Multilayer piezoelectric ceramic bonding mechanism

Abstract

The utility model relates to a multi-layer piezoelectric ceramic bonding mechanism which comprises a main die and further comprises a plurality of piezoelectric ceramic layers, the limiting blocks are arranged to be of an L-shaped structure, and the number of the limiting blocks is two; the number of the poly-fluorine blocks is two, and the poly-fluorine blocks are arranged to be of a plate-shaped structure; the receiving pressing sheets are arranged to be of a plate-shaped structure, and the number of the receiving pressing sheets is two; two bonding grooves are symmetrically formed in the main mold, and the limiting blocks, the fluorine-gathering blocks and the receiving pressing pieces are all movably connected to the interiors of the corresponding bonding grooves. By adding the limiting block, the device can adapt to pressing and bonding of guide vanes of different specifications, it is guaranteed that the guide vanes of different specifications cannot move in the bonding process, the guide vanes can be prevented from being damaged in the bonding process by adding the poly-fluorine block, and the purpose of rapid demolding can be achieved in a screw connection mode.

Description

Technical Field

[0001] The utility model relates to the technical field of acoustic detection, in particular to a multi-layer piezoelectric ceramic bonding mechanism. Background Art

[0002] Electroceramics is a special ceramic material with good high temperature resistance, corrosion resistance, high hardness, low dielectric loss, high insulation performance, etc. Electroceramics can be used to manufacture various electronic components, such as piezoelectric motors, piezoelectric oscillators, piezoelectric sensors, electroacoustic transducers, surface acoustic wave devices, etc.

[0003] In the prior art, when bonding the guide plates of the electric ceramics, a mold needs to be used for positioning. However, the molds at this stage are mostly fixed, which is not convenient for bonding guide plates of different specifications. In addition, during the bonding process, the guide plates are easily damaged due to the characteristics of the ceramic material, which results in the bonding process of the guide plates being not only cumbersome but also having a high failure rate.

[0004] Based on this, those skilled in the art have proposed a multilayer piezoelectric ceramic bonding mechanism. Utility Model Content

[0005] In view of the above problems existing in the prior art, the main purpose of the utility model is to provide a multilayer piezoelectric ceramic bonding mechanism.

[0006] The technical solution of the utility model is as follows: a multilayer piezoelectric ceramic bonding mechanism, including a main mold, and also including;

[0007] A limit block, wherein the limit block is set to an L-shaped structure and the number is two;

[0008] A polyfluoride block, wherein the polyfluoride block is configured as a plate-shaped structure and the number of the polyfluoride blocks is configured as two;

[0009] A receiving press sheet, wherein the receiving press sheet is configured as a plate-shaped structure and the number of the receiving press sheets is configured as two;

[0010] The main mold is symmetrically provided with two bonding grooves, and the limit block, the polyfluorine block and the receiving pressing sheet are all movably connected inside the corresponding bonding grooves.

[0011] Through the above technical means, according to the different specifications of the guide piece, choose whether to place the limit block to adapt to the guide pieces of different specifications, place the receiving pressing sheet at the bottom of the bonding groove, place the guide piece to be bonded on the receiving pressing sheet, and then place the polyfluoride block on the guide piece.

[0012] As a preferred embodiment, the top of the main mold is symmetrically threaded with two top fixing screws, and both sides of the main mold are threaded with two side fixing screws, and the top fixing screws and the side fixing screws both extend into the corresponding bonding grooves.

[0013] Through the above technical means, the limit block is fixed by rotating the top fixing screw and the side fixing screw to fit with the limit block.

[0014] As a preferred embodiment, three positioning slots are provided inside the bonding groove, the three positioning slots are arranged in a rectangular structure, and the inside of the positioning slots is provided with internal threads.

[0015] Through the above technical means, the positioning slot is used to fix the limit block.

[0016] As a preferred implementation, the corners of the limit block are provided with matching holes, and the matching holes are used in conjunction with the positioning slots.

[0017] Through the above technical means, the screws are inserted into the matching holes and screwed into the positioning slots, cooperating with the top fixing screws and the side fixing screws to fix the limit block.

[0018] As a preferred embodiment, two through grooves are symmetrically formed at the bottom of the main mold and below the corresponding bonding grooves.

[0019] Through the above technical means, the through groove is used to place the conductive terminal of the guide piece.

[0020] Compared with the prior art, the advantages and positive effects of the utility model are:

[0021] The utility model can adapt the device to the pressing and bonding of guide pieces of different specifications by adding a limit block, thereby ensuring that the guide pieces of different specifications will not shift during the bonding process, and by adding a polyfluoride block, the guide piece can be prevented from being damaged during bonding, and by means of screw connection, the purpose of rapid demoulding can also be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is an exploded view of the utility model;

[0023] Figure 2 It is an isometric view of the utility model in a disassembled state;

[0024] Figure 3 It is an isometric view of the main mold of the utility model;

[0025] Figure 4 It is an isometric view of the limit block of the utility model.

[0026] Legend: 1. Main mold; 2. Limit block; 3. Polyfluorine block; 4. Receiving press plate; 5. Top fixing screw; 6. Side fixing screw; 7. Adhesive groove; 8. Positioning slot hole; 9. Through groove; 10. Matching hole. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments.

