Intelligent data processing CPU device

Abstract

The utility model discloses an intelligent data processing CPU device which comprises a heat dissipation assembly, the heat dissipation assembly comprises a heat dissipation bin, the top of the heat dissipation bin is fixedly connected with a fan bin, the interior of the heat dissipation bin and the interior of the fan bin are of a communicated L-shaped structure, the input end of the fan bin is fixedly provided with a plurality of heat dissipation fans, and the heat dissipation fans are connected with the fan bin. Pin holes are formed in the inner wall of the heat dissipation bin, a conversion disc is installed on the inner wall of the top of the heat dissipation bin in a matched and clamped mode, and a CPU is fixedly installed on the top of the conversion disc. By arranging the conversion disc, after the conversion disc is cooled, air cooling heat dissipation can be conducted on the bottom of the CPU, and the conversion disc conducts heat dissipation on the bottom of the CPU under the contact effect; the risk of damage to circuit antennas caused by direct blowing to the CPU is prevented, meanwhile, the cooling liquid in the liquid cooling bin is used for achieving the air-cooling heat dissipation effect on the bottom of the conversion disc, and the safety and stability of equipment use are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of CPU devices, in particular to a data intelligent processing CPU device. Background Art

[0002] The CPU device is usually composed of a control unit, a computing unit, a storage unit, and a cache. It can quickly process large amounts of data and complex computing tasks, and plays a vital role in the performance of the computer. The CPU generates a lot of heat when working, and it is necessary to maintain an efficient heat dissipation effect on the CPU to prevent the CPU temperature from being too high, resulting in slow data intelligent processing. The existing method is usually to electrically connect the CPU and install it on the surface of the circuit board. Then this installation structure can only cool the surface of the CPU through a fan, but the heat-generating part of the CPU is generally on the side close to the circuit board, resulting in poor heat dissipation effect, and it is not convenient to carry out targeted and efficient heat dissipation of the bottom of the CPU. Utility Model Content

[0003] The purpose of the utility model is to provide a data intelligent processing CPU device to solve the problems raised in the above background technology.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A CPU device for intelligent data processing includes a heat dissipation component, which includes a heat dissipation bin. The top of the heat dissipation bin is fixedly connected to a fan bin. The heat dissipation bin and the fan bin are internally connected in an L-shaped structure. A heat dissipation fan is fixedly installed at the input end of the fan bin. The heat dissipation fans are arranged in a plurality. Pin holes are opened on the inner wall of the heat dissipation bin. A conversion disk is installed on the inner wall of the top of the heat dissipation bin in cooperation with a card. A CPU is fixedly installed on the top of the conversion disk.

[0006] In a preferred embodiment of the present utility model, a fan rack is fixedly installed on the inner wall of the top of the fan compartment, a cooling fan is fixedly installed on the inner wall of the fan rack, and the cooling fan is arranged as a strip-shaped air outlet.

[0007] In a preferred embodiment of the present invention, the cooling fan output end is cooperatively connected with the fan bin top input end, and side panels are fixedly installed on the left and right outer walls of the cooling bin, and the side panels are at the same height as the top outer wall of the conversion disk.

[0008] In a preferred embodiment of the utility model, ventilation holes are evenly opened around the top of the heat dissipation bin, and the ventilation holes are located around the pin holes. A sealing plate is fixedly installed on the input end of the heat dissipation bin, and a liquid cooling bin is opened on the inner wall of the top of the heat dissipation bin. A liquid filling hole is opened on the input end of the liquid cooling bin, and the liquid filling hole is used to add coolant into the liquid cooling bin.

[0009] In a preferred embodiment of the present invention, the outer wall of the bottom of the conversion disk is evenly fixed with pins, the outer wall of the pins is plug-connected with the inner wall of the pin hole, the pins are used to electrically connect with the circuit board, and the top of the conversion disk is evenly fixed with docking contacts.

[0010] In a preferred embodiment of the present utility model, the outer wall at the bottom of the CPU is evenly provided with docking grooves, the inner wall of the docking groove is provided with a circuit, the docking groove and the docking contacts are plug-in connected, and the conversion disk and the CPU are electrically connected through the docking contacts and the inner wall of the docking groove.

