Head binding device of chip mounter

Abstract

The utility model relates to the technical field of semiconductors, in particular to a chip mounter binding device, which is used for picking and mounting chips and comprises a working module, a sealing module and a ventilation module. The working module comprises a main shaft and a supporting frame, a first gas circuit is arranged in the main shaft, a containing cavity for installing the sealing module is formed in the supporting frame, and the main shaft is connected with one end of the sealing module; a second gas path is formed in the sealing module, and the sealing module comprises a shaft ring provided with a shaft hole; the ventilation module sequentially passes through the shaft hole, the second gas circuit and the first gas circuit and then communicates with the outside. The chip mounter binding head device solves the technical problems that a conventional chip mounter binding head device is insufficient in vacuum sealing performance, cannot ensure that a vacuum pressure value is within a deviation range when a chip is mounted, and is difficult to meet the requirement of high precision of chip mounting.

Description

[Technical field]

[0001] The utility model relates to the technical field of semiconductors, in particular to a head binding device for a chip mounter. [Background technology]

[0002] The head binding device of the chip mounter is an indispensable equipment in the integrated circuit packaging process. It is mainly used for picking and mounting chips during the automatic chip mounting process in the semiconductor industry. The chip is picked up by using the suction nozzle of the head binding device to remove the chip from the wafer, and the chip is mounted on the lead frame.

[0003] However, the existing head binding device of the chip mounter has insufficient vacuum sealing performance and cannot ensure that the vacuum pressure value range is within the deviation range during chip mounting, which makes it difficult to meet the high-precision requirements of chip mounting.

[0004] In view of this, the utility model provides a head binding device for a chip mounting machine with good vacuum sealing and high chip mounting accuracy to solve the above technical problems. [Contents of the utility model]

[0005] In order to solve the technical problems that the vacuum sealing of the existing head binding device of the chip mounting machine is insufficient, the vacuum pressure value during chip mounting cannot be guaranteed to be within the deviation range, and the high-precision requirements of chip mounting are difficult to meet, the utility model provides a head binding device for the chip mounting machine.

[0006] The technical solution of the utility model to solve the technical problem is to provide a head binding device for a chip mounter, which is used for picking up and mounting chips, and includes a working module, a sealing module and a ventilation module;

[0007] The working module comprises a main shaft and a support frame, a first gas path is provided inside the main shaft, a receiving cavity for installing the sealing module is provided inside the support frame, and the main shaft is connected to one end of the sealing module;

[0008] A second gas path is opened in the sealing module, wherein the sealing module comprises a shaft ring with a shaft hole;

[0009] The ventilation module is connected to the outside through the axial hole, the second air path and the first air path in sequence.

[0010] Preferably, an annular channel is formed between the outer circumferential surface of the collar and the inner wall of the accommodating cavity, and the ventilation module is connected to the shaft hole through the annular channel.

[0011] Preferably, the sealing module also includes a bearing assembly, the main shaft is connected to the inner ring of the bearing assembly; the bearing assembly includes a first bearing group and a second bearing group, the shaft ring is located between the first bearing group and the second bearing group, and the first bearing group and / or the second bearing group include at least two connected bearings.

[0012] Preferably, the annular channel is defined between the outer circumferential surface of the collar, the inner wall of the accommodating cavity, the first bearing group, and the second bearing group.

[0013] Preferably, a seal is provided between adjacent bearings.

[0014] Preferably, a seal is provided between the bearing adjacent the collar and the collar.

[0015] Preferably, the sealing element is a nano-sealing ring.

[0016] Preferably, the working module further comprises a motor, a working end of the motor is connected to one end of the bearing assembly, and when the motor is working, the motor drives the main shaft to rotate through the bearing assembly.

[0017] Preferably, the working module also includes a suction nozzle connected to the working end of the main shaft, and the interior of the suction nozzle is connected to the first air path; the gas of the head binding device of the placement machine passes through the interior of the suction nozzle, and after flowing through the first air path, the second air path and the annular channel, it is connected to the ventilation module.

[0018] Preferably, the ventilation module comprises an air pipe body and a connector, and a third air path is opened in the ventilation module; one end of the connector is connected to the second air path through the third air path, and the other end of the connector is connected to the air pipe body.

[0019] Compared with the prior art, the head binding device for a chip mounter provided by the utility model has the following advantages:

[0020] 1. The first embodiment of the utility model provides a head binding device for a chip placement machine, which is used for picking up and placing chips. The head binding device for the chip placement machine includes a working module, a sealing module and a ventilation module; the working module includes a main shaft and a support frame, a first air path is provided inside the main shaft, a containing cavity for installing the sealing module is provided inside the support frame, and the main shaft is connected to one end of the sealing module; a second air path is opened in the sealing module, and the sealing module includes a shaft ring with an axial hole; the ventilation module is connected to the outside world through the axial hole, the second air path and the first air path in sequence.

[0021] It can be understood that the chip mounting machine head binding device provided in the first embodiment of the utility model can be used for picking up and mounting chips during the automatic mounting process in the semiconductor industry. A sealing module whose one end is connected to the main shaft is arranged in the head binding device, and the first air path inside the main shaft is connected to the second air path in the sealing module, and the sealing module includes a shaft ring connected to the ventilation module, and the ventilation module is connected to the second air path through the shaft hole opened by the shaft ring.

[0022] It should be noted that the above design can ensure good vacuum sealing of the head binding device and high vacuum during chip picking and mounting, thereby ensuring that the position of the chip does not shift during the high-speed movement process of picking up the chip for mounting.

