Developing box

Abstract

The utility model provides a developing box which is detachably mounted in an image forming device, the image forming device is provided with a chip contact point, and the developing box comprises a developing roller which can rotate around an axis extending in a first direction; the shell is used for containing a developing agent and comprises a first side and a second side separated from the first side in the first direction; the input gear is arranged on the first side and can receive and transmit driving force from the image forming device; the electronic device further comprises a chip assembly, the chip assembly comprises a first circuit board, the first circuit board is provided with an electric connection contact surface used for making contact with the chip contact points, and the electric connection contact surface is arranged in the first direction in an extending mode; and the second circuit board is provided with a storage part, and the storage part is arranged in a second direction which is crossed with the first direction in an extending manner.

Description

Technical Field

[0001] The utility model relates to the field of imaging, in particular to a developing box. Background Art

[0002] An electronic image forming device is an imaging device that forms a visible image on a record through the principle of electronic photographic imaging, including copiers, printers, and LED printers. An image forming device generally includes a processing box that is detachably mounted in the main body of the image forming device. Existing processing boxes include various forms. For example, the processing box may be a photosensitive drum box including a photosensitive drum, or a developing box storing a developer, or an integrated box in which the developing box and the photosensitive drum box are integrated. The imaging principle of the image forming device is as follows: First, the surface of the photosensitive drum is charged to a predetermined potential. A laser beam is projected onto the surface of the photosensitive drum to form an electrostatic latent image. A visible image is obtained by supplying a developer to the electrostatic latent image. Next, the visible developer image developed on the photosensitive drum is transferred to the printing medium directly or through an intermediate transfer medium, and then fixed to the printing medium through a fixing process.

[0003] Generally, the process cartridge has a printing life, and must be replaced when the process cartridge reaches the end of its printing life. To this end, the user must know various information about the process cartridge. The process cartridge is equipped with a chip that stores various information about its operation, and when the process cartridge is used up, a new process cartridge needs to be replaced. The prior art provides a chip with a high degree of integration and a small size to adapt to the process cartridge and the electronic image forming device, but the cost of the chip is high and the design is difficult, so it is necessary to develop a new storage device and process cartridge. Utility Model Content

[0004] In order to better develop the existing technology, the utility model provides a developing box, which can be detachably installed in an image forming device, the image forming device has a chip contact point, and the developing box includes:

[0005] A developing roller rotatable about an axis extending in a first direction;

[0006] a housing for containing a developer, comprising a first side and a second side separated from the first side in the first direction;

[0007] An input gear, disposed on the first side, capable of receiving and transmitting a driving force from the image forming device;

[0008] Also included is a chip assembly, the chip assembly comprising:

[0009] A first circuit board, wherein the first circuit board is provided with an electrical connection contact surface for contacting with the chip contact point, and the electrical connection contact surface is extended in the first direction;

[0010] A second circuit board is provided with a storage portion, and the storage portion is extended in a second direction crossing the first direction.

[0011] Furthermore, the electrical connection contact surface and the storage portion are arranged vertically.

[0012] Furthermore, the first circuit board includes a first surface and a second surface arranged opposite to the first surface, the electrical connection contact surface is arranged on the first surface, and the second surface is connected to the second circuit board.

[0013] Furthermore, the second circuit board includes a third surface and a fourth surface arranged opposite to the third surface, the storage part is arranged on the third surface, and the second surface is connected to the first circuit board.

[0014] Furthermore, the chip assembly also includes a power supply part, which is arranged on the fourth surface and is electrically connected to the storage part.

[0015] Furthermore, the power supply part includes a battery, a positive electrode and a negative electrode, the positive electrode of the battery is connected to the second circuit board through the positive electrode, and the negative electrode of the battery is connected to the second circuit board through the negative electrode.

[0016] Furthermore, it also includes a chip rack, on which a supporting groove and a receiving groove connected to the supporting groove are provided, the first circuit board is installed and supported in the supporting groove, and the second circuit board is installed in the receiving groove.

