Semiconductor device
By adopting a tight layer design of special-shaped circuit boards and low-thermal resistance metal materials in semiconductor devices, combining electrical contact areas and wire connections, the problem of insufficient heat dissipation is solved, and excellent heat dissipation effect is achieved. It is suitable for high-energy-consuming electronic products. Improves the reliability of the device.
Patent Information
- Application Number
- CN202421080816.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-17
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-05-17
AI Technical Summary
The existing semiconductor devices have shortcomings in heat dissipation, which leads to the failure of electronic components due to accumulation of thermal energy, affecting the operation of the device.
Using a special-shaped circuit board, combined with low thermal resistance metal material and a tight layer design, it can achieve excellent heat dissipation effect through electrical contact areas and wires, and the electrical connection between the special-shaped circuit board and other printed circuit boards is solved by solving the traditional circuit board. Compatibility issues between plate thickness and connection method.
It effectively improves the heat dissipation effect and reduces the risk of failure caused by thermal energy accumulation of electronic components. It is suitable for high-energy-consuming electronic products such as power supplies and servers, improving the reliability of the device.
Smart Images
Figure CN222320247U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a semiconductor device, and in particular to a semiconductor device comprising a circuit board. Background Art
[0002] Recently, the demand for semiconductor devices has been rising. Some electronic components that are prone to heat generation may be installed in semiconductor devices. If the heat is not properly discharged, it will affect the operation of the electronic components, and in severe cases, it may cause the semiconductor device to fail. Therefore, there is still an urgent need to develop a semiconductor device that can improve the heat dissipation problem. Utility Model Content
[0003] The utility model relates to a semiconductor device which can solve the problem of difficult heat dissipation.
[0004] According to an embodiment of the utility model, a semiconductor device is provided. The semiconductor device includes a special-shaped circuit board. The special-shaped circuit board includes a bottom portion and a first side portion. The bottom portion extends along a first direction. The first side portion is connected to a first end of the bottom portion and extends along a second direction, and the first direction is different from the second direction.
[0005] According to another embodiment of the utility model, a semiconductor device is provided. The semiconductor device includes a special-shaped circuit board and a first circuit board. The special-shaped circuit board corresponds to the peripheral area of the first circuit board. The special-shaped circuit board includes a bottom portion and a first side portion. The bottom portion extends along a first direction. The first side portion is connected to a first end of the bottom portion and extends along a second direction, and the first direction is different from the second direction. The first circuit board includes a substrate and an electronic component. The substrate includes a heat dissipation material. The electronic component is arranged on the substrate.
[0006] According to another embodiment of the utility model, a semiconductor device is provided. The semiconductor device includes a special-shaped circuit board, a first circuit board and a second circuit board. The special-shaped circuit board corresponds to the peripheral area of the first circuit board. The first circuit board is electrically connected to the second circuit board via the special-shaped circuit board. The special-shaped circuit board includes a bottom portion and a first side portion. The bottom portion extends along a first direction. The first side portion is connected to a first end of the bottom portion and extends along a second direction, and the first direction is different from the second direction. The first circuit board includes a substrate and an electronic component. The substrate includes a heat dissipation material. The electronic component is arranged on the substrate.
[0007] In order to better understand the above and other aspects of the present invention, embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Figure 1A A side view of a circuit board according to a comparative example is shown.
[0009] Figure 1B A side view of a circuit board according to an embodiment of the present invention is shown.
[0010] Figure 2A A three-dimensional diagram of a semiconductor device according to an embodiment of the present invention is shown.
[0011] Figure 2B Draw Figure 2A A front view of a special-shaped circuit board and a first circuit board in a semiconductor device.
[0012] Figure 2C Draw Figure 2A A rear view of a special-shaped circuit board and a first circuit board in a semiconductor device.
[0013] Figure 2D Draw Figure 2A A side view of a special-shaped circuit board and a first circuit board in a semiconductor device.