[0023] The utility model provides a shaft ring with an axial hole, and respectively provides a first air path and a second air path inside the main shaft and the sealing module, so that the requirements of chip manufacturing can be met during chip mounting, and the quality of the chip can be prevented from being affected by insufficient vacuum sealing. Through this design, the technical problems of insufficient vacuum sealing of the existing head binding device of the chip mounting machine, inability to ensure that the vacuum pressure value during chip mounting is within the deviation range, and difficulty in meeting the high-precision requirements of chip mounting are solved.

[0024] 2. In the first embodiment of the present invention, a head binding device for a chip mounter is provided, wherein an annular channel is formed between the outer peripheral surface of the shaft ring and the inner wall of the accommodating cavity, and the ventilation module is connected with the shaft hole through the annular channel.

[0025] It can be understood that the annular channel is connected to both the ventilation module and the axial hole opened on the shaft ring, and an annular channel is formed between the outer peripheral surface of the shaft ring and the inner wall of the accommodating cavity, which can ensure that the ventilation module is sealed and connected with the second air path opened in the sealing module through the annular channel, thereby improving the vacuum sealing of the head binding device.

[0026] 3. In the SMT head binding device provided by the first embodiment of the utility model, the sealing module also includes a bearing assembly, and the main shaft is connected to the inner ring of the bearing assembly; the bearing assembly includes a first bearing group and a second bearing group, the shaft ring is located between the first bearing group and the second bearing group, and the first bearing group and / or the second bearing group include at least two connected bearings.

[0027] It can be understood that by arranging the first bearing group and the second bearing group on the head binding device, and the first bearing group and / or the second bearing group are composed of at least two bearings connected together, through this design, it can be ensured that when the head binding device is pressed down to pick up and mount the chip, the working end of the spindle does not generate lateral force on the chip, and at the same time, the rigidity of the spindle is guaranteed, thereby meeting the high-precision requirements for the chip mounting position.

[0028] 4. In the first embodiment of the present invention, the head binding device for a chip mounter is provided, wherein the annular channel is set between the outer peripheral surface of the shaft ring, the inner wall of the accommodating cavity, the first bearing group, and the second bearing group.

[0029] It can be understood that the annular channel provided in the embodiment of the utility model is defined between the first bearing group and the second bearing group in the vertical direction. Under the condition that the annular channel is formed between the outer peripheral surface of the collar and the inner wall of the accommodating cavity, the top end face and the bottom end face of the collar are tightly connected to the end faces of the first bearing group and the second bearing group respectively, so as to further ensure the sealing of the head binding device.

[0030] 5. The first embodiment of the utility model provides a head binding device for a chip mounter, wherein a seal is provided between adjacent bearings; and a seal is provided between adjacent bearings of the shaft ring and the shaft ring.

[0031] It can be understood that the collar is located between the first bearing group and the second bearing group, that is, the top end face and the bottom end face of the collar are respectively connected to the bearings of the first bearing group and the second bearing group, and seals are provided between the top end face of the collar and the bearing of the first bearing group, and between the bottom end face of the collar and the bearing of the second bearing group.

[0032] It should be noted that the seal can reduce the friction between adjacent bearings and between the shaft ring and the bearing while ensuring the sealing of the head binding device, thereby extending the service life of the head binding device and improving its durability.

[0033] 6. The first embodiment of the present invention provides a head binding device for a chip mounter, wherein the sealing member is a nano-seal ring. It can be understood that the nano-seal ring can be arranged between adjacent bearings, or between adjacent bearings and the shaft ring of the shaft ring, to ensure the high sealing performance of the head binding device, and the nano-seal ring is wear-resistant and durable, which greatly improves the service life of the head binding device.

[0034] 7. The first embodiment of the utility model provides a head binding device for a chip mounter, wherein the working module further comprises a motor, wherein the working end of the motor is connected to one end of the bearing assembly, and when the motor is working, the motor drives the main shaft to rotate through the bearing assembly.

[0035] It can be understood that the working end of the motor is connected to one end of the bearing assembly, and the main shaft is connected to the inner ring of the bearing assembly. The motor drives the bearing assembly to rotate when working; the main shaft connected to the inner ring of the bearing assembly drives the main shaft to rotate synchronously while the bearing assembly rotates. Through this design, the friction force encountered by the main shaft is lower when it rotates.

[0036] It should be noted that the bearing assembly of the embodiment of the utility model also includes a coupling connected between the motor and the first bearing group. Through the transmission method of the coupling, the rotation of the motor is used to drive the bearing assembly and the main shaft to rotate synchronously, which can improve the sealing inside the head binding device.

[0037] 8. The first embodiment of the utility model provides a head binding device for a placement machine, and the working module also includes a suction nozzle connected to the working end of the main shaft, and the interior of the suction nozzle is connected to the first air path; the gas of the head binding device for the placement machine passes through the interior of the suction nozzle, and after flowing through the first air path, the second air path and the annular channel, it is connected to the ventilation module.

[0038] It can be understood that after the suction nozzle is connected to the working end of the main shaft and the interior of the suction nozzle is connected to the first air path, one end of the ventilation module is connected to the shaft hole through an annular channel, and the other end is sealed and connected to the equipment responsible for air extraction; the equipment responsible for air extraction is turned on to keep the ventilation module continuously evacuated to extract the gas in the ventilation module, the second channel, the first channel and the inside of the suction nozzle, so that there is an air pressure difference between the inside of the suction nozzle and the outside atmosphere, and finally the chip is stably attached to the working end of the suction nozzle, and then the chip is picked up and mounted, so as to ensure the rigidity of deep cavity mounting and meet the high-precision requirements of the chip mounting position.

