Die bonding system

Abstract

A die bonding system includes a pick-and-place device, a carrier fixing platform, and a transfer platform. The pick-and-place device comprises a suction head used for picking up the crystal grains and placing the crystal grains on the carrier. The carrier fixing platform is used for fixing a carrier. The carrier has a bearing surface arranged facing downward or inclined at an angle with respect to a horizontal plane. The transfer platform includes a driver, the pick-and-place device is arranged on the transfer platform, and the driver controls the pick-and-place device to move to a position below the carrier or to be inclined at an angle with respect to a horizontal plane, and the pick-and-place device bonds the die to the bearing surface of the carrier from the position below the carrier or at the inclined angle.

Description

Technical Field

[0001] The present disclosure relates to die bonding systems. Background Art

[0002] The system-on-integrated chip (SoIC) packaging technology adopted by chip packaging manufacturers is based on wafer-on-wafer (WoW) and chip-on-wafer (CoW) multi-die stacking technology, in which the dies are stacked in a face-to-face or face-to-back manner to be connected to each other.

[0003] For the System on Integrated Chip (SoIC) pick-and-place bonding process, top die control during bonding is the most important key factor for yield assessment. The bonding conditions of the pick-and-place bonder also affect the quality of plane-to-plane bonding. Once particles land on the wafer or die, the bonding interface will be deformed, which in turn affects the reliability of the bonding interface between the wafer and the die. Utility Model Content

[0004] Some embodiments of the present disclosure provide a die bonding system, comprising: a picker and placer, a carrier fixing platform, and a conveying platform. The picker and placer is used to pick up a die and place the die on a carrier. The carrier fixing platform is used to fix the carrier, and the carrier's bearing surface faces downward. The conveying platform is used to control the picker and placer to move to a position below the carrier, and the picker and placer bonds the die to the bearing surface.

[0005] Some other embodiments of the present disclosure provide a die bonding system, comprising: a picker and placer, a carrier fixing platform, and a conveying platform. The picker and placer is used to pick up a die and place the die on a carrier. The carrier fixing platform is used to fix the carrier, and the carrier has a bearing surface inclined at an angle relative to a horizontal plane. The conveying platform is used to control the picker and placer to bond the die to the bearing surface of the carrier.

[0006] Still other embodiments of the present disclosure provide a die bonding system, comprising: a picker, a carrier fixing platform, a conveying platform, a die rack, and a die rack fixing platform. The picker is used to pick up a die and place the die on the carrier. The carrier fixing platform is used to fix the carrier, and the carrier's bearing surface faces downward. The conveying platform is used to control the picker to move to a position below the carrier, and the picker bonds the die to the bearing surface. The die is arranged on the die rack and faces downward. The die rack is arranged below the die rack fixing platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The various aspects of the present disclosure can be best understood by the following detailed description and reading together with the accompanying drawings. Note that, in accordance with standard practice in the industry, the various features are not drawn to scale. In fact, the size of the various features may be arbitrarily increased or decreased for clarity of discussion.

[0008] Figure 1A and Figure 1B is a schematic diagram of a die bonding system and a die bonding method using the system according to an embodiment of the present disclosure;

[0009] Figure 2A and Figure 2B is a schematic diagram of a die bonding system and a die bonding method using the system according to another embodiment of the present disclosure;

[0010] Figure 3A and Figure 3B is a schematic diagram of a die bonding system and a die bonding method using the system according to another embodiment of the present disclosure;

[0011] Figure 3C and Figure 3D is a schematic diagram of a die bonding system and a die bonding method using the system according to another embodiment of the present disclosure;

[0012] Figure 4A and Figure 4B is a schematic diagram of a die bonding system and a die bonding method using the system according to another embodiment of the present disclosure.

[0013]

Explanation of symbols

[0014] 10: Carrier

[0015] 101: Die Bonding System

[0016] 102: Die Bonding System

[0017] 103: Die Bonding System

[0018] 104: Die Bonding System

[0019] 105: Die Bonding System

[0020] 11: Load-bearing surface

[0021] 110: Pick and place device

[0022] 112: Suction head

[0023] 114: Vacuum generator

[0024] 115: Rotation axis

[0025] 116: Driving device

[0026] 12: Particles

[0027] 120:Carrier fixed platform

[0028] 121: Load-bearing surface

[0029] 122: Fixed part

[0030] 123: Rotation axis

[0031] 124: Driving device

[0032] 130:Transmission Platform

[0033] 131: Rotation axis

[0034] 132:Drive

[0035] 133: Linear drive module

[0036] 140: Die rack

[0037] 141: Load-bearing surface

[0038] 142: Cutting belt

[0039] 144: Chip rack fixing platform

[0040] 145:Fixed parts

[0041] 146: Driving device

[0042] 150:Remove device

[0043] 16: Bonding film

[0044] 20: Grain

[0045] C: Airflow

[0046] F: Suction

[0047] H: Horizontal plane

[0048] θ: Angle DETAILED DESCRIPTION

[0049] The disclosure that follows provides many different implementations or embodiments for implementing different features of the provided subject matter. Specific embodiments of components and arrangements are described below to simplify the disclosure. Of course, these are merely embodiments and are not restrictive. For example, in the subsequent description, a first feature is formed above or on a second feature, and an implementation in which the first feature and the second feature are formed in direct contact may be included, and an additional feature may be formed between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. In addition, the disclosure may repeat reference numerals and / or letters in various embodiments. Such repetition is for the purpose of simplification and clarity, and the repetition itself does not mean the relationship between the various embodiments and / or configurations discussed.