[0017] Furthermore, the first circuit board is provided with a first soldering point, the second circuit board is provided with a second soldering point, and the first soldering point and the second soldering point are connected by welding.

[0018] Furthermore, it also includes a flexible circuit board, one end of which is connected to the first circuit board and electrically connected to the electrical contact surface, and the other end of the flexible circuit board is connected to the second circuit board and electrically connected to the storage part.

[0019] Furthermore, the first circuit board is configured as a flexible circuit board, and the flexible circuit board is electrically connected to the second circuit board.

[0020] The developer box of the utility model is provided with a chip assembly, the chip assembly has an electrical connection contact surface arranged on a first circuit board and extending in a first direction, and a storage part arranged on a second circuit board and extending in a second direction intersecting the first direction. The first circuit board and the second circuit board are staggered in space, which reduces the installation space of the chip on the shell, facilitates the loading and unloading of the chip, and is conducive to the miniaturization of the developer box. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a front structural schematic diagram of the developing box in Embodiment 1 of the present utility model;

[0022] Figure 2 It is a partially exploded schematic diagram of an angle of the first side of the developing cartridge in Embodiment 1 of the utility model;

[0023] Figure 3 It is a partially exploded schematic diagram of another angle of the first side of the developing box in Embodiment 1 of the utility model;

[0024] Figure 4 It is a three-dimensional structural schematic diagram of the chip assembly of the developing box in Example 1 of the utility model;

[0025] Figure 5 It is a partially exploded schematic diagram of the chip assembly of the developing box in Example 1 of the utility model;

[0026] Figure 6 It is a side schematic diagram box of the sheet assembly of the developer core in Example 1 of the utility model;

[0027] Figure 7 It is a three-dimensional structural schematic diagram of the chip assembly of the developing box in Example 1 of the utility model;

[0028] Figure 8 It is a three-dimensional structural schematic diagram of the chip assembly of the developing box in Example 2 of the utility model;

[0029] Fig. 9 It is a side schematic diagram of the chip assembly of the developing box in Example 2 of the utility model;

[0030] Fig.10 It is a side schematic diagram of a chip assembly and a chip frame of a developing box in Example 2 of the utility model. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and technical effect of the embodiment of the utility model clearer, the technical scheme of the developer box of the utility model will be described clearly and completely in conjunction with the accompanying drawings. Obviously, the described embodiment is only a preferred embodiment of the utility model, not all embodiments. Based on the embodiment of the utility model, other embodiments obtained by those skilled in the art without creative work belong to the protection scope of the utility model.

[0032] In the following description, the direction in which the rotation axis of the developing roller extends is referred to as the first direction (also referred to as the axial direction), which is also the direction in which the rotation axis of the photosensitive drum extends; the second direction is the installation direction in which the developing cartridge is installed to the drum cartridge. The first direction and the second direction intersect each other. Example 1

[0033] like Figure 1 As shown. The developer box 100 in this embodiment includes a shell 1, which is configured to accommodate a developer therein, and is welded by an upper shell and a lower shell to form a cavity that can accommodate the developer. The shell 1 extends in a first direction and includes a first side 11 and a second side 12 separated from each other in the first direction. The developing roller 2 is accommodated in the shell 1 of the developer box 100 and can rotate relative to the developing roller shaft extending in the first direction. The axial ends of the developing roller 2 are supported by the first side 11 and the second side 12 of the shell 1. The powder feeding roller 3 is accommodated in the shell 1 of the developer box 100 and can rotate relative to the powder feeding roller shaft extending in the first direction. The two ends of the powder feeding roller shaft are supported by the first side 11 and the second side 12 of the shell 1 respectively. The stirring frame can convey the toner in the shell 1 to the powder feeding roller, and the powder feeding roller then conveys the received toner to the developing roller 2. After receiving the toner transferred by the powder feeding roller, the developing roller 2 conveys the developer to the photosensitive drum in the drum box to develop an electrostatic latent image on the surface of the photosensitive drum. In this embodiment, a portion of the developing roller 2 is located inside the housing 1 ; the other portion of the developing roller 2 is exposed outside the housing 1 .

