Wiring structure of electronic paper

Abstract

The utility model provides an electronic paper wiring structure, which comprises a plurality of ESD electrostatic protection devices, an electronic paper display screen and a plurality of COM data lines connected with the electronic paper display screen, the electronic paper display screen comprises an AA area and an IC driver, and the AA area comprises a plurality of columns of pixel points; one ends of a plurality of COM data lines are led out from the IC driver, and the other ends of the COM data lines are connected with a plurality of columns of pixel points in the AA area in the vertical direction and then attached to the side edge of the electronic paper display screen; the ESD electrostatic protection device is placed above the IC driver and attached to the COM data line on the transverse side edge of the electronic paper display screen. By changing the wiring mode of the COM data line and moving the ESD electrostatic protection device from the left side and the right side of the electronic paper to the lower side, the width of the frame of the electronic paper is reduced, the typesetting mode of the electronic paper is optimized, and the typesetting number is increased.

Description

Technical Field

[0001] The utility model belongs to the field of electronic paper design, and in particular relates to a wiring structure of electronic paper. Background Art

[0002] E-paper ink screen display has the characteristics of ultra-low power consumption, low-frequency display, power saving, etc., and has been widely used in price tags, advertising signs, bus stops, etc. Usually, in the conventional design of e-paper, in order to avoid corrosion risks, PV holes cannot be designed within a certain distance near the FPL cutting line, so in conventional design, the COM line and ESD structure containing the PV hole need to be placed outside this safe distance, which will make the border of the e-paper wider.

[0003] However, in actual electronic paper splicing, this conventional design often results in larger electronic paper seams due to the wider electronic paper borders, which reduces the number of electronic paper layouts and reduces the screen-to-body ratio. Utility Model Content

[0004] The utility model proposes a wiring structure of electronic paper, which reduces the width of the electronic paper frame, optimizes the layout of the electronic paper and increases the number of layouts by changing the wiring method of the COM data line and moving the ESD electrostatic protection device from the left and right sides of the electronic paper to the bottom.

[0005] This practical information is achieved through the following technical solutions:

[0006] An electronic paper wiring structure includes a plurality of ESD electrostatic protection devices, an electronic paper display screen, and a plurality of COM data lines connected to the electronic paper display screen, wherein the electronic paper display screen includes an AA area and an IC driver, and the AA area includes a plurality of columns of pixel points;

[0007] One end of a plurality of COM data lines is led out from the IC driver, and the other end is connected to a plurality of columns of pixel points in the AA area in a vertical direction and then attached to the side of the electronic paper display screen;

[0008] The ESD electrostatic protection device is placed above the IC driver and attached to the COM data line on the lateral side of the electronic paper display screen.

[0009] In the above solution, the layout of the electronic paper is optimized by changing the original electronic paper COM data line from the conventional horizontal connection of pixels to the vertical connection of pixels. At the same time, the ESD electrostatic protection devices originally placed on the left and right sides of the electronic paper are changed to be placed under the electronic paper. This frees up some space on both sides of the electronic paper, effectively reducing the width of the borders on both sides of the electronic paper and increasing the number of electronic papers that can be laid out horizontally.

[0010] Preferably, the COM data line and the ESD electrostatic protection device further include a PV hole, and the PV hole of the COM data line is located at the COM data line where the ESD electrostatic protection device is placed.

[0011] In the above solution, because the ESD electrostatic protection device is placed under the electronic paper, the PV hole is also under the electronic paper. In this way, the PV hole is farther away from the FPL electronic ink film than before, and is less likely to be corroded by the liquid produced after the FPL electronic ink film is damaged, thereby improving the safety and stability of the electronic paper.

[0012] Preferably, the PV hole is a SINX protective layer with the upper metal layer removed.

[0013] Preferably, the electronic paper display screen further comprises an FPL electronic ink film, and the FPL electronic ink film is coated on the outer side of the electronic paper display screen.

[0014] Preferably, the shortest distance between the FPL electronic ink film, the COM data line and the PV hole of the ESD electrostatic protection device is greater than a first threshold.

