Leveling mechanism for semiconductor packaging
By designing multiple fixed blocks, blocks, adjustment mechanisms and support structures in the leveling mechanism for semiconductor packaging, the problem of unstable position of the semiconductor packaging leveling mechanism is solved, and higher stability and accuracy are achieved, reducing the Processing errors and wear.
Patent Information
- Application Number
- CN202421050831.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-15
- Publication Date
- 2024-12-31
- Estimated Expiration
- 2034-05-15
AI Technical Summary
The existing leveling mechanism for semiconductor packaging is fixed and unstable in the position of the semiconductor and crystallization zone during clamping operation, which easily leads to angular deviation, resulting in errors such as the thickness of the processed product.
A leveling mechanism including a base, a first support block, an adjustment mechanism, a load-bearing disc, a fixing block, a stop block, a limiting block, a connecting rod, a connecting ring, a rotating block, a pressure plate and a motor are designed, and the plurality of fixing blocks are passed The limit blocking is performed with the blocking block, the vertical movement of the adjustment mechanism is adjusted, the adsorption effect of the pressure plate and the structural support of the support block, enhancing the stability of the leveling mechanism.
The stable fixation and leveling of semiconductors is achieved, the error and wear of processed products are reduced, and the structural stability of the leveling mechanism and the integrity of processed products are enhanced.
Smart Images
Figure CN222281945U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of leveling devices, in particular to a leveling mechanism for semiconductor packaging. Background Art
[0002] In the existing technology, most leveling mechanisms used for semiconductor packaging have a series of problems such as lack of stability in fixing the position of the semiconductor and the crystallization region when clamping the workpiece, and are prone to angular deviation, which causes certain errors in the thickness of the workpiece during the operation of the leveling mechanism. Utility Model Content
[0003] The purpose of the utility model is to provide a leveling mechanism for semiconductor packaging, so as to solve the problems that most of the leveling mechanisms for semiconductor packaging mentioned above have the problem that when clamping the processed product, the fixation of the position of the semiconductor and the crystallization region is not stable enough, and the angle deviation is easy to occur, which causes certain errors in the thickness of the processed product during the operation of the leveling mechanism.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solution: it includes a base, wherein the middle of the base away from both sides are fixedly connected with a first support block, the tops of multiple first support blocks are fixedly connected with an adjustment mechanism, a first motor is arranged in the middle of one side of the base away from the first support block, a carrying plate is fixedly connected in the middle of the top of the base, and a processed product is arranged in the middle of the top of the carrying plate.
[0005] As a further solution of the utility model: a plurality of first fixed blocks are evenly fixedly connected on all four sides of the top of the base, and a blocking block is provided on one end of the plurality of first fixed blocks close to each other and close to the supporting plate, and the plurality of first fixed blocks and the blocking blocks are used to limit and block the four sides of the added products to prevent them from shifting and tilting.
[0006] As a further solution of the utility model: a connecting rod is arranged in the middle of the bottom of the adjusting mechanism, a limiting block is arranged on the outer wall of the connecting rod, a connecting ring is fixedly connected in the middle of the bottom of the limiting block, and a rotating block is arranged in the middle of the top of the adjusting mechanism, which is beneficial to control the vertical movement adjustment of the adjusting mechanism, and multiple limiting blocks 305 limit the distance of the connecting rod 304 to a certain extent.
[0007] As a further solution of the utility model: the bottom of the connecting ring is fixedly connected with a connecting plate, and a plurality of mounting screw holes are opened through the four sides of the top of the connecting plate. The middle of the tops of the plurality of mounting screw holes are threadedly connected with connecting bolts, which have a certain fixing effect and are threadedly connected with strong stability.
[0008] As a further solution of the utility model: a pressure plate is fixedly connected to the middle of the bottom of the connecting plate, and pressure holes are evenly opened on the top of the pressure plate, which has a certain adsorption effect.
[0009] As a further solution of the utility model: a first fixed plate is fixedly connected in the middle of the top of each of the multiple first support blocks, a first column is fixedly connected in the middle of the top of each of the multiple first fixed plates, a first adapter block is arranged on the top of each of the multiple first columns, a second adapter block is fixedly connected on one side of each of the multiple first adapter blocks close to each other, and an adjustment mechanism is arranged in the middle of the top of the second adapter block for structurally supporting the adjustment mechanism.
