PCB with ESD device
By designing the combination structure of ESD pads and PIN pads on the PCB board, it allows the direct addition of ESD devices without changing the board, solving the problem of missing ESD devices, shortening the development cycle and improving product quality.
Patent Information
- Application Number
- CN202420983050.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-08
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-08
AI Technical Summary
In PCB board design, engineers are prone to missed ESD devices, resulting in products being easily damaged by static and surge interference during use, which extends the development cycle and increases costs.
Design a PCB board with ESD pad and PIN pad. The ESD pad is arranged at the edge of the PIN pad to form a pad form, allowing the ESD device to be directly added without changing the board, by combining the ESD device with ESD pad mount to solve the problem of missing addition.
It effectively avoids the risk of missing ESD devices during design, shortens the product launch cycle, improves product quality, and extends the service life of PCB boards.
Smart Images
Figure CN222263125U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of PCB boards, and in particular, to a PCB board with an ESD device. Background Art
[0002] The data port of the external port (headphone, VGA, HDMI, AV, USB, network port, etc.) is connected in series with an ESD device to improve the ESD protection and surge protection capabilities of the data port. Without an ESD device, static electricity and surge interference are easily introduced during the use of the product, causing damage to the main chip on the product, resulting in the product not being able to be used normally.
[0003] Generally, engineers need to add ESD devices to the schematic diagram and then import them into the PCB. At present, engineers are prone to forget to add ESD devices during design, which may cause product damage during ESD testing or normal use. It is often necessary to modify the PCB board to add ESD devices, which will extend the development cycle and increase costs, which is not conducive to the rapid promotion of products in the market. Summary of the invention
[0004] The purpose of the embodiments of the present application is to provide a PCB board with an ESD device, which can solve the above-mentioned technical problems.
[0005] An embodiment of the present application provides a PCB board with an ESD device, including a PCB board and a plurality of ESD pads, wherein a plurality of traces are arranged on the PCB board, PIN pads are arranged at both ends of the traces, the ESD pads are arranged at the edges of the PIN pads, and the PIN pads are connected to the ESD pads.
[0006] Preferably, the ESD pad is configured to be square, and the PIN pad is configured to be circular.
[0007] Preferably, the length of the ESD pad is 0.5-5 mm.
[0008] Preferably, the PIN pad and the ESD pad are integrally formed, and both the PIN pad and the ESD pad are made of metal copper.
[0009] Preferably, an antistatic layer is provided on the upper end of the ESD pad.
[0010] Beneficial effects of the utility model:
[0011] The utility model provides a PCB board with ESD devices, comprising a PCB board and a plurality of ESD pads, wherein a plurality of routing lines are arranged on the PCB board, PIN pads are arranged at both ends of the routing lines, the ESD pads are arranged at the edges of the PIN pads, and the PIN pads are communicated with the ESD pads. The utility model combines the PIN pads with the ESD pads to form a pad form, and if an ESD device needs to be added, there is no need to modify the board, and the ESD device can be directly added and the ESD device can be mounted on the ESD pads. The utility model can effectively avoid the omission of adding ESD devices during design; avoid modifying the PCB board; shorten the product launch cycle; effectively avoid product damage during use by the user end, and improve product quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0013] Figure 1 It is a schematic diagram of the structure of the PIN pad and the ESD pad of the utility model;
[0014] Figure 2 This is a circuit diagram of the utility model without using an ESD device;
[0015] Figure 3 The utility model adds an ESD device to the circuit diagram.
[0016] The reference numerals are:
[0017] 1. ESD pad; 2. PIN pad. DETAILED DESCRIPTION
[0018] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0019] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0020] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0021] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0022] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0023] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0024] like Figure 1 As shown, a PCB board with ESD devices includes a PCB board and multiple ESD pads 1, multiple traces are arranged on the PCB board, PIN pads 2 are arranged at both ends of the traces, the ESD pads 1 are arranged at the edge of the PIN pads 2, and the PIN pads 2 are connected to the ESD pads 1. The utility model combines the PIN pads 2 with the ESD pads 1 to form a pad form. If an ESD device needs to be added, there is no need to modify the board. The ESD device can be directly added and the ESD device can be mounted on the ESD pads 1. The utility model can effectively avoid the omission of adding ESD devices during design; avoid modifying the PCB board; shorten the product launch cycle; effectively avoid product damage during user-end use and improve product quality.
[0025] like Figure 1As shown, in this embodiment, the ESD pad 1 is set to be square, and the PIN pad 2 is set to be round; the length of the ESD pad 1 is 0.5-5mm; the PIN pad 2 and the ESD pad 1 are integrally formed, and the PIN pad 2 and the ESD pad 1 are both made of metal copper. Specifically, when manufacturing the PCB board, the PIN pad 2 and the ESD pad 1 can be directly processed as one piece. When ESD devices need to be added later, they can be directly installed without changing the structure of the PCB board, thereby extending the service life of the PCB board.
[0026] like Figure 1 As shown, in this embodiment, in order to prevent the influence of static electricity on the PCB board, an antistatic layer is provided on the upper end of the ESD pad 1. Similarly, an antistatic layer can also be added on the PIN pad 2.
[0027] like Figure 2 As shown, the design of this circuit diagram omits to add ESD devices. When it is necessary to add ESD devices, either the structure of the PCB board must be changed or the PCB board must be hollowed out for installation. Both of these will affect the service life of the PCB board. Figure 3 As shown, diode D9 and diode D10 are ESD devices. When ESD pad 1 is added to the PCB board, the problem can be solved by mounting the ESD devices normally.
[0028] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A PCB board with an ESD device, characterized in that: It comprises a PCB board and a plurality of ESD pads. The PCB board is provided with a plurality of routing lines. Both ends of the routing lines are provided with PIN pads. The ESD pads are provided at the edges of the PIN pads. The PIN pads are connected with the ESD pads.
2. A PCB board with an ESD device according to claim 1, characterized in that: The ESD pad is configured to be square, and the PIN pad is configured to be circular.
3. A PCB board with an ESD device according to claim 1, characterized in that: The length of the ESD pad is 0.5-5 mm.
4. A PCB board with an ESD device according to claim 1, characterized in that: The PIN pad and the ESD pad are integrally formed, and both the PIN pad and the ESD pad are made of metal copper.
5. A PCB board with an ESD device according to claim 1, characterized in that: An antistatic layer is arranged on the upper end of the ESD pad.