Double-cavity detection device of probe station

Abstract

A probe station with a double-cavity structure relates to the technical field of probe stations, and comprises a cavity provided with a feeding door capable of being opened and closed; the isolation plate divides the cavity into a device cavity and a mechanical cavity, the feeding door is communicated with the device cavity and the outside, and a connecting port is formed in the isolation plate; the movable testing device comprises a movable rod and a chuck, a machine body of the movable testing device is arranged in the mechanical cavity, the movable rod penetrates through the connecting port, and the chuck is connected with the movable rod, is used for placing a tested semiconductor material and can be controlled by the movable rod to extend out of the feeding door. According to the application, the cavity is divided into two parts by using the isolation plate, so that the mobile testing device and the testing space are respectively positioned in two different areas of the mechanical cavity and the device cavity, thereby avoiding interference of electromagnetic radiation emitted by the mobile testing device in an operation process on semiconductor material detection in the device cavity; therefore, the semiconductor material can be accurately tested in the device cavity.

Description

Technical Field

[0001] The present application relates to the technical field of probe stations, and in particular to a dual-cavity detection device of a probe station. Background Art

[0002] In the process of manufacturing semiconductor materials, detection is a very important step. The probe station can absorb semiconductor materials of various specifications and provide multiple adjustable test needles and probe holders. In conjunction with measuring instruments, it can complete parameter detection of integrated circuit voltage, current, resistance, and capacitance-voltage characteristic curves.

[0003] At present, the probe station usually places the test device, the probe station and the moving device in the same chamber. The utility model patent announcement number CN220137196U discloses a wafer test probe station lifting mechanism, including a sample stage, a driving device, a chuck and a testing device. The driving device is arranged at the bottom of the sample stage, the chuck is arranged at the top of the driving device, the testing device is arranged at the top of the sample stage, and a control panel is arranged on the left outer surface of the sample stage. A support column is arranged inside the driving device, a motor is arranged at the bottom of the support column, a rotating shaft is arranged on the top of the motor, and a thread is arranged on the outer surface of the rotating shaft. A bottom rod is arranged on the top of the rotating shaft, and a telescopic rod is arranged on the top of the bottom rod. A placement plate is arranged on the top of the chuck, and baffles are arranged on the left and right sides of the placement plate, a connecting rod is arranged at the bottom of the testing device, a probe card is arranged at the bottom of the connecting rod, and infrared light emitting diodes are arranged on the left and right sides of the bottom of the probe card; because the driving device and the testing device need electricity to drive the operation, and the electromagnetic radiation of the electricity will affect the test of the semiconductor material, resulting in deviation in the test, which is not conducive to ensuring the performance of the semiconductor material. Summary of the invention

[0004] In order to solve the impact of the driving and testing equipment of the probe station on the testing of semiconductor materials, the present application provides a dual-cavity detection device of the probe station.

[0005] The dual-cavity detection device of a probe station provided in the present application adopts the following technical solution:

[0006] A dual-cavity detection device for a probe station, comprising:

[0007] The cavity is provided with a feed door which can be opened and closed;

[0008] An isolation plate separates the cavity into a device cavity and a mechanical cavity. The feeding door connects the device cavity and the outside world. A connection port is provided on the isolation plate.

[0009] The mobile testing device comprises a moving rod and a chuck. The body of the mobile testing device is arranged in a mechanical cavity. The moving rod passes through a connecting port. The chuck is connected to the moving rod and is used to place a semiconductor material for testing. The chuck can be extended from a feeding door under the control of the moving rod.

[0010] By adopting the above technical scheme, the cavity is divided into two parts by using an isolation plate, so that the mobile test device and the test space are located in two different areas of the mechanical cavity and the device cavity respectively, thereby avoiding the electromagnetic radiation emitted during the operation of the mobile test device from interfering with the semiconductor material detection in the device cavity, which is beneficial to the accurate testing of semiconductor materials in the device cavity, and is beneficial to ensuring the quality of semiconductor materials while avoiding the waste of good products caused by detection errors; the connecting port enables the moving rod of the mobile test device to extend into the device cavity, so that the chuck can be moved in the device cavity, and the moving rod can also be used to connect the test probe, so that the mobile test device can test the semiconductor material to be tested located on the chuck through the moving rod; the feeding door is used for the chuck to extend out of the cavity, so that the chuck can be installed and removed outside the cavity, making the semiconductor material detection process more convenient.

[0011] Optionally, the cavity is a rectangular parallelepiped, and the isolation plate separates the cavity into two parts, an upper part and an lower part, and the device cavity is located above the mechanical cavity.

