter is integrated on one tube core (1) with a maximum of two film thicknesses, which can take into account both electrical performance and production yield.
4. A surface acoustic wave filter module for radio frequency front-end reception according to claim 1, characterized in that: The medium and high frequency filters are targeted at the medium and high frequency bands of 4G communications, with a frequency band range of 1700MHz-2700MHz.
5. A surface acoustic wave filter module for radio frequency front-end reception according to claim 4, characterized in that: The multi-band medium and high frequency filters are integrated on one tube core (1), with a maximum of two film thicknesses, and can take into account both electrical performance and production yield.
6. A surface acoustic wave filter module for radio frequency front-end reception according to any one of claims 1 to 5, characterized in that: The plurality of tube cores (1) are reversely soldered on a substrate (3) via soldering balls (4), and a gap is left between the tube cores (1) and the upper surface of the substrate (3).
7. A surface acoustic wave filter module for radio frequency front-end reception according to claim 6, characterized in that: The tube core (1) includes one and / or more of the three frequency bands of low, medium and high.
8. A surface acoustic wave filter module for radio frequency front-end reception according to claim 6, characterized in that: The welding balls (4) are tin balls or gold balls.
9. A surface acoustic wave filter module for radio frequency front-end reception according to claim 6, characterized in that: A sealing material (5) is provided above the tube core (1) and the substrate (3), a dry film continuously bonded to the tube core (1) is provided between the sealing material (5) and the tube core (1), and the dry film is extended and laid on the substrate (3).
10. A surface acoustic wave filter module for radio frequency front-end reception according to claim 9, characterized in that: The sealing material (5) is made of injection molding material or black film.
