Industrial Internet of Things intelligent temperature monitoring terminal

Abstract

The utility model relates to the technical field of temperature monitoring terminal application, in particular to an intelligent temperature monitoring terminal of industrial Internet of Things. The terminal comprises two thermal resistance acquisition circuits, a microprocessor unit, a power input protection circuit, a power step-down circuit, a power boost circuit, a serial port signal conversion circuit and a communication unit. The industrial heat tracing pipeline temperature real-time monitoring device supports collection of two thermal resistor PT100 temperature sensors, is specially used for real-time temperature monitoring of an industrial heat tracing pipeline, and can effectively replace a detection mode of manual work or construction wiring.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature monitoring terminal application, and in particular to an industrial Internet of Things intelligent temperature monitoring terminal, which is applied to an industrial Internet of Things control system. Background Art

[0002] With the continuous development and progress of industrial automation technology, improving efficiency and reducing costs have become new requirements for process control systems and factory management. This requires existing control systems to adapt to this change and apply new technologies to become smarter and more optimized than ever before. At present, in petrochemical plants, each type of refining equipment is accompanied by numerous medium transmission pipelines. Especially in winter, if the temperature is too low, the solidification of the medium will affect the transmission, so the pipeline ambient temperature needs to be monitored. The current practice is to regularly hire temporary workers to carry out temperature measurement on site with handheld temperature measuring guns. Therefore, it is necessary to deploy a wireless temperature measurement monitoring system to reduce operating costs and improve operating efficiency. In view of the above problems, an industrial Internet of Things intelligent temperature monitoring terminal is proposed. Utility Model Content

[0003] In view of the above-mentioned deficiencies in the prior art, the utility model provides an industrial Internet of Things intelligent temperature monitoring terminal, which is suitable for industrial environments, easy to install, based on long-distance wireless transmission technology, fully supports the networks of the three major operators, is battery-powered, does not require wiring, has a long service life, can cache data offline, can perform terminal maintenance locally or remotely, has an anti-theft alarm function, effectively replaces manual labor to reduce operating costs, and improves the factory's automation management level.

[0004] In order to achieve the above utility model purpose, the technical solution adopted by the utility model is:

[0005] An industrial Internet of Things intelligent temperature monitoring terminal, comprising:

[0006] Two-way thermal resistance acquisition circuit, microprocessor unit, power input protection circuit, power step-down circuit, power step-up circuit, serial port signal conversion circuit and communication unit;

[0007] One end of the two-way thermal resistance acquisition circuit is connected to an external temperature sensor, and the other end of the two-way thermal resistance acquisition circuit is connected to a microprocessor unit;

[0008] The microprocessor unit is connected to the serial port signal conversion circuit, and the serial port signal conversion circuit is connected to the communication unit;

[0009] One end of the power input protection circuit is connected to an external power supply, and the other end of the power input protection circuit is respectively connected to a power step-down circuit and a power step-up circuit; the power step-down circuit is connected to a microprocessor unit; and the power step-up circuit is connected to a communication unit.

[0010] Furthermore, the communication unit comprises:

[0011] 4G module, 4G antenna, GNSS antenna and 4G module control circuit;

[0012] The 4G module is connected to the 4G antenna, the GNSS antenna and the 4G module control circuit respectively.

[0013] Furthermore, the communication unit further comprises:

[0014] SIM card processing circuit;

[0015] The SIM card processing circuit is connected to the 4G module.

[0016] Furthermore, it also includes an acquisition control circuit;

[0017] The acquisition control circuit is connected to two thermal resistance acquisition circuits.

[0018] Furthermore, it also includes a Bluetooth module;

[0019] The Bluetooth module is connected to the microprocessor unit.

[0020] Furthermore, it also includes a serial port to USB circuit;

[0021] The serial port to USB circuit is connected to the microprocessor unit.

[0022] Furthermore, it also includes an external expansion FLASH circuit;

[0023] The external expansion FLASH circuit is connected to the microprocessor unit.

[0024] Further, it also includes an external storage circuit;

[0025] The external storage circuit is connected to the microprocessor unit.

[0026] Further, a debugging interface is included;

[0027] The debugging interface is connected to the microprocessor unit.

[0028] Furthermore, it also includes a status indication circuit and a key circuit;

[0029] The state indicating circuit and the key circuit are both connected to the microprocessor unit.

