Machine room and data center

Abstract

The embodiment of the utility model provides a machine room and a data center, and relates to the technical field of data centers. Wherein the machine room comprises a plurality of cooling chambers arranged at intervals, and the cooling chambers are used for being connected with the data center; each cooling chamber comprises a plurality of high-density cabinets, a plurality of first air conditioners and at least one power supply cabinet, the high-density cabinets are evenly arranged in the cooling chambers at intervals, the power supply cabinets are used for supplying power to the high-density cabinets, and the first air conditioners are arranged between the high-density cabinets. Therefore, an original low-density cabinet is replaced by the high-density cabinet, the requirement of the AI technology for the computing capacity of the data center is met, heat dissipation is conducted on the high-density cabinet through the cooling chamber and the first air conditioner, the heat dissipation requirement of the high-density cabinet is met, electric power is distributed to the high-density cabinet through the power supply cabinet, and stable operation of the high-density cabinet is guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of data centers, and in particular to a computer room and a data center. Background Art

[0002] Data centers are core facilities in the field of information technology. They integrate computing resources, storage resources, and network resources to provide reliable, efficient, and secure data processing, storage, and transmission services for various digital applications.

[0003] In the relevant technology, a data center usually includes facilities such as a computer room, a refrigeration room, and a power room. The computer room is equipped with multiple low-density cabinets for installing and carrying IT infrastructure such as servers, storage devices, and network devices. The refrigeration room is connected to the computer room to adjust the temperature and humidity in the computer room, and the power room is connected to the computer room to provide stable and reliable power support for the equipment in the computer room.

[0004] However, faced with the continued growth in the scale of AI models and the amount of data, the number and power of servers that a single low-density cabinet can support are limited, making it difficult to meet the higher requirements of AI technology for data center computing capabilities. Utility Model Content

[0005] The embodiments of the present application provide a computer room and a data center to solve the problem that the number and power of servers supported by a single low-density cabinet are limited, and it is difficult to meet the higher requirements of AI technology on the computing power of the data center.

[0006] In a first aspect, an embodiment of the present application provides a computer room, comprising a plurality of cooling rooms arranged at intervals, wherein the cooling rooms are used to be connected to a data center; each of the cooling rooms comprises a plurality of high-density cabinets, a plurality of first air conditioners and at least one power supply cabinet, the high-density cabinets are evenly and spaced apart in the cooling room, the power supply cabinets are used to supply power to the high-density cabinets, and the first air conditioners are respectively arranged between the high-density cabinets.

[0007] In one possible implementation, in the computer room provided by the embodiment of the present application, the high-density cabinets of each of the above-mentioned cooling rooms are arranged in at least two rows, and each row of the above-mentioned high-density cabinets forms a cabinet group. The number of the above-mentioned power supply cabinets is at least two, and each of the above-mentioned cabinet groups is arranged corresponding to at least one above-mentioned power supply cabinet.

[0008] In a possible implementation, in the computer room provided by the embodiment of the present application, the same cabinet group is provided with at least four of the above-mentioned high-density cabinets, and each of the above-mentioned first air conditioners is interspersed in the above-mentioned cabinet group.

[0009] In a possible implementation, in the computer room provided by the embodiment of the present application, the high-density cabinets of the same cabinet group are respectively connected to the corresponding power supply cabinets through cables.

[0010] In a possible implementation, in the computer room provided by the embodiment of the present application, each of the above-mentioned cooling rooms also includes at least one low-density cabinet, and the above-mentioned power supply cabinet is connected to the above-mentioned low-density cabinet to supply power to the above-mentioned low-density cabinet.

[0011] On the other hand, an embodiment of the present application provides a data center, comprising a refrigeration room and the computer room described in any one of the first aspects, wherein the refrigeration room is connected to the computer room through a pipeline.