[0014] Figure 2E A three-dimensional diagram of a semiconductor device according to another embodiment of the present invention is shown.
[0015] Figure 2F A three-dimensional diagram of a semiconductor device according to another embodiment of the present invention is shown.
[0016] Figure 2G A three-dimensional diagram of a semiconductor device according to another embodiment of the present invention is shown.
[0017] Figure 2H A three-dimensional diagram of a semiconductor device according to another embodiment of the present invention is shown.
[0018] Figure 3A A three-dimensional diagram of a semiconductor device according to another embodiment of the present invention is shown.
[0019] Figure 3B Draw Figure 3A A partial side view of a semiconductor device.
[0020] Figure 3C A three-dimensional diagram of a semiconductor device according to another embodiment of the present invention is shown. DETAILED DESCRIPTION
[0021] The following will describe in detail various embodiments of the utility model, with accompanying drawings as examples. In addition to these detailed descriptions, the utility model can also be widely implemented in other embodiments, and any easy replacement, modification, and equivalent changes of the embodiments are included in the scope of the utility model, and are subject to the subsequent claims. In the description of the specification, in order to give the reader a more complete understanding of the utility model, many specific details and implementation examples are provided; however, these specific details and implementation examples should not be regarded as limitations of the utility model. In addition, well-known steps or elements are not described in the details to avoid unnecessary limitations on the utility model.
[0022] Figure 1A A side view of a circuit board NB according to a comparative example is shown. Figure 1B A side view of a circuit board 120 ′ according to an embodiment of the present invention is shown.
[0023] Please refer to Figure 1A The circuit board NB is, for example, a conventional integrated circuit board (PCB), including a substrate 124N, a heat sink 122N disposed below (on the back side) of the substrate 124N, a circuit layer 126N disposed above (on the front side) the substrate 124N, and a plurality of electronic components EN disposed above the circuit layer 126N. The material of the substrate 124N is mainly composed of a resin with high thermal resistance and glass fiber, and the thickness T1 is, for example, 0.9 mm. The material of the heat sink 122N may include aluminum. The electronic component EN may include a metal-oxide-semiconductor field-effect transistor (MOSFET).
[0024] Please refer to Figure 1B, the circuit board 120’ is, for example, a Metal Core PCB (MCPCB), including a substrate 122, an insulating layer 124 disposed above the substrate 122, a circuit layer 126 disposed above the insulating layer 124, and a plurality of electronic components E disposed above the circuit layer 126. The material of the substrate 122 includes a heat dissipation material, and the heat dissipation material is a metal material with low thermal resistance. For example, the heat dissipation material includes aluminum, so the circuit board 120’ can also be called an aluminum substrate. However, it should be understood that the present invention is not limited thereto. In other embodiments, the heat dissipation material of the substrate 122 can be other suitable heat dissipation materials (metal materials with low thermal resistance). The electronic component E can include a Metal Oxide Semiconductor Field Effect Transistor (MOSFET). In this embodiment, the material of the insulating layer 124 can include resin, and the thickness T2 of the insulating layer 124 is, for example, 0.1 mm. However, the range of the thickness T2 of the present invention is not limited thereto. It can be seen that the thickness T2 of the insulating layer 124 in this embodiment is less than the thickness T1 of the substrate 124N in the comparative example (i.e., T2 < T1), and the overall thickness of the circuit board 120’ can be less than the overall thickness of the circuit board NB. In addition, since the resin layer of the circuit board NB is thicker and requires manual labor for off-line assembly, the resin insulating layer of the circuit board 120’ is very thin, and the layers are already tightly bonded, without the need for additional assembly. According to experimental and simulation results, the heat dissipation effect of the circuit board 120’ is better than that of the circuit board NB. Therefore, the application of the circuit board 120’ is particularly important. In this embodiment, the circuit board 120’ can be a single-sided single-layer aluminum substrate. However, the present invention is not limited thereto. In other embodiments, the circuit board 120’ can be a single-sided single / multi-layer aluminum substrate, a double-sided single-layer aluminum substrate, or a double-sided multi-layer aluminum substrate.