[0034] like Figure 2 As shown, a gear transmission system is also provided outside the first side 11 of the developer box 100 of this embodiment, and the gear transmission system transmits the driving force received from the image forming device to the developer box 100. The gear transmission system of the developer box 100 of the utility model is provided outside the first side 11, and includes an input gear 31, a developing roller gear 32, a powder feeding roller gear 33 and a stirring frame gear 34. The developing roller gear 32 is installed at the first end of the developing roller 2 and can rotate together with the developing roller 2; the powder feeding roller gear 33 is installed at the first end of the powder feeding roller 3 and can rotate together with the powder feeding roller 3; the input gear 31 is provided on the first side 11 and can rotate around an axis (not shown) extending in an axial direction, and the input gear 31 can be engaged with a driving force input member (not shown) in the image forming device to receive the driving force from the image forming device and rotate. The input gear 31 is meshed with the developing roller gear 32 and the powder feeding roller gear 33 respectively to transmit the received driving force to the developing roller 2 and the powder feeding roller respectively, thereby driving the developing roller 2 and the powder feeding roller to rotate; the stirring frame gear 34 is meshed with the input gear 31 and drives the stirring frame to rotate together.

[0035] like Figure 1As shown, the first side 11 of the developing box 100 of the present invention is also provided with a protective cover 13 covering the gear transmission system. The protective cover 13 can prevent the gear system of the developing box 100 from being disturbed by the outside world, so as to stably limit the gear system between the first side 11 and the protective cover 13 in the axial direction, and the gear transmission system can stably transmit the driving force. A hole is provided on the protective cover 13 to expose a part of the input gear 31 to the outside so that the input gear 31 can receive the driving force from the image forming device.

[0036] like Figure 4 As shown, the chip assembly 4 includes a storage portion 41 and an electrical contact portion 42, the storage portion 41 and the electrical contact portion 42 are arranged on different circuit boards, and the storage portion 41 and the electrical contact portion 42 are electrically connected. Specifically, the chip assembly 4 also includes a first circuit board 43 and a second circuit board 44, the storage portion 41 is arranged on the second circuit board 44, the electrical contact portion 42 is arranged on the first circuit board 43, the first circuit board 43 and the second circuit board 44 are electrically connected through a conductive medium, so that the storage portion 41 and the electrical contact portion 42 are electrically connected, and the storage portion 41 is arranged on one of the second circuit boards 44 The storage part 41 may be a wafer, and is configured to store information related to the developer cartridge 100, such as toner color, authentication code, serial number, remaining toner, page yield (maximum number of printable pages), number of printed pages, manufacturer, production date and other data. The electrical contact part 42 is disposed on a surface of the first circuit board 43 and exposed on the surface of the housing 1. When the developer cartridge 100 is mounted on a printing device, the electrical contact part 42 is electrically connected to the printing device, thereby establishing communication between the chip assembly 4 and the printing device, so that the printing device can read the information in the storage part 41. The electrical contact part 42 includes contact contacts, which are used to contact with electrical contacts of the printing device to realize electrical connection between the chip assembly 4 and the printing device, wherein the contact contacts are configured as gold fingers, and the number of contact contacts may be multiple. In this embodiment, the number of contact contacts is four.

[0037] like Figure 5As shown, the chip assembly 4 further includes a power supply part 45, which is used to provide the power required by the chip assembly 4. The power supply part 45 is arranged on one surface of the second circuit board 44, and includes a battery 451, a positive electrode 452 and a negative electrode 453. The positive electrode of the battery 451 is connected to the second circuit board 44 through the positive electrode 452, and the negative electrode of the battery 451 is connected to the second circuit board 44 through the negative electrode 453, and then connected to the storage part 41 through the second circuit board 44 to provide power to the storage part 41. In this embodiment, the battery 451 is configured as a button battery, the positive electrode 452 is configured as a bent conductive metal sheet, an installation space is formed between the conductive metal sheet and the second circuit board 44, and the battery 451 is installed in the installation space, one end of the conductive metal sheet is welded on the second circuit board 44 and electrically connected to the second circuit board 44, a conductive connection portion is arranged on the top wall of the conductive metal sheet, the positive electrode of the battery 441 contacts the conductive connection portion and is connected to the second circuit board 44 through the conductive connection portion, and the negative electrode 453 is configured as a gold finger arranged on one surface of the second circuit board 44.