[0050] Additionally, to facilitate describing the relationship of one element or feature to another element or feature as depicted in the figures, spatially relative terms may be used herein, such as "below," "below," "lower," "above," "upper," and the like. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should be interpreted similarly accordingly.

[0051] According to some embodiments of the present disclosure, in order to prevent contaminants from falling on the carrier or the die, and to prevent the occurrence of an unbonded interface between the carrier and the die, as in Figure 1B , Figure 2B ,and Figure 4B , arranging the carrier and the carrier holding platform face down as shown in Figure 2A and Figure 4A Arrange the die and die holder face down as shown in .

[0052] Reference Figure 1A and Figure 1B , a schematic diagram of a die bonding system 101 and a die bonding method according to an embodiment of the present disclosure is shown. The die bonding system 101 includes a pick-and-place device 110, a die rack 140, a carrier fixing platform 120, and a conveying platform 130. The pick-and-place device 110 is mounted on the conveying platform 130, and the conveying platform 130 can generally be a pick-and-place machine with a two-axis moving stage and a servo controller, such as Datacon provided by BE Semiconductor Industries N.V., Shibaura Mechatronics Co., Ltd. TM2200evo multi-wafer die bonding machine, model: TFC-6000, or other similar machines. The picker 110 can complete the pick-and-place operation of the die 20 through the movement of the robot arm and digital control. The picker and place machine and the robot arm are used to transfer the picker 110 to the carrier 10 (such as a wafer). The picker 110 is used to pick up the die 20 on the die rack 140 and place the die 20 on the carrying surface 11 of the carrier 10.

[0053] In some embodiments, carrier 10 (i.e., wafer) may include glass, silicon, germanium, a printed circuit board (PCB), and the like. In some embodiments, the thickness of carrier 10 may be between about a few mils and tens of mils, and carrier 10 may have a diameter of about 300 millimeters (mm). Carrier 10 functions as a fan-out carrier wafer during packaging of semiconductor devices or dies.

[0054] In some embodiments, the die 20 may be a central processing unit (CPU) die, a graphics processing unit (GPU) die, a system-on-a-chip (SoC) unit die, or a high bandwidth memory (HBM), a power management die (e.g., a power management integrated circuit (PMIC)), a radio frequency (RF) die, a sensor die, a micro-electro-mechanical-system (MEMS) die, or a signal processing die (e.g., a digital signal processor (DSP)). Figure 1A As shown in FIG. 1 , the dies 20 are collected and stored in a die rack 140 (eg, a waffle pack) or on a dicing tape 142 , and the dies 20 can be picked up from the die rack 140 or the dicing tape 142 by the picker 110 .

[0055] In some embodiments, the die rack 140 (e.g., die box) is a carrier for the bare die 20 and is used for the transfer and handling of small batches of die. The die box is usually a plastic tray with pockets whose size is suitable for a specific die size. For example, the die rack 140 is a 6×6 die box containing 36 dies, and the present disclosure is not limited thereto.

[0056] In some embodiments, before placing the die 20 on the carrier 10, a bonding film 16 may be formed on the carrier 10. The bonding film 16 may be a silicon dioxide film, and the thickness may be, for example, between 0.1 micrometers and 1 micrometers. Due to direct room temperature bonding, the bonding film 16 may generate a weak van der Waals force between the die 20 and the carrier 10, so that the bonding surface of the die 20 may be completely attached to the bonding film 16.

[0057] In some embodiments, a combination of metal-to-metal bonding and dielectric-to-dielectric bonding, or fusion bonding is used to bond the die 20 to the carrier 10. The combination of metal-to-metal bonding and dielectric-to-dielectric bonding or fusion bonding includes pre-bonding and annealing. During pre-bonding, a small pressure is applied to bond the die 20 to the carrier 10 via van der Waals forces. The pre-bonding may be performed at room temperature (e.g., between about 21° C. and about 25° C.) or at a higher temperature.

[0058] In some embodiments, the carrier 10 is arranged below the carrier fixing platform 120, and the carrier 10 has a bearing surface 11, and the bearing surface 11 is arranged to face downward. The carrier fixing platform 120 can be a wafer stage / table, an electrostatic chuck (e-chuck), or other devices with the same concept. The area of ​​the carrier fixing platform 120 is greater than the area of ​​the carrier 10 (e.g., wafer). The diameter of the carrier 10 can be in the range of 200 mm to 450 mm, such as about 200 mm, about 300 mm, about 450 mm, or any suitable size. In some embodiments, the carrier fixing platform 120 is designed to have a plurality of wafer support pins, which can be independently (independently of each other) and vertically (perpendicular to the surface of the wafer supported thereon) moved, but there may be no wafer support pins thereon. In some other embodiments, the electrostatic chuck is designed to use electricity to generate an electrostatic force (e.g., Coulomb force and Johnson-Rahbek force) to maintain the position of the carrier 10.

[0059] Reference Figure 1A and Figure 1BThe picker and placer 110 includes a suction head 112, a carrier fixing platform 120, and a carrier 10. The suction head 112 is used to pick up a die 20 and place the die 20 on the carrier 10. The carrier fixing platform 120 is used to fix the carrier 10. The carrier 10 has a bearing surface 11 arranged face-down. The conveying platform 130 is connected to a driver 132. The picker and placer 110 is arranged on the conveying platform 130, and the driver 132 controls the picker and placer 110 to move to a position below the carrier 10, and the picker and placer 110 carries the die 20 to be bonded to the bearing surface 11 of the carrier 10 from the position below the carrier 10.