[0012] In a possible implementation, the data center provided in the embodiment of the present application further includes at least one power room, and the power room is respectively connected to the power supply cabinets in each of the cooling rooms to supply power to the power supply cabinets.

[0013] In a possible implementation, in the data center provided in the embodiment of the present application, a plurality of second air conditioners are arranged in the refrigeration chamber, the second air conditioners are configured to provide cold air into the refrigeration chamber, and the refrigeration chamber is connected to the bottom of each of the cooling chambers through the pipeline.

[0014] In a possible implementation, in the data center provided in the embodiment of the present application, a chilled water distribution unit is further provided in the refrigeration room, and the chilled water distribution unit is connected to the second air conditioner to provide chilled water for the second air conditioner.

[0015] In a possible implementation, in the data center provided by the embodiment of the present application, the cooling chambers are symmetrically distributed on both sides of the refrigeration chamber.

[0016] The computer room and data center provided by the embodiment of the present application, wherein the embodiment of the present application provides a computer room, including a plurality of cooling rooms arranged at intervals, the cooling rooms are used to be connected to the data center; each cooling room includes a plurality of high-density cabinets, a plurality of first air conditioners and at least one power supply cabinet, the high-density cabinets are evenly and spacedly arranged in the cooling room, the power supply cabinets are used to supply power to the high-density cabinets, and each first air conditioner is respectively arranged between each high-density cabinet. Thus, the original low-density cabinets are replaced with high-density cabinets to meet the requirements of AI technology for the computing power of the data center, and the high-density cabinets are cooled by the setting of the cooling room and the first air conditioner to meet the cooling requirements of the high-density cabinets, and the power supply cabinets are used to distribute power to each high-density cabinet to ensure the stable operation of the high-density cabinets.

[0017] In addition to the technical problems solved by the embodiments of the present application, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the technical solutions provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0019] Figure 1 A schematic diagram of the structure of the computer room provided in the embodiment of the present application;

[0020] Figure 2 A schematic diagram of the structure of a data center provided in an embodiment of the present application.

[0021] Description of reference numerals:

[0022] 10- Computer room;

[0023] 20-refrigeration room; 21-second air conditioner; 22-chilled water distribution unit;

[0024] 30-Electricity room;

[0025] 100-cooling room; 110-high-density cabinet; 120-power supply cabinet; 130-first air conditioner; 140-low-density cabinet.

[0026] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0027] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation methods described in the following exemplary embodiments do not represent all implementation methods consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the attached claims. Based on the embodiments in the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the embodiments of the present application.

[0028] In the embodiments of the present application, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present application and their embodiments, and are not intended to limit the indicated devices, elements or components to have specific orientations, or to be constructed and operated in specific orientations. Moreover, in addition to being used to indicate orientations or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present application can be understood according to the specific circumstances.

[0029] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0030] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments of the embodiments of the present application described herein, for example, can be implemented in an order other than those illustrated or described herein.

[0031] In the embodiments of the present application, words such as "exemplarily" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplarily" or "for example" is intended to present related concepts in a specific way.

[0032] Unless otherwise stated, the term "plurality" means two or more.

[0033] As described in the background technology, data centers are core facilities in the field of information technology. Data centers integrate computing resources, storage resources, and network resources to provide reliable, efficient, and secure data processing, storage, and transmission services for various digital applications.

[0034] In the relevant technology, a data center usually includes facilities such as a computer room, a refrigeration room, and a power room. The computer room is equipped with multiple low-density cabinets for installing and carrying IT infrastructure such as servers, storage devices, and network devices. The refrigeration room is connected to the computer room to adjust the temperature and humidity in the computer room, and the power room is connected to the computer room to provide stable and reliable power support for the equipment in the computer room.

[0035] However, faced with the continued growth in the scale of AI models and the amount of data, the number and power of servers that a single low-density cabinet can support are limited, making it difficult to meet the higher requirements of AI technology for data center computing capabilities.