[0030] The utility model has the following beneficial effects:

[0031] The utility model adopts a flame-retardant ABS material shell, which is suitable for industrial environments. It adopts self-built brackets, wall-mounted installation or hanging on existing fixed objects. It is very convenient to install. It is based on industrial Internet of Things transmission technology and fully supports the networks of the three major operators. It is powered by a large-capacity battery and has an ultra-low power consumption design. It has a long service life and can cache data offline without a network. It can perform equipment maintenance through a cloud platform, USB or Bluetooth. It supports 2-way thermal resistor PT100 temperature sensor acquisition, is highly intelligent, and is dedicated to real-time temperature monitoring of industrial heating pipes. It can effectively replace manual or wiring detection methods, has good economic and social benefits, and is suitable for popularization and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a structural diagram of an industrial Internet of Things intelligent temperature monitoring terminal;

[0033] Figure 2 It is the circuit schematic diagram of the two-channel thermal resistance acquisition circuit;

[0034] Figure 3 This is the circuit schematic diagram of the power input protection circuit;

[0035] Figure 4 It is the circuit schematic diagram of the power supply step-down circuit;

[0036] Figure 5 It is the circuit schematic diagram of the power boost circuit;

[0037] Figure 6 It is the circuit principle diagram of the serial port signal conversion circuit;

[0038] Figure 7 This is the circuit schematic diagram of the 4G antenna;

[0039] Figure 8 This is the circuit schematic diagram of the GNSS antenna;

[0040] Fig. 9 It is the circuit schematic diagram of the SIM card processing circuit;

[0041] Fig.10 It is the circuit schematic diagram of the acquisition control circuit;

[0042] Fig.11 This is the circuit schematic diagram of the Bluetooth module;

[0043] Fig.12 This is the circuit schematic diagram of the serial port to USB circuit;

[0044] Fig.13 This is the circuit schematic diagram of the external FLASH circuit;

[0045] Fig.14 This is the circuit schematic diagram of the external storage circuit. DETAILED DESCRIPTION

[0046] The specific implementation methods of the utility model are described below to facilitate technical personnel in this technical field to understand the utility model, but it should be clear that the utility model is not limited to the scope of the specific implementation methods. For ordinary technical personnel in this technical field, as long as various changes are within the spirit and scope of the utility model defined and determined by the attached claims, these changes are obvious, and all utility model creations using the concept of the utility model are protected.

[0047] like Figure 1 As shown, an industrial Internet of Things intelligent temperature monitoring terminal provided by an embodiment of the utility model includes:

[0048] Two-way thermal resistance acquisition circuit, microprocessor unit, power input protection circuit, power step-down circuit, power step-up circuit, serial port signal conversion circuit and communication unit;

[0049] One end of the two-way thermal resistance acquisition circuit is connected to an external temperature sensor, and the other end of the two-way thermal resistance acquisition circuit is connected to a microprocessor unit;

[0050] The microprocessor unit is connected to the serial port signal conversion circuit, and the serial port signal conversion circuit is connected to the communication unit;

[0051] One end of the power input protection circuit is connected to an external power supply, and the other end of the power input protection circuit is respectively connected to a power step-down circuit and a power step-up circuit; the power step-down circuit is connected to a microprocessor unit; and the power step-up circuit is connected to a communication unit.

[0052] In this embodiment, the two-way thermal resistance acquisition circuit uses two-way thermal resistance PT100 temperature sensors for temperature acquisition, and one of the thermal resistance acquisition circuits is as follows: Figure 2 As shown, it includes a temperature acquisition chip U4, three resistors R1, R16, and R17, a magnetic bead R12, a capacitor C12, and a temperature sensor connection terminal RTD1; wherein the resistor R1 is used for adaptation connection, the resistor R12 is used to stabilize the input voltage of the temperature acquisition chip U4, the resistor R16 is used as a reference base resistor, the resistor R17 is used for pull-up, the capacitor C12 is used for filtering, the temperature sensor connection terminal RTD1 is used to connect the temperature sensor, the temperature acquisition chip U4 is used to collect and process the temperature, and send the data to the data processing chip through SPI communication.

[0053] In this embodiment, the microprocessor unit uses a microcontroller chip STM32L496RGT6 to collect temperature signal data and wirelessly communicate the collected temperature signal. The STM32F405RGT6 model MCU microcontroller is based on high performance The CortexR-M4 32-bit RISC core operates at up to 168MHz. The Cortex-M4 core has a floating point unit (FPU) single precision and supports all Arm single-precision data processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) to enhance application security. The STM32F405RGT6 model product uses high-speed embedded memory (flash memory, up to 1MB, SRAM up to 192KB), up to 4KB backup SRAM, and is connected to two APB buses, three AHB buses, and a 32-bit multi-AHB bus matrix. All devices provide three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers, including two PWM timers for motor control, two general-purpose 32-bit timers, and true random number generators (RNG). They also have standard and advanced function communication interfaces. The STM32F405RGT6 model MCU microcontroller operates from 1.8 to 3.6V power supply at a temperature of -40 to +105°C.