[0060] In some embodiments, the suction head 112 can be a vacuum suction cup. Figure 1A As shown in FIG, a vacuum generator (e.g., a pump) 114 may be connected to the suction head 112 through a pipe so that the picker and placer 110 may fix the die 20 during vacuuming. After the vacuum generator 114 is turned off to release the vacuum in the suction head 112, the picker and placer 110 may release the die 20 during vacuum release so that the die 20 may be bonded to the carrier 10 through the bonding film 16 or the conductive bumps (not shown).

[0061] In some embodiments, the carrier 10 may be a bulk semiconductor wafer. For example, the carrier 10 may include a compound semiconductor. The compound semiconductor may include gallium arsenide, silicon carbide, indium arsenide, indium phosphide, other suitable materials, or combinations thereof. However, in other embodiments, the carrier 10 may include an alloy semiconductor, such as silicon germanium, silicon germanium carbide, gallium arsenic phosphide, or gallium indium phosphide. In other embodiments, the carrier 10 may include a silicon-on-insulator (SOI) or a germanium-on-insulator (GOI) substrate. The manufacture of the silicon-on-insulator substrate may be via separation by implantation of oxygen technology, wafer bonding technology, other suitable technology, or a combination of the above technologies.

[0062] In some embodiments, an interconnect structure may be formed on the carrier 10. The interconnect structure may include multiple interlayer dielectric layers, such as a low-k material having a smaller relative dielectric constant than silicon dioxide. Replacing silicon dioxide with a low-k dielectric of the same thickness reduces parasitic capacitance, which may allow for faster switching speeds (in the case of synchronous circuits) and lower heat dissipation. The interconnect structure may also include multiple layers of conductive features, such as conductive wires, conductive vias, and / or various conductive contacts, formed between the multiple interlayer dielectric layers.

[0063] In some embodiments, the carrier 10 includes different device elements. For example, the device elements may include transistors (e.g., metal oxide semiconductor field effect transistors (MOSFETs), complementary metal oxide semiconductor (CMOS) transistors, bipolar junction transistors (BJTs), high voltage transistors, high frequency transistors, p-channel and / or n-channel field effect transistors (PFETs and / or NFETs), diodes, or other suitable components). Different device elements may use different processing methods, including deposition, etching, implantation, lithography, annealing, and / or other suitable processing methods.

[0064] In some embodiments, the device elements in the carrier 10 may be interconnected by an interconnect structure to form an integrated circuit device. The integrated circuit device may include a logic device, a memory device (e.g., a static random access memory (SRAM)), a radio frequency (RF) device, an input / output (I / O) device, a system on a chip (SOC) device, an image sensor device, other suitable devices, or a combination of the above devices.

[0065] exist Figure 1B In order to prevent contaminants (e.g., particles 12 or undesirable objects) on the surface of the carrier fixing platform 120 from falling on the carrier 10 or the die 20 before the die bonding process, and to prevent the possibility of an unbonded interface between the carrier 10 and the die 20 due to the formation of a gap or a gap between the carrier 10 and the die 20 during the pick-and-place bonding process, the carrier fixing platform 120 and the carrier 10 are arranged to face downward. Because the carrier fixing platform 120 and the carrier 10 face downward, the particles 12 initially attached to the carrier fixing platform 120 and the carrier 10 fall due to gravity. The particles 12 can also be removed via other external forces (e.g., a jet or electrostatic force). Therefore, the bearing surface 121 of the carrier fixing platform 120 and the bearing surface 11 of the carrier 10 can be kept clean and will not be contaminated by particles 12 or other undesirable contaminants, so that defective carriers 10 will not be produced. Particles 12 may come from particles in the gas, contaminants generated during the manufacturing process, particles initially attached to the die or wafer, or other devices that generate particles 12. Particles 12 may contaminate carrier 10 during the die bonding process, thereby producing defective carrier 10.

[0066] In some embodiments, the carrier fixing platform 120 may use mechanical elements, vacuum adsorption elements, electrostatic adsorption elements, clamping elements, or other elements to hold the carrier 10. Figure 1BAs shown in FIG. 1 , at least two fixing parts 122, such as hooks or chucks, are provided on the carrying surface 121 of the carrier fixing platform 120, and the two fixing parts 122 can hold the carrier 10 at the bottom of the carrier fixing platform 120. Alternatively, the carrier 10 can be fixed to the carrier 10 by electrostatic force or vacuum suction (at Figure 1B The upward arrow at the rear of the carrier 10 shown in FIG. 1 indicates that the suction force F) is adsorbed on the bottom of the carrier fixing platform 120. Therefore, there is no limitation on using mechanical elements or clamping elements to hold the carrier 10. That is, the carrier fixing platform 120 may be a vacuum holding platform, an electrostatic holding platform, or a mechanical holding platform.

[0067] In some embodiments, the carrier fixing platform 120 can be driven by a driving device 124 (e.g., Figure 1B ), and use a drive device 124 to control the movement of the carrier fixing platform 120, including horizontal movement, vertical movement, rotation, and / or tilt, etc. The drive device may include, for example, a robot arm, a motor, a gear, a linear transmission module, or a combination thereof.