[0015] The above solution stipulates that the shortest distance between the PC hole and the FPL electronic ink film is greater than a first threshold value, thereby reducing the risk of the PV hole being corroded by corrosive liquids.

[0016] Preferably, each column of pixels is connected by a COM data line.

[0017] Preferably, each pixel point is distributed in a matrix.

[0018] Preferably, the electronic paper display screen further comprises an FPC layer, and the FPC layer is located below the IC driver and the ESD electrostatic protection device.

[0019] Preferably, one side of the COM data line is attached to the IC driver, and the other side is attached to the FPC layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solution of the present invention, the drawings required for use in the implementation mode will be briefly introduced below. Obviously, the drawings described below are only some implementation modes of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 is a cross-sectional view of a wiring structure of an electronic paper provided by a certain embodiment of the utility model;

[0022] Figure 2It is a cross-sectional view of a wiring structure of a conventionally designed electronic paper provided in a certain embodiment of the present utility model.

[0023] Explanation of the reference numerals: pixel-pixel; ESD-ESD electrostatic protection device; AA-AA area; FPL-FPL electronic ink film; com line-COM connecting line; IC-IC driver; FPC-FPC layer. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] It should be understood that the step numbers used in this article are only for the convenience of description and are not intended to limit the order in which the steps are executed.

[0026] In the description of the embodiments of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or a connection through an intermediate medium, or it can be a communication between the two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] Embodiment 1

[0028] like Figure 1 As shown, Figure 1 A cross-sectional view of a wiring structure of an electronic paper provided for a certain embodiment of the present invention includes a plurality of ESD electrostatic protection devices, an electronic paper display screen and a plurality of COM data lines connected to the electronic paper display screen, wherein the electronic paper display screen includes an AA area and an IC driver, and the AA area includes a plurality of columns of pixel points.

[0029] In this embodiment, one end of the COM data line is led out from the IC driver, and the other end is connected to several columns of pixel points in the AA area in a vertical direction and then adhered to the side of the electronic paper display screen; wherein, the other side of the COM data line led out from the IC driver is also adhered to the FPC layer; the FPC layer is a flexible printed circuit board, referred to as a soft board, which is made into a conductor circuit pattern on the surface of a flexible substrate by using a light imaging pattern transfer and etching process method. The surface of the circuit pattern is protected and insulated by PI and a glue layer, and is used for connection between electronic components in the electronic paper.

[0030] The COM data line is attached to the FPC layer on one side and to the IC driver on the other side, and then is led out from the IC driver to first connect to the ESD structure and then to the pixel point; wherein, the IC driver is responsible for driving the display in the electronic paper and also controls the driving current.

[0031] The AA area includes several columns of pixels, all of which are arranged in a matrix, and each column of pixels is vertically connected by a COM data line. After a COM data line connects a column of pixels, it is led out from the AA area and closely attached to the side of the electronic paper display.

[0032] In this embodiment, the ESD electrostatic protection device is placed on the COM data line on the side of the electronic paper display screen close to the IC driver, and the ESD electrostatic protection device is above the IC driver. Since the ESD electrostatic protection device is placed below the electronic paper display screen, the left and right sides of the electronic paper display screen are narrowed, which effectively reduces the width of the borders on both sides of the electronic paper and increases the number of electronic papers that can be laid out in the horizontal direction; wherein, the COM data line and the ESD electrostatic protection device on the side close to the IC driver in the horizontal direction include a number of PV holes, and the PV hole is a membrane structure in which the SINX protective layer on the upper layer of the metal is removed, which can connect the metal to ITO (a semiconductor material that can be used as an electrode for electronic ink in electronic paper).

[0033] Since the electronic paper display screen also includes an FPL electronic ink film, the FPL electronic ink film is formed by coating a microcapsule electrophoretic display material on a flexible film on the side of the electronic paper. When the FPL electronic ink film is cut, since the microcapsule electrophoretic display material is a liquid material, namely electronic ink, the microcapsules are prone to rupture after cutting, causing the internal solution to penetrate into the PV hole and corrode the metal circuit. In order to avoid corrosion of the metal circuit, in this embodiment, the ESD electrostatic protection device with the PV hole is placed on the side close to the IC driver, and the shortest distance between the FPL electronic ink film and the COM data line and the PV hole of the ESD electrostatic protection device is required to be greater than a preset first threshold value, ensuring that the PV hole and the FPL electronic ink film are outside a certain safety distance, thereby reducing the risk of corrosion of the metal circuit of the electronic paper.