[0039] 9. In the first embodiment of the utility model, the mounting machine head binding device provided, the ventilation module includes an air pipe body and a connector, and a third air path is opened in the ventilation module; one end of the connector is connected to the second air path through the third air path, and the other end of the connector is connected to the air pipe body.

[0040] It can be understood that one end of the connector is connected to the trachea body, and the other end is connected to the third air path. When the trachea body is connected to the second air path through the third air path, the trachea is sealed and connected to the device responsible for vacuuming. The device responsible for vacuuming is turned on to allow the vacuum to pass through the trachea body and the connector to reach the third air path. After passing through the third air path and the axial hole on the shaft ring, it reaches the second air path in the sealing module.

[0041] It should be noted that the purpose of providing the connector is to avoid a gap between the air pipe and the third air path that affects the vacuum sealing of the head binding device, thereby avoiding poor chip picking and mounting effects due to the introduction of vacuum.

Brief Description of the Drawings

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0043] Figure 1 It is a schematic diagram of the overall structure of the head binding device of the chip mounter in the first embodiment of the utility model.

[0044] Figure 2 It is a cross-sectional view of the internal structure of the head binding device of the chip placement machine according to the first embodiment of the utility model.

[0045] Figure 3 The utility model Figure 2 A partial enlarged view of part A.

[0046] Description of the accompanying drawings:

[0047] 10. Head binding device of chip mounter; 100. first gas path; 200. second gas path; 300. third gas path; 400. annular channel;

[0048] 1. working module; 11. spindle; 12. support frame; 121. accommodating chamber; 13. motor; 14. nozzle;

[0049] 2. Sealing module; 21. Shaft ring; 211. Shaft hole; 22. Bearing assembly; 221. First bearing group; 222. Second bearing group; 2211. Bearing; 223. Coupling; 23. Sealing element;

[0050] 3. Ventilation module; 31. Trachea body; 32. Connector. [Specific implementation method]

[0051] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0052] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0053] It should be noted that the terms "first" and "second" etc. in the specification and claims of the present utility model are used to distinguish different objects rather than to describe a specific order.

[0054] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0055] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0056] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0057] See also Figure 1 , Figure 2 and Figure 3 The first embodiment of the utility model provides a head binding device 10 for a chip placement machine, which is used for picking up and placing chips, and includes a working module 1, a sealing module 2 and a ventilation module 3; the working module 1 includes a main shaft 11 and a support frame 12, a first air path 100 is provided inside the main shaft 11, and a receiving cavity 121 for installing the sealing module 2 is provided inside the support frame 12, and the main shaft 11 is connected to one end of the sealing module 2; a second air path 200 is opened in the sealing module 2, and the sealing module 2 includes a shaft ring 21 with an axial hole 211; the ventilation module 3 is connected to the outside world through the axial hole 211, the second air path 200 and the first air path 100 in sequence.

[0058] The chip mounter head binding device 10 provided in the first embodiment of the utility model is mainly used for picking up and accurately mounting chips during the automatic mounting process in the semiconductor industry.

[0059] Specifically, the head binding device 10 of the SMT machine is provided with a sealing module 2, the main shaft 11 is connected to one end of the sealing module 2, the first air path 100 opened inside the main shaft 11 is connected to the second air path 200 opened in the sealing module 2, and the sealing module 2 includes a shaft ring 21 connected to the ventilation module 3, and the ventilation module 3 is connected to the second air path 200 through the shaft hole 211 opened by the shaft ring 21.

[0060] The above design can ensure good vacuum sealing of the head binding device 10 of the chip mounter and high vacuum during chip picking and mounting, thereby ensuring that the position of the chip does not shift during the high-speed movement process of picking up the chip for mounting.

[0061] It can be understood that the first embodiment of the utility model is to provide a shaft ring 21 with an axial hole 211, and respectively provide a first gas path 100 and a second gas path 200 inside the main shaft 11 and the sealing module 2, so as to meet the chip manufacturing requirements during chip mounting and avoid affecting the quality of the chip due to insufficient vacuum sealing of the head binding device.

[0062] It should be noted that the first air circuit 100 is arranged inside the main shaft 11, wherein the first air circuit 100 is arranged along the length direction of the main shaft 11 and passes through both ends of the main shaft 11, and one end of the sealing module 2 is sealed and connected to the main shaft 11 to seal the end of the main shaft 11, so that the second air circuit 200 opened in the sealing module 2 is connected to the first air circuit 100 inside the main shaft 11.

[0063] The utility model solves the technical problems that the vacuum sealing performance of the existing head binding device of the chip mounting machine is insufficient, the vacuum pressure value during chip mounting cannot be guaranteed to be within the deviation range, and the high-precision requirement of chip mounting is difficult to meet.

[0064] It should be further explained that the working end of the main shaft 11 is generally connected to the suction nozzle, and the working end of the main shaft 11 and the suction nozzle are internally connected. The suction nozzle seals the working end of the main shaft 11 so that the first air path 100 inside the main shaft 11 is connected to the inside of the suction nozzle.

[0065] In the head binding device 10 of the placement machine, the ventilation module 3 is connected with the interior of the suction nozzle after passing through the axial hole 211, the second air path 200 and the first air path 100 in sequence; one end of the ventilation module 3 is defined as the air inlet end and the other end is defined as the air outlet end. The air inlet end of the ventilation module 3 is connected with the exhaust device, and the air outlet end is connected with the axial hole 211 opened on the shaft ring 21.