[0068] In some embodiments, the picker and placer 110 is arranged on the conveying platform 130, and the conveying platform 130 can be driven by a driver 132, and the driver 132 is used to control the movement of the carrier fixing platform 120, including horizontal movement, vertical movement, rotation, and / or tilting. The driver 132 may include, for example, a mechanical arm, a motor, a gear, a linear transmission module 133, or a combination thereof. The driver 132 is used to control the picker and placer 110 to move to a position below the carrier 10, so that the picker and placer 110 can join the die 20 to the bearing surface 11 of the carrier 10 from the position below the carrier 10. In addition, the picker and placer 110 can be moved to the carrier fixing platform 120 by the linear transmission module 133, and the driver 132 is used to control the rotation of the linear transmission module 133 relative to the rotation axis 131, so that the picker and placer 110 rotates upward or downward.

[0069] As in Figure 1A and Figure 1B As shown in , the driver 132 controls the picker and placer 110 to move to the top of the die rack 140, and the suction head 112 of the picker and placer 110 moves downward to pick up the die 20 and place the die 20 on the dicing tape 142. Next, the driver 132 controls the picker and placer 110 to rotate 180 degrees, so that the suction head 112 of the picker and placer 110 faces upward, and the die 20 is also set upward. Next, the driver 132 controls the picker and placer 110 to move to a position below the carrier fixing platform 120, the die 20 faces the carrier 10 located below the carrier fixing platform 120, and the bearing surface 11 of the carrier 10 is set downward. Then, the suction head 112 of the picker and placer 110 moves upward, so that the die 20 is bonded to the bearing surface 11 of the carrier 10.

[0070] In some embodiments, when the carrier fixing platform 120 and the carrier 10 are changed to face downward, the particles 12 originally attached to the carrier fixing platform 120 and the carrier 10 fall due to gravity. In addition, the particles 12 can also be removed via an external force (such as a jet or electrostatic force). In addition, a combination of metal-to-metal bonding and dielectric-to-dielectric bonding or fusion bonding is used to bond the die 20 to the carrier 10, and the bonding film 16 can generate a weak van der Waals force between the die 20 and the carrier 10, so that the die 20 does not fall from the carrier 10. In addition, the die 20 can be completely attached to the bonding film 16 without particles falling thereon, reducing the possibility of forming a gap due to incomplete bonding (non-bonding) between the die 20 and the carrier 10.

[0071] Reference Figure 2A and Figure 2B , Figure 2A and Figure 2B 1 is a schematic diagram of a die bonding system 102 and a die bonding method using the same according to an embodiment of the present disclosure. The die bonding system 102 includes a picker 110, a die rack 140, a carrier fixing platform 120, and a conveying platform 130. The picker 110 includes a suction head 112, the suction head 112 is used to pick up a die 20 and place the die 20 on a carrier 10, and the carrier fixing platform 120 is used to fix the carrier 10, and the carrier 10 has a bearing surface 11 arranged to face downward. The conveying platform 130 includes a driver 132, the picker 110 is arranged on the conveying platform 130, and the driver 132 controls the picker 110 to move to a position below the carrier 10, and the picker 110 bonds the die 20 to the bearing surface 11 of the carrier 10 from the position below the carrier 10.

[0072] In some embodiments, a plurality of dies 20 and a die rack 140 are arranged below a die rack fixing platform 144, the dies 20 are arranged on a dicing tape 142, the die rack 140 has a bearing surface 141, and the bearing surface 141 faces downward. The die rack fixing platform 144 may be a table / table, an electrostatic chuck (e-chuck), or other devices having the same concept. The die rack fixing platform 144 has a larger area than the die rack 140. In some embodiments, the die rack fixing platform 144 is arranged to have a plurality of die rack support pins that can move independently (independently of each other) and vertically (perpendicular to the surface of the die rack 140 supported thereon), but there may be no die rack support pins thereon. In other embodiments, an electrostatic chuck is arranged as a device that uses electricity to generate electrostatic forces (e.g., Coulomb force and Johansen-Rabech force) to maintain the position of the die rack 140.

[0073] In some embodiments, the die frame fixing platform 144 may use mechanical elements, vacuum adsorption elements, electrostatic adsorption elements, clamping elements, or other elements to hold the die frame 140. Figure 2B As shown in FIG. 1 , at least two fixing members 145, such as hooks or chucks, are provided on the die frame fixing platform 144. The two fixing members 145 hold the die frame 140 at a position below the die frame fixing platform 144. Alternatively, electrostatic force or vacuum suction (in Figure 2B The upward arrow shown in FIG. 1 indicates that the suction force F) adsorbs the die frame 140 under the die frame fixing platform 144. Therefore, it is not limited to use mechanical elements or clamping elements to hold the die frame 140. That is, the die frame fixing platform 144 can be a vacuum holding platform, an electrostatic holding platform, or a mechanical holding platform.

[0074] In some embodiments, the die frame fixing platform 144 can be driven by a driving device 146 (e.g., Figure 2A ), and use a drive device 146 to control the movement of the die frame fixing platform 144, including horizontal movement, vertical movement, rotation, and / or tilt, and the like. The drive device 146 may include, for example, a robot arm, a motor, a gear, a linear transmission module 133, or a combination thereof.

[0075] In some embodiments, the picker and placer 110 is arranged on a conveying platform 130, and the conveying platform 130 can be driven via a driver 132, and the driver 132 is used to control the movement of the conveying platform 130, including horizontal movement, vertical movement, rotation, and / or tilt, etc. The driver 132 is, for example, a mechanical arm, a motor, a gear, a linear transmission module 133, or a combination thereof. The driver 132 is used to control the picker and placer 110 to move to a position below the carrier 10, so that the picker and placer 110 joins the die 20 to the carrying surface 11 of the carrier 10 from the position below the carrier 10.

