110GHz photoelectric receiver module packaging shell
By designing the 110GHz photoelectric receiver module packaging shell, using white resin photocuring printing and CNC molding technology, the strength and shielding problems of existing photoelectric receiver packaging shell are solved, achieving higher portability and aesthetics, ensuring that Protection of high-value devices.
Patent Information
- Application Number
- CN202420227707.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-31
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-01-31
AI Technical Summary
The existing photoelectric receiver packaging has poor strength, is not compact enough, has no insulation and shielding functions, making it difficult to protect high-value devices while providing good shielding, and is poor in portability and aesthetics.
A 110GHz photoelectric receiver module packaging housing was designed, using packaging box body, detector packaging box body, detector packaging box cover plate, packaging box upper cover plate, support, installation hole, limit hole, and screw Components such as holes, photocuring printing and CNC molding, increase the strength and compactness of the shell, and use metal to provide insulation and shielding effects.
It significantly improves the strength and structural compactness of the packaging shell, has insulation and shielding functions, improves portability and aesthetics, can effectively protect high-value devices, and provide good shielding effects.
Smart Images
Figure CN222263214U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of optical devices, in particular to a 110GHz optoelectronic receiver module packaging shell. Background Art
[0002] A general optoelectronic component analyzer refers to a technology that uses an optoelectronic component analyzer to test and analyze optoelectronic components. This analyzer is usually used to test the performance parameters of optoelectronic components such as photodiodes, phototransistors, and photodetectors, such as photocurrent, response time, spectral characteristics, etc. A general optoelectronic component analyzer usually includes a light source, an optical system, an electronics system, and a data processing system, and can perform optoelectronic characteristic tests, optoelectronic parameter measurements, and analysis on optoelectronic components.
[0003] A photoelectric transmitter is a device that can convert electrical signals into optical signals and transmit them. It is usually composed of a light source, a modulator and a transmitter. It can be used in fiber-optic communications, lidar, photoelectric sensing and other fields. However, the existing photoelectric receiver packaging shell has poor strength, is not compact enough, does not have insulation and shielding functions, has poor portability and aesthetics, and is difficult to protect high-value devices while providing good shielding.
[0004] Therefore, it is necessary to provide a 110 GHz optoelectronic receiver module packaging shell to solve the above technical problems. Utility Model Content
[0005] The utility model provides a 110GHz optoelectronic receiver module packaging shell, which solves the problems of the existing optoelectronic receiver packaging shell having poor strength, compact structure, lack of insulation and shielding effects, poor portability and aesthetics, and difficulty in protecting high-value devices while providing good shielding.
[0006] In order to solve the above technical problems, the utility model provides a 110 GHz optoelectronic receiver module packaging shell, comprising: a packaging box body, a detector packaging box body is arranged inside the packaging box body, a detector packaging box cover is arranged on the top of the detector packaging box body, and a packaging box upper cover is arranged on the top of the detector packaging box cover.
[0007] Preferably, a support member is fixedly connected to the inner wall of the packaging box body, and first mounting holes are provided on both sides of the top of the support member.
[0008] Preferably, second mounting holes are provided on both sides of the top of the detector packaging box body, and first limiting holes are provided on both sides of the bottom of the inner wall of the packaging box body.
[0009] Preferably, both sides of the detector packaging box body are fixedly connected to limiting ears, and a second limiting hole is opened inside the limiting ears.
[0010] Preferably, both sides of the bottom of the inner wall of the detector packaging box are fixedly connected to limiting columns.
[0011] Preferably, a first screw hole is provided inside the upper cover plate of the packaging box, and the first screw hole is matched with the first mounting hole.
[0012] Preferably, a second screw hole is provided inside the cover plate of the detector packaging box, and the second screw hole is matched with the second mounting hole.
[0013] Preferably, the tops of the packaging box body and the detector packaging box body are both not sealed.