[0011] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention.

[0012] 1. By setting a conversion plate, after the conversion plate is cooled, it contacts the bottom of the CPU, so that the bottom of the CPU can be cooled by air. The conversion plate dissipates heat by contacting the bottom of the CPU, which prevents the risk of direct blowing on the CPU and causing damage to the circuit antenna. At the same time, the coolant in the liquid cooling chamber is used to cool the bottom of the conversion plate, thereby improving the safety and stability of the equipment.

[0013] 2. By arranging water cooling and air cooling inside the heat dissipation compartment and the fan compartment to dissipate heat from the bottom of the conversion disk, the conversion disk can dissipate heat from the bottom of the CPU, thereby improving the CPU heat dissipation efficiency and thus improving the stability of the equipment operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0015] Figure 1 It is a schematic diagram of the main structure of a data intelligent processing CPU device;

[0016] Figure 2 It is a schematic diagram of the structure of a CPU device for intelligent data processing from an upward perspective;

[0017] Figure 3 It is a schematic diagram of the decomposition structure of a data intelligent processing CPU device;

[0018] Figure 4 A schematic diagram of the structure of a heat dissipation component in a CPU device for intelligent data processing;

[0019] Figure 5 The present invention is a schematic diagram of the structure of a transfer plate in a CPU device for intelligent data processing.

[0020] In the figure: heat dissipation chamber 100, fan chamber 110, fan frame 120, heat dissipation fan 130, liquid cooling chamber 140, liquid filling hole 141, ventilation hole 150, pin hole 160, sealing plate 170, conversion disk 200, pin 210, contact point 220, CPU 300. DETAILED DESCRIPTION

[0021] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0022] Example 1: Figure 1-3 , including a heat dissipation component, the heat dissipation component includes a heat dissipation chamber 100, the top of the heat dissipation chamber 100 is fixedly connected to the fan chamber 110, the heat dissipation chamber 100 and the fan chamber 110 are internally connected in an L-shaped structure, a heat dissipation fan 130 is fixedly installed at the input end of the fan chamber 110, and the heat dissipation fan 130 is arranged in a plurality, and pin holes 160 are opened on the inner wall of the heat dissipation chamber 100, and a conversion disk 200 is installed on the inner wall of the top of the heat dissipation chamber 100 in cooperation with a card-connected connection, and a CPU 300 is fixedly installed on the top of the conversion disk 200.

[0023] The specific usage scenario of this embodiment is as follows: CPU, i.e. central processing unit, is the core component of a computer, like the brain of a computer, responsible for executing instructions in a computer program, performing data operations, logical judgments and controlling the operation of the entire computer system. A CPU device is usually composed of a control unit, a computing unit, a storage unit and a cache, etc. It can quickly process large amounts of data and complex computing tasks. The CPU is used to control data intelligent devices, a heat dissipation chamber 100 is used to cooperate with a fan chamber 110 to dissipate heat from the bottom of the CPU device, and a conversion disk 200 is used to convert the bottom contacts of an existing CPU, so that the CPU can be first installed on the top of the conversion disk 200, and then the conversion disk 200 is electrically connected to the circuit board, so that a heat dissipation component that can be used to efficiently dissipate heat from the CPU can be arranged at the bottom of the CPU.

[0024] Example 2: As shown in Figure 3 and Figure 4The fan rack 120 is fixedly installed on the inner wall of the top of the fan bin 110, and the cooling fan 130 is fixedly installed on the inner wall of the fan rack 120. The cooling fan 130 is arranged as a strip air outlet, and the output end of the cooling fan 130 is connected with the input end of the top of the fan bin 110. Side panels are fixedly installed on the outer walls on both sides of the cooling bin 100, and the side panels are at the same height as the outer wall on the top of the conversion disk 200. Air holes 150 are evenly opened around the top of the cooling bin 100, and the air holes 150 are located around the pin holes 160. A sealing plate 170 is fixedly installed on the input end of the cooling bin 100. A liquid cooling bin 140 is opened on the inner wall of the top of the cooling bin 100, and a liquid adding hole 141 is opened at the input end of the liquid cooling bin 140. The liquid adding hole 141 is used to add coolant to the liquid cooling bin 140.