[0076] In some embodiments, the die rack 140 and the carrier 10 are arranged to face downward, so the driver 132 does not need to control the conveying platform 130 to rotate 180 degrees, but keeps the die 20 facing upward, and the conveying platform 130 moves horizontally between the die rack 140 and the carrier 10 .

[0077] As in Figure 2A and Figure 2BAs shown in , the driver 132 controls the picker and placer 110 to move to a position below the die rack 140, and the suction head 112 of the picker and placer 110 moves upward to pick up the die 20 and place the die 20 on the dicing tape 142. Therefore, although the die 20 is set downward, the die 20 adheres to the dicing tape 142 and does not fall. Next, the driver 132 controls the picker and placer 110 to translate, so that the suction head 112 of the picker and placer 110 moves to a position below the carrier fixing platform 120, and the die 20 faces the carrier 10 located below the carrier fixing platform 120, and the bearing surface 11 of the carrier 10 is arranged to face downward. Then, the suction head 112 of the picker and placer 110 moves upward, so that the die 20 is bonded to the bearing surface 11 of the carrier 10.

[0078] In some embodiments, when the die frame 140 and the carrier 10 face downward, the particles 12 originally attached to the die frame 140 and the carrier 10 will naturally fall due to gravity. The particles 12 can be easily removed by other external forces (such as jets or electrostatic forces). In addition, a combination of metal-to-metal bonding and dielectric-to-dielectric bonding or fusion bonding is used to bond the die 20 to the carrier 10, and the bonding film 16 can generate a weak van der Waals force between the die 20 and the carrier 10, so that the die 20 does not fall from the carrier 10. In addition, the die 20 can be completely attached to the bonding film 16 without particles falling thereon, thereby reducing the possibility of forming a gap due to incomplete bonding (non-bonding) between the die 20 and the carrier 10.

[0079] Reference Figure 3A and Figure 3B , Figure 3A and Figure 3B 1 is a schematic diagram of a die bonding system 103 and a die bonding method according to another embodiment of the present disclosure. The die bonding system 103 includes a picker and placer 110, a die rack 140, a carrier fixing platform 120, and a conveying platform 130. The picker and placer 110 includes a suction head 112, the suction head 112 is used to pick up a die 20 and place the die 20 on a carrier 10, and the carrier fixing platform 120 is used to fix the carrier 10, and the carrier 10 has a carrying surface 11 inclined at an angle θ relative to a horizontal plane H. The conveying platform 130 includes a driver 132, the picker and placer 110 is arranged on the conveying platform 130, the driver 132 controls the picker and placer 110 to tilt at an angle θ relative to the horizontal plane H, and the picker and placer 110 bonds the die 20 to the carrying surface 11 of the carrier 10 at the inclined angle θ. In one embodiment, the tilt angle θ is, for example, greater than 5 degrees and less than 90 degrees. In one embodiment, the tilt angle θ is, for example, between about 25 degrees and about 35 degrees, or greater than 35 degrees or less than 25 degrees.

[0080] In some embodiments, the die rack 140 is arranged to face upward, and the carrier 10 is tilted at an angle θ relative to the horizontal plane H and faces a predetermined direction (non-vertical direction). Therefore, the driver 132 does not need to control the conveying platform 130 to rotate 180 degrees, but rotates a small range of angles θ. For example, the driver 132 controls the conveying platform 130 to rotate about 25 degrees to about 35 degrees. After the conveying platform 130 rotates a predetermined angle θ, the conveying platform 130 can continue to move horizontally between the die rack 140 and the carrier 10.

[0081] In some embodiments, after one or more semiconductor processes are completed on the carrier fixing platform 120, some particles 12 will inevitably adhere to the surface of the carrier fixing platform 120. The particles 12 may come from particles 12 in the gas, contaminants generated during the process, particles 12 initially attached to the carrier, or other devices that generate particles 12. The particles 12 may contaminate the carrier 10 during the die bonding process, thereby generating a defective carrier 10 (e.g., wafer).

[0082] exist Figure 3B In order to remove particles 12 or particles 12 initially attached to the carrier 10 from the surface of the carrier fixing platform 120 before the die bonding process, the carrier fixing platform 120 and the carrier 10 are arranged from an upward setting to an inclined setting, so that the bearing surface 121 of the carrier fixing platform 120 and the bearing surface 11 of the carrier 10 are inclined relative to the horizontal plane H. When the carrier fixing platform 120 and the carrier 10 are arranged to be inclined, a gas flow C (e.g., a jet flow or a gas flow C) can be provided via the removal device 150 to pass through the carrier fixing platform 120, so that the particles 12 are taken away from the surface of the carrier 10 by the gas flow C. Therefore, when the carrier fixing platform 120 and the carrier 10 are arranged to be inclined, the bearing surface 11 of the carrier 10 can be kept clean without being contaminated by the particles 12 or other undesirable contaminants.

[0083] In some embodiments, the carrier fixing platform 120 may use mechanical elements, vacuum adsorption elements, electrostatic adsorption elements, clamping elements, or other elements to hold the carrier 10. Figure 3B As shown in FIG. 1 , at least two fixing parts 122, such as hooks or chucks, are provided on the carrying surface 11 of the carrier fixing platform 120, and the two fixing parts 122 hold the carrier 10 on the top of the carrier fixing platform 120. Alternatively, the carrier 10 can be attached to the carrier 10 via electrostatic force or vacuum suction (at Figure 3B The arrow of the back of the carrier 10 shown in FIG. faces downward to indicate that the suction force F) is adsorbed onto the carrier fixing platform 120. Therefore, there is no limitation on using mechanical elements or clamping elements to hold the carrier 10. That is, the carrier fixing platform 120 may be a vacuum holding platform, an electrostatic holding platform, or a mechanical holding platform.