[0066] The specific process of chip adsorption by the head binding device 10 of the placement machine is as follows: after the suction nozzle is attached to the chip, the exhaust device is turned on to keep exhausting the ventilation module 3, thereby exhausting the gas inside the ventilation module 3, the second air path 200, the first air path 100 and the inside of the suction nozzle, so that there is an air pressure difference between the inside of the suction nozzle and the outside atmosphere, and finally the chip is stably attached to the working end of the suction nozzle. At this time, the chip can be picked up and mounted by adsorption at the working end of the suction nozzle.

[0067] Under ideal conditions, the interior of the head binding device 10 of the SMT machine is in a completely vacuum state. However, in reality, a completely vacuum state is not easy to achieve, the cost is relatively high, and the requirements for the exhaust equipment are relatively high.

[0068] Optionally, the head binding device 10 of the placement machine also includes a device for replacing suction nozzles. For the main shaft 11 in the working module 1, its working end can be connected to suction nozzles of different sizes, and the suction nozzles can be replaced automatically or manually, which can be set according to actual conditions.

[0069] Please continue reading Figures 1 to 3 An annular channel 400 is formed between the outer circumferential surface of the collar 21 and the inner wall of the accommodating chamber 121 , and the ventilation module 3 is connected to the shaft hole 211 through the annular channel 400 .

[0070] Specifically, the annular channel 400 is communicated with both the ventilation module 3 and the axial hole 211 provided on the shaft collar 21 , that is, the annular channel 400 is formed between the outer peripheral surface of the shaft collar 21 and the inner wall of the accommodating chamber 121 .

[0071] It can be understood that the annular channel 400 formed between the outer surface of the collar 21 and the inner wall of the accommodating chamber 121 can ensure that the ventilation module 3 is sealed and connected with the second air path 200 opened in the sealing module 2 through the annular channel 400, thereby improving the vacuum sealing of the head binding device 10 of the placement machine.

[0072] Among them, the ventilation module 3 is connected with the axial hole 211 on the shaft ring 21 through the annular channel 400, and the annular channel 400 is connected with the second air path 200 through the axial hole 211, so that the ventilation module 3 is connected with the first air path 100 after passing through the annular channel 400, the shaft ring 21 and the axial hole 211 on the shaft ring 21, and the second air path 200 in sequence.

[0073] It should be noted that the working end of the main shaft 11 is generally connected to the suction nozzle, and the working end of the main shaft 11 and the suction nozzle are internally connected, that is, the first air path 100 is internally connected to the suction nozzle. The suction nozzle seals the working end of the main shaft 11 so that the first air path 100 inside the main shaft 11 is internally connected to the suction nozzle.

[0074] For further information, see Figure 1and Figure 2 The sealing module 2 also includes a bearing assembly 22 , and the main shaft 11 is connected to the inner ring of the bearing assembly 22 .

[0075] It can be understood that one end of the sealing module 2 seals the end of the main shaft 11 , and the second gas path 200 is connected to the first gas path 100 inside the main shaft 11 , which is specifically achieved by fixing the main shaft 11 on the inner ring of the bearing assembly 22 .

[0076] It should be noted that the end face of the main shaft 11 away from its working end is connected to the inner ring of the bearing assembly 22. At this time, the first air path 100 is set corresponding to the inner ring hole of the bearing assembly 22, so that the first air path 100 is connected to the second air path 200 opened in the sealing module 2.

[0077] It should be further explained that the bearing assembly 22 can reduce the friction generated during the chip mounting process and ensure the rotation accuracy of the spindle 11, ensuring that the head binding device 10 of the chip mounting machine rotates concentrically to meet the high-precision requirements of the chip mounting position.

[0078] Specifically, in the process of the SMT machine head binding device 10 sucking the chip for mounting, the bearing assembly 22 can support the rotation of the main shaft 11 to correct the angle of the chip, wherein the bearing assembly 22 includes a first bearing group 221 and a second bearing group 222, and the shaft ring 21 is located between the first bearing group 221 and the second bearing group 222, and the first bearing group 221 and / or the second bearing group 222 include at least two connected bearings 2211.

[0079] It should be noted that the collar 21 is located between the first bearing group 221 and the second bearing group 222 , that is, one end surface of the collar 21 is connected to the bearing 2211 of the first bearing group 221 , and the other end surface is connected to the bearing 2211 of the second bearing group 222 .

[0080] It can be understood that the first bearing group 221 and the second bearing group 222 both include bearings 2211. In the first bearing group 221 and the second bearing group 222, the number of bearings 2211 can be one, two or more. The specific number of bearings 2211 can be set according to actual conditions. For example, when the length of the main shaft 11 and the specific model of the bearing 2211 used change, the specific number of bearings 2211 will change accordingly.

[0081] As a specific implementation of the first embodiment of the utility model, the first bearing group 221 and the second bearing group 222 are both composed of two bearings 2211 connected together. The bearings 2211 arranged in the first bearing group 221 and the second bearing group 222 can ensure that when the head binding device 10 of the placement machine is pressed down to realize the picking and mounting of the chip, no lateral force is generated on the chip, thereby meeting the high-precision requirements of the chip mounting position.

[0082] It should be further explained that, for the SMT head binding device 10 provided in the first embodiment of the present invention, the first bearing group 221 and the second bearing group 222 of the bearing assembly 22 are both composed of two bearings 2211 connected together. This design can provide good stability when mounting chips, but the specific implementation method of this embodiment cannot be used to limit the present invention. For example, the number of bearings 2211 included in the first bearing group 221 and the second bearing group 222 can be different, and the provision of multiple bearings 2211 can improve the working performance of the SMT head binding device 10 and reduce the friction inside the device. Therefore, any modifications, equivalent replacements and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

[0083] In the first embodiment of the utility model, a first bearing group 221 and a second bearing group 222 are arranged on the head binding device 10 of the placement machine, and the first bearing group 221 and / or the second bearing group 222 are composed of at least two bearings 2211 connected together. Through this design, it can be ensured that when the head binding device 10 of the placement machine is pressed down to pick up and mount the chip, the working end of the main shaft 11 does not generate lateral force on the chip, thereby ensuring the rigidity of the main shaft 11.