[0025] When the circuit board 120’ is to be applied to an electronic product, it is usually necessary to make an electrical connection with other printed circuit boards, but some problems are often encountered. For example, it is difficult for the circuit board 120’ to be connected to other printed circuit boards by a gold finger, the circuit board 120’ cannot be connected to other printed circuit boards by soldering, and the hole size on other printed circuit boards cannot match the thickness of the circuit board 120’. Therefore, an embodiment of the present invention proposes a special-shaped circuit board (such as the special-shaped circuit boards 110 to 210) to assist in the electrical connection between the circuit board 120’ (such as the first circuit boards 120 to 220) and other printed circuit boards (such as the second circuit boards 130 to 230) (detailed as follows).
[0026] Figure 2A The perspective view of the semiconductor device 10 according to an embodiment of the present invention is shown. Figure 2B Shown Figure 2A The front view of the special-shaped circuit board 110 and the first circuit board 120 in the semiconductor device 10. Figure 2C Shown Figure 2AFIG. 1 is a rear view of the special-shaped circuit board 110 and the first circuit board 120 in the semiconductor device 10 . Figure 2D Draw Figure 2A The structure of the first circuit board 120 may be the same as or similar to that of the semiconductor device 10. Figure 1B The circuit board 120 ′ shown, ie, the first circuit board 120 , may be a metal core circuit board, which has an excellent heat dissipation effect. Figure 2E A three-dimensional diagram of a semiconductor device 10 ′ according to another embodiment of the present invention is shown. Figure 2F A three-dimensional diagram of a semiconductor device 10 ″ according to another embodiment of the present invention is shown. Figure 2G A three-dimensional diagram of a semiconductor device 10 ′″ according to another embodiment of the present invention is shown. Figure 2H A three-dimensional diagram of a semiconductor device 10"" according to another embodiment of the present invention is shown. The same or similar elements in the semiconductor devices 10'-10"" are marked with the same or similar element symbols, and have the same or similar materials or functions. The repeated parts will not be described in detail.
[0027] Please also refer to Figures 2A to 2D , the semiconductor device 10 includes a special-shaped circuit board 110, a first circuit board 120 and a second circuit board 130, the special-shaped circuit board 110 corresponds to (e.g., is connected to) the peripheral area of the first circuit board 120, and the first circuit board 120 is electrically connected to the second circuit board 130 via the special-shaped circuit board 110. Figure 2A As shown, the volume (i.e., size) of the first circuit board 120 is smaller than the volume (i.e., size) of the second circuit board 130. Figure 2B As shown, the special-shaped circuit board 110 includes a bottom portion 112, a first side portion 114 and a second side portion 116. The bottom portion 112 extends along a first direction D1. The first side portion 114 is connected to the first end 11201 of the bottom portion 112 and extends along the second direction D2. The first direction D1 is different from the second direction D2. In this embodiment, the first direction D1 and the second direction D2 are perpendicular to each other, but the utility model is not limited to this. The second side portion 116 is connected to the second end 11202 of the bottom portion 112 and extends along the second direction D2, and the first end 11201 and the second end 11202 are opposite to each other. The structure of the first circuit board 120 can be similar to the circuit board 120', that is, it includes a substrate 122, an insulating layer 124 disposed above the substrate 122, a circuit layer 126 disposed above the insulating layer 124, and a plurality of electronic components E disposed above the circuit layer 126 (it can also be said that the electronic components E are disposed on the substrate 122), as shown in FIG. Figure 1BAs shown. The material of the substrate 122 includes a heat dissipation material, which is a metal material with low thermal resistance. For example, the heat dissipation material includes aluminum (the present invention is not limited thereto). In this embodiment, the circuit board 120 may be a single-sided single-layer aluminum substrate, but the present invention is not limited thereto. In other embodiments, the circuit board 120 may be a single-sided single-layer aluminum substrate, a double-sided single-layer aluminum substrate, or a double-sided multi-layer aluminum substrate. Figure 2D As shown, the special-shaped circuit board 110 overlaps the peripheral area of the first circuit board 120 in the third direction D3. The third direction D3 is, for example, perpendicular to the first direction D1 and the second direction D2.