[0012] By adopting the above technical solution, since the mobile testing device is heavy, the mechanical chamber located below can make the probe station as a whole more stable. And since the semiconductor material will be in a high pressure or vacuum state during the detection process, the mechanical chamber is located below the cavity, so that the cavity and the isolation plate do not have to bear excessive pressure, thereby avoiding damage to the cavity and the isolation plate.

[0013] Optionally, the feeding door is arranged on the upper surface of the shell of the cavity, and the central axis of the feeding door coincides with the central axis of the connecting port.

[0014] By adopting the above technical solution, since the moving rod of the mobile test device moves the chuck through the connecting port, so that the central axis of the feed door and the connecting port coincide, the moving rod only needs to move vertically to send the chuck out of the feed door, or to put the chuck into the device cavity, making the test of the probe station more convenient.

[0015] Optionally, the feeding door includes a closed door panel and a door panel slide rail. The cavity is provided with a door panel slot at the feeding door for the closed door panel to slide in the cavity. The door panel track is arranged outside the cavity for moving the closed door panel.

[0016] By adopting the above technical solution, the closed door panel is embedded in the cavity through the empty groove of the door panel, so that the door panel can slide in the empty groove of the door panel to complete the opening and closing of the feeding door. Without occupying additional space, the opening and closing operation of the feeding door is more convenient. The closed door panel can be moved outside the cavity through the door panel slide rail provided on the outside of the cavity, making it more convenient to operate the closed door panel.

[0017] Optionally, a temperature sensor and a humidity sensor are also provided in the device cavity to monitor the temperature and humidity of the device cavity.

[0018] By adopting the above technical solutions, there are more stringent requirements for temperature and humidity in semiconductor material testing. Therefore, by real-time monitoring of the temperature and humidity in the device cavity through temperature sensors and humidity sensors, it can ensure that the environment in semiconductor material testing is suitable, which is conducive to ensuring the accuracy of detection.

[0019] Optionally, the device cavity is provided with a device cavity air port, and the mechanical cavity is provided with a mechanical cavity air port.

[0020] By adopting the above technical solution, during the semiconductor material testing process, there will be environmental requirements such as low temperature, high pressure, vacuum or inert atmosphere. By connecting a refrigeration device through the device cavity air port, refrigerant gas is introduced into the device cavity, or by inflation, vacuum or introduction of inert gas, the device cavity can create different environments to increase the applicability of the probe station. The mobile test device in the mechanical cavity usually requires a dry working environment, so dry air needs to be introduced into the mechanical cavity through the mechanical cavity air port to ensure the normal operation of the mobile test device.

[0021] Optionally, a rubber ring is provided at the connection between the chuck and the moving rod.

[0022] By adopting the above technical solution, since the moving rod extends from the device cavity to the mechanical cavity at the connection port, there will be gas leakage at the connection port. When the moving rod puts the chuck into the test position of the device cavity, the chuck covers the surface of the connection port, and the connection between the chuck and the moving rod is just at the position of the connection port. Therefore, by providing a rubber ring at the connection between the chuck and the moving rod, when the chuck is in the test position, the rubber ring seals the gap between the connection port and the chuck, thereby increasing the airtightness of the device cavity and ensuring the stability of the environment during semiconductor material testing.

[0023] Optionally, the cavity is one of a copper shell, an aluminum shell and a steel shell, and the isolation plate is one of a copper plate, an aluminum plate and a steel plate.

[0024] By adopting the above technical solution, the purpose of the dual-cavity structure is to ensure that the semiconductor material is not affected by the electromagnetic radiation generated by the mobile test device during the detection process. By using copper, aluminum and steel as the materials of the cavity and the isolation plate, the dual-cavity structure can better shield the battery radiation and ensure that the test of the semiconductor material in the device cavity is not disturbed.

[0025] In summary, the present application includes at least one of the following beneficial technical effects:

[0026] 1. The cavity is separated into a device cavity and a mechanical cavity by an isolation plate, so that the semiconductor material detection is carried out in the device cavity, and the mobile test device is operated in the mechanical cavity, so that the semiconductor material will not be affected by the electromagnetic radiation generated by the mobile test device during the test process. By using copper, aluminum, steel and other materials to manufacture the cavity and isolation plate, the probe station has a stronger ability to isolate electromagnetic radiation, which is conducive to ensuring the stability of the semiconductor material testing process;

[0027] 2. By providing the device cavity air port, cooling device, temperature sensor and humidity sensor, the environment in the device cavity can be changed and detected, meeting the different detection environment requirements of different semiconductor materials, which is conducive to increasing the applicability of the probe station;

[0028] 3. By adding a rubber ring at the connection between the chuck and the moving rod, when the chuck is in the detection position, the rubber ring can fill the gap between the connection port and the chuck, thereby increasing the airtightness of the device cavity, which is beneficial to maintaining the environment in the device cavity and ensuring the smooth progress of semiconductor material testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;

[0030] Figure 2 is a schematic cross-sectional structural diagram of a first state of an embodiment of the present application;

[0031] Figure 3 is a schematic cross-sectional structural diagram of the second state of the embodiment of the present application;

[0032] Figure 4 yes Figure 3 A partial enlarged schematic diagram of part A.