[0084] Please continue reading Figures 1 to 3 The annular channel 400 is set between the outer circumferential surface of the collar 21 , the inner wall of the accommodating cavity 121 , the first bearing group 221 and the second bearing group 222 .

[0085] It can be understood that the annular channel 400 is responsible for the communication between the sealing module 2 and the ventilation module 3. The annular channel 400 is formed by the outer peripheral surface of the shaft ring 21 and the inner wall of the opposite accommodating cavity 121 in the horizontal direction of the SMT head binding device 10, and is defined between the first bearing group 221 and the second bearing group 222 in the vertical direction.

[0086] Among them, under the condition that the annular channel 400 is formed between the outer peripheral surface of the collar 21 and the inner wall of the accommodating cavity 121, the top end face of the collar 21 is tightly connected to the bottom end face of the first bearing group 221, and the bottom end face of the collar 21 is tightly connected to the top end face of the second bearing group 222, which can further ensure the sealing of the head binding device 10 of the placement machine.

[0087] It should be noted that the annular channel 400 formed by the outer peripheral surface of the collar 21, the inner wall of the accommodating cavity 121, the first bearing group 221 and the second bearing group 222 can ensure that the ventilation module 3 is sealed and connected with the second air path 200 opened in the sealing module 2 after passing through the annular channel 400.

[0088] See also Figure 2 and Figure 3 As an optional implementation, a seal 23 is provided between adjacent bearings 2211 .

[0089] It can be understood that since the collar 21 is located between the first bearing group 221 and the second bearing group 222, the bearing 2211 in the first bearing group 221 is separated from the bearing 2211 in the second bearing group 222 close to the first bearing group 221. Therefore, adjacent bearings 2211 can only exist alone in the first bearing group 221 or the second bearing group 222.

[0090] For the bearing 2211 of the first embodiment of the utility model, the end surface of the bearing 2211 is connected to the sealing member 23 . Specifically, the sealing member 23 is placed on the end surface between the inner ring and the outer ring of the bearing 2211 .

[0091] It should be noted that, as a preferred implementation scheme in the first embodiment of the utility model, seals 23 are provided between adjacent bearings 2211 in the first bearing group 221 and between adjacent bearings 2211 in the second bearing group 222. The seals 23 can ensure good sealing of the SMT head binding device 10, reduce friction between adjacent bearings 2211, and extend the service life of the SMT head binding device 10.

[0092] As another optional implementation, a seal 23 is provided between the shaft collar 21 and the bearing 2211 adjacent to the shaft collar 21 .

[0093] It can be understood that the collar 21 is located between the first bearing group 221 and the second bearing group 222 , one end surface of the collar 21 is connected to the bearing 2211 of the first bearing group 221 , and the other end surface is connected to the bearing 2211 of the second bearing group 222 .

[0094] Specifically, in the first embodiment of the present utility model, the top end surface of the shaft ring 21 is connected to the bearing 2211 at the bottom of the first bearing group 221 , and the bottom end surface is connected to the bearing 2211 at the top of the second bearing group 222 .

[0095] It should be noted that, as a preferred implementation scheme in the first embodiment of the utility model, a seal 23 is provided between the top end face of the collar 21 and the bearing 2211 of the first bearing group 221, and between the bottom end face of the collar 21 and the bearing 2211 of the second bearing group 222. The seal 23 can reduce the friction between adjacent collars 21 and the bearing 2211 while ensuring good sealing of the SMT head binding device 10, thereby extending the service life of the SMT head binding device 10 and improving durability.

[0096] Please continue reading Figures 1 to 3 , the sealing member 23 is a nano-sealing ring.

[0097] It can be understood that the nano-seal is an important sealing element, whose main functions include preventing leakage or seepage of fluid (liquid or gas), maintaining a pressure difference between the inside of the device and the outside (even a complete vacuum state), and preventing the entry of pollutants and dust.

[0098] It should be noted that the seal 23 in the present invention can be arranged between adjacent bearings 2211, or between adjacent bearings 2211 and the shaft ring 21. The good sealing effect of the seal 23 can prevent the second air path 200 opened in the sealing module 2 from being directly connected to the outside atmosphere, thereby ensuring the high sealing performance inside the SMT head binding device 10, and the wear resistance and durability, thereby improving the service life of the SMT head binding device 10.

[0099] Furthermore, the seal 23 can also protect the sealing surface in contact with it from being damaged; optionally, in addition to being arranged between adjacent bearings 2211 and adjacent bearings 2211 and the shaft ring 21, the seal 23 can also be arranged between the bearing 2211 of the second bearing group 222 and the main shaft 11, wherein the seal 23 can be arranged in the portion connecting the above two.

[0100] In particular, the seal 23 as a nano-sealing ring cannot be connected to the inner ring and outer ring of the bearing 2211. The sealing effect of the seal 23 can ensure the high sealing performance inside the head binding device 10 of the placement machine. It is set on the inner and outer rings of the bearing 2211, which will affect the normal rotation of the bearing 2211.