[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0029] Example

[0030] like Figure 1-Figure 4 As shown, the utility model provides a multilayer piezoelectric ceramic bonding mechanism: comprising a main mold 1, and also comprising;

[0031] Limit block 2, the limit block 2 is set to an L-shaped structure and the number is two;

[0032] A polyfluoride block 3, wherein the polyfluoride block 3 is configured as a plate-shaped structure and the number of the polyfluoride blocks 3 is configured as two;

[0033] A receiving press sheet 4, wherein the receiving press sheet 4 is configured as a plate-shaped structure and the number of the receiving press sheet 4 is configured as two;

[0034] Two bonding grooves 7 are symmetrically provided on the main mold 1, and the limit block 2, the polyfluorine block 3 and the receiving pressing sheet 4 are all movably connected inside the corresponding bonding grooves 7;

[0035] In summary: according to the different specifications of the guide piece, choose whether to place the limit block 2 to adapt to the guide pieces of different specifications, place the receiving pressing sheet 4 at the bottom of the bonding groove 7, place the guide piece to be bonded on the receiving pressing sheet 4, and then place the polyfluoride block 3 on the guide piece.

[0036] like Figure 1-Figure 4 As shown, the top of the main mold 1 is symmetrically threaded with two top fixing screws 5, and both sides of the main mold 1 are threaded with two side fixing screws 6, and the top fixing screws 5 and the side fixing screws 6 extend to the inside of the corresponding bonding groove 7;

[0037] In summary: the limit block 2 is fixed by rotating the top fixing screw 5 and the side fixing screw 6 to fit with the limit block 2.

[0038] like Figure 1-Figure 4 As shown, three positioning slots 8 are provided inside the bonding slot 7. The three positioning slots 8 are arranged in a rectangular structure, and the interiors of the positioning slots 8 are provided with internal threads.

[0039] In summary: the positioning slot 8 is used to fix the limit block 2.

[0040] like Figure 1-Figure 4As shown, the corners of the limit block 2 are provided with matching holes 10, which are used in conjunction with the positioning slots 8;

[0041] In summary: insert the screw into the matching hole 10 and screw it into the positioning notch 8 to cooperate with the top fixing screw 5 and the side fixing screw 6 to fix the limit block 2.

[0042] like Figure 1-Figure 4 As shown, two through grooves 9 are symmetrically formed at the bottom of the main mold 1 and below the corresponding bonding grooves 7;

[0043] In summary: the through slot 9 is used to place the conductive terminal of the guide piece.

[0044] Working principle:

[0045] According to the different specifications of the guide piece, choose whether to place the limit block 2 to adapt to the guide pieces of different specifications. If the limit block 2 needs to be installed, insert the screw into the matching hole 10 and screw it into the positioning slot 8, and cooperate with the top fixing screw 5 and the side fixing screw 6 to fix the limit block 2. After the installation, the pressing operation can be performed. First, place the receiving pressing piece 4 at the bottom of the bonding groove 7, place the guide piece to be bonded on the receiving pressing piece 4, and then place the polyfluoride block 3 on the guide piece. Use the characteristics of the polyfluoride block 3 to prevent the guide piece from being damaged during the extrusion process.

[0046] Finally, it should be noted that the above-described embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A multilayer piezoelectric ceramic bonding mechanism, comprising a main mold (1), characterized in that: Also includes; A limit block (2), wherein the limit block (2) is configured as an L-shaped structure and the number of the limit blocks is two; A polyfluoride block (3), wherein the polyfluoride block (3) is configured as a plate-shaped structure and the number of the polyfluoride blocks (3) is configured as two; A receiving press sheet (4), wherein the receiving press sheet (4) is configured as a plate-shaped structure and the number of the receiving press sheets (4) is configured as two; The main mold (1) is symmetrically provided with two bonding grooves (7), and the limit block (2), the polyfluorine block (3) and the receiving pressing sheet (4) are all movably connected inside the corresponding bonding grooves (7).

2. A multilayer piezoelectric ceramic bonding mechanism according to claim 1, characterized in that: The top of the main mold (1) is symmetrically threaded with two top fixing screws (5), and both sides of the main mold (1) are threaded with two side fixing screws (6), and the top fixing screws (5) and the side fixing screws (6) both extend to the inside of the corresponding bonding groove (7).

3. The multilayer piezoelectric ceramic bonding mechanism according to claim 1, characterized in that: Three positioning slots (8) are provided inside the bonding groove (7), the three positioning slots (8) are arranged in a rectangular structure, and the positioning slots (8) are provided with internal threads inside.

4. The multilayer piezoelectric ceramic bonding mechanism according to claim 1, characterized in that: The limiting blocks (2) are provided with matching holes (10) at their corners, and the matching holes (10) are used in conjunction with the positioning slots (8).

5. The multilayer piezoelectric ceramic bonding mechanism according to claim 1, characterized in that: Two through grooves (9) are symmetrically formed at the bottom of the main mold (1) and below the corresponding bonding grooves (7).

Images