[0033] Figure numerals: 1. cavity; 11. isolation plate; 12. connection port; 13. feed door; 13a. closed door panel; 13b. door panel slide rail; 14. door panel slot; 2. device cavity; 21. temperature sensor; 22. humidity sensor; 23. device cavity air port; 3. mechanical cavity; 31. mechanical cavity air port; 4. mobile test device; 41. mobile rod; 42. chuck; 43. rubber ring. DETAILED DESCRIPTION

[0034] The following is combined with Figure 1 To Attachment Figure 4 , further details of this application are given.

[0035] Reference Figure 1 and 2A dual-cavity detection device of a probe station includes a cavity 1, an isolation plate 11 and a mobile test device 4. The cavity 1 is a rectangular structure. The isolation plate 11 divides the cavity 1 into two upper and lower rectangular spaces in the horizontal direction, wherein the upper space is a device cavity 2, and the lower space is a mechanical cavity 3, wherein the size of the mechanical cavity 3 is slightly larger, the device cavity 2 is used for semiconductor material detection, and the mechanical cavity 3 is used to place the device body of the mobile test device 4, so that the battery radiation generated during the operation of the mobile test device 4 can be isolated by the isolation plate 11, thereby avoiding affecting the semiconductor material testing process in the device cavity; a connecting port 12 is opened in the middle of the isolation plate 11, connecting the device cavity 2 and the mechanical cavity 3, so that the mobile test device 4 can move and test the semiconductor material in the device cavity 2 through the connecting port 12, and the top surface of the cavity 1 A feeding door 13 is also provided in the middle part, and the feeding door 13 can be opened and closed. When semiconductor materials need to be placed in the device cavity 2, the feeding door 13 is opened, and when the semiconductor material test is started, the feeding door 13 is closed, so as to make the device cavity 2 in a closed state, which is beneficial to ensure the stability of the test environment; the device cavity 2 is provided with four device cavity air ports 23 connected to the outside world, and the device cavity air ports 23 can be used to inflate or evacuate the device cavity 2 to create a high pressure or vacuum environment in the device cavity 2, or to introduce inert gas to create an inert atmosphere, and the device cavity 2 can create various test environments through the device cavity air ports 23; the mechanical cavity 3 is provided with four mechanical cavity air ports 31, and dry gas is added into the mechanical cavity 3 through the mechanical cavity air ports 31, so as to maintain the dry environment of the mechanical cavity 3, which is beneficial to the normal operation of the mobile test device 4.

[0036] Reference Figure 2 and 3 The mobile test device 4 extends a moving rod 41, and the moving rod 41 passes through the isolation plate 11 from the mechanical cavity 3 from the connection port 12 and enters the device cavity 2. A chuck 42 is fixed at the end of the moving rod 41, and the chuck 42 is used to place the test semiconductor material. The moving rod 41 can move the chuck 42 up and down. When the semiconductor material needs to be placed or removed, the moving rod 41 moves the chuck 42 upward so that the chuck 42 extends out of the feed gate 13, so that the operator can replace the test semiconductor material outside the probe station, making the semiconductor material replacement operation more convenient. In addition, the moving rod 41 is also used to enable the test device of the mobile test device 4 to connect the chuck 42 through the moving rod 41, so that the semiconductor material can be tested on the chuck 42.

[0037] Reference Figure 2 and 3The feeding door 13 includes a closed door panel 13a and a door panel slide rail 13b, and a door panel slot 14 is opened in the cavity 1 near the feeding door 13. The closed door panel 13a is placed in the door panel slot 14. The space of the door panel slot 14 is large, so that the closed door panel 13a can be retracted into the cavity 1 when the feeding door 13 is opened, and the opening of the feeding door 13 is closed when the feeding door 13 is closed. The door panel slide rail 13b is arranged on the surface of the cavity 1, and the sliding block connected to the closed door panel 13a is slid on the door panel slide rail 13b to realize the control of the sliding of the closed door panel 13a.

[0038] Reference Figure 2 and 3 A temperature sensor 21 and a humidity sensor 22 are also provided in the device cavity 2. The temperature sensor 21 and the humidity sensor 22 are used to detect the temperature and humidity in the device cavity 2 to ensure that the temperature and humidity in the device cavity 2 can meet the requirements of semiconductor material testing to ensure accurate semiconductor material testing.