[0010] As a further solution of the utility model: a second column is fixedly connected to the middle of the bottom of the first motor, and a second support block is fixedly connected to the bottom of the second column, which is beneficial to enhancing the support of the bottom of the motor.
[0011] Compared with the prior art, the beneficial effects of the utility model are:
[0012] 1. In the utility model, by installing a plurality of first fixing blocks, the positions of the carrier plate and the processed product are fixed around by a fixed connection structure, which has a strong limiting effect. By setting a plurality of blocking blocks for limiting the two ends of the carrier plate that are far away from each other, it has a stabilizing effect on the leveling operation of the semiconductor device. By installing a plurality of first columns, it is beneficial to enhance the stable connection of the adjustment mechanism structure.
[0013] 2. In the utility model, by installing an adjusting mechanism, it is helpful to control the height adjustment of the pressure plate. The multiple pressure holes opened on the pressure plate have a certain buffering adsorption property, which can prevent it from causing different degrees of wear on the processing, and is helpful to ensure the integrity of its structure. The installation of multiple support blocks is conducive to good structural support for the bottom of the column, and enhances the stability of the structural connection between the first motor and the adjusting mechanism. By installing a carrying plate, it is helpful to provide a certain bottom structural support for the processable product, which is conducive to reducing the destructiveness to the processed product. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is the structural front view of the utility model;
[0015] Figure 2 For the utility model Figure 1 A is a schematic diagram of the structure enlargement;
[0016] Figure 3 It is a structural schematic diagram of the adjustment mechanism in the utility model;
[0017] Figure 4 It is a structural schematic diagram of the medium pressure plate of the utility model.
[0018] In the figure: 1. base; 2. first support block; 201. first fixed plate; 202. first column; 203. first adapter block; 204. second adapter block; 3. adjustment mechanism; 301. connecting plate; 302. mounting screw hole; 303. connecting bolt; 304. connecting rod; 305. limit block; 606. connecting ring; 307. rotating block; 4. first motor; 401. second support block; 402. second column; 5. bearing plate; 6. processed product; 7. pressure plate; 701. pressure hole; 8. first fixed block; 9. blocking block. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0020] See also Figures 1 to 4 In the embodiment of the utility model, a base 1 is included, and first support blocks 2 are fixedly connected to the middle of the two sides of the base 1 away from each other, and adjustment mechanisms 3 are fixedly connected to the tops of multiple first support blocks 2. A first motor 4 is arranged in the middle of one side of the base 1 away from the first support block 2, a carrying plate 5 is fixedly connected to the middle of the top of the base 1, and a processed product 6 is arranged in the middle of the top of the carrying plate 5.
[0021] Among them, multiple first fixed blocks 8 are evenly fixedly connected on all sides of the top of the base 1, and blocking blocks 9 are provided on one end of the multiple first fixed blocks 8 close to each other and close to the supporting plate 5. The multiple first fixed blocks 8 and the blocking blocks 9 are used to limit and block the four sides of the added product 6 to prevent it from shifting and tilting.
[0022] A connecting rod 304 is arranged in the middle of the bottom of the adjusting mechanism 3, a limiting block 305 is arranged on the outer wall of the connecting rod 304, a connecting ring 606 is fixedly connected in the middle of the bottom of the limiting block 305, and a rotating block 307 is arranged in the middle of the top of the adjusting mechanism 3, which is beneficial to controlling the movement and adjustment of the adjusting mechanism 3, and a plurality of limiting blocks 305 limit the distance of the connecting rod 304 to a certain extent.
[0023] The bottom of the connecting ring 606 is fixedly connected to the connecting plate 301, and multiple mounting screw holes 302 are opened all around the top of the connecting plate 301. The middle of the tops of the multiple mounting screw holes 302 are threadedly connected with connecting bolts 303, which have a certain fixing effect, threaded connection, and strong stability.
[0024] A pressing plate 7 is fixedly connected to the middle of the bottom of the connecting plate 301 , and pressure holes 701 are evenly opened on the top of the pressing plate 7 , which has a certain adsorption effect.