[0084] In some embodiments, the carrier fixing platform 120 can be driven via a driving device 124, and the driving device 124 is used to control the movement of the carrier fixing platform 120, including horizontal movement, vertical movement, rotation, and / or tilt, etc. The driving device 124 may include, for example, a mechanical arm, a motor, a gear, a linear transmission module, or a combination thereof. Figure 3B As shown in , the carrier fixing platform 120 includes a rotation axis 123, and the driving device 124 can control the carrier fixing platform 120 to rotate relative to the rotation axis 123 to tilt a predetermined angle θ. The tilt angle θ is, for example, greater than 5 degrees and less than 90 degrees. In one embodiment, the tilt angle θ is, for example, between about 25 degrees and about 35 degrees.

[0085] In some embodiments, the picker 110 is arranged on a conveying platform 130, and the conveying platform 130 can be driven via a driver 132, and the driver 132 is used to control the movement of the conveying platform 130, including horizontal movement, vertical movement, rotation, and / or tilt, etc. The driver 132 may include, for example, a robot arm, a motor, a gear, a linear transmission module 133, or a combination thereof. The driver 132 is used to control the transfer of the picker 110 to the top of the carrier 10, so that the picker 110 joins the die 20 to the carrying surface 11 of the carrier 10 from the top of the carrier 10. As in Figure 3A As shown in , the conveying platform 130 includes a rotating shaft 131, and the driver 132 controls the conveying platform 130 to rotate relative to the rotating shaft 131 to tilt a predetermined angle θ. The tilt angle θ is, for example, greater than 5 degrees and less than 90 degrees. In one embodiment, the tilt angle θ is, for example, between about 25 degrees and about 35 degrees.

[0086] As in Figure 3A and Figure 3B As shown in , the driver 132 controls the picker 110 to move to a position on top of the die rack 140, and the suction head 112 of the picker 110 moves downward to pick up the die 20, and places the die 20 on the dicing tape 142. Next, the driver 132 controls the picker 110 to rotate at an angle θ, so that the picker 110 and the die 20 are tilted and translated. Next, the suction head 112 of the picker 110 moves to a position on top of the carrier fixing platform 120, and the tilted die 20 faces the carrier 10 located on top of the carrier fixing platform 120. Then, the suction head 112 of the picker 110 moves toward the carrier 10, so that the die 20 is bonded to the carrying surface 11 of the carrier 10.

[0087] In some embodiments, when the carrier 10 and the carrier fixing platform 120 are set to be inclined, the particles 12 originally attached to the die frame 140 and the carrier 10 can be removed via the removal device 150 (for example, a jet or air flow C provided by the removal device 150), so that the die 20 can be completely attached to the bonding film without any particles falling thereon, thereby reducing the possibility of forming a gap between the die 20 and the carrier 10 due to incomplete bonding (non-bonding).

[0088] Reference Figure 3C and Figure 3D , Figure 3C and Figure 3D FIG. 1 is a schematic diagram of a die bonding system 104 and a die bonding method using the system according to another embodiment of the present disclosure. The die bonding system 104 includes a picker and placer 110, a die rack 140, a carrier fixing platform 120, and a conveying platform 130. Figure 3C and Figure 3D The relevant description of the die bonding system 104 in is similar to the die bonding system 103, so it is not repeated here. In some embodiments, the picker and placer 110 is set on the conveying platform 130, and the conveying platform 130 includes, for example, a linear transmission module 133 (such as a slide rail), and the picker and placer 110 can be moved by the linear transmission module 133, so that the picker and placer 110 can maintain horizontal movement between the die rack 140 and the carrier 10. In addition, the suction head 112 of the picker and placer 110 includes a rotating shaft 115 and a driving device 116, and the driving device 116 is used to control the suction head 112 to rotate relative to the rotating shaft 115 to tilt at an angle θ, so that the suction head 112 and the die 20 are arranged to be tilted. The tilt angle θ is, for example, greater than 5 degrees and less than 90 degrees. In one embodiment, the tilt angle θ is, for example, between about 25 degrees and about 35 degrees.

[0089] As in Figure 3C and Figure 3D As shown in , when the picker and placer 110 moves to the top of the die rack 140, the suction head 112 of the picker and placer 110 moves downward to pick up the die 20. Then, the driver 132 controls the picker and placer 110 to move through the linear transmission module 133, so that the suction head 112 of the picker and placer 110 is transferred to the top of the carrier fixing platform 120. Next, the drive device 116 controls the suction head 112 to rotate relative to the rotation axis 115 to tilt at an angle θ, and arranges the suction head 112 and the die 20 to be tilted. Next, the suction head 112 of the picker and placer 110 moves toward the carrier 10, so that the die 20 is bonded to the carrying surface 11 of the carrier 10 at the tilted angle θ. After the bonding step of the die 20 is completed, the drive device 116 controls the suction head 112 to rotate in the opposite direction relative to the rotation axis 115 to be set downward (as in Figure 3C), thereby picking up another die 20, and repeating the above-mentioned bonding steps for this other die 20.