[0028] According to some embodiments, the special-shaped circuit board 110 may include a resin material, and no electronic components are disposed on the special-shaped circuit board 110. The second circuit board 130 may include a resin material, and some electronic components E1 may be disposed on the second circuit board 130 (eg, Figure 2H shown).
[0029] Please refer to Figure 2B , the special-shaped circuit board 110 further includes at least one first wire C1 and at least one second wire C2, the first wire C1 is electrically connected to the corresponding electronic component E and extends between the first side portion 114 and the bottom portion 112, and the second wire C2 is electrically connected to the corresponding electronic component E and extends between the second side portion 116 and the bottom portion 112. It should be understood that the number of the first wire C1 and the second wire C2 can be greater than 1 respectively. The bottom portion 112 includes a body area 1121 and an electrical contact area 1122, and the first wire C1 and the second wire C2 are electrically in contact with the electrical contact area 1122 respectively. The height H1 of the body area 1121 in the second direction D2 is less than the height H2 of the electrical contact area 1122 in the second direction D2.
[0030] In this embodiment, the width of the first side portion 114 in the first direction D1 is the same as the width of the second side portion 116 in the first direction D1, but the present invention is not limited to this. In some embodiments, the width of the first side portion 114 in the first direction D1 may be greater than or less than the width of the second side portion 116 in the first direction D1.
[0031] In this embodiment, the electrical contact area 1122 may include a gold finger structure, and the gold finger structure may be electrically contacted with other circuit boards, such as the second circuit board 130. Figure 2AAs shown. For example, the second circuit board 130 includes a groove 130u corresponding to the electrical contact area 1122 of the special-shaped circuit board 110, and at least a portion of the electrical contact area 1122 is inserted into the groove 130u, so that the first circuit board 120 can be electrically connected to the second circuit board 130 through the special-shaped circuit board 110. In this embodiment, the normal direction of the upper surface 120a of the first circuit board 120 (i.e., the third direction D3) is perpendicular to the normal direction of the upper surface 130a of the second circuit board 130 (i.e., the second direction D2), but the utility model is not limited thereto. In this embodiment, the upper surface 120a of the first circuit board 120 represents the surface of the first circuit board 120 on which the electronic component E is disposed. In other words, the first wire C1 and the second wire C2 extending in the special-shaped circuit board 110 are respectively electrically connected to the corresponding electronic component E in the first circuit board 120, and are electrically connected to the electrical contact area 1122, and then are electrically connected to the second circuit board 130 through the electrical contact area 1122. The electronic components E in the first circuit board 120 may include high-power electronic components, which easily generate heat energy during operation. Therefore, due to the excellent heat dissipation characteristics of the first circuit board 120, the heat energy generated by the electronic components E is not easily accumulated, and the semiconductor device 10 is less likely to be affected by the heat energy. The semiconductor device 10 can be applied to power products, servers, or other suitable electronic products.
[0032] In this embodiment, the special-shaped circuit board 110 is similar to a U-shape. Figure 2A-2B In some embodiments, the special-shaped circuit board 110' includes a bottom portion 112 and a first side portion 114, but does not include a second side portion 116, so that the special-shaped circuit board 110' is similar to an L-shape, such as Figure 2E In some embodiments, the special-shaped circuit board 110" includes a bottom portion 112, a first side portion 114, a second side portion 116, and a top portion 118. The top portion 118 is, for example, disposed between the first side portion 114 and the second side portion 116 and relative to the bottom portion 112, so that the special-shaped circuit board 110" is similar to a square. Figure 2F shown.