[0101] For the preferred implementation scheme provided in the first embodiment of the utility model, the seal 23 is located between adjacent bearings 2211 and between adjacent bearings 2211 and the shaft ring 21; it can be understood that the number and position of the seals 23 can be set according to actual needs, that is to say, the specific implementation method of this embodiment cannot be used to limit the utility model, and any modifications, equivalent replacements and improvements made within the principles of the utility model should be included in the protection scope of the utility model.

[0102] Please continue reading Figure 1 and Figure 2 The working module 1 also includes a motor 13 , a working end of the motor 13 is connected to one end of a bearing assembly 22 , and when the motor 13 is working, the motor 13 drives the main shaft 11 to rotate through the bearing assembly 22 .

[0103] It can be understood that the working end of the motor 13 is connected to one end of the bearing assembly 22. When the motor 13 is working, it drives the bearing assembly 22 to rotate, thereby driving the main shaft 11 to rotate together.

[0104] It should be noted that the main shaft 11 is connected to the inner ring of the bearing assembly 22. When the motor 13 drives the bearing assembly 22 to rotate, it drives the main shaft 11 to rotate synchronously. Through this design, the friction force encountered by the main shaft 11 when rotating can be lowered, thereby extending the service life of the head binding device 10 of the placement machine.

[0105] It should be further explained that, in the first embodiment of the utility model, the bearing assembly 22 also includes a coupling 223 connected between the motor 13 and the first bearing group 221, and the two ends of the coupling 223 are axially connected to the motor 13 and the first bearing group 221 of the bearing assembly 22 respectively. Through the transmission mode of the coupling 223, the rotation of the motor 13 is used to drive the bearing assembly 22 and the main shaft 11 to rotate, and the motor 13, the bearing assembly 22 and the main shaft 11 can be rotated synchronously under the coaxial condition. Through this design, the sealing inside the head binding device 10 of the placement machine can be improved.

[0106] For further information, please refer to Figures 1 to 3 The working module 1 also includes a suction nozzle 14 connected to the working end of the main shaft 11, and the interior of the suction nozzle 14 is connected to the first air path 100; the gas of the head binding device 10 of the placement machine passes through the interior of the suction nozzle 14, and after flowing through the first air path 100, the second air path 200 and the annular channel 400, it is connected to the ventilation module 3.

[0107] It can be understood that the suction nozzle 14 in the head binding device 10 of the placement machine is connected to the working end of the main shaft 11, and the working end of the main shaft 11 is connected to the inside of the suction nozzle 14, that is, the first air path 100 is connected to the inside of the suction nozzle 14, and the working end of the main shaft 11 is sealed by the suction nozzle 14, so that the first air path 100 inside the main shaft 11 is connected to the inside of the suction nozzle 14.

[0108] In the head binding device 10 of the chip mounter, one end of the ventilation module 3 is communicated with the shaft hole 211 through the annular channel 400 , so as to realize the sealed connection between the ventilation module 3 and the sealing module 2 .

[0109] After passing through the axial hole 211, the second air path 200 and the first air path 100 in sequence, the ventilation module 3 is connected with the interior of the suction nozzle 14. The specific process of adsorbing the chip is as follows: the air inlet end of the ventilation module 3 is connected with the exhaust device, and the air outlet end thereof is connected with the sealing module 2. After the suction nozzle 14 is attached to the chip, the exhaust device is turned on to keep exhausting the ventilation module 3, and the gas inside the ventilation module 3, the sealing module 2, the main shaft 11 and the suction nozzle 14 is extracted, so that there is an air pressure difference between the inside of the suction nozzle 14 and the outside atmosphere, and finally the chip is stably attached to the working end of the suction nozzle 14. At this time, the chip can be picked up and mounted by adsorption at the working end of the suction nozzle 14.

[0110] Under ideal conditions, the interior of the head binding device 10 of the SMT machine is in a completely vacuum state. However, in reality, a completely vacuum state is not easy to achieve, the cost is relatively high, and the requirements for the exhaust equipment are relatively high.

[0111] Optionally, the head binding device 10 of the placement machine also includes a device for replacing a suction nozzle. For the main shaft 11 in the working module 1, its working end can be connected to suction nozzles 14 of different sizes, and the suction nozzle 14 can be replaced automatically or manually, which can be set specifically according to actual conditions.

[0112] See also Figure 2 The ventilation module 3 includes a trachea body 31 and a connector 32 , and a third air path 300 is opened in the ventilation module 3 ; one end of the connector 32 is connected to the second air path 200 through the third air path 300 , and the other end of the connector 32 is connected to the trachea body 31 .

[0113] It can be understood that, in the ventilation module 3, the trachea body 31 is connected to the third air path 300 through the connector 32, that is, the trachea body 31 is connected to the second air path 200 after passing through the connector 32 and the third air path 300 in sequence.

[0114] Specifically, the air pipe body 31 passes through the third air path 300 in the ventilation module 3, the second air path 200 in the sealing module 2, the first air path 100 in the main shaft 11 and the inside of the suction nozzle 14 in sequence, and finally communicates with the outside through the inside of the suction nozzle 14.

[0115] It should be noted that, as a preferred implementation scheme of the first embodiment of the utility model, the air outlet end of the trachea body 31 is connected to the third air path 300 through the connecting head 32, and the air inlet end of the trachea body 31 is connected to the air extraction device, thereby realizing a sealed connection among the air extraction device, the trachea body 31 and the third air path 300.