[0090] Reference Figure 4A and Figure 4B , Figure 4A and Figure 4B 1 is a schematic diagram of a die bonding system 105 and a die bonding method according to another embodiment of the present disclosure. The die bonding system 105 includes a picker 110, a die rack 140, a die rack fixing platform 144, a carrier fixing platform 120, and a conveying platform 130. The picker 110 includes a suction head 112 for picking up a die 20 and placing the die 20 on a carrier 10. The die rack 140 is disposed at the bottom of the die rack fixing platform 144, and the die rack 140 is disposed to be inclined. The carrier fixing platform 120 is used to fix the carrier 10, the carrier 10 has a bearing surface 11, and the bearing surface 11 is disposed to face downward. The conveying platform 130 includes a driver 132, which arranges the picker and placer 110 on the conveying platform 130. The driver 132 controls the picker and placer 110 to tilt at an angle θ relative to the horizontal plane H, and controls the picker and placer 110 to move to a position below the carrier 10, and the picker and placer 110 joins the wafer 20 to the carrying surface 11 of the carrier 10.

[0091] In some embodiments, the die rack 140 is arranged to be tilted, and the carrier 10 can be arranged to face downward or to be tilted. In some embodiments, the die rack fixing platform 144 can be driven via a driving device 146, and the driving device 146 is used to control the movement of the die rack fixing platform 144, including horizontal movement, vertical movement, rotation, and / or tilting, etc. The driving device 146 can include, for example, a mechanical arm, a motor, a gear, a linear transmission module, or a combination thereof.

[0092] In some embodiments, the die frame fixing platform 144 may utilize mechanical elements, vacuum adsorption elements, electrostatic adsorption elements, clamping elements, or other elements to hold the die frame 140. Figure 4A As shown in FIG. 1 , at least two fixing members 145, such as hooks or chucks, are provided on the die frame fixing platform 144. The two fixing members 145 hold the die frame 140 at the bottom of the die frame fixing platform 144. Alternatively, the die frame 140 can be attached or fixed to the bottom of the die frame fixing platform 144 (at Figure 4A The upward arrow shown in FIG. 1 represents the suction force F on the rear of the die frame 140. Therefore, it is not limited to use mechanical elements or clamping elements to hold the die frame 140. That is, the die frame fixing platform 144 may be a vacuum holding table, an electrostatic holding table, or a mechanical holding table.

[0093] As in Figure 4A As shown in , the driver 132 does not need to control the conveying platform 130 to rotate 180 degrees, but rotates a small range of angle θ, for example, the driver 132 controls the conveying platform 130 to rotate about 25 degrees to about 35 degrees. After the conveying platform 130 rotates a predetermined angle θ, the conveying platform 130 can continue to move horizontally between the die rack 140 and the carrier 10, or the conveying platform 130 can rotate in the opposite direction until the picker 110 and the die 20 face upward, and then the driver 132 drives the picker 110 to move horizontally between the die rack 140 and the carrier 10.

[0094] exist Figure 4B In order to remove the particles 12 and / or the particles 12 initially attached to the carrier 10 from the surface of the carrier fixing platform 120 before the die bonding process, the carrier fixing platform 120 and the carrier 10 are arranged downward instead of upward, so that the bearing surface 121 of the carrier fixing platform 120 and the bearing surface 11 of the carrier 10 are arranged downward. Next, the driver 132 controls the picker and placer 110 to move laterally, so that the suction head 112 of the picker and placer 110 moves to a position below the carrier fixing platform 120, and the die 20 faces the carrier 10 located at the bottom of the carrier fixing platform 120, and the bearing surface 11 of the carrier 10 is arranged downward. Then, the suction head 112 of the picker and placer 110 moves upward, so that the die 20 is bonded to the bearing surface 11 of the carrier 10.

[0095] The present disclosure relates to a die bonding system and a die bonding method using the system, wherein a picker and placer picks up a die and places the die on a carrier, and the carrier is arranged to face down or tilted at an angle relative to a horizontal plane, so as to avoid contaminants from falling on the carrier or the die and eliminate an unbonded interface between the carrier and the die.

[0096] According to some embodiments of the present disclosure, a die bonding system is provided, including a picker and placer, a carrier fixing platform, and a conveying platform. The picker and placer is used to pick up a die and place the die on a carrier. The carrier fixing platform is used to fix the carrier. The carrier has a downwardly facing bearing surface. The conveying platform is used to control the picker and placer to move to a position below the carrier, and the picker and placer bonds the die to the bearing surface.

[0097] In some embodiments, in the die bonding system, the carrier is held below the carrier holding platform via suction.

[0098] In some embodiments, in a die bonding system, a substrate includes a bonding film for bonding a die to a carrying surface.

[0099] In some embodiments, in the die bonding system, the transfer platform includes a rotation axis and a driver, and the driver is used to control the transfer platform to rotate upward or downward relative to the rotation axis.

[0100] In some embodiments, in the die bonding system, the transfer platform includes a linear transmission module, the picker and placer is moved to the carrier fixing platform by the linear transmission module, and the driver is used to control the rotation of the picker and placer relative to the rotation axis.

[0101] In some embodiments, in the die bonding system, the carrier fixing platform includes at least one fixing portion, and the at least one fixing portion holds the carrier on the bottom of the carrier fixing platform.

[0102] In some embodiments, the die bonding system further includes a die frame and a die frame fixing platform, the die frame is arranged below the die frame fixing platform, and the die is arranged on the die frame and faces downward.

[0103] In some embodiments, in the die bonding system, the die frame fixing platform is driven by a driving device, and the driving device is used to control the die frame fixing platform to tilt at an angle relative to a horizontal plane.

[0104] In some embodiments, in the die bonding system, the die frame fixing platform includes a vacuum holding table, an electrostatic holding table, or a mechanical holding table.