[0033] In such Figure 2A-2B In the illustrated embodiment, the special-shaped circuit board 110 and the first circuit board 120 are connected to each other by a solder paste process, that is, the circuit connection between the special-shaped circuit board 110 and the first circuit board 120 is achieved by solder paste, but the utility model is not limited thereto. In some embodiments, the special-shaped circuit board 110'' and the first circuit board 120'' can be connected to each other by a snap-fit structure PS instead of solder paste, such as Figure 2G As shown. Figure 2GIn the illustrated embodiment, the snap-fit structure PS includes a convex portion of the special-shaped circuit board 110"' and a concave portion of the first circuit board 120"', but the present invention is not limited thereto. In addition, the special-shaped circuit board 110"' may include a solder paste guide hole SU1, and the solder paste guide hole SU1 corresponds to the electrical contact area 1122"' of the special-shaped circuit board 110"', so that an electrical connection can be achieved between the electrical contact area 1122"' and the second circuit board 130 through solder paste.
[0034] In such Figure 2A-2B In the illustrated embodiment, the electrical contact area 1122 in the special-shaped circuit board 110 is electrically connected to the second circuit board 130 by means of a gold finger structure, but the present invention is not limited thereto. In some embodiments, the electrical contact area 1122"" in the special-shaped circuit board 110"" does not include a gold finger structure, and the second circuit board 130 does not have a groove 130u. The electrical contact area 1122"" of the bottom portion 112"" of the special-shaped circuit board 110"" is electrically connected to the second circuit board 130 by means of solder paste, such as Figure 2H In addition, the electrical contact area 1122"" may include Figure 2G The solder paste guide hole SU1 is shown.
[0035] Figure 3A A three-dimensional diagram of a semiconductor device 20 according to another embodiment of the present invention is shown. Figure 3B Draw Figure 3A FIG. 2 is a partial side view of a semiconductor device 20 . Figure 3C A perspective view of a semiconductor device 20' according to another embodiment of the present invention is shown. The same or similar elements in the semiconductor devices 20 and 20' are marked with the same or similar element numbers, and the two have the same or similar materials or functions, and the repeated parts will not be described in detail.
[0036] Please also refer to Figure 3A-3B, the semiconductor device 20 includes a special-shaped circuit board 210, a plurality of first circuit boards 220 and a third circuit board 230. The semiconductor device 20 is designed similarly to the stand concept of a plug-in printed circuit board, that is, the appearance of the special-shaped circuit board 210 is similar to a stand, and the first circuit board 220 can be inserted into and removed from the stand of the special-shaped circuit board 210. The first circuit board 220 includes first circuit boards 2201-2203. The special-shaped circuit board 210 corresponds to (e.g., can be detachably connected to) the peripheral area of the first circuit board 220, and the first circuit board 220 is electrically connected to the second circuit board 230 via the special-shaped circuit board 210. The special-shaped circuit board 210 includes a bottom portion 212, a plurality of first side portions 214 and a plurality of second side portions 216. The bottom portion 212 extends along the first direction D1 and the third direction D3. The plurality of first side portions 214 include, for example, first side portions 2141-2144, which are arranged at intervals on the bottom portion 212 along the third direction D3, and the plurality of second side portions 216 include, for example, second side portions 2161-2164, which are arranged at intervals on the bottom portion 212 along the third direction D3, and the first side portions 2141-2144 overlap the second side portions 2161-2164 in the first direction D1. That is, the bottom portion 212 continuously extends between the first side portions 2141-2144 and the second side portions 2161-2164 below the first circuit boards 2201-2203, and the first side portions 2141-2144 and the second side portions 2161-2164 provide a plurality of accommodating spaces for the first circuit boards 2201-2203. For example, the first circuit board 2201 is accommodated between the first side portions 2141-2142 and the second side portions 2161-2162, the first circuit board 2202 is accommodated between the first side portions 2142-2143 and the second side portions 2162-2163, and the first circuit board 2203 is accommodated between the first side portions 2143-2144 and the second side portions 2163-2164. It should be understood that the number of the first circuit board 220, the first side portion 214 and the second side portion 216 of the present invention is not limited to Figure 3A As shown in the number, in some embodiments, the number of first circuit boards 220 may be greater than 3, the number of first side portions 214 and the number of second side portions 216 may be greater than 4, respectively, and the length of the bottom portion 212 in the third direction D3 may be increased to provide more first circuit boards 220.