[0038] like Figure 6As shown, the first circuit board 43 is electrically connected to the second circuit board 44 by welding, and the first circuit board 43 and the second circuit board 44 are arranged perpendicular to each other. Specifically, the first circuit board 43 has a first surface 43a and a second surface 43b arranged opposite to the first surface 43a, and the second circuit board 44 has a third surface 44a and a fourth surface 44b arranged opposite to the third surface 44a. A plurality of contact contacts are arranged on the first surface 43a of the first circuit board 43, and the first surface 43a is exposed outside the shell 1. The first circuit board 43 is arranged on the first side 11 of the shell 1 in the first direction, and the first circuit board 43 is extended in the first direction. The plurality of contact contacts are arranged in the first direction and form an electrical contact surface, that is, the electrical contact surface extends in the first direction, and the second circuit board 44 extends in the second direction, and the storage part 41 arranged on the second circuit board 44 extends in the second direction, and the electrical contact surface and the storage part 41 extend in different directions. The second surface 43b of the first circuit board 43 is provided with a plurality of first solder points, and the first solder points are electrically connected to the corresponding contact points, and the first solder points are connected to the second circuit board 44 by welding. Correspondingly, the third surface 44a or the fourth surface 44b of the second circuit board 44 is provided with a second solder point, and the second solder point is electrically connected to the power supply part 45 and the storage part 41, and the second solder point is electrically connected to the first solder point on the first circuit board 43 by welding, so that the electrical contact part 42, the storage part 41 and the power supply part 45 are electrically connected to each other. In this embodiment, the second solder point is provided on the third surface 44a, and in order to facilitate welding, the second circuit board 44 abuts the second surface 43b of the first circuit board 43, so that the second surface 43b of the first circuit board 43 is provided close to the third surface 44 of the second circuit board 44, and the first circuit board 43 and the second circuit board 44 are directly fixedly connected by welding. Optionally, the first circuit board 43 and the second circuit board 44 can also be connected by a cable or a flexible circuit board to achieve the electrical connection between the first circuit board 43 and the second circuit board 44, such as Figure 7As shown, one end of the flexible circuit board 46 is connected to the first surface 43a of the first circuit board 43 and is electrically connected to the electrical contact part 41, and the other end of the flexible circuit board 46 is connected to the third surface 44a or the fourth surface 44b of the second circuit board 44 and is electrically connected to the storage part 42 and the power supply part 45. The first circuit board 43 and the second circuit board 44 are connected by the flexible circuit board 46. When the chip assembly 4 is installed, the first circuit board 43 and the second circuit board 44 can be relatively displaced, which increases the installation freedom of the chip assembly 4. The first circuit board 43 and the second circuit board 44 can be installed separately, and the second circuit board 44 can have more installation position options. Among them, the storage part 41 is arranged on the third surface 44a, and the power supply part 45 is arranged on the fourth surface 44b, which reduces the circuit layout space, is conducive to the miniaturization of the chip assembly 4 and the developer box 100, and can also reduce the interference of the power supply part 45 on the signal transmission of the storage part 41. Furthermore, the storage portion 41 arranged on the second circuit board 44 extends in the second direction, and the second circuit board 44 forms an angle a with the first direction. Preferably, the second circuit board 44 is arranged facing the first direction, that is, a is 90°, and the first circuit board 43 and the second circuit board 44 are staggered in space, which can reduce the installation space of the chip assembly 4 and is conducive to the miniaturization of the developing box 100.