[0034] Embodiment 2

[0035] like Figure 2 As shown, it is a cross-sectional view of a wiring structure of a conventionally designed electronic paper. Figure 2The COM data line horizontally connects the pixels of each row in the AA area, and the ESD electrostatic protection device is placed on the left and right sides of the electronic paper display. Compared with the wiring structure of the electronic paper provided in this application, the PV hole is closer to the FPL electronic ink film, which makes the metal circuit of the electronic paper more susceptible to corrosion.

[0036] In this embodiment, the dimensions of the electronic paper under conventional design are 31.8×32.7 um. After using the wiring structure of the electronic paper provided in this application, the left and right borders of the electronic paper can be reduced by 0.6 um in width.

[0037] This embodiment proposes a wiring structure of electronic paper: including several ESD electrostatic protection devices, an electronic paper display screen and several COM data lines connected to the electronic paper display screen, the electronic paper display screen includes an AA area and an IC driver, the AA area includes several columns of pixels; one end of several COM data lines is led out from the IC driver, and the other end is connected to several columns of pixels in the AA area in a vertical direction and then attached to the side of the electronic paper display screen; the ESD electrostatic protection device is placed above the IC driver and attached to the COM data line on the lateral side of the electronic paper display screen. Its beneficial effect is that by changing the wiring method of the COM data line and moving the ESD electrostatic protection device from the left and right sides of the electronic paper to the bottom side, the width of the electronic paper frame is reduced, the layout method of the electronic paper is optimized, and the number of layouts is increased.

[0038] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the utility model. It should be understood that the above description is only a specific embodiment of the utility model and is not intended to limit the scope of protection of the utility model. It is particularly pointed out that for those skilled in the art, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model should be included in the scope of protection of the utility model.

Claims

1. A wiring structure of electronic paper, characterized in that: It includes several ESD electrostatic protection devices, an electronic paper display screen and several COM data lines connected to the electronic paper display screen, wherein the electronic paper display screen includes an AA area and an IC driver, and the AA area includes several columns of pixel points; One end of a plurality of COM data lines is led out from the IC driver, and the other end is connected to a plurality of columns of pixel points in the AA area in a vertical direction and then attached to the side of the electronic paper display screen; The ESD electrostatic protection device is placed above the IC driver and attached to the COM data line on the lateral side of the electronic paper display screen.

2. The wiring structure of electronic paper according to claim 1, characterized in that: The COM data line and the ESD electrostatic protection device further include a PV hole, and the PV hole of the COM data line is located at the COM data line where the ESD electrostatic protection device is placed.

3. The wiring structure of electronic paper according to claim 2, characterized in that: The PV hole is a SINX protective layer with the metal upper layer removed.

4. The wiring structure of electronic paper according to claim 1, characterized in that: The electronic paper display screen further includes an FPL electronic ink film, and the FPL electronic ink film is coated on the outer side of the electronic paper display screen.

5. The wiring structure of electronic paper according to claim 4, characterized in that: The shortest distance between the FPL electronic ink film, the COM data line, and the PV hole of the ESD electrostatic protection device is greater than a first threshold.

6. The wiring structure of electronic paper according to claim 1, characterized in that: Each column of pixels is connected by a COM data line.

7. The wiring structure of electronic paper according to claim 1, characterized in that: Each pixel point is distributed in a matrix.

8. The wiring structure of electronic paper according to claim 1, characterized in that: The electronic paper display screen further comprises an FPC layer, and the FPC layer is located below the IC driver and the ESD electrostatic protection device.

9. The wiring structure of electronic paper according to claim 8, characterized in that: One side of the COM data line is attached to the IC driver, and the other side is attached to the FPC layer.

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