[0037] like Figure 3BAs shown, the first side portions 2141-2143 and the second side portions 2161-2163 may have a latch structure 218 to be detachably engaged with the first circuit boards 2201-2203, and the electrical connection between the special-shaped circuit board 210 and the first circuit board 220 is realized through the latch structure 218, so that the first circuit board 220 is electrically connected to the second circuit board 220 through the special-shaped circuit board 210. In this embodiment, the latch structure 218 of the first side portions 2141-2143 and the second side portions 2161-2163 provides a protruding portion, and a position corresponding to the latch structure 218 in the peripheral area of the first circuit board 2201-2203 provides a concave portion, and the protruding portion and the concave portion are engaged with each other, but the utility model is not limited thereto.
[0038] In some embodiments, the special-shaped circuit board 210 includes an electrical contact area (not shown), and the electrical contact area (not shown) is electrically connected to the second circuit board 230 through a gold finger structure. In some embodiments, the electrical contact area 2122' in the special-shaped circuit board 210' does not include a gold finger structure, and the second circuit board 230 does not have a groove. The special-shaped circuit board 210' may further include a solder paste guide hole SU2, and the solder paste guide hole SU2 corresponds to the electrical contact area 2122' in the special-shaped circuit board 210' (such as Figure 3C As shown), the electrical contact area 2122' and the second circuit board 230 are electrically connected via solder paste.
[0039] From the above content, it can be seen that by setting the special-shaped circuit board, the first circuit board with excellent heat dissipation effect can be electrically connected to the second circuit board, so some high-energy-consuming electronic components can be set on the first circuit board to avoid heat energy affecting the operation of the electronic components.
[0040] In summary, although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. A person skilled in the art of the present invention may make various modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the following claims.
Claims
1. A semiconductor device, characterized in that: The semiconductor device includes a special-shaped circuit board, and the special-shaped circuit board includes: a bottom portion extending along a first direction; and At least one first side portion is connected to the first end of the bottom portion and extends along a second direction, wherein the first direction is different from the second direction.
2. The semiconductor device according to claim 1, wherein The special-shaped circuit board further includes at least one first conductive wire, and the at least first conductive wire extends in the first side portion and the bottom portion.
3. The semiconductor device according to claim 1 or 2, wherein: The special-shaped circuit board further includes at least one second side portion, wherein the at least one second side portion is connected to the second end of the bottom portion and extends along the second direction, and the first end and the second end are opposite to each other.
4. The semiconductor device according to claim 3, wherein: The special-shaped circuit board further includes at least one second conductive wire, and the at least second conductive wire extends in the second side portion and the bottom portion.
5. The semiconductor device according to claim 2, wherein: The bottom portion includes a body region and an electrical contact region, the first conductive line is in electrical contact with the electrical contact region, and a height of the body region in the second direction is smaller than a height of the electrical contact region in the second direction.
6. The semiconductor device according to claim 3, wherein: The number of the at least one first side portion is multiple, the number of the at least one second side portion is multiple, the multiple first side portions are arranged on the bottom portion at intervals along a third direction, the multiple second side portions are arranged on the bottom portion at intervals along the third direction, the multiple first side portions overlap the multiple second side portions in the first direction, and the third direction is different from the first direction and the second direction.