[0039] like Figure 3 As shown, in this embodiment, the developing box 100 further includes a chip rack 5, which is used to install the chip assembly 4. The chip rack 5 is arranged on the first side 11 of the housing 1. Specifically, the chip rack 5 is detachably mounted on the first side 11 of the housing 1, so that the chip assembly 4 mounted on the chip rack 5 is detachably mounted on the first side 11 of the housing 1. Further, the chip rack 5 is mounted on the protective cover 13. In other optional embodiments, the chip rack 5 can be integrally formed with the housing 1. The chip rack 5 is provided with a supporting groove 51 and a receiving groove 52 connected to the supporting groove 51. The first circuit board 43 of the chip assembly 4 is mounted and supported on the supporting groove 51, and the second circuit board 44 of the chip assembly 4 is mounted in the receiving groove 52, so as to facilitate the loading and unloading of the chip assembly 4 and reduce the installation space of the chip assembly 4. Example 2

[0040] Different from the above-mentioned embodiment 1, the structure of the chip assembly in this embodiment is different.

[0041] like Figure 8As shown, the chip assembly 6 includes a storage portion 61, an electrical contact portion 62, a support plate 63, a second circuit board 64, and a flexible circuit board 66. The storage portion 61 and the electrical contact portion 62 are separately arranged, and the storage portion 61 and the electrical contact portion 62 are electrically connected. Specifically, the storage portion 61 is arranged on the second circuit board 64, the electrical contact portion 62 is arranged on the support plate 63, and the electrical contact portion 62 and the second circuit board 64 are electrically connected through the flexible circuit board 66, so that the storage portion 61 and the electrical contact portion 62 are electrically connected. The storage portion 61 is arranged on one surface of the second circuit board 64. The storage portion 61 can be a wafer, which is configured to store information related to the developing box 100, such as toner color, authentication code, serial number, remaining toner amount, page yield (maximum number of printable pages), number of printed pages, manufacturer, production date and other data. The electrical contact portion 62 is disposed on a surface of the support plate 63 and exposed on the surface of the housing 1. When the developing box 100 is installed on the printing device, the electrical contact portion 62 is electrically connected to the printing device, thereby establishing communication between the chip assembly 6 and the printing device, so that the printing device can read the information in the storage portion 61. The electrical contact portion 62 includes a contact point, which is used to contact the electrical contact of the printing device to achieve electrical connection between the chip assembly 6 and the printing device, wherein the contact point is configured as a gold finger, and the number of the contact points can be multiple. In this embodiment, the number of the contact points is four.

[0042] The electrical contact portion 62 is arranged on a flexible circuit board 66, and the flexible circuit board 66 is fixed on a surface of the support plate 63, that is, the electrical contact portion 62 and the flexible circuit board 66 are arranged in one piece, which simplifies the structure of the chip assembly 6 and facilitates installation. Among them, the contact point is configured as a gold finger or a metal conductive sheet arranged on the flexible circuit board 66, and the flexible circuit board 66 is fixed on the chip frame 5 through the support plate 63. In this embodiment, the support plate 63 is configured as a plate-shaped plastic part, which is detachably mounted on the surface of the chip frame 5. Optionally, the support plate 63 can be arranged in one piece with the chip frame 5, and the flexible circuit board 66 is fixed on the support plate 63 by an adhesive or a clamping structure. The support plate 63 extends in the first direction, and the plurality of contact points of the electrical contact portion 62 are arranged in the first direction and form an electrical contact surface, that is, the electrical contact surface extends in the first direction, and the second circuit board 64 extends in the second direction, and the storage portion 61 arranged on the second circuit board 64 extends in the second direction, and the electrical contact surface and the storage portion 61 extend in different directions. As a preferred embodiment, the first direction and the second direction are perpendicular to each other.