[0036] To solve the above problems, the embodiment of the present application provides a computer room and a data center, wherein the computer room includes a plurality of cooling rooms arranged at intervals, and the cooling rooms are used to be connected to the data center; each cooling room includes a plurality of high-density cabinets, a plurality of first air conditioners and at least one power supply cabinet, and the high-density cabinets are evenly and spacedly arranged in the cooling room, the power supply cabinet is used to supply power to the high-density cabinets, and each first air conditioner is respectively arranged between each high-density cabinet. Thus, the original low-density cabinet is replaced with a high-density cabinet, meeting the requirements of AI technology for the computing power of the data center, and the high-density cabinet is cooled by the setting of the cooling room and the first air conditioner to meet the heat dissipation requirements of the high-density cabinet, and the power supply cabinet distributes power to each high-density cabinet to ensure the stable operation of the high-density cabinet.

[0037] The following specific embodiments are used to describe in detail the technical solutions of the embodiments of the present application and how the technical solutions of the embodiments of the present application solve the above-mentioned technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0038] Please refer to Figure 1 In a first aspect, the present embodiment provides a computer room 10, comprising a plurality of cooling rooms 100 arranged at intervals, the cooling rooms 100 being used to be connected to a data center; each cooling room 100 comprises a plurality of high-density cabinets 110, a plurality of first air conditioners 130 and at least one power supply cabinet 120, the high-density cabinets 110 are evenly and spaced apart in the cooling room 100, the power supply cabinet 120 is used to supply power to the high-density cabinets 110, and each first air conditioner 130 is respectively arranged between each high-density cabinet 110.

[0039] The high-density cabinet 110 refers to a cabinet designed for high-density deployment of servers, network equipment or other IT equipment. The high-density cabinet 110 generally has a compact structural design to maximize the equipment capacity within a unit space. The notable feature of the high-density cabinet 110 is that it can accommodate a large number of computing units and storage devices, and the number of devices inside each cabinet far exceeds that of traditional or low-density cabinets.

[0040] The low-density cabinet 140, also often referred to as a common cabinet or a standard cabinet, is relative to the high-density cabinet 110. The low-density cabinet 140 is more traditional in design and usually follows the size and specifications of industry standards. The internal space of the low-density cabinet 140 is relatively spacious, the equipment deployment density is low, and the number of IT devices that can be accommodated in each cabinet is limited.

[0041] Specifically, in the present embodiment, the cooling chamber 100 is a closed structure, so as to be isolated from the cold and hot air flows in the outside, thereby ensuring the heat dissipation effect in the entire cooling chamber 100 .

[0042] Data centers usually include facilities such as computer rooms, refrigeration rooms, and power rooms. The computer room is equipped with multiple low-density cabinets for installing and carrying IT infrastructure such as servers, storage devices, and network equipment. The refrigeration room is connected to the computer room to adjust the temperature and humidity in the computer room, and the power room is connected to the computer room to provide stable and reliable power support for the equipment in the computer room.

[0043] Specifically, the cooling chamber 100 provided in this embodiment is connected to the refrigeration chamber 20 in the data center. A ventilation floor is formed at the bottom of the cooling chamber 100. A plurality of ventilation holes connected to the refrigeration chamber 20 are provided on the ventilation floor, thereby allowing cold air to flow from the refrigeration chamber 20 into the cooling chamber 100. At the same time, the cold air can be evenly distributed to each cooling chamber 100 through the space under the ventilation floor to achieve heat dissipation in the cooling chamber 100.

[0044] Specifically, in this embodiment, a plurality of high-density cabinets 110 are disposed in the cooling chamber 100. The plurality of high-density cabinets 110 are arranged evenly and at intervals. The arrangement of the high-density cabinets 110 can be adaptively adjusted according to actual needs to meet operational requirements in different scenarios.