7. A semiconductor device, characterized in that: The semiconductor device includes a special-shaped circuit board and a first circuit board, wherein the special-shaped circuit board corresponds to a peripheral area of the first circuit board, wherein the special-shaped circuit board includes: a bottom portion extending along a first direction; and at least one first side portion connected to the first end of the bottom portion and extending along a second direction, the first direction being different from the second direction; At least one of the first circuit boards comprises: a substrate including a heat dissipation material; and An electronic component is disposed on the substrate.
8. The semiconductor device according to claim 7, wherein: The special-shaped circuit board further includes at least one first conductive wire, which is electrically connected to the electronic component and extends into the first side portion and the bottom portion.
9. The semiconductor device according to claim 7 or 8, wherein: The special-shaped circuit board further includes a second side portion, the second side portion is connected to the second end of the bottom portion and extends along the second direction, and the first end and the second end are opposite to each other.
10. The semiconductor device according to claim 9, wherein: The special-shaped circuit board further includes at least one second conductive wire, and the at least second conductive wire extends in the second side portion and the bottom portion.
11. The semiconductor device according to claim 8, wherein The bottom portion includes a body region and an electrical contact region, the first conductive line is in electrical contact with the electrical contact region, and a height of the body region in the second direction is smaller than a height of the electrical contact region in the second direction.
12. The semiconductor device according to claim 9, wherein The number of the at least one first side portion is multiple, the number of the at least one second side portion is multiple, the multiple first side portions are arranged on the bottom portion at intervals along a third direction, the multiple second side portions are arranged on the bottom portion at intervals along the third direction, the multiple first side portions overlap the multiple second side portions in the first direction, and the third direction is different from the first direction and the second direction.
13. A semiconductor device, characterized in that: The semiconductor device includes a special-shaped circuit board, a first circuit board and a second circuit board, wherein the special-shaped circuit board corresponds to a peripheral area of the first circuit board, and the first circuit board is electrically connected to the second circuit board via the special-shaped circuit board, wherein the special-shaped circuit board includes: a bottom portion extending along a first direction; and at least one first side portion connected to the first end of the bottom portion and extending along a second direction, the first direction being different from the second direction; At least one of the first circuit boards comprises: a substrate including a heat dissipation material; and An electronic component is disposed on the substrate.
14. The semiconductor device according to claim 13, wherein: The special-shaped circuit board also includes at least one first conductive wire, which is electrically connected to the electronic component and extends into the first side portion and the bottom portion.
15. The semiconductor device according to claim 13 or 14, wherein: The special-shaped circuit board further includes at least one second side portion, wherein the at least one second side portion is connected to the second end of the bottom portion and extends along the second direction, and the first end and the second end are opposite to each other.
16. The semiconductor device according to claim 15, wherein: The special-shaped circuit board further includes at least one second conductive wire, and the at least second conductive wire extends in the second side portion and the bottom portion.
17. The semiconductor device according to claim 14, wherein: The bottom portion includes a body region and an electrical contact region, the first conductive line is in electrical contact with the electrical contact region, and a height of the body region in the second direction is smaller than a height of the electrical contact region in the second direction.
18. The semiconductor device according to claim 15, wherein: The number of the at least one first side portion is multiple, the number of the at least one second side portion is multiple, the multiple first side portions are arranged on the bottom portion at intervals along a third direction, the multiple second side portions are arranged on the bottom portion at intervals along the third direction, the multiple first side portions overlap the multiple second side portions in the first direction, and the third direction is different from the first direction and the second direction.
19. The semiconductor device according to claim 13, wherein: A normal direction of an upper surface of the first circuit board is perpendicular to a normal direction of an upper surface of the second circuit board.
20. The semiconductor device according to claim 13, wherein The volume of the first circuit board is smaller than the volume of the second circuit board.