[0054] In this embodiment, the power input protection circuit includes a battery connection connector S1, a fuse F3, five resistors R98, R99, R102, R104, R110, two MOS tubes Q14, Q15, a capacitor C60 and a bidirectional ESD protection T4. Figure 3 As shown, the battery connector S1 is used to connect to an external battery, the fuse F3 is used for overcurrent protection, the resistors R98 and R99 are used for voltage division to control the conduction of Q14, the resistors R104 and R110 are used for voltage division to control the conduction of Q15, the capacitor C60 is used for filtering and decoupling, the MOS tube Q14 is used to control the conduction of the power input, the MOS tube Q15 is used to control the conduction between the power input ground and the internal signal ground, and the bidirectional ESD protection T4 is used for static electricity or overvoltage protection.

[0055] In this embodiment, the power supply step-down circuit includes an LDO chip U15, two resistors R101, R106, three capacitors C54, C55, C56, and two ESD protection diodes T2, T12. Figure 4As shown. Resistor R101 is used for adapting the connection, resistor R106 is used for pulling up to keep the high level enabled, capacitor C54 is used to stabilize the input power supply, capacitors C55 and C56 are used to stabilize the output power supply, LDO chip U15 converts the input power supply into 3.3V power supply for the subsequent circuit, and ESD protection diodes T2 and T12 are used for ESD protection to prevent static electricity, surge and clamp voltage.

[0056] In this embodiment, the power boost circuit includes seven resistors R103, R107-R109, R112-R114, four capacitors C53, C57-C59, an inductor L2, three voltage regulator diodes D6, D7, D16 and a DC / DC chip U16. Figure 5 As shown. Resistor R107 is reserved for function and is not welded, resistor R103 is used for matching connection, resistor R108 is used for pull-up, resistor R114 is used for pull-down, resistor R112 is used for current limiting, resistor R109 and resistor R113 are used for precise control of power supply output voltage, capacitors C53, C57-C59 are used for filtering and decoupling, inductor L2 is used for feedback and stable voltage, voltage regulator diodes D6, D7, D16 are used for protection against overvoltage and to achieve intrinsic safety design, and DC / DC chip U16 is used for voltage conversion.

[0057] In this embodiment, the serial port signal conversion circuit includes six resistors R66, R67, R71, R72, R140, R141, two capacitors C29, C30, and two transistors Q10, Q11. Figure 6 As shown, the resistors R66 and R67 are used for current limiting, the resistors R71 and R72 are used for pulling up the voltage, the resistors R140 and R141 are used for adapting the connection, the capacitors C29 and C30 are used for filtering and decoupling, and the transistors Q10 and Q11 are used for controlling the conduction and cutoff of the signal.

[0058] In this embodiment, the communication unit includes:

[0059] 4G module, 4G antenna, GNSS antenna and 4G module control circuit;

[0060] The 4G module is connected to the 4G antenna, the GNSS antenna and the 4G module control circuit respectively.

[0061] The 4G module unit uses the 4G chip EC200U-CNAA, and uses AT commands through the serial port to communicate data with the server via 4G long-distance wireless transmission.

[0062] like Figure 7 and Figure 8As shown, the 4G antenna and GNSS antenna include six resistors R65, R68, R69, R73, R76, R77, a capacitor C95, and two antenna connectors P4 and P5. The antenna connector P4 is used to connect the external 4G antenna, and the resistors R65, R68, and R69 form a 4G antenna receiving π-type network for matching and adjusting the signal receiving effect. The antenna connector P5 is used to connect the external GNSS antenna, the capacitor C95 is used for coupling signals, and the resistors R73, R76, and R77 form a GNSS antenna receiving π-type network for matching and adjusting the signal receiving effect.

[0063] The 4G module control circuit includes a digital transistor and a capacitor, and the microprocessor unit controls the on and off of the digital transistor to control the 4G module.

[0064] In this embodiment, the communication unit further includes a SIM card processing circuit; the SIM card processing circuit is connected to the 4G module.