[0116] Furthermore, when the suction nozzle 14 is connected to the working end of the main shaft 11 and the two are internally connected, the vacuum device is turned on to enable the vacuum device to maintain continuous vacuuming of the trachea body 31, and the gas in the trachea body 31, the third air path 300, the second air path 200, the first air path 100 and the suction nozzle 14 is extracted, so that there is an air pressure difference between the inside of the suction nozzle 14 and the outside atmosphere, and finally the chip is stably attached to the working end of the suction nozzle 14, thereby realizing the picking and mounting of the chip. Through this design, the rigidity of the head binding device 10 of the placement machine for deep cavity mounting of the chip can be guaranteed, and the high-precision requirements of the chip mounting position can be met.

[0117] As a preferred solution of the first embodiment of the utility model, the purpose of setting the connecting head 32 is to avoid insufficient sealing between the trachea body 31 and the third air path 300. If there is a gap between the trachea body 31 and the third air path 300, it will affect the vacuum sealing of the head binding device 10 of the placement machine, resulting in poor chip picking and placement effects.

[0118] Compared with the prior art, the head binding device for a chip mounter provided by the utility model has the following advantages:

[0119] 1. The first embodiment of the utility model provides a head binding device for a chip placement machine, which is used for picking up and placing chips. The head binding device for the chip placement machine includes a working module, a sealing module and a ventilation module; the working module includes a main shaft and a support frame, a first air path is provided inside the main shaft, a containing cavity for installing the sealing module is provided inside the support frame, and the main shaft is connected to one end of the sealing module; a second air path is opened in the sealing module, and the sealing module includes a shaft ring with an axial hole; the ventilation module is connected to the outside world through the axial hole, the second air path and the first air path in sequence.

[0120] It can be understood that the chip mounting machine head binding device provided in the first embodiment of the utility model can be used for picking up and mounting chips during the automatic mounting process in the semiconductor industry. A sealing module whose one end is connected to the main shaft is arranged in the head binding device, and the first air path inside the main shaft is connected to the second air path in the sealing module, and the sealing module includes a shaft ring connected to the ventilation module, and the ventilation module is connected to the second air path through the shaft hole opened by the shaft ring.

[0121] It should be noted that the above design can ensure good vacuum sealing of the head binding device and high vacuum during chip picking and mounting, thereby ensuring that the position of the chip does not shift during the high-speed movement process of picking up the chip for mounting.

[0122] The utility model provides a shaft ring with an axial hole, and respectively provides a first air path and a second air path inside the main shaft and the sealing module, so that the requirements of chip manufacturing can be met during chip mounting, and the quality of the chip can be prevented from being affected by insufficient vacuum sealing. Through this design, the technical problems of insufficient vacuum sealing of the existing head binding device of the chip mounting machine, inability to ensure that the vacuum pressure value during chip mounting is within the deviation range, and difficulty in meeting the high-precision requirements of chip mounting are solved.

[0123] 2. In the first embodiment of the present invention, a head binding device for a chip mounter is provided, wherein an annular channel is formed between the outer peripheral surface of the shaft ring and the inner wall of the accommodating cavity, and the ventilation module is connected with the shaft hole through the annular channel.

[0124] It can be understood that the annular channel is connected to both the ventilation module and the axial hole opened on the shaft ring, and an annular channel is formed between the outer peripheral surface of the shaft ring and the inner wall of the accommodating cavity, which can ensure that the ventilation module is sealed and connected with the second air path opened in the sealing module through the annular channel, thereby improving the vacuum sealing of the head binding device.

[0125] 3. In the SMT head binding device provided by the first embodiment of the utility model, the sealing module also includes a bearing assembly, and the main shaft is connected to the inner ring of the bearing assembly; the bearing assembly includes a first bearing group and a second bearing group, the shaft ring is located between the first bearing group and the second bearing group, and the first bearing group and / or the second bearing group include at least two connected bearings.

[0126] It can be understood that by arranging the first bearing group and the second bearing group on the head binding device, and the first bearing group and / or the second bearing group are composed of at least two bearings connected together, through this design, it can be ensured that when the head binding device is pressed down to pick up and mount the chip, the working end of the spindle does not generate lateral force on the chip, and at the same time, the rigidity of the spindle is guaranteed, thereby meeting the high-precision requirements for the chip mounting position.

[0127] 4. In the first embodiment of the present invention, the head binding device for a chip mounter is provided, wherein the annular channel is set between the outer peripheral surface of the shaft ring, the inner wall of the accommodating cavity, the first bearing group, and the second bearing group.

[0128] It can be understood that the annular channel provided in the embodiment of the utility model is defined between the first bearing group and the second bearing group in the vertical direction. Under the condition that the annular channel is formed between the outer peripheral surface of the collar and the inner wall of the accommodating cavity, the top end face and the bottom end face of the collar are tightly connected to the end faces of the first bearing group and the second bearing group respectively, so as to further ensure the sealing of the head binding device.

[0129] 5. The first embodiment of the utility model provides a head binding device for a chip mounter, wherein a seal is provided between adjacent bearings; and a seal is provided between adjacent bearings of the shaft ring and the shaft ring.

[0130] It can be understood that the collar is located between the first bearing group and the second bearing group, that is, the top end face and the bottom end face of the collar are respectively connected to the bearings of the first bearing group and the second bearing group, and seals are provided between the top end face of the collar and the bearing of the first bearing group, and between the bottom end face of the collar and the bearing of the second bearing group.

[0131] It should be noted that the seal can reduce the friction between adjacent bearings and between the shaft ring and the bearing while ensuring the sealing of the head binding device, thereby extending the service life of the head binding device and improving its durability.

[0132] 6. The first embodiment of the present invention provides a head binding device for a chip mounter, wherein the sealing member is a nano-seal ring. It can be understood that the nano-seal ring can be arranged between adjacent bearings, or between adjacent bearings and the shaft ring of the shaft ring, to ensure the high sealing performance of the head binding device, and the nano-seal ring is wear-resistant and durable, which greatly improves the service life of the head binding device.