[0045] Among them, by maintaining the intervals between the high-density cabinets 110, it is possible to ensure that cold air can flow smoothly to each high-density cabinet 110, thereby improving the overall heat dissipation efficiency, ensuring the stable operating temperature of the equipment inside the high-density cabinet 110, and extending the service life of the equipment.

[0046] At the same time, by replacing the original low-density cabinet 140 with a high-density cabinet 110, the computing power, space utilization and energy efficiency can be greatly improved, thereby effectively responding to the AI ​​technology's needs for massive data processing and complex calculations and meeting the needs of future business growth.

[0047] Specifically, in this embodiment, the cooling chamber 100 further includes at least one power supply cabinet 120 and a plurality of first air conditioners 130. The power supply cabinet 120 is used to supply power to the high-density cabinets 110, and the first air conditioners 130 are interspersed between the high-density cabinets 110 to form a point-to-point heat dissipation network to avoid the generation of local hot spots, thereby ensuring the heat dissipation efficiency of the high-density cabinets 110.

[0048] In an optional embodiment, there are two power supply cabinets 120, one of which can be kept closed as a backup. Therefore, when the main power supply cabinet 120 fails or is under maintenance, the backup power supply cabinet 120 can be quickly activated to ensure that the power supply is not interrupted, ensure the normal operation of the computer room 10, improve the reliability of the system, and reduce the risk of data loss or business interruption caused by power outages.

[0049] In another optional embodiment, there are two power supply cabinets 120, and the two power supply cabinets 120 are respectively connected to the two power rooms 30, thereby forming a dual-circuit power supply, which improves the reliability and stability of power supply. Even if one of the power rooms 30 fails or undergoes maintenance, the other power room 30 can still continue to provide power to the corresponding power supply cabinet 120, ensuring the continuous operation of the high-density cabinet 110, thereby ensuring the uninterrupted business of the computer room 10.

[0050] Secondly, the dual-circuit power supply architecture can also achieve load balancing. By properly allocating the power supply loads of the two power rooms 30, the utilization of power resources can be optimized and the potential risks caused by overloading of a single power room 30 can be reduced.

[0051] In addition, as the business volume grows, more power supply cabinets 120 and power rooms 30 can be added as needed in the future, and the existing dual-circuit power supply architecture can be easily integrated with the new equipment without the need for large-scale modifications to the existing system.

[0052] Specifically, in this embodiment, by dividing the machine room 10 into a plurality of cooling chambers 100 , a relatively independent heat dissipation environment is formed inside each cooling chamber 100 , so that targeted heat dissipation can be achieved for the equipment in each cooling chamber 100 .

[0053] In addition, the temperature and humidity in each cooling chamber 100 can be precisely controlled through the refrigeration chamber 20 and the first air conditioner 130, avoiding the occurrence of local heat island problems, ensuring uniform heat dissipation in each cold channel, and avoiding equipment performance degradation or failure due to uneven heat dissipation.

[0054] At the same time, when a cooling room 100 needs to be maintained or expanded, it can be done independently without affecting the normal operation of other cold channels. When the number of cold channels needs to be increased or decreased, it can be easily configured and adjusted flexibly according to actual needs, ensuring the flexibility of the machine room 10.

[0055] In addition, it should be noted that this embodiment does not impose any restriction on the number of cooling chambers 100 in each machine room 10, and can be adaptively selected according to actual needs. Exemplarily, the number of cooling chambers 100 is six.

[0056] In an optional embodiment, the high-density cabinets 110 of each cooling room 100 are arranged in at least two rows, each row of high-density cabinets 110 forms a cabinet group, the number of power supply cabinets 120 is at least two, and each cabinet group is arranged corresponding to at least one power supply cabinet 120.

[0057] Specifically, in the present embodiment, the high-density cabinets 110 in each cooling chamber 100 are arranged in at least two rows, so as to facilitate air circulation and help the first air conditioner 130 to effectively dissipate heat for the high-density cabinets 110 .