[0025] The specific usage scenario of this embodiment is as follows: the heat dissipation fan 130 is installed on the inner wall of the fan frame 120, and the fan frame 120 and the heat dissipation fan 130 are installed together on the outer wall of the top of the fan chamber 110, and then the conversion disk 200 is plugged and installed on the top of the heat dissipation chamber 100, so that the pins 210 at the bottom of the conversion disk 200 are inserted into the inside of the pin holes 160, and the pins 210 are inserted into the jacks inside the circuit board, so that the conversion disk 200 can be plugged and connected with the surface of the circuit board, and then the bottom of the CPU 300 is matched and connected with the top of the conversion disk 200, so that the slot at the bottom of the CPU 300 is connected with the conversion disk 2 00 is plugged into the contact point 220 on the top outer wall, so that the circuit in the bottom slot of CPU 300 is plugged into the inner wall of the contact point 220, so that the electrical connection between CPU 300 and the conversion disk 200 is completed, so that the CPU 300 completes the electrical connection with the circuit board. When the CPU 300 is working and generating heat, the cooling fan 130 is turned on to blow air into the heat dissipation bin 100, so that the cooling fan 130 forms an airflow inside the heat dissipation bin 100 and the fan bin 110, and the airflow passes through the air vents 150 to cool the bottom of the conversion disk 200.

[0026] Example 3: Figure 4 and Figure 5 The outer wall of the bottom of the conversion disk 200 is evenly fixed with pins 210, and the outer wall of the pin 210 is plugged into the inner wall of the pin hole 160. The pin 210 is used to electrically connect with the circuit board. The top of the conversion disk 200 is evenly fixed with docking contacts 220. The outer wall of the bottom of the CPU 300 is evenly opened with docking grooves, and the inner wall of the docking groove is provided with circuits. The docking groove and the docking contact 220 are plugged into the conversion disk 200 and the CPU 300 are electrically connected through the docking contact 220 and the inner wall of the docking groove.

[0027] The specific usage scenario of this embodiment is: the heat dissipation chamber 100 is fixedly installed on the surface of the circuit board, so that the pin holes 160 at the bottom of the heat dissipation chamber 100 are matched and distributed one by one with the sockets on the surface of the circuit board for connecting the pins 210 at the bottom of the conversion disk 200, and the pins 210 at the bottom of the conversion disk 200 are inserted into the pin holes 160, so that the pins 210 are inserted into the sockets inside the circuit board, so that the conversion disk 200 can be plugged and connected with the surface of the circuit board, and then the bottom of the CPU 300 is matched and connected with the top of the conversion disk 200, so that the slot at the bottom of the CPU 300 is plugged and connected with the contact point 220 on the outer wall of the top of the conversion disk 200, and the circuit in the slot at the bottom of the CPU 300 is plugged and connected with the inner wall of the contact point 220, so that the electrical connection between the CPU 300 and the conversion disk 200 is completed.