[0014] Compared with the related art, the 110 GHz optoelectronic receiver module packaging shell provided by the utility model has the following beneficial effects:
[0015] The utility model provides a 110GHz optoelectronic receiver module packaging shell. Through the arrangement of a packaging box body, a detector packaging box body, a detector packaging box cover, a packaging box upper cover, a support, a first mounting hole, a second mounting hole, a first limiting hole, a limiting ear, a second limiting hole, a limiting column, a first screw hole and a second screw hole, the strength of the packaging shell is greatly increased, the structure is compact, the insulation and shielding effects are achieved, the portability and aesthetics are improved, the needs can be well met, and high-value devices can be protected while providing good shielding. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 A schematic structural diagram of a first embodiment of a 110 GHz optoelectronic receiver module packaging housing provided by the utility model;
[0017] Figure 2 A schematic diagram of the structure of the packaging box body provided by the utility model;
[0018] Figure 3 A schematic diagram of the structure of the detector packaging box provided by the utility model;
[0019] Figure 4 A schematic diagram of the structure of the detector packaging box cover provided by the utility model;
[0020] Figure 5 This is a schematic structural diagram of the upper cover plate of the packaging box provided by the utility model.
[0021] Numbers in the figure:
[0022] 1. Packaging box body, 2. Detector packaging box body, 3. Detector packaging box cover, 4. Packaging box upper cover, 5. Support, 6. First mounting hole, 7. Second mounting hole, 8. First limiting hole, 9. Limiting ear, 10. Second limiting hole, 11. Limiting column, 12. First screw hole, 13. Second screw hole. DETAILED DESCRIPTION
[0023] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.
[0024] First embodiment
[0025] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ,in, Figure 1 A schematic structural diagram of a first embodiment of a 110 GHz optoelectronic receiver module packaging housing provided by the utility model; Figure 2 A schematic diagram of the structure of the packaging box body provided by the utility model; Figure 3 A schematic diagram of the structure of the detector packaging box provided by the utility model; Figure 4 A schematic diagram of the structure of the detector packaging box cover provided by the utility model; Figure 5 The schematic diagram of the structure of the upper cover of the packaging box provided by the utility model. The 110GHz optoelectronic receiver module packaging shell includes: a packaging box body 1, which is formed in one piece by photocuring printing with white resin, is 6.5mm thick, and is provided with reinforcing columns to increase strength. Copper columns are reserved at all places where screws are required for fixing and glued to make the installation more secure. A detector packaging box body 2 is arranged inside the packaging box body 1. The detector packaging box body 2 is formed in one piece by CNC, and a step is milled on the upper edge to facilitate positioning during installation. The bottom step makes it easy to align the joint. The metal can effectively provide shielding, and the four corner mounting holes save space. The detector packaging box cover 3 is arranged on the top of the detector packaging box body 2. The cover 3 is formed in one piece by CNC, and a step is milled on the edge to facilitate positioning during installation. A packaging box upper cover 4 is arranged on the top of the detector packaging box cover 3. The packaging box upper cover 4 is 3 mm thick white resin with reinforcing ribs, and is formed by photocuring printing. Its function is to close the shell. The shell is formed in one piece by white resin photocuring printing. The main body of the box is square, has good integrity, and is more beautiful. The hexagonal sink is used to install copper columns, locking devices and cover plates. The upper cover reinforcement ribs can effectively prevent deformation. The internal metal packaging box provides good shielding while protecting high-value devices. The use of photocuring printing technology and CNC has achieved improved portability and aesthetics.
[0026] The working principle of the 110GHz optoelectronic receiver module packaging shell provided by the utility model is as follows:
[0027] The packaging shell is mainly composed of a packaging box body 1 and a packaging box upper cover 4, a detector packaging box cover 3 and a detector packaging box body 2. The packaging box upper cover 4 and the packaging box body 1 are formed by photocuring printing with white resin, and the detector packaging box cover 3 and the detector packaging box body 2 are formed by CNC integrally with 6061 aluminum. The composition is strong, insulating and shielded. When in use, first align the second limiting hole 10 inside the upper limiting ear 9 of the detector packaging box body 2 with the first limiting hole 8, and tighten the screws to install the detector packaging box body 2 and the packaging box body 1, then align the second screw hole 13 on the detector packaging box cover 3 with the second mounting hole 6, and tighten the screws to install the detector packaging box cover 3 and the detector packaging box body 2, finally place the packaging box upper cover 4 on the support 5, align the first screw hole 12 with the first mounting hole 6 on the packaging box body 1, and tighten the screws to install the packaging box upper cover 4 and the packaging box body 1.