[0058] In an optional embodiment, each power supply cabinet 120 corresponds to a cabinet group, so that each cabinet group can be powered separately, so that each cabinet group can obtain independent and stable power supply, which is convenient for separate power monitoring, management and maintenance. When a fault occurs or maintenance is required, the problem area can be quickly located and isolated, reducing the impact on the entire computer room 10, and improving reliability and maintainability.

[0059] In an optional embodiment, each cabinet group can correspond to two power supply cabinets 120, one of which is mainly used for power supply, and the other is used as a backup, so that it can take over the power supply task when the main power supply cabinet 120 fails, to ensure that the equipment in the cabinet group will not be affected by power outages.

[0060] In an optional embodiment, the power of the high-density cabinet 110 is 25kw, and the power of the first air conditioner 130 is 50kw.

[0061] Specifically, in this embodiment, the high-density cabinet 110 is 25kw, which is enough to carry high-performance computing tasks or large-scale data processing needs to meet the computing power requirements of applications in fields such as AI, big data analysis, and cloud computing.

[0062] Compared with low-power cabinets, the 25kw high-density cabinet 110 can provide more computing power in the same physical space, thereby achieving higher computing density and providing more powerful service support in a limited space.

[0063] Among them, in order to ensure the stable operation of the high-density cabinet 110, in this embodiment, the first air conditioner 130 adopts a 50kw first air conditioner 130, thereby ensuring that each high-density cabinet 110 can obtain sufficient cold air supply, thereby effectively reducing the temperature inside the cabinet and avoiding performance degradation or equipment damage due to overheating.

[0064] In this embodiment, the first air conditioner 130 is interspersed between two adjacent high-density cabinets 110, so as to achieve close cooling of the heat source, reduce the loss of cold air during transmission, and improve the heat dissipation efficiency. At the same time, this layout also ensures that each high-density cabinet 110 can get a uniform and sufficient supply of cold air, effectively reducing the temperature inside the cabinet and ensuring the stable operation of the equipment.

[0065] Specifically, when the cooling effect of the first air conditioner 130 is not sufficient to achieve heat dissipation of the entire high-density cabinet 110 , auxiliary heat dissipation can also be performed through the refrigeration chamber 20 to ensure the heat dissipation efficiency and effect of the computer room 10 .

[0066] In an optional embodiment, the same cabinet group is provided with at least four high-density cabinets 110 , and each first air conditioner 130 is interspersed in the cabinet group.

[0067] Specifically, in this embodiment, there are two cabinet groups in each cooling room 100, and correspondingly, there are two power supply cabinets 120. At the same time, there are four high-density cabinets 110 in each cabinet group, and the four high-density cabinets 110 are arranged evenly and at intervals, and the first air conditioner 130 is interspersed between the four high-density cabinets 110, so as to ensure the heat dissipation effect of each high-density cabinet 110 and avoid the problem of heat concentration generated by a single high-density cabinet 110 and the occurrence of local hot spots.

[0068] At the same time, the first air conditioner 130 is interspersed between the high-density cabinets 110, which can facilitate air circulation and help the first air conditioner 130 to effectively dissipate heat for the high-density cabinets 110. In addition, the number of four high-density cabinets 110 can meet the actual needs of the current data center business, providing sufficient computing power while avoiding excessive waste of resources.

[0069] Secondly, the number of first air conditioners 130 can be set corresponding to the high-density cabinets 110. For example, the number of first air conditioners 130 can be three, and the three first air conditioners 130 are respectively arranged between two adjacent high-density cabinets 110 to ensure that the first air conditioner 130 can cover and effectively dissipate heat for each cabinet group to ensure a stable operating temperature inside the high-density cabinet 110.

[0070] In addition, it should be noted that the specific number of high-density cabinets 110, power supply cabinets 120 and first air conditioners 130 can be adaptively selected according to actual needs, and this embodiment does not impose any limitation on this.