[0133] 7. The first embodiment of the utility model provides a head binding device for a chip mounter, wherein the working module further comprises a motor, wherein the working end of the motor is connected to one end of the bearing assembly, and when the motor is working, the motor drives the main shaft to rotate through the bearing assembly.

[0134] It can be understood that the working end of the motor is connected to one end of the bearing assembly, and the main shaft is connected to the inner ring of the bearing assembly. The motor drives the bearing assembly to rotate when working; the main shaft connected to the inner ring of the bearing assembly drives the main shaft to rotate synchronously while the bearing assembly rotates. Through this design, the friction force encountered by the main shaft is lower when it rotates.

[0135] It should be noted that the bearing assembly of the embodiment of the utility model also includes a coupling connected between the motor and the first bearing group. Through the transmission method of the coupling, the rotation of the motor is used to drive the bearing assembly and the main shaft to rotate synchronously, which can improve the sealing inside the head binding device.

[0136] 8. The first embodiment of the utility model provides a head binding device for a placement machine, and the working module also includes a suction nozzle connected to the working end of the main shaft, and the interior of the suction nozzle is connected to the first air path; the gas of the head binding device for the placement machine passes through the interior of the suction nozzle, and after flowing through the first air path, the second air path and the annular channel, it is connected to the ventilation module.

[0137] It can be understood that after the suction nozzle is connected to the working end of the main shaft and the interior of the suction nozzle is connected to the first air path, one end of the ventilation module is connected to the shaft hole through an annular channel, and the other end is sealed and connected to the equipment responsible for air extraction; the equipment responsible for air extraction is turned on to keep the ventilation module continuously evacuated to extract the gas in the ventilation module, the second channel, the first channel and the inside of the suction nozzle, so that there is an air pressure difference between the inside of the suction nozzle and the outside atmosphere, and finally the chip is stably attached to the working end of the suction nozzle, and then the chip is picked up and mounted, so as to ensure the rigidity of deep cavity mounting and meet the high-precision requirements of the chip mounting position.

[0138] 9. In the first embodiment of the utility model, the mounting machine head binding device provided, the ventilation module includes an air pipe body and a connector, and a third air path is opened in the ventilation module; one end of the connector is connected to the second air path through the third air path, and the other end of the connector is connected to the air pipe body.

[0139] It can be understood that one end of the connector is connected to the trachea body, and the other end is connected to the third air path. When the trachea body is connected to the second air path through the third air path, the trachea is sealed and connected to the device responsible for vacuuming. The device responsible for vacuuming is turned on to allow the vacuum to pass through the trachea body and the connector to reach the third air path. After passing through the third air path and the axial hole on the shaft ring, it reaches the second air path in the sealing module.

[0140] It should be noted that the purpose of providing the connector is to avoid a gap between the air pipe and the third air path that affects the vacuum sealing of the head binding device, thereby avoiding poor chip picking and mounting effects due to the introduction of vacuum.

[0141] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A head binding device for a chip mounter, used for picking up and mounting chips, characterized in that: It includes a working module, a sealing module and a ventilation module; The working module comprises a main shaft and a support frame, a first gas path is provided inside the main shaft, a receiving cavity for installing the sealing module is provided inside the support frame, and the main shaft is connected to one end of the sealing module; A second gas path is opened in the sealing module, wherein the sealing module comprises a shaft ring with a shaft hole; The ventilation module is connected to the outside through the axial hole, the second air path and the first air path in sequence.

2. The head binding device for a chip mounter according to claim 1, characterized in that: An annular channel is formed between the outer peripheral surface of the shaft ring and the inner wall of the accommodating cavity, and the ventilation module is communicated with the shaft hole through the annular channel.

3. The head binding device for a chip mounter according to claim 2, characterized in that: The sealing module further comprises a bearing assembly, and the main shaft is connected to the inner ring of the bearing assembly; The bearing assembly comprises a first bearing group and a second bearing group, the collar is located between the first bearing group and the second bearing group, and the first bearing group and / or the second bearing group comprises at least two connected bearings.

4. The head binding device for a chip mounter according to claim 3, characterized in that: The annular channel is defined between the outer circumferential surface of the shaft ring, the inner wall of the accommodating cavity, the first bearing group, and the second bearing group.

5. The head binding device for a chip mounter according to claim 4, characterized in that: A seal is provided between adjacent bearings.

6. The head binding device for a chip mounter according to claim 4, characterized in that: A seal is provided between the bearing adjacent to the collar and the collar.

7. The head binding device for a chip mounter according to claim 5 or 6, characterized in that: The sealing element is a nano-sealing ring.

8. The head binding device for a chip mounter according to claim 3, characterized in that: The working module also includes a motor, a working end of which is connected to one end of the bearing assembly. When the motor is working, the motor drives the main shaft to rotate through the bearing assembly.

9. The head binding device for a chip mounter according to claim 2, characterized in that: The working module further comprises a suction nozzle connected to the working end of the spindle, and the interior of the suction nozzle is in communication with the first air path; The gas of the head binding device of the placement machine passes through the interior of the suction nozzle, and after flowing through the first gas path, the second gas path and the annular channel, is communicated with the ventilation module.

10. The head binding device for a chip mounter according to claim 1, characterized in that: The ventilation module comprises a trachea body and a connector, and a third air path is opened in the ventilation module; One end of the connector is communicated with the second gas path through the third gas path, and the other end of the connector is communicated with the gas pipe body.

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