[0043] like Figure 5As shown, the chip assembly 6 further includes a power supply part 65, which is used to provide the power required by the chip assembly 6. The power supply part 65 is arranged on one surface of the second circuit board 64, and includes a battery 651, a positive electrode 652 and a negative electrode 653. The positive electrode of the battery 651 is connected to the second circuit board 64 through the positive electrode 652, and the negative electrode of the battery 651 is connected to the second circuit board 64 through the negative electrode 653, and then connected to the storage part 61 through the second circuit board 64, so as to provide power to the storage part 61. In this embodiment, the battery 651 is configured as a button battery, the positive electrode 652 is configured as a bent conductive metal sheet, an installation space is formed between the conductive metal sheet and the second circuit board 64, and the battery 651 is installed in the installation space, one end of the conductive metal sheet is welded on the second circuit board 64 and electrically connected to the second circuit board 64, a conductive connection portion is arranged on the top wall of the conductive metal sheet, the positive electrode of the battery 641 contacts the conductive connection portion and is connected to the second circuit board 64 through the conductive connection portion, and the negative electrode 653 is configured as a gold finger arranged on one surface of the second circuit board 64.

[0044] The chip rack 5 is arranged on the first side of the housing. Specifically, the chip rack 5 is detachably mounted on the first side 11 of the housing 1, so that the chip assembly 6 mounted on the chip rack 5 is detachably mounted on the first side 11 of the housing 1. Further, the chip rack 5 is mounted on the protective cover 13. In other optional embodiments, the chip rack 5 can be integrally formed with the housing 1. The chip rack 5 is provided with a supporting groove 51 and a receiving groove 52 connected to the supporting groove 51. The first circuit board 63 of the chip assembly 6 is mounted and supported on the supporting groove 51, and the second circuit board 64 of the chip assembly 6 is mounted in the receiving groove 52. When the chip assembly is mounted on the chip rack, the second circuit board 64 is first mounted and fixed in the receiving groove 52, and then the flexible circuit board 66 or the supporting board 63 is mounted on the supporting groove 51. The chip assembly 6 is easy to install and remove, and the installation space of the chip assembly 6 is reduced.

[0045] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A developing cartridge, detachably mounted in an image forming device, the image forming device having a chip contact point, the developing cartridge comprising: A developing roller rotatable about an axis extending in a first direction; a housing for containing a developer, comprising a first side and a second side separated from the first side in the first direction; An input gear, disposed on the first side, capable of receiving and transmitting a driving force from the image forming device; It is characterized in that it also includes a chip component, and the chip component includes: A first circuit board, wherein the first circuit board is provided with an electrical connection contact surface for contacting with the chip contact point, and the electrical connection contact surface is extended in the first direction; A second circuit board is provided with a storage portion, and the storage portion is extended in a second direction crossing the first direction.

2. The developing cartridge according to claim 1, wherein: The electrical connection contact surface and the storage portion are disposed vertically.

3. The developing cartridge according to claim 1, wherein: The first circuit board includes a first surface and a second surface arranged opposite to the first surface, the electrical connection contact surface is arranged on the first surface, and the second surface is connected to the second circuit board.

4. The developing cartridge according to claim 3, wherein: The second circuit board includes a third surface and a fourth surface disposed opposite to the third surface, the storage portion is disposed on the third surface, and the second surface is connected to the first circuit board.

5. The developing cartridge according to claim 4, wherein: The chip assembly further includes a power supply portion, which is disposed on the fourth surface and is electrically connected to the storage portion.

6. The developing cartridge according to claim 5, wherein: The power supply part includes a battery, a positive electrode and a negative electrode. The positive electrode of the battery is connected to the second circuit board through the positive electrode, and the negative electrode of the battery is connected to the second circuit board through the negative electrode.

7. The developing cartridge according to claim 3, wherein: It also includes a chip frame, which is provided with a supporting groove and a receiving groove connected to the supporting groove, the first circuit board is installed and supported in the supporting groove, and the second circuit board is installed in the receiving groove.

8. The developing cartridge according to claim 1, wherein: The first circuit board is provided with a first soldering point, the second circuit board is provided with a second soldering point, and the first soldering point and the second soldering point are connected by welding.

9. The developing cartridge according to claim 1, wherein: It also includes a flexible circuit board, one end of which is connected to the first circuit board and electrically connected to the electrical connection contact surface, and the other end of which is connected to the second circuit board and electrically connected to the storage part.

10. The developing cartridge according to claim 1, wherein: The first circuit board is configured as a flexible circuit board, and the flexible circuit board is electrically connected to the second circuit board.

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