[0071] In an optional embodiment, the high-density cabinets 110 in the same cabinet group are respectively connected to corresponding power supply cabinets 120 via cables.

[0072] Specifically, in this embodiment, each power supply cabinet 120 is connected to each high-density cabinet 110 in its corresponding cabinet group through different cables, so that even if a cable or connection point connecting one of the high-density cabinets 110 to the power supply cabinet 120 fails, each high-density cabinet 110 connected to the power supply cabinet 120 through other cables can still receive power, thereby ensuring that the power supply of the high-density cabinet 110 is not interrupted.

[0073] At the same time, the connection method of multiple cables makes the power distribution more uniform and efficient. The power supply cabinet 120 can adjust the power output of each cable according to actual needs to achieve refined power management of the high-density cabinet 110. This helps to avoid waste of power resources and improve the energy utilization efficiency of the data center.

[0074] In an optional embodiment, each cooling chamber 100 further includes at least one low-density cabinet 140 , and the power supply cabinet 120 is connected to the low-density cabinet 140 to supply power to the low-density cabinet 140 .

[0075] Specifically, when arranging the high-density cabinet 110, it is mainly limited by the capacity of the power supply system and the U-bit resources. The limited capacity of the power supply system means that the power room 30 cannot provide unlimited power support for all cabinets. Although the high-density cabinet 110 can provide powerful computing power, its power demand is also correspondingly high. In the case of tight power supply, the deployment of high-density cabinets 110 will cause power overload, which will affect the normal operation of other equipment in the computer room 10 and even cause safety hazards.

[0076] U-slot is a standard space unit for installing cabinets in a computer room, and each cabinet needs to occupy a certain number of U-slots. Since high-density cabinets 110 integrate more computing devices and storage resources, they often need to occupy more U-slots. In the case of limited U-slot resources, if high-density cabinets 110 are forcibly deployed, it will not only occupy a large amount of valuable U-slot resources, but may also affect the deployment of other devices and future expansion needs.

[0077] Therefore, under the premise of limited capacity of the power supply system and tight U-bit resources, this embodiment adopts a combination of high-density cabinets 110 and low-density cabinets 140, so as to provide a certain computing power and expansion space for the computer room 10 without exceeding the power supply limitations and tight U-bit resources.

[0078] Specifically, the low-density cabinet 140 generates relatively less heat, which can reduce the heat dissipation pressure in the cooling chamber 100. Therefore, in this embodiment, the low-density cabinet 140 is arranged at the end of the cooling chamber 100 and is arranged adjacent to a high-density cabinet 110, so that the heat dissipation of the low-density cabinet 140 and the high-density cabinet 110 can be achieved by using a first air conditioner 130 to provide cold air.

[0079] Please refer to Figure 1 and Figure 2 In a second aspect, this embodiment provides a data center, comprising a refrigeration room 20 and the computer room 10 described in any one of the first aspects, wherein the refrigeration room 20 is connected to the computer room 10 through a pipeline.

[0080] The computer room 10 has been described in the above embodiments and will not be described again here.

[0081] Specifically, the data center includes a refrigeration room 20 and a computer room 10 as described in any one of the first aspects, and the refrigeration room 20 is connected to the computer room 10 through a pipeline. The computer room 10 includes a plurality of cooling rooms 100 arranged at intervals, and the cooling rooms 100 are used to be connected to the refrigeration room 20; each cooling room 100 includes a plurality of high-density cabinets 110, a plurality of first air conditioners 130 and at least one power supply cabinet 120, the high-density cabinets 110 are evenly and spacedly arranged in the cooling room 100, the power supply cabinet 120 is used to supply power to the high-density cabinets 110, and each first air conditioner 130 is respectively arranged between each high-density cabinet 110. Thereby, the original low-density cabinet is replaced with a high-density cabinet 110 to meet the requirements of AI technology for the computing power of the data center. Through the setting of the cooling room 100 and the first air conditioner 130, the high-density cabinet 110 is cooled to meet the heat dissipation requirements of the high-density cabinet 110. Electricity is distributed to each high-density cabinet 110 through the power supply cabinet 120, ensuring the stable operation of the high-density cabinet 110.