[0105] According to some embodiments of the present disclosure, a die bonding system is provided, including a picker and placer, a carrier fixing platform, and a conveying platform. The picker and placer is used to pick up a die and place the die on a carrier. The carrier fixing platform is used to fix the carrier. The carrier has a bearing surface inclined at an angle relative to a horizontal plane. The conveying platform is used to control the picker and placer to bond the die to the bearing surface.

[0106] In some embodiments, in the die bonding system, the carrier fixing platform is driven via a driving device, the carrier fixing platform includes a rotation axis, and the driving device is used to control the rotation of the carrier fixing platform relative to the rotation axis to tilt the angle.

[0107] In some embodiments, in the die bonding system, the picker is driven by a driver, the driver controls the picker to rotate at this angle so that the picker and the die are tilted, and the driver controls the picker to move to the top of the carrier fixing platform.

[0108] In some embodiments, in a die bonding system, a picker and placer includes a suction head, a driving device, and a rotation axis, and the driving device is used to control the rotation of the suction head relative to the rotation axis to tilt the angle.

[0109] In some embodiments, the die bonding system further comprises a removal device for providing a gas flow through the carrier fixing platform to remove the plurality of particles on the carrier.

[0110] According to some embodiments of the present disclosure, a die bonding method is provided, comprising the following steps: picking up a die by a picker and placer, and bonding the die to a bearing surface of a substrate by the picker and placer; fixing the substrate on a platform, and the bearing surface faces downward or is inclined at an angle relative to a horizontal plane.

[0111] In some embodiments, in the die-to-die bonding method, a picker and placer picks up the die and rotates it upward to bond the die to a carrying surface.

[0112] In some embodiments, in the die-to-die bonding method, the die is disposed under the die rack, and a picker and placer picks up the die and moves to a position under the carrier fixing platform to bond the die to the carrying surface.

[0113] In some embodiments, in the die-to-die bonding method, a picker and placer picks up the die and tilts it at this angle to bond the die to the carrying surface.

[0114] In some embodiments, the die-to-die bonding method further includes providing a removal device for providing a gas flow through the carrier fixing platform to remove a plurality of particles on the carrier.

[0115] In some embodiments, in the die-to-die bonding method, the die and the carrier are bonded to each other via a combination of metal-to-metal bonding, and dielectric-to-dielectric bonding, or fusion bonding.

[0116] Some embodiments of the present disclosure provide a die bonding system, comprising: a picker, a carrier fixing platform, a conveying platform, a die rack, and a die rack fixing platform. The picker is used to pick up a die and place the die on the carrier. The carrier fixing platform is used to fix the carrier, and the carrier's bearing surface faces downward. The conveying platform is used to control the picker to move to a position below the carrier, and the picker bonds the die to the bearing surface. The die is arranged on the die rack and faces downward. The die rack is arranged below the die rack fixing platform.

[0117] The above summarizes the features of several embodiments so that those skilled in the art can better understand the various aspects of the present disclosure. Those skilled in the art will appreciate that they may easily use the present disclosure as a basis for the design or modification of other processes and structures to achieve the same purpose as the embodiments introduced herein, and / or to achieve the same advantages. Those skilled in the art will also appreciate that such equal constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and modifications without departing from the spirit and scope of the present disclosure.

Claims

1. A die bonding system, characterized in that: Include: a picker and placer for picking up a die and placing the die on a carrier; a carrier fixing platform for fixing the carrier, with a carrying surface of the carrier facing downward; and A conveying platform is used for controlling the picker and placer to move to a position below the carrier, and the picker and placer joins the die to the carrying surface.

2. The die bonding system according to claim 1, wherein: The carrier is held below the carrier fixing platform via a suction force.

3. The die bonding system according to claim 1, wherein: The carrier includes a bonding film for bonding the die to the carrying surface.

4. The die bonding system according to claim 1, wherein: The conveying platform includes a rotating shaft and a driver, and the driver is used to control the conveying platform to rotate upward or downward relative to the rotating shaft.

5. The die bonding system according to claim 1, wherein: The carrier fixing platform includes at least one fixing portion, and the at least one fixing portion holds the carrier at a bottom of the carrier fixing platform.

6. A die bonding system, characterized in that: Include: a picker and placer for picking up a die and placing the die on a carrier; a carrier fixing platform for fixing the carrier, wherein the carrier has a carrying surface inclined at an angle relative to a horizontal plane; and A conveying platform is used to control the picker and placer to bond the die to the carrying surface of the carrier.

7. The die bonding system according to claim 6, wherein: The carrier fixing platform is driven by a driving device, the carrier fixing platform comprises a rotating shaft, and the driving device is used to control a rotation of the carrier fixing platform relative to the rotating shaft to tilt the angle.

8. The die bonding system of claim 6, wherein: The picker and placer is driven by a driver, and the driver controls the picker and placer to rotate at the angle so that the picker and placer are tilted with the die, and the driver controls the picker and placer to move to a top of the carrier fixing platform.

9. The die bonding system according to claim 6, wherein: The pick-and-place device comprises a suction head, a driving device, and a rotating shaft. The driving device is used for controlling the suction head to rotate relative to the rotating shaft to tilt the angle.

10. A die bonding system, characterized in that: Include: a picker and placer for picking up a die and placing the die on a carrier; a carrier fixing platform, used to fix the carrier, with a bearing surface of the carrier facing downward; a conveying platform for controlling the picker and placer to move to a position below the carrier, and the picker and placer to bond the die to the carrying surface; a die frame, wherein the die is arranged on the die frame and faces downward; and A die frame fixing platform, wherein the die frame is arranged below the die frame fixing platform.

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