[0039] Reference Figure 4 A rubber ring 43 is provided at the connection between the back of the chuck 42 and the moving rod 41. When the chuck 42 is received into the device cavity 2, it keeps descending until the chuck 42 is close to the connecting port 12. At this time, the rubber ring 43 will fill the gap between the connecting port 12, the moving rod 41 and the chuck 42, so that the device cavity 2 is isolated from the mechanical cavity 3, thereby ensuring the stability of the environment of the device cavity 2 during semiconductor material testing.

[0040] The implementation principle of the embodiment of the present application is as follows: before the semiconductor material is tested, the chuck 42 extends out of the feeding door 13 through the moving rod 41, and the operator can install the semiconductor material to be tested on the chuck 42. The chuck 42 with the semiconductor material to be tested is driven by the moving rod 41 and sinks into the device cavity 2 and is close to the isolation plate 11. When the chuck 42 moves to the test position, the rubber ring 43 closes the connection port 12 to isolate the device cavity 2 and the mechanical cavity 3. Since the test may make the air pressure and gas of the device cavity 2 and the mechanical cavity 3 different, the isolation by the rubber ring 43 is conducive to ensuring that the environment of the device cavity 2 remains stable when testing semiconductor materials. The feeding door 13 is closed, and the gas introduced into the device cavity air port 23 is adjusted to make the device cavity 2 2 reaches the environment required for testing semiconductor materials, dry air is introduced into the mechanical cavity air port 31, so that the mobile test device 4 in the mechanical cavity 3 is in a suitable working environment. When the environment in the device cavity 2 is adjusted to be suitable and stable, the mobile test device 4 starts to test the semiconductor material on the chuck 42. After the test is completed, the device cavity air port 23 adjusts the air pressure in the device cavity 2 to make the device cavity 2 and the external air pressure equal, opens the feed door 13, and lifts the chuck 42 so that the chuck 42 extends out of the feed door 13, so that the operator can take out the tested semiconductor material, and use the dual-cavity detection device of the probe station to avoid the mobile test device 4 from generating battery radiation to affect the semiconductor material test, thereby ensuring the accuracy of the semiconductor material test.

[0041] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A dual-cavity detection device for a probe station, characterized in that: include: The cavity (1) is provided with a feed door (13) that can be opened and closed; an isolation plate (11), the isolation plate (11) separating the cavity (1) into a device cavity (2) and a mechanical cavity (3), the feed door (13) connecting the device cavity (2) and the outside, and a connection port (12) being provided on the isolation plate (11); A mobile testing device (4) comprises a mobile rod (41) and a chuck (42). The body of the mobile testing device (4) is arranged in the mechanical cavity (3). The mobile rod (41) passes through the connecting port (12). The chuck (42) is connected to the mobile rod (41) and is used for placing a test semiconductor material. The chuck (42) can be controlled by the mobile rod (41) to extend from the feeding door (13).

2. A dual-cavity detection device for a probe station according to claim 1, characterized in that: The cavity (1) is a rectangular parallelepiped; the isolation plate (11) divides the cavity into two parts, an upper part and an lower part; the device cavity (2) is located above the mechanical cavity (3).

3. A dual-cavity detection device for a probe station according to claim 2, characterized in that: The feeding door (13) is arranged on the upper surface of the shell of the cavity (1), and the central axis of the feeding door (13) coincides with the central axis of the connecting port (12).

4. A dual-cavity detection device for a probe station according to claim 1, characterized in that: The feeding door (13) comprises a closed door panel (13a) and a door panel slide rail (13b); the cavity (1) is provided with a door panel slot (14) at the feeding door (13) for allowing the closed door panel (13a) to slide in the cavity (1); and the door panel slide rail (13b) is arranged outside the cavity (1) for moving the closed door panel (13a).

5. A dual-cavity detection device for a probe station according to claim 1, characterized in that: A temperature sensor (21) and a humidity sensor (22) are also provided in the device cavity (2) for monitoring the temperature and humidity of the device cavity.

6. A dual-cavity detection device for a probe station according to claim 1, characterized in that: The device cavity (2) is provided with a device cavity air port (23), and the mechanical cavity (3) is provided with a mechanical cavity air port (31).

7. A dual-cavity detection device for a probe station according to claim 1, characterized in that: A rubber ring (43) is provided at the connection between the chuck (42) and the moving rod (41).

8. A dual-cavity detection device for a probe station according to claim 1, characterized in that: The cavity (1) is one of a copper shell, an aluminum shell and an iron shell, and the isolation plate (11) is one of a copper plate, an aluminum plate and a steel plate.

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