[0028] The working principle of the utility model is as follows: when in use, a person skilled in the art opens the sealing plate 170, fills a proper amount of coolant into the liquid cooling chamber 140 inside the heat dissipation chamber 100, and then seals and installs the sealing plate 170 at the port at the input end of the liquid cooling chamber 140, and then fixes the heat dissipation chamber 100 on the surface of the circuit board so that the pin holes 160 at the bottom of the heat dissipation chamber 100 and the jacks on the surface of the circuit board for connecting the pins 210 at the bottom of the conversion disk 200 are matched and distributed one by one, so that the heat dissipation chamber 100 is fixedly connected to the top of the circuit board, and then the heat dissipation chamber 100 is fixedly connected to the top of the circuit board. The heat fan 130 is installed on the inner wall of the fan frame 120, and the fan frame 120 and the heat dissipation fan 130 are installed together on the outer wall of the top of the fan chamber 110. Then, the conversion disk 200 is plugged and installed on the top of the heat dissipation chamber 100, so that the pins 210 at the bottom of the conversion disk 200 are inserted into the pin holes 160, and the pins 210 are inserted into the jacks inside the circuit board, so that the conversion disk 200 can be plugged and connected with the surface of the circuit board, and then the bottom of the CPU 300 is matched and connected with the top of the conversion disk 200, so that the slot at the bottom of the CPU 300 is connected with the The contact point 220 on the top outer wall of the conversion disk 200 is plugged and connected, so that the circuit in the bottom slot of the CPU 300 is plugged and connected with the inner wall of the contact point 220, so that the CPU 300 is electrically connected to the conversion disk 200, so that the CPU 300 is electrically connected to the circuit board. When the CPU 300 is working and heating up, the cooling fan 130 is turned on to blow air to the inside of the heat dissipation chamber 100, so that the cooling fan 130 forms airflow inside the heat dissipation chamber 100 and the fan chamber 110, and the airflow is smooth. The bottom of the conversion disk 200 is cooled by air through the air holes 150, so that the conversion disk 200 can contact the bottom of the CPU 300 after the temperature is lowered, so that the bottom of the CPU 300 can be cooled by air. The conversion disk 200 dissipates heat by contact with the bottom of the CPU 300, which prevents the risk of damage to the circuit antennae caused by direct blowing of air on the CPU 300. At the same time, the coolant in the liquid cooling chamber 140 is used to cool the bottom of the conversion disk 200 by air, thereby improving the safety and stability of the equipment.

[0029] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A data intelligent processing CPU device, comprising a heat dissipation component, wherein the heat dissipation component comprises a heat dissipation chamber (100), characterized in that: The top of the heat dissipation chamber (100) is fixedly connected to the fan chamber (110); the heat dissipation chamber (100) and the fan chamber (110) are internally connected L-shaped structures; a heat dissipation fan (130) is fixedly installed at the input end of the fan chamber (110); a plurality of heat dissipation fans (130) are provided; a pin hole (160) is provided on the inner wall of the heat dissipation chamber (100); a conversion disk (200) is installed on the inner wall of the top of the heat dissipation chamber (100) in a cooperating manner; and a CPU (300) is fixedly installed on the top of the conversion disk (200).

2. A data intelligent processing CPU device according to claim 1, characterized in that: The fan rack (120) is fixedly mounted on the top inner wall of the fan compartment (110), and a heat dissipation fan (130) is fixedly mounted on the inner wall of the fan rack (120), wherein the heat dissipation fan (130) is arranged as a strip-shaped air outlet.

3. A data intelligent processing CPU device according to claim 1, characterized in that: The output end of the heat dissipation fan (130) is cooperatively connected with the input end at the top of the fan bin (110), and side panels are fixedly installed on the left and right outer walls of the heat dissipation bin (100), and the side panels are at the same height as the top outer wall of the conversion disk (200).

4. A data intelligent processing CPU device according to claim 3, characterized in that: The top of the heat dissipation chamber (100) is evenly provided with ventilation holes (150) around the periphery, and the ventilation holes (150) are located around the pin holes (160). A sealing plate (170) is fixedly installed at the input end of the heat dissipation chamber (100). A liquid cooling chamber (140) is provided on the inner wall of the top of the heat dissipation chamber (100). The input end of the liquid cooling chamber (140) is provided with a liquid adding hole (141), and the liquid adding hole (141) is used to add cooling liquid into the liquid cooling chamber (140).

5. A data intelligent processing CPU device according to claim 1, characterized in that: The outer wall of the bottom of the conversion disk (200) is evenly fixed with pins (210), the outer wall of the pins (210) is plug-connected with the inner wall of the pin hole (160), the pins (210) are used to be electrically connected with the circuit board, and the top of the conversion disk (200) is evenly fixed with docking contacts (220).

6. A data intelligent processing CPU device according to claim 5, characterized in that: The outer wall at the bottom of the CPU (300) is evenly provided with docking grooves, the inner wall of the docking grooves is provided with circuits, the docking grooves and the docking contacts (220) are plugged together for connection, and the conversion disk (200) and the CPU (300) are electrically connected through the docking contacts (220) and the inner wall of the docking grooves.

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