[0082] In an optional embodiment, at least one power room 30 is further included. The power room 30 is respectively connected to the power supply cabinets 120 in each cooling room 100 to supply power to the power supply cabinets 120 .

[0083] Specifically, in this embodiment, there are two power rooms 30, and the power supply cabinets 120 in each cooling room are respectively connected to the two power rooms 30, thereby forming a dual-circuit power supply, which improves the reliability and stability of power supply. Even if one of the power rooms 30 fails or undergoes maintenance, the other power room 30 can still continue to provide power to the corresponding power supply cabinet 120, ensuring the continuous operation of the high-density cabinet 110, thereby ensuring the uninterrupted business of the computer room 10.

[0084] Secondly, the dual-circuit power supply architecture can also achieve load balancing. By properly allocating the power supply loads of the two power rooms 30, the utilization of power resources can be optimized and the potential risks caused by overloading of a single power room 30 can be reduced.

[0085] In addition, as the business volume grows, more power supply cabinets 120 and power rooms 30 can be added as needed in the future, and the existing dual-circuit power supply architecture can be easily integrated with the new equipment without the need for large-scale modifications to the existing system.

[0086] In an optional embodiment, a plurality of second air conditioners 21 are disposed in the refrigeration chamber 20 , and the second air conditioners 21 are configured to provide cold air to the refrigeration chamber 20 , and the refrigeration chamber 20 is connected to the bottom of each cooling chamber 100 through a pipeline.

[0087] Specifically, in the present embodiment, a plurality of second air conditioners 21 are disposed in the refrigeration chamber 20 , and the second air conditioners 21 can accurately control the temperature, humidity and air flow distribution.

[0088] The refrigeration chamber 20 is connected to the bottom of each cooling chamber 100 through a pipeline to provide an additional cold source supplement to the cooling chamber 100 to achieve auxiliary heat dissipation.

[0089] The number of the second air conditioners 21 can be adaptively adjusted according to actual needs, and this embodiment does not impose any limitation on this. For example, when the number of the second air conditioners 21 is four.

[0090] In an optional embodiment, a chilled water distribution unit 22 is further disposed in the refrigeration chamber 20 , and the chilled water distribution unit 22 is connected to the second air conditioner 21 to provide chilled water for the second air conditioner 21 .

[0091] Specifically, in this embodiment, a chilled water distribution unit 22 is further provided in the refrigeration chamber 20, and the chilled water distribution unit 22 is connected to the second air conditioner 21 to provide chilled water for the second air conditioner 21. At the same time, the chilled water distribution unit 22 can adjust the temperature of the chilled water to meet the cooling requirements of different areas of the data center. By adjusting the temperature of the chilled water, the temperature in the data center can be more accurately controlled to ensure that the power supply cabinet 120, the high-density cabinet 110 and other equipment can operate at a suitable temperature.

[0092] In addition, the chilled water distribution unit 22 can also distribute the flow of chilled water according to the cooling requirements of different cooling chambers 100 .

[0093] In order to ensure uniformity in chilled water distribution, in this embodiment, the number of chilled water distribution units 22 is the same as the number of cooling chambers 100, thereby achieving a one-to-one correspondence and ensuring that the power supply cabinet 120, high-density cabinet 110 and other equipment in each cooling chamber 100 can obtain the same and sufficient cooling resources. This avoids the problem of local overheating caused by uneven distribution of cooling resources and improves the stability and reliability of the entire system.

