Reinforced heat dissipation device for notebook computer

Abstract

The utility model discloses a reinforced heat dissipation device for a notebook computer, and relates to the technical field of reinforced heat dissipation devices for notebook computers, in particular to a heat dissipation box, the bottom surface of the heat dissipation box is fixedly connected with four fixing plates, and the inner wall of each fixing plate is connected with a supporting plate in a sliding mode. Two clamping blocks are connected to the inner wall of each supporting plate in a sliding mode, two first springs are fixedly connected to the inner wall of each supporting plate, one end of each first spring is fixedly connected with the corresponding clamping block, and through the mutual matching relation between a second connecting rod and a third spring, the clamping blocks are fixedly connected to the inner wall of each supporting plate; a third spring pushes a second connecting rod to move towards the notebook body under the action of resilience force of the third spring, and through contact extrusion of the second connecting rod and the notebook body, the notebook body can be clamped and fixed by driving the second connecting rod through the third spring; and therefore, the effect that the notebook computer body can be fixed in the heat dissipation box through the second connecting rod is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of enhanced heat dissipation devices for notebooks, in particular to an enhanced heat dissipation device for notebooks. Background Art

[0002] With the rapid development of miniaturization, micro-miniaturization and integration technology of electronic components, the power density of electronic equipment is gradually increasing. Taking computer chips as an example, the performance of laptops is improving, the processor frequency is getting higher and higher, and the heat generated is also increasing. If this heat cannot be dissipated, it will not only affect the stability of the system and cause the computer performance to decline, but also affect the service life of the computer.

[0003] After searching, a Chinese patent with publication number CN219872256U discloses a microcomputer protection device with good protection effect and heat dissipation effect. Its technical points are: The utility model discloses a microcomputer protection device with good protection effect and heat dissipation effect, which relates to the field of microcomputer protection and heat dissipation technology. The utility model is equipped with a microcomputer support mechanism on both sides of the microcomputer, an adjustment mechanism is movably connected inside the microcomputer support mechanism, and a microcomputer heat dissipation mechanism is movably connected inside the adjustment mechanism, which can conveniently adjust and enhance the air outlet effect of different models of notebook computer microcomputers. Specifically, the position of the microcomputer heat dissipation mechanism relative to the microcomputer support mechanism is adjusted by moving the slide cylinder on the main slide bar and the auxiliary slide bar, and then the hot air at the air outlet is accelerated to be extracted through the venturi tube inside the heat dissipation base, which can improve the heat dissipation effect of the notebook computer microcomputer. In this process, the notebook computer microcomputer does not directly contact the desktop, which solves the problem of obstructed heat dissipation effect of the notebook computer microcomputer.

[0004] The above solution solves the problem of hindered heat dissipation of the notebook computer, but this device cannot fix the position of the notebook. When using the notebook, the notebook is placed on the heat dissipation box. If the user uses it improperly, the notebook may fall out of the heat dissipation box, causing damage to the notebook and affecting the subsequent use of the notebook.

[0005] Therefore, a new solution needs to be proposed to solve this problem. Utility Model Content

[0006] In view of the above background technology, the prior art has the problem that the position of the notebook body cannot be fixed.

[0007] The utility model discloses an enhanced heat dissipation device for a notebook computer, comprising a heat dissipation box, wherein four fixing plates are fixedly connected to the bottom surface of the heat dissipation box, the inner wall of each fixing plate is slidably connected to a support plate, the inner wall of each support plate is slidably connected to two clamping blocks, the inner wall of each support plate is fixedly connected to two first springs, one end of each first spring is fixedly connected to the corresponding clamping block, and the other end is fixedly connected to the inner wall of the corresponding support plate, a clamping groove is provided on the outer surface of each fixing plate, and the outer surface of each clamping block is slidably connected to the corresponding clamping groove.

[0008] Furthermore, the outer surface of each fixed plate is fixedly connected to a connecting plate, the inner wall of each connecting plate is slidably connected to a first connecting rod, each of the first connecting rods is fixedly connected to a push block at one end close to the corresponding fixed plate, and the outer surface of each push block is slidably connected to the corresponding slot.

[0009] Furthermore, a second spring is sleeved on the outer surface of each of the first connecting rods, one end of each of the second springs is fixedly connected to the corresponding connecting plate, and the other end of each of the second springs is fixedly connected to the corresponding first connecting rod.

[0010] Furthermore, a filter plate is fixedly connected to the inner wall of the heat dissipation box, and a heat sink is fixedly installed on the outer surface of the filter plate.

[0011] Furthermore, the inner wall of the heat dissipation box is fixedly connected to a support frame, the upper surface of the support frame is slidably connected to a notebook body, and the outer surface of the heat dissipation box is provided with heat dissipation holes.

[0012] Furthermore, four second connecting rods and four insertion rods are provided inside the heat sink, and the outer surface of each insertion rod is slidably connected to the heat sink. A fixing groove is provided on the upper surface of each second connecting rod, and the outer surface of each second connecting rod is slidably connected to the heat sink.