[0065] The SIM card processing circuit includes four resistors R59, R60, R61, R63, four capacitors C25, C27, C28, C31, a SIM card holder U8, and an ESD integrated chip U10. Fig. 9 As shown, resistors R59, R60, R61, and R63 are used for current limiting, capacitor C25 is used for stabilizing input voltage, capacitors C27, C28, and C31 are used for filtering, SIM card holder U8 is used for plugging in 4G card and connecting with 4G module unit, and ESD integrated chip U10 is used for anti-static protection.

[0066] In this embodiment, this embodiment also includes a collection control circuit; the collection control circuit is connected to the two thermal resistance collection circuits.

[0067] The acquisition control circuit includes five resistors R13, R20, R22, R24, R29, four capacitors C8, C9, C10, C13, and three MOS tubes Q3, Q4, Q5. Fig.10 As shown. Resistors R13 and R20 are used for power supply voltage division, capacitor C8 is used to stabilize the collected voltage, resistor R22 is a pull-down resistor, MOS tube Q3 is used to control the on-off of the power supply voltage collection circuit, resistors R24 and R29 are pull-down resistors, capacitors C9, C10, and C13 are used for filtering, decoupling, and stabilizing the voltage, and MOS tubes Q4 and Q5 cooperate to control the on-off of the power supply of the temperature collection circuit.

[0068] In this embodiment, this embodiment also includes a Bluetooth module; the Bluetooth module is connected to the microprocessor unit.

[0069] The Bluetooth module includes a Bluetooth chip U17, a light-emitting diode D9, seven resistors R115-R119, R142, R143 and three capacitors C62-C64. Fig.11 As shown, resistors R115 and R116 are used to pull down the voltage, resistors R117, R118, R142, and R143 are used for connection adaptation, resistor R119 is used for current limiting, light-emitting diode D9 is used for Bluetooth status indication, capacitors C62, C63, and C64 are used for power filtering and decoupling, and Bluetooth chip U17 is used for Bluetooth communication and sends Bluetooth data to the microprocessor unit through the serial port.

[0070] In this embodiment, this embodiment also includes a serial port to USB circuit; the serial port to USB circuit is connected to the microprocessor unit.

[0071] The serial port to USB circuit includes a USB interface U1, a serial port to USB chip U20, a fuse F1, a diode D1, an ESD protection T1 and a capacitor C89. Fig.12 As shown, the USB interface U1 is used to connect to an external USB device, the fuse F1 is used for overcurrent protection, the diode D1 is used for reverse protection, the ESD protection T1 is used for static electricity or overvoltage protection, the capacitor C89 is used for filtering and decoupling, and the serial port to USB chip U20 is used to convert the serial port signal into a USB signal.

[0072] In this embodiment, this embodiment also includes an external FLASH circuit; the external FLASH circuit is connected to the microprocessor unit.

[0073] The external FLASH circuit includes a FLASH chip U5, three resistors R15, R18, R19, and a capacitor C7. Fig.13 As shown, resistors R15, R18, and R19 are used for current limiting, capacitor C7 is used for decoupling and stabilizing the power supply, and FLASH chip U5 interacts with the MCU processing unit through SPI communication to expand the FLASH space.

[0074] In this embodiment, this embodiment further includes an external storage circuit; the external storage circuit is connected to the microprocessor unit.

[0075] The external storage circuit includes an EEPROM chip N1, three resistors R80, R81, R82, and a capacitor C42. Fig.14 As shown, resistors R80, R81, and R82 are pull-up resistors, capacitor C42 is used for decoupling and stabilizing the power supply, and EEPROM chip N1 interacts with the microprocessor unit through I2C communication to provide non-volatile storage space.

[0076] In this embodiment, the embodiment further includes a debugging interface; the debugging interface is connected to the microprocessor unit.

[0077] The debug interface includes a four-pin connector through which an external debug device is connected to the microprocessor unit for debugging.

[0078] In this embodiment, this embodiment also includes a state indication circuit and a key circuit; the state indication circuit and the key circuit are both connected to the microprocessor unit.

[0079] The status indication circuit is composed of a light emitting diode and a resistor. The light emitting diode is controlled by a microprocessor unit to indicate the status of the terminal.

[0080] The key circuit includes a key and a resistor. The microprocessor unit collects different operation states of the key to realize external input operation.

[0081] In this embodiment, the external temperature signal is collected by two thermal resistor acquisition circuits, and the temperature data is sent to the microprocessor unit through the SPI communication method, and the temperature value is obtained after data conversion. At the same time, the temperature acquisition time is recorded and placed in the temperature data cache. The battery power can be collected by the microprocessor unit. GNSS location information can be obtained through the 4G module unit. The temperature acquisition cycle and the data upload cycle are set by the RTC function in the microprocessor unit. When the data upload cycle arrives, the 4G wireless communication inside the microprocessor unit communicates and interacts with the 4G module unit in the AT naming method through the serial port signal conversion circuit, and the 4G module unit sends the data to the external cloud platform. If the device is offline, the collected temperature data will be written to the external storage and will not be lost. During the temperature acquisition process, the judgment and processing of temperature exceeding the upper and lower limits and the recovery of exceeding the upper and lower limits are carried out at the same time. Once generated, the server is immediately notified through the event report.