[0094] Specifically, in this embodiment, the number of cooling chambers 100 is six, and correspondingly, the number of chilled water distribution units 22 is six, so as to be arranged one-to-one with the cooling chambers 100. In other embodiments, the specific number of cooling chambers 100 and chilled water distribution units 22 can also be adaptively selected according to actual needs, and this embodiment does not impose any limitation on this.

[0095] In an optional embodiment, the cooling chambers 100 are symmetrically distributed on both sides of the refrigeration chamber 20 .

[0096] Specifically, in this embodiment, the cooling chambers 100 are symmetrically distributed on both sides of the refrigeration chamber 20, which can ensure that each cooling chamber 100 can independently receive the cold air supply from the refrigeration chamber 20, reducing the loss of cold air during transmission, improving the cooling efficiency, and ensuring that the equipment in the computer room 10 can continue to operate in a suitable temperature environment.

[0097] Those skilled in the art will readily come to other embodiments of the present application after considering the specification and practicing the utility model disclosed herein. The present application embodiment is intended to cover any variation, use or adaptation of the present application embodiment, which follows the general principles of the present application embodiment and includes common knowledge or customary technical means in the art that are not disclosed in the present application embodiment. The specification and embodiments are to be regarded as exemplary only, and the true scope and spirit of the present application embodiment are indicated by the following claims.

[0098] It should be understood that the embodiments of the present application are not limited to the precise structures described above and shown in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the embodiments of the present application is limited only by the appended claims.

Claims

1. A machine room, characterized in that: include: A plurality of cooling rooms (100) are arranged at intervals, the cooling rooms (100) being used to be connected to a data center; each of the cooling rooms (100) comprises a plurality of high-density cabinets (110), a plurality of first air conditioners (130) and at least one power supply cabinet (120); the high-density cabinets (110) are arranged evenly and at intervals in the cooling room (100); the power supply cabinet (120) is used to supply power to the high-density cabinets (110); and each of the first air conditioners (130) is arranged between each of the high-density cabinets (110).

2. The machine room according to claim 1, characterized in that: The high-density cabinets (110) of each cooling room (100) are arranged in at least two rows, each row of the high-density cabinets (110) forms a cabinet group, the number of the power supply cabinets (120) is at least two, and each cabinet group is arranged corresponding to at least one power supply cabinet (120).

3. The machine room according to claim 2, characterized in that: The same cabinet group is provided with at least four of the high-density cabinets (110), and each of the first air conditioners (130) is interspersed and arranged in the cabinet group.

4. The machine room according to claim 2, characterized in that: The high-density cabinets (110) of the same cabinet group are respectively connected to the corresponding power supply cabinets (120) via cables.

5. The computer room according to any one of claims 1 to 4, characterized in that: Each cooling chamber (100) further comprises at least one low-density cabinet (140), and the power supply cabinet (120) is connected to the low-density cabinet (140) to supply power to the low-density cabinet (140).

6. A data center, characterized in that: It comprises a refrigeration room (20) and a machine room (10) according to any one of claims 1 to 5, wherein the refrigeration room (20) is connected to the machine room (10) through a pipeline.

7. The data center according to claim 6, characterized in that: It also comprises at least one power room (30), wherein the power room (30) is respectively connected to the power supply cabinet (120) in each cooling room (100) to supply power to the power supply cabinet (120).

8. The data center according to claim 6, characterized in that: A plurality of second air conditioners (21) are arranged in the refrigeration chamber (20), and the second air conditioners (21) are configured to provide cold air to the refrigeration chamber (20). The refrigeration chamber (20) is connected to the bottom of each cooling chamber (100) through the pipeline.

9. The data center according to claim 8, characterized in that: A chilled water distribution unit (22) is also provided in the refrigeration chamber (20); the chilled water distribution unit (22) is connected to the second air conditioner (21) to provide chilled water for the second air conditioner (21).

10. The data center according to any one of claims 6 to 9, characterized in that: The cooling chambers (100) are symmetrically distributed on both sides of the refrigeration chamber (20).

Images