[0013] Furthermore, a third spring is sleeved on the outer surface of each second connecting rod, and one end of each third spring close to the heat sink is fixedly connected to the heat sink, and the other end is fixedly connected to the corresponding second connecting rod.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0015] 1. The utility model is provided with a second connecting rod, a third spring, a notebook body, a heat sink and other components. Through the mutual cooperation between the second connecting rod and the third spring, the third spring pushes the second connecting rod to move toward the notebook body under the action of its own rebound force. Through the contact and extrusion between the second connecting rod and the notebook body, the notebook body can be clamped and fixed by the second connecting rod driven by the third spring, thereby achieving the effect that the device can fix the notebook body in the heat sink through the second connecting rod.

[0016] 2. The utility model sets a first connecting rod, a first spring, a second spring, a card block, a push block and other components. The first spring pushes the card block to move along the corresponding card slot, so that the support plate can be fixed to the fixed plate through the card block, and by pressing the corresponding second connecting rod, the push plate moves horizontally along the corresponding card slot and pushes the card block to enter the support plate, thereby achieving the effect that the device can adjust the height of the heat sink by connecting the card block with the card slots of different heights. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the support plate structure of the utility model;

[0020] Figure 3 This is a schematic diagram of the heat sink structure of the utility model;

[0021] Figure 4 This is a schematic diagram of the second connecting rod structure of the utility model.

[0022] In the figure: 1. heat sink; 2. fixing plate; 3. support plate; 4. first spring; 5. clamping block; 6. clamping slot; 7. connecting plate; 8. first connecting rod; 9. second spring; 10. push block; 11. heat sink; 12. filter plate; 13. support frame; 14. heat dissipation hole; 15. second connecting rod; 16. third spring; 17. plug-in rod; 18. notebook body; 19. fixing slot. DETAILED DESCRIPTION

[0023] The following will disclose multiple embodiments of the utility model with diagrams. For the purpose of clear description, many physical details will be described together in the following description. However, it should be understood that these physical details should not be used to limit the utility model. In other words, in some embodiments of the utility model, these physical details are not necessary. In addition, for the purpose of simplifying the diagram, some conventional structures and components will be depicted in a simple schematic manner in the diagram.

[0024] See also Figure 1 , Figure 2 The utility model is a notebook computer heat dissipation device, comprising a heat dissipation box 1, the bottom surface of the heat dissipation box 1 is fixedly connected with four fixing plates 2, the inner wall of each fixing plate 2 is slidably connected with a support plate 3, the inner wall of each support plate 3 is slidably connected with two card blocks 5, the inner wall of each support plate 3 is fixedly connected with two first springs 4, one end of each first spring 4 is fixedly connected with the corresponding card block 5, and the other end is fixedly connected with the inner wall of the corresponding support plate 3, the outer surface of each fixing plate 2 is provided with a card slot 6, the outer surface of each card block 5 is slidably connected with the corresponding card block 5, and the inner wall of each support plate 3 is fixedly connected with two first springs 4. The groove 6 is slidably connected, and the fixed plate 2 and the support plate 3 serve as the supporting mechanism of the heat sink 1. The height can be adjusted by sliding the support plate 3 in the corresponding fixed plate 2. During the vertical movement of the support plate 3 along the corresponding fixed plate 2, the corresponding block 5 will completely enter the support plate 3. At this time, the corresponding first spring 4 begins to compress. When the block 5 passes through the groove 6, the first spring 4 pushes the block 5 into the groove 6 under the action of its rebound force. At this time, the support plate 3 can be fixed on the fixed plate 2 and the height of the heat sink 1 can be fixed by the connection between the block 5 and the groove 6.

[0025] See also Figure 1 , Figure 2 The outer surface of each fixed plate 2 is fixedly connected with a connecting plate 7, and the inner wall of each connecting plate 7 is slidably connected with a first connecting rod 8. Each first connecting rod 8 is fixedly connected with a push block 10 at one end close to the corresponding fixed plate 2. The outer surface of each push block 10 is slidably connected with the corresponding card slot 6. When the first connecting rod 8 is pressed, the first connecting rod 8 will move horizontally along the corresponding connecting plate 7 toward the corresponding fixed plate 2. At this time, the push block 10 enters the card slot 6 and pushes the card block 5 through the push block 10 to make it enter the corresponding support plate 3. At this time, the support plate 3 can be separated from the corresponding fixed plate 2, and then the support plate 3 can move vertically along the fixed plate 2.

[0026] See also Figure 2A second spring 9 is sleeved on the outer surface of each first connecting rod 8, one end of each second spring 9 is fixedly connected to the corresponding connecting plate 7, and the other end is fixedly connected to the corresponding first connecting rod 8. When the first connecting rod 8 is pressed, the corresponding second spring 9 begins to compress, and when the pressure on the first connecting rod 8 is released, the first connecting rod 8 is pushed to reset itself under the action of the corresponding second spring 9's rebound force.

[0027] See also Figure 3 A filter plate 12 is fixedly connected to the inner wall of the heat sink 1, and a heat sink 11 is fixedly installed on the outer surface of the filter plate 12. The heat sink 11 is started by PLC control. The heat sink 11 can dissipate heat when it rotates. The filter plate 12 can block external dust and prevent dust from entering the heat sink 11.