[0025] A first fixed plate 201 is fixedly connected in the middle of the top of each of the multiple first support blocks 2, a first column 202 is fixedly connected in the middle of the top of each of the multiple first fixed plates 201, a first adapter block 203 is arranged on the top of each of the multiple first columns 202, a second adapter block 204 is fixedly connected on one side where the multiple first adapter blocks 203 are close to each other, and an adjustment mechanism 3 is arranged in the middle of the top of the second adapter block 204 for structurally supporting the adjustment mechanism 3.
[0026] A second column 402 is fixedly connected to the middle of the bottom of the first motor 4, and a second support block 401 is fixedly connected to the bottom of the second column 402, which is beneficial to enhancing the support of the bottom of the motor.
[0027] The working principle of the utility model is: the adjusting mechanism 3 controls the connecting rod 304 to adjust the vertical height through the first motor 4, and acts on the top of the processing plane 6 through the pressure plate 7, wherein the opening of multiple pressure holes 701 can enhance the adsorption effect of the pressure plate 7, and avoid problems such as wear on the top of the processed product 6. Multiple first fixed blocks 8 are used to limit the position of the processed product 6 on all sides, and multiple blocking blocks 9 are formed to press against the middle of the two ends of the processed product 6 to achieve a certain limiting effect, and the fixing effect is strong. The installation of multiple support blocks is conducive to good structural support for the bottom of the column, and enhances the stability of the structural connection between the first motor 4 and the adjusting mechanism 3.
[0028] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A semiconductor packaging leveling mechanism, comprising a base (1), characterized in that: The base (1) is fixedly connected to first support blocks (2) in the middle of two sides away from each other, and the tops of the plurality of first support blocks (2) are fixedly connected to adjustment mechanisms (3). A first motor (4) is arranged in the middle of one side of the base (1) away from the first support blocks (2). A carrying plate (5) is fixedly connected in the middle of the top of the base (1), and a processed product (6) is arranged in the middle of the top of the carrying plate (5).
2. A semiconductor packaging leveling mechanism according to claim 1, characterized in that: A plurality of first fixing blocks (8) are evenly and fixedly connected around the top of the base (1), and a blocking block (9) is provided at one end of the plurality of first fixing blocks (8) close to each other and close to the supporting plate (5).
3. A semiconductor packaging leveling mechanism according to claim 1, characterized in that: A connecting rod (304) is provided in the middle of the bottom of the adjusting mechanism (3), a limiting block (305) is provided on the outer wall of the connecting rod (304), a connecting ring (606) is fixedly connected in the middle of the bottom of the limiting block (305), and a rotating block (307) is provided in the middle of the top of the adjusting mechanism (3).
4. A semiconductor packaging leveling mechanism according to claim 3, characterized in that: The bottom of the connecting ring (606) is fixedly connected to a connecting plate (301), and a plurality of mounting screw holes (302) are provided through the four sides of the top of the connecting plate (301), and the middle of the tops of the plurality of mounting screw holes (302) are threadedly connected to connecting bolts (303).
5. A semiconductor packaging leveling mechanism according to claim 4, characterized in that: A pressing plate (7) is fixedly connected to the middle of the bottom of the connecting plate (301), and pressure holes (701) are evenly penetrated through the top of the pressing plate (7).
6. The semiconductor packaging leveling mechanism according to claim 1, characterized in that: A first fixed plate (201) is fixedly connected in the middle of the top of each of the plurality of first supporting blocks (2), a first column (202) is fixedly connected in the middle of the top of each of the plurality of first fixed plates (201), a first adapter block (203) is arranged on the top of each of the plurality of first columns (202), a second adapter block (204) is fixedly connected on one side of each of the plurality of first adapter blocks (203) close to each other, and an adjustment mechanism (3) is arranged in the middle of the top of each of the second adapter blocks (204).
7. The semiconductor packaging leveling mechanism according to claim 1, characterized in that: A second column (402) is fixedly connected to the middle of the bottom of the first motor (4), and a second support block (401) is fixedly connected to the bottom of the second column (402).