[0082] The microprocessor unit obtains the NTP network time through the 4G module unit and uses this time as the benchmark for its own time. This embodiment relies on the mature 4G network and uses low-power long-distance wireless communication functions to realize wireless transmission of field instrument data to the cloud platform and mobile client. This embodiment can set temperature upper and lower limits, fluctuation thresholds, upload time, acquisition time and other parameters on the terminal through USB or Bluetooth, and can quickly update the firmware. It can also remotely set parameters or update firmware through the cloud platform, view real-time data and historical data online, and accurately and timely grasp the field information. This embodiment uses a large-capacity lithium battery, and the MCU processing unit, 4G module unit, and Bluetooth module unit adopt a low-power design, and cooperate with the acquisition control circuit and the 4G module control circuit to provide a long life for the terminal. This embodiment uploads data through the wireless module, so that the instrument has practical functions such as data breakpoint continuation, automatic switching of working modes, real-time alarm of upper and lower temperature limits, and one-key wake-up.

[0083] The present invention uses specific embodiments to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

[0084] Those skilled in the art will appreciate that the embodiments described herein are intended to help readers understand the principles of the present invention, and should be understood that the protection scope of the present invention is not limited to such specific statements and embodiments. Those skilled in the art can make various other specific variations and combinations based on the technical inspirations disclosed in the present invention without departing from the essence of the present invention, and these variations and combinations are still within the protection scope of the present invention.

Claims

1. An industrial Internet of Things intelligent temperature monitoring terminal, characterized in that: include: Two-way thermal resistance acquisition circuit, microprocessor unit, power input protection circuit, power step-down circuit, power step-up circuit, serial port signal conversion circuit and communication unit; One end of the two-way thermal resistance acquisition circuit is connected to an external temperature sensor, and the other end of the two-way thermal resistance acquisition circuit is connected to a microprocessor unit; The microprocessor unit is connected to the serial port signal conversion circuit, and the serial port signal conversion circuit is connected to the communication unit; One end of the power input protection circuit is connected to an external power supply, and the other end of the power input protection circuit is respectively connected to a power step-down circuit and a power step-up circuit; the power step-down circuit is connected to a microprocessor unit; and the power step-up circuit is connected to a communication unit.

2. The industrial Internet of Things intelligent temperature monitoring terminal according to claim 1 is characterized in that: The communication unit includes: 4G module, 4G antenna, GNSS antenna and 4G module control circuit; The 4G module is connected to the 4G antenna, the GNSS antenna and the 4G module control circuit respectively.

3. The industrial Internet of Things intelligent temperature monitoring terminal according to claim 2 is characterized in that: The communication unit also includes: SIM card processing circuit; The SIM card processing circuit is connected to the 4G module.

4. The industrial Internet of Things intelligent temperature monitoring terminal according to claim 1 is characterized in that: Also includes an acquisition control circuit; The acquisition control circuit is connected to two thermal resistance acquisition circuits.

5. The industrial Internet of Things intelligent temperature monitoring terminal according to claim 1 is characterized in that: Also includes Bluetooth module; The Bluetooth module is connected to the microprocessor unit.

6. The industrial Internet of Things intelligent temperature monitoring terminal according to claim 1, characterized in that: It also includes a serial port to USB circuit; The serial port to USB circuit is connected to the microprocessor unit.

7. The industrial Internet of Things intelligent temperature monitoring terminal according to claim 1 is characterized in that: It also includes an external FLASH circuit; The external expansion FLASH circuit is connected to the microprocessor unit.

8. The industrial Internet of Things intelligent temperature monitoring terminal according to claim 1, characterized in that: Also included is an external storage circuit; The external storage circuit is connected to the microprocessor unit.

9. The industrial Internet of Things intelligent temperature monitoring terminal according to claim 1, characterized in that: Also includes a debug interface; The debugging interface is connected to the microprocessor unit.

10. The industrial Internet of Things intelligent temperature monitoring terminal according to claim 1, characterized in that: It also includes a status indication circuit and a key circuit; The state indicating circuit and the key circuit are both connected to the microprocessor unit.

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