[0028] See also Figure 3 The inner wall of the heat dissipation box 1 is fixedly connected with a support frame 13, and the upper surface of the support frame 13 is slidably connected with a notebook body 18. The outer surface of the heat dissipation box 1 is provided with heat dissipation holes 14. The support frame 13 supports the notebook body 18 while reducing the contact between the notebook body 18 and the heat dissipation box 1. The heat dissipation holes 14 and the support frame 13 can increase the heat dissipation speed.

[0029] See also Figure 4 Four second connecting rods 15 and four plug rods 17 are provided inside the heat sink 1. The outer surface of each plug rod 17 is slidably connected to the heat sink 1. A fixing groove 19 is provided on the upper surface of each second connecting rod 15. The outer surface of each second connecting rod 15 is slidably connected to the heat sink 1. When the second connecting rod 15 is pulled, the second connecting rod 15 will move horizontally outward along the heat sink 1 until the fixing groove 19 and the corresponding plug rod 17 are in the same vertical line. At this time, the plug rod 17 will enter the fixing groove 19, and then the position of the second connecting rod 15 will be fixed.

[0030] See also Figure 3 , Figure 4 A third spring 16 is sleeved on the outer surface of each second connecting rod 15. One end of each third spring 16 close to the heat sink 1 is fixedly connected to the heat sink 1, and the other end is fixedly connected to the corresponding second connecting rod 15. When the second connecting rod 15 is pulled, the third spring 16 begins to stretch, and under the action of its rebound force, it pushes the second connecting rod 15 to clamp the notebook body 18.

[0031] When using the utility model: first pull the second connecting rod 15, and make the corresponding insertion rod 17 plug into the corresponding fixing groove 19, at this time the second connecting rod 15 is fixed, the third spring 16 is in a stretched state, then place the notebook body 18 on the support frame 13, and then release the insertion rod 17, at this time the second connecting rod 15 will clamp the notebook body 18 under the push of the third spring 16, and then start the heat sink 11, the heat sink 11 rotates and dissipates heat for the notebook body 18, and then by pressing the corresponding first connecting rod 8, the first connecting rod 8 pushes the card block 5 through the push block 10 to make it enter the corresponding support plate 3, at this time the support plate 3 can move vertically along the corresponding fixing plate 2, and the height of the heat sink 1 is adjusted and fixed by the card block 5 and the card slots 6 of different heights.

[0032] The above is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the claims of the present invention.

Claims

1. A notebook enhanced heat dissipation device, comprising a heat dissipation box (1), characterized in that: The bottom surface of the heat dissipation box (1) is fixedly connected with four fixing plates (2), the inner wall of each fixing plate (2) is slidably connected with a support plate (3), the inner wall of each support plate (3) is slidably connected with two clamping blocks (5), the inner wall of each support plate (3) is fixedly connected with two first springs (4), one end of each first spring (4) is fixedly connected to the corresponding clamping block (5), and the other end is fixedly connected to the inner wall of the corresponding support plate (3), the outer surface of each fixing plate (2) is provided with a clamping groove (6), the outer surface of each clamping block (5) is slidably connected to the corresponding clamping groove (6), the interior of the heat dissipation box (1) is provided with four second connecting rods (15) and four plug rods (17), the outer surface of each plug rod (17) is slidably connected to the heat dissipation box (1), the upper surface of each second connecting rod (15) is provided with a fixing groove (19), and the outer surface of each second connecting rod (15) is slidably connected to the heat dissipation box (1).

2. The enhanced heat dissipation device for a notebook according to claim 1, characterized in that: The outer surface of each fixed plate (2) is fixedly connected to a connecting plate (7), the inner wall of each connecting plate (7) is slidably connected to a first connecting rod (8), and one end of each first connecting rod (8) close to the corresponding fixed plate (2) is fixedly connected to a push block (10), and the outer surface of each push block (10) is slidably connected to the corresponding slot (6).

3. The enhanced heat dissipation device for a notebook according to claim 2, characterized in that: A second spring (9) is sleeved on the outer surface of each first connecting rod (8), one end of each second spring (9) is fixedly connected to the corresponding connecting plate (7), and the other end is fixedly connected to the corresponding first connecting rod (8).

4. The enhanced heat dissipation device for a notebook according to claim 1, characterized in that: A filter plate (12) is fixedly connected to the inner wall of the heat dissipation box (1), and a heat dissipation fin (11) is fixedly mounted on the outer surface of the filter plate (12).

5. The enhanced heat dissipation device for notebook according to claim 4, characterized in that: The inner wall of the heat dissipation box (1) is fixedly connected to a support frame (13), the upper surface of the support frame (13) is slidably connected to a notebook body (18), and the outer surface of the heat dissipation box (1) is provided with heat dissipation holes (14).

6. The enhanced heat dissipation device for a notebook according to claim 5, characterized in that: A third spring (16) is sleeved on the outer surface of each second connecting rod (15); one end of each third spring (16) close to the heat sink (1) is fixedly connected to the heat sink (1), and the other end is fixedly connected to the corresponding second connecting rod (15).

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