[0028] Compared with the related art, the 110 GHz optoelectronic receiver module packaging shell provided by the utility model has the following beneficial effects:
[0029] By arranging the packaging box body 1, the detector packaging box body 2, the detector packaging box cover 3, the packaging box upper cover 4, the support 5, the first mounting hole 6, the second mounting hole 7, the first limiting hole 8, the limiting ear 9, the second limiting hole 10, the limiting column 11, the first screw hole 12 and the second screw hole 13, the strength of the packaging shell is greatly increased, the structure is compact, and it has insulation and shielding effects, thereby achieving the improvement of portability and aesthetics, being able to meet the needs well, and being able to protect high-value devices while providing good shielding.
[0030] Second embodiment
[0031] Please refer to Figure 2-5 Based on the 110 GHz optoelectronic receiver module package shell provided in the first embodiment of the present application, the second embodiment of the present application proposes another 110 GHz optoelectronic receiver module package shell. The second embodiment is only a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.
[0032] Specifically, the difference of the 110 GHz optoelectronic receiver module packaging shell provided in the second embodiment of the present application is that, in the 110 GHz optoelectronic receiver module packaging shell, a support member 5 is fixedly connected to the inner wall of the packaging box body 1, and a first mounting hole 6 is opened on both sides of the top of the support member 5, and a second mounting hole 7 is opened on both sides of the top of the detector packaging box body 2, and a first limiting hole 8 is opened on both sides of the bottom of the inner wall of the packaging box body 1, and limiting ears 9 are fixedly connected to both sides of the detector packaging box body 2, and a second limiting hole 10 is opened inside the limiting ears 9, and limiting columns 11 are fixedly connected to both sides of the bottom of the inner wall of the detector packaging box body 2, a first screw hole 12 is opened inside the packaging box upper cover plate 4, and the first screw hole 12 is adapted to the first mounting hole 6, and a second screw hole 13 is opened inside the detector packaging box cover plate 3, and the second screw hole 13 is adapted to the second mounting hole 7, and the tops of the packaging box body 1 and the detector packaging box body 2 are both open.
[0033] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. A 110 GHz optoelectronic receiver module packaging shell, characterized in that: include: A packaging box body (1), wherein a detector packaging box body (2) is arranged inside the packaging box body (1), a detector packaging box cover plate (3) is arranged on the top of the detector packaging box body (2), and a packaging box upper cover plate (4) is arranged on the top of the detector packaging box cover plate (3).
2. The 110 GHz optoelectronic receiver module packaging shell according to claim 1, characterized in that: A support member (5) is fixedly connected to the inner wall of the packaging box body (1), and first mounting holes (6) are provided on both sides of the top of the support member (5).
3. The 110 GHz optoelectronic receiver module packaging shell according to claim 1, characterized in that: Second mounting holes (7) are provided on both sides of the top of the detector packaging box body (2), and first limiting holes (8) are provided on both sides of the bottom of the inner wall of the packaging box body (1).
4. The 110 GHz optoelectronic receiver module packaging shell according to claim 1, characterized in that: Both sides of the detector packaging box body (2) are fixedly connected to limiting ears (9), and a second limiting hole (10) is provided inside the limiting ears (9).
5. The 110 GHz optoelectronic receiver module packaging shell according to claim 1, characterized in that: Limiting columns (11) are fixedly connected to both sides of the bottom of the inner wall of the detector packaging box body (2).
6. The 110 GHz optoelectronic receiver module packaging shell according to claim 1, characterized in that: A first screw hole (12) is provided inside the upper cover plate (4) of the packaging box, and the first screw hole (12) is matched with the first mounting hole (6).
7. The 110 GHz optoelectronic receiver module packaging shell according to claim 1, characterized in that: A second screw hole (13) is provided inside the detector packaging box cover plate (3), and the second screw hole (13) is matched with the second mounting hole (7).
8. The 110 GHz optoelectronic receiver module packaging shell according to claim 1, characterized in that: The tops of the packaging box body (1) and the detector packaging